Panasonic TX-R32LX8 User manual

© 2008 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TX-R32LX80
LH80 Chassis
LCD TV
Specifications
Power Source :
A
C SINGLE 220-240 V, 50/60 Hz
Power Consumption
Average Use 138 W
Standby condition 1.0 W
Display panel
Aspect Ratio 16:9
Visible screen size 698 mm (W) × 392 mm (H)
(No. of pixels) 1,049,088 (1,366 (W) × 768 (H))
Sound
Speaker Full range × 2 pcs, 8 Ω
Audio Output 20 W (10 W + 10 W), 10% THD
Headphones M3 (3.5 mm) Jack × 1
PC signals VGA, SVGA, XGA, WVGA, WXGA
Vertical scanning frequency 60 Hz
Receiving Systems / Band name SYSTEMS FUNCTIONS
———————————————————————————————————————
1PAL B, G, H
2PAL I Reception
of broadcast
transmission and
playback from
video cassette tape
recorders.
3PAL D, K
4SECAM B, G
5SECAM D, K
6SECAM K1
7NTSC M (NTSC 3.58 / 4.5 MHz)
———————————————————————————————————————
8NTSC 4.43 / 5.5 MHz Playback from
special VCR’s or DVD.
9NTSC 4.43 / 6.0 MHz
ORDER NO. MTV0801629CE

1 Safety Precautions 4
1.1. General Guidelines 4
1.2. Touch-Current Check 4
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 5
3 About Lead Free Solder (PbF) 6
4 Self Check Function 7
4.1. Self Check 7
4.2. Power LED Blinking Timing Chart 7
5 Chassis Board 9
5.1. Chassis Installation 9
6 Location of Lead Wiring 10
6.1. Wire Dressing 10
6.2. Wire Dressing and Connections 10
7 Disassembly for Service 11
7.1. AC Code dressing for 2-Pin 11
10 NTSC 4.43 / 6.5 MHz
11 NTSC 3.58 / 5.5 MHz Playback from
special VCR’s or DVD.
12 NTSC 3.58 / 6.0 MHz
13 NTSC 3.58 / 6.5 MHz
14 SECAM I
———————————————————————————————————————
15 PAL 60 Hz / 5.5 MHz Playback from
Special Disc Players
and Special VCR’s or DVD.
16 PAL 60 Hz / 6.0 MHz
17 PAL 60 Hz / 6.5 MHz
Aerial - Rear VHF / UHF
Operation Conditions Temperature : 0°C - 35°C
Humidity : 20% -- 80% RH (non-condensing)
Connection Terminals :
AV1 AUDIO L-R RCA PIN Type × 2 0.5 V[rms]
Input VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 Ω)
AV2 AUDIO L-R RCA PIN Type × 2 0.5 V[rms]
Input VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 Ω)
COMPONENT Y 1.0 V[p-p] (including synchronization)
PB/C
B,P R/C R±0.35 V[p-p]
AV3 AUDIO L-R RCA PIN Type × 2 0.5 V[rms]
Input VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 Ω)
S VIDEO Mini DIN 4-pin Y: 1.0 V[p-p] (75 Ω) C: 0.286 V[p-p] (75 Ω)
Others HDMI 1/2 Input TYPE A Connectors
Audio Input for
HDMI 1 RCA PIN Type × 2 0.5 V[rms]
PC Input HIGH-DENSITY D-SUB 15 PIN R, G, B / 0.7 V[p-p] (75 Ω)
HD, VD / TTL LEVEL 2.0-5.0 V[rms] (high
impedance)
Monitor AUDIO L-R RCA PIN Type × 2 0.5 V[rms] (high impedance)
Output VIDEO RCA PIN Type × 1 1.0 V[p-p] (75Ω)
Dimensions (W × H × D) 820 mm × 578 mm × 225 mm (With TV Stand)
820 mm × 539 mm × 110 mm (TV only)
Mass 17 kg (Net)
Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
CONTENTS
Page Page
2
TX-R32LX80

7.2. AC Code dressing for 3-Pin 11
7.3. Chassis Rail Installation 12
7.4. VESA Bracket Installation 13
7.5. Pedestal Assembly Preparation 14
7.6. LED Panel Installation 16
7.7. LCD Panel Assembly Installation 17
8 Service Mode Adjustment 18
8.1. SERVICE 1 18
8.2. SERVICE 2 18
8.3. Self Check Mode 18
8.4. Hotel Mode Adjustment 18
9 Adjustment 20
9.1. Voltage Chart of A Board 20
9.2. Voltage Chart of P board 20
9.3. DVCO Adjustment 20
10 Conductor Views 21
10.1. A-Board 21
10.2. A-Board 22
11 Schematic Diagram 23
11.1. Schematic Diagram Notes 23
11.2. A Board 24
11.3. G Board 34
11.4. K Board 36
11.5. P Board 37
11.6. SW Board 41
11.7. V Board 42
11.8. Z Board 46
12 Parts Location & Mechanical Replacement Parts List 50
12.1. Parts Location 50
13 Packing Exploded View 51
14 Replacement Parts List 52
14.1. Electrical Replacement Parts List 53
3
TX-R32LX80

1 Safety Precautions
1.1. General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.2. Touch-Current Check
1.Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2.Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such
as a water pipe as shown in Figure 1.
3.Use the Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4.Check each exposed metallic part and measure the voltage at each point.
5.The potential at any point (touch current) expressed as voltage U1and U2, do not exceed the following values:
For AC: U1= 35 V (peak) and U2= 0.35 V (peak);
For DC: U1= 1.0 V,
NOTE :
The limit value of U2= 0.35 V (peak) for AC and U1= 1.0 V for DC correspond to the values 0.7 mA (peak) AC and 2.0 mA DC.
The limit value U1= 35 V (peak) for AC correspond to the value 70 mA (peak) AC for frequencies greater than 100 kHz.
6.Should a measurement be out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
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TX-R32LX80

2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-
effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the
incidence of component damage caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminium foil to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charges sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it (most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or
comparable conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices (otherwise harmless motions such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).
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TX-R32LX80