Panasonic TH-103PF10UK - 103" Plasma Panel User manual

Order Number ITD0709071CE
B34 Canada: D10
Service Manual
High Definition Plasma Display
Model No. TH-103PF10UK
Model No. TH-103PF10EK
GPF10D Chassis
A W RNING
This service information is desi ned for experienced repair technicians only and is not desi ned for use by the eneral public.
It does not contain warnin s or cautions to advise non-technical individuals of potential dan ers in attemptin to service a product.
Products powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service
or repair the product or products dealt with in this service information by anyone else could result in serious injury or death.
T BLE OF CONTENTS PAGE PAGE
1 Safety Precautions-------------------------------------------------------3 7.5. Removal of HDMI-Board (UK) ---------------------------- 28
1.1. General Guidelines -----------------------------------------------3 7.6. Removal of HDD-Board (EK) ----------------------------- 28
2 Warning------------------------------------------------------------------------4 7.7. Removal of DS-Board --------------------------------------- 28
2.1. Prevention of Electrostatic Dischar e (ESD) 7.8. Removal of HX-Board ---------------------------------------- 29
to Electrostatically Sensitive (ES) Devices ------------- 4 7.9. Removal of DN-Board --------------------------------------- 29
2.2. About lead free solder (PbF) --------------------------------- 5 7.10. Removal of PB-Board ---------------------------------------- 29
3 Service Navigation-------------------------------------------------------6 7.11. Removal of H5-Board ---------------------------------------- 30
3.1. Service Hint --------------------------------------------------------- 6 7.12. Removal of D-Board------------------------------------------30
3.2. Applicable si nals------------------------------------------------ 8 7.13. Removal of P-Board (MULTI_1), (MULTI_2) ------ 30
4 Specifications------------------------------------------------------------10 7.14. Removal of P-Board (SUS_1), (SUS_2) -------------- 31
5 Service M ode--------------------------------------------------------------11 7.15. Removal of F-Board ------------------------------------------31
5.1. CAT (Computer Aided Test) mode ----------------------- 11 7.16. Removal of PC-Board --------------------------------------- 32
5.2. IIC mode structure (followin items value is 7.17. Removal of SU-Board ---------------------------------------- 32
sample data) ------------------------------------------------------ 15 7.18. Removal of SM-Board --------------------------------------- 33
5.3. Option Settin ----------------------------------------------------16 7.19. Removal of SD-Board --------------------------------------- 34
6 Troubleshooting Guide ---------------------------------------------- 18 7.20. Removal of SC-Board -------------------------------------- 34
6.1. Self Check----------------------------------------------------------18 7.21. Removal of SC2-Board ------------------------------------- 35
6.2. No Power-----------------------------------------------------------20 7.22. Removal of S1-Board and V2-Board ------------------- 35
6.3. No Picture --------------------------------------------------------- 20 7.23. Removal of SS2-Board ------------------------------------- 36
6.4. Local screen failure -------------------------------------------- 21 7.24. Removal of SS3-Board ------------------------------------- 36
7 Disassembly and ssembly Instructions ------------------ 22 7.25. Removal of SS-Board --------------------------------------- 37
7.1. Rear Cover and Board----------------------------------------22 7.26. Removal of Fan--------------------------------------------------38
7.2. Location of Rear Cover screws ------------------------- 23 7.27. Removal of C1-Board ---------------------------------------- 39
7.3. Removal of Side An le (L), (R ) ------------------------- 26 7.28. Removal of C2-Board ---------------------------------------- 39
7.4. Removal of HA-Board-----------------------------------------27 7.29. Removal of C3-Board ---------------------------------------- 40
Panasonic' © 2007 Matsushita Electric Industrial Co., Ltd. All
ri hts reserved. Unauthorized copyin and distribu
tion is a violation of law.

TH-103PF10UK/EK
7.30. Removal of C4-Board ------------------------------- ------- 41
7.31. Removal of C5-Board ------------------------------- ------- 41
7.32. Removal of C6-Board ------------------------------- ------- 42
7.33. Removal of C7-Board ------------------------------- ------- 42
7.34. Removal of C8-Board ------------------------------- ------- 43
7.35. Removal of C9-Board ------------------------------- ------- 43
7.36. Removal of CX-Board ------------------------------- ------- 44
7.37. Removal of CY-Board ------------------------------- ------- 44
7.38. Removal of CZ-Board ------------------------------- ------- 45
7.39. Removal of DR1-Board (A) ----------------------- ------- 45
7.40. Removal of DR1-Board (B) ----------------------- ------- 46
7.41. Removal of DR2-Board (A) ----------------------- ------- 46
7.42. Removal of DR2-Board (B) ----------------------- ------- 46
7.43. Removal of CD-Board ------------------------------- ------- 47
7.44. Removal of AC Inlet --------------------------------- ------- 48
7.45. Removal of Cabinet and Front Glass ------- ------- 48
7.46. Removal of V1-Board and V3-Board---------- ------- 51
7.47. Removal of Plasma Panel ------------------------ ------- 51
8 Measurements and djustments------------------------------58
8.1. Adjustment Procedure ---------------------------------------58
8.2. Adjustment--------------------------------------------------------62
9 Block Diagram----------------------------------------------------------67
9.1. Dia ramNote---------------------------------------------------- 67
9.2. Main (1 of 2) Block Dia ram-------------------------------68
9.3. Main (2 of 2) Block Dia ram-------------------------------69
9.4. P-Board (1 of 2) and F-Board Block Dia ram ----- 70
9.5. P-Board (2 of 2) Block Dia ram --------------------------71
9.6. HA, HX, PC, PB, V1, V2 and V3-Board Block
Dia ram------------------------------------------------------------ 72
9.7. HDMI-Board (1 of 2) Block Dia ram-------------------73
9.8. HDMI-Board (2 of 2) Block Dia ram-------------------74
9.9. HDD-Board Block Dia ram--------------------------------75
9.10. DS-Board (1 of 2) and H3-Board Block
Dia ram------------------------------------------------------------ 76
9.11. DS-Board (2 of 2) Block Dia ram ----------------------- 77
9.12. DN-Board (1 of 2) Block Dia ram ----------------------- 78
9.13. DN-Board (2 of 2) Block Dia ram ----------------------- 79
9.14. D-Board (1 of 2) Block Dia ram ------------------------- 80
9.15. D-Board (2 of 2) Block Dia ram --------------------------81
9.16. C1, C2, CY and CZ-Board Block Dia ram -------- 82
9.17. C2, C3, CX and CY-Board Block Dia ram -------- 83
9.18. C4, C5, C8 and C9-Board Block Dia ram -------- 84
9.19. C5, C6, C7 and C8-Board Block Dia ram -------- 85
9.20. SC2 and S1-Board Block Dia ram --------------------- 86
9.21. SC-Board Block Dia ram ---------------------------------- 87
9.22. SU, SM and SD-Board Block Dia ram --------------- 88
9.23. SS, SS2 and SS3-Board Block Dia ram ------------- 89
9.24. DR1, DR2 and CD-Board Block Dia ram ------------ 90
10 Wiring Connection Diagram --------------------------------------91
10.1. Interconnection (1 of 8) Dia ram ------------------------ 91
10.2. Interconnection (2 of 8) Dia ram ------------------------92
10.3. Interconnection (3 of 8) Dia ram------------------------93
10.4. Interconnection (4 of 8) Dia ram------------------------94
10.5. Interconnection (5 of 8) Dia ram------------------------95
10.6. Interconnection (6 of 8) Dia ram------------------------96
10.7. Interconnection (7 of 8) Dia ram------------------------97
10.8. Interconnection (8 of 8) Dia ram------------------------98
10.9. Lead Wirin (1)------------------------------------------------- 99
10.10. Lead Wirin (2 )----------------------------------------------100
10.11. Lead Wirin (3)----------------------------------------------101
10.12. Lead Wirin (4 )----------------------------------------------102
10.13. Lead Wirin (5)-----------------------------------------------103
10.14. Lead Wirin (6)-----------------------------------------------104
10.15. Lead Wirin (7)-----------------------------------------------105
10.16. Lead Wirin (8)-----------------------------------------------106
10.17. Lead Wirin (9)-----------------------------------------------107
11 Exploded View and Replacement Parts List-----------108
2

TH-103PF10UK/EK
1 Safety Precautions
1.1. General Guidelines
1. When conductin repairs and servicin , do not attempt to modify the equipment, its parts or its materials.
2. When wirin units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the
wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wirin unit instead.
3. When conductin repairs and servicin , do not twist the Faston connectors but plu them strai ht in or unplu them strai ht
out.
4. When servicin , observe the ori inal lead dress. If a short circuit is found, replace all parts which have been overheated or
dama ed by the short circuit.
5. After servicin , see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6. After servicin , make the followin leaka e current checks to prevent the customer from bein exposed to shock hazards.
1.2. Leakage Current Hot Check (See
Figure 1.)
1. Plu the AC cord directly into the AC outlet. Do not use
an isolation transformer for this check.
2. Connect a 1.5kohm, 10 watts resistor, in parallel with a
0.15|iF capacitors, between each exposed metallic part
on the set and a ood earth round such as a water pipe,
as shown in Fi ure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensi
tivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the volt
a e at each point.
5. Reverse the AC plu in the AC outlet and repeat each of
the above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leaka e current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leaka e
current must not exceed 1/2 milliamp. In case a measure
ment is outside of the limits specified, there is a possibility
of a shock hazard, and the equipment should be repaired
and rechecked before it is returned to the customer.
1.1.1. Leakage Current Cold Check
1. Unplu the AC cord and connect a jumper between the
two pron s on the plu .
2. Measure the resistance value, with an ohmmeter,
between the jumpered AC plu and each exposed metal
lic cabinet part on the equipment such as screwheads,
connectors, control shafts, etc. When the exposed metal
lic part has a return path to the chassis, the readin
should be between 1Mohm and 5.2Mohm.
When the exposed metal does not have a return path to
the chassis, the readin must beOO.
1.1
Fi ure 1
3

TH-103PF10UK/EK
2 Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi
tive (ES) Devices
Some semiconductor (solid state) devices can be dama ed easily by static electricity. Such components commonly are called Elec
trostatically Sensitive (ES) Devices. Examples of typical ES devices are inte rated circuits and some field-effect transistors and
semiconductor "chip" components. The followin techniques should be used to help reduce the incidence of component dama e
caused by electrostatic dischar e (ESD).
1. Immediately before handlin any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touchin a known earth round. Alternatively, obtain and wear a commercially available dischar in ESD wrist strap,
which should be removed for potential shock reasons prior to applyin power to the unit under test.
2. After removin an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi
num foil, to prevent electrostatic char e buildup or exposure of the assembly.
3. Use only a rounded-tip solderin iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)"
can enerate electrical char e sufficient to dama e ES devices.
5. Do not use freon-propelled chemicals. These can enerate electrical char es sufficient to dama e ES devices.
6. Do not remove a replacement ES device from its protective packa e until immediately before you are ready to install it. (Most
replacement ES devices are packa ed with leads electrically shorted to ether by conductive foam, aluminum foil or compara
ble conductive material).
7. Immediately before removin the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handlin unpacka ed replacement ES devices. (Otherwise ham less motion such as the brush
in to ether of your clothes fabric or the liftin of your foot from a carpeted floor can enerate static electricity (ESD) sufficient
to dama e an ES device).
IMPORT NT S FETY NOTICE
There are special components used in this equipment which are imporant for safety.
These parts are marked by Д in the schematic dia rams, Exploded Views and replacement parts list. It is
essential that these critical parts should be replaced with manufacturer's specified parts to prevent shock, fire, or
other hazards. Do not modify the ori inal desi n without permission of manufacturer.
4

TH-103PF10UK/EK
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+ g+Cu).
That is Tin (Sn), Silver ( g) and Copper (Cu) although other types are available.
2.2. bout lead free solder (PbF)
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
su est the use of Pb free solder as well, althou h Pb solder may be used.
PCBs manufactured usin lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a hi her meltin point than standard solder. Typically the meltin point is 50 ~ 70 °F (30~40 °C) hi her. Please
use a hi h temperature solderin iron and set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too hi h (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applyin Pb sol
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applyin Pb solder.
• After applyin PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see fi ure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+A +Cu (tin, silver, copper) solder. How
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
5

TH-103PF10UK/EK
3 Service Navigation
3.1. Service Hint
6

TH-103PF10UK/EK
Board Name Function Board Name Function
D Di ital Si nal Processor,
Format Converter,
Plasma AI Processor
Sub-Field Processor
CX Data Drive (X)
CY Data Drive (Y)
CZ Data Drive (Z)
H5 Audio Out
DS Slot Interface (Audio / Video / Sync Input
Switch),
SYNC Processor, Audio Processor,
Speaker Out Amplifier,
DC-DC Converter
S1 Power Switch
SS2 Sustain Out (Upper)
SS3 Sustain Out (Lower)
V1 LED_G, R
SS Sustain Drive V2 Key Scan
SC Scan Drive V3 Remocon Receiver
SC2 DC-DC Converter For Scan Drive PB Fan Control
SU Scan Out (Upper) P(SUS_1/2) Power Supply
SM Scan Out (Middle) P(MULTI_1/2) Power Supply
SD Scan Out (Lower) F Line Filter
C1 Data Drive (1) PC Power Control
C2 Data Drive (2) HX PC / RS-232C
C3 Data Drive (3) HA BNC Component Video
C4 Data Drive (4) DN Di ital Si nal Processor, Microcomputer
C5 Data Drive (5) HDD DVI-D Terminal (EK)
C6 Data Drive (6) HDMI Dual HDMI (UK)
C7 Data Drive (7) CD C-Board / D-Board Connection
C8 Data Drive (8) DR1 Ener y Data Recovery
C9 Data Drive (9) DR2 Ener y Data Recovery
Note:
Extension cable kit for Slot Board is supplied as service fixtures and tools.
(Part No. TZSC07040)
7

3.2. pplicable signals
TH-103PF10UK/EK
pplicable input signals for Component I RGB, Mini D-sub 15P(* Mark)
Si nal name Horizontal frequency (kHz) Vertical frequency (Hz) Component / RGB / Mini D-sub
15P (Dot clock (MHz))
1 525 (480) / 60i 15.73 59.94 4 (13.5)
2 525 (480)/60p 31.47 59.94 4 (27.0) *4
3 625 (575) / 50i 15.63 50.00 4 (13.5)
4 625 (575)/50p 31.25 50.00 4 (27.0)
5 625 (576)/50p 31.25 50.00
6 750 (720)/60p 45.00 60.00 4 (74.25)
7 750 (720)/50p 37.50 50.00 4 (74.25)
81,125 (1,080) / 60p 67.50 60.00 4 (148.5) *1
91,125 (1,080) / 60i 33.75 60.00 4 (74.25) *1
10 1,125 (1,080) / 50p 56.26 50.00 4 (148.5) *1
11 1,125 (1,080) / 50i 28.13 50.00 4 (74.25) *1
12 1,125 (1,080)/24sF 27.00 47.92 4 (74.25) *1
13 1,125 (1,080)/30p 33.75 30.00 4 (74.25) *1
14 1,125 (1,080)/25р 28.13 25.00 4 (74.25) *1
15 1,125 (1,080)/24р 27.00 24.00 4 (74.25) *1
16 1,250 (1,080) / 50i 31.25 50.00 4 (74.25) *2
17 640 x 400 @70 Hz 31.46 70.07 4 (25.17)
18 640 x 480 @60 Hz 31.47 59.94 4 (25.18) *5
19 640 x 480 @72 Hz 37.86 72.81 4 (31.5)
20 640 x 480 @75 Hz 37.50 75.00 4 (31.5)
21 640 x 480 @85 Hz 43.27 85.01 4 (36.0)
22 800 x 600 @56 Hz 35.16 56.25 4 (36.0)
23 800 x 600 @60 Hz 37.88 60.32 4 (40.0)
24 800 x 600 @72 Hz 48.08 72.19 4 (50.0)
25 800 x 600 @75 Hz 46.88 75.00 4 (49.5)
26 800 x 600 @85 Hz 53.67 85.06 4 (56.25)
27 852 x 480 @60 Hz 31.47 59.94 4 (33.54) *5
28 1,024 x 768 @50 Hz 39.55 50.00
29 1,024 x 768 @60 Hz 48.36 60.00 4 (65.0)
30 1,024 x 768 @70 Hz 56.48 70.07 4 (75.0)
31 1,024 x 768 @75 Hz 60.02 75.03 4 (78.75)
32 1,024 x 768 @85 Hz 68.68 85.00 4 (94.5)
33 1,066 x 600 @60 Hz 37.64 59.94 4 (53.0)
34 1,152 x 864 @60 Hz 53.70 60.00
35 1,152 x 864 @75 Hz 67.50 75.00 4 (108.0)
36 1,280 x 960 @60 Hz 60.00 60.00 4 (108.0)
37 1,280 x 960 @85 Hz 85.94 85.00 4 (148.5)
38 1,280 x 1,024 @60 Hz 63.98 60.02 4 (108.0)
39 1,280 x 1,024 @75 Hz 79.98 75.03 4 (135.0)
40 1,280 x 1,024 @85 Hz 91.15 85.02 4 (157.5)
41 1,366 x 768 @50 Hz 39.55 50.00
42 1,366 x 768 @60 Hz 48.36 60.00 4 (86.71)
43 1,400 x 1,050 @60 Hz 65.22 60.00
44 1,600 x 1,200 @60 Hz 75.00 60.00 4 (162.0)
45 1,600 x 1,200 @65 Hz 81.25 65.00 4 (175.5)
46 1,920 x 1,080 @60 Hz 67.50 60.00 4 (148.5) *3
47 1,920 x 1,200 @60 Hz 74.04 59.95
48 Macintosh13” (640x480) 35.00 66.67 4 (30.24)
49 Macintosh16” (832x624) 49.72 74.54 4 (57.28)
50 Macintosh21” (1,152x 870) 68.68 75.06 4 (100.0)
1: Based on SMPTE274M standard.
2: Based on SMPTE295M standard.
3: The input si nal is reco nized as 1,125 (1,080) 160p.
4: When selected the RGB format and 525p si nal input to the Mini D-sub 15P terminal, it is reco nized as VGA60Hz si nal.
5: When inputted VGA60Hz format si nal from the other than Mini D-sub 15P terminal, it is reco nized as 525p si nal
Note: Si nals without above speci cation may not be displayed properly.
8

TH-103PF10UK/EK
VIDEO input (HDMI)
Si nal format Vertical
frequency (Hz) Horizontal frequency (kHz) Dot clock (MHz) Number of active pixels Total number of pixels Number of active lines Total number of lines
1 VGA60 59.94 31.47 25.18 640 800 480 525
2 525/60p 59.94 31.47 27.00 720 858 480 525
3 625/50p 50.00 31.25 27.00 720 864 576 625
4 750/60p 60.00 45.00 74.25 1280 1650 720 750
5 750/50p 50.00 37.50 74.25 1280 1980 720 750
6 1125/60i 60.00 33.75 74.25 1920 2200 1080 1125
7 1125/50i 50.00 28.13 74.25 1920 2640 1080 1125
81125/60p* 60.00 67.50 148.50 1920 2200 1080 1125
91125/50p* 50.00 56.26 148.50 1920 2640 1080 1125
10 1125/24p* 24.00 27.00 74.25 1920 2750 1080 1125
*Not compatible with HDMI Terminal Board (TY-FB8HM)
Audio si nal Linear PCM : 48/44.1/32 kHz
9

TH-103PF10UK/EK
4 Specifications
Power Source (UK)
Power Source (EK)
Power Consumption
Power on (UK)
Power on (EK)
Stand-by condition
Power off condition
Plasma Display panel
Screen size
(No. of pixels)
Operating condition
Temperature
Humidity
pplicable signals
Scannin format
PC si nals
Connection terminals
HDMI A-B (UK)
DVI-D (EK)
COMPONENT / RGB IN
PC IN
200 V - 240V AC, 50 / 60Hz
220 V - 240 V AC, 50 / 60Hz
1,550 W
1,500 W
Save OFF 1.0 W, Save ON 0.9 W
0.5 W
Drive method: AC type 103-inch, 16:9 aspect ratio
89.5” (2,269 mm) (W) x 50.5” (1,277 mm) (H) x 103” (2,604 mm) (dia onal)
2,073,600 (1,920 (W) x 1,080 (H)) [5,760 x 1,080 dots]
32 °F - 104 °F (0 °C - 40 °C)
20 % - 80 %
525 (480) / 60i*60p, 625 (575) / 50i*50p, 750 (720) / 60p*50p, 1125 (1080) /
60i * 60p * 50i * 50p * 24p * 25p * 30p * 24sF, 1250 (1080) / 50i
VGA, SVGA, XGA, SXGA,
UXG A .....(compressed)
Horizontal scannin frequency 15 - 110 kHz
Vertical scannin frequency 48 - 120 Hz
SERIAL
AUDIO OUT
TYPE A Connector x 2
Video Input
Audio Input
Content Protection
Y / G (BNC)
PB / B (BNC), PR / R (BNC)
AUDIO IN (RCA PIN JACK x 2)
(HIGH-DENSITY Mini D-SUB 15PIN)
R / Pr / Cr:
HD / VD:
VBS (use HD port) (EK)
AUDIO IN (M3 JACK)
EXTERNAL CONTROL TERMINAL (D-SUB 9PIN)
RCA PIN JACK x 2 (L / R)
DVI-D 24 Pin x 1
compliance with DVI Revision 1.0
Stereo mini jack (M3) x 1
0.5Vrms
Compatible with HDCP 1.1
with / sync 1.0 Vp-p (75-ohm)
0.7 Vp-p (75-ohm)
0.5 Vrms
Y or G with / sync 1.0 Vp-p (75-ohm)
Y or G without / sync 0.7 Vp-p (75-ohm)
0.7 Vp-p (75-ohm)
0.7 Vp-p (75-ohm)
1.0 - 5.0 Vp-p (hi h impedance)
with / picture 1.0 Vp-p (hi h impedance)
without / picture 0.3 Vp-p (hi h impedance)
0.5 Vrms (hi h impedance)
RS-232C COMPATIBLE
OUTPUT LEVEL : VARIABLE (-<*> - 0 dB)
[INPUT 1KHz / 0dB, 10Kohm Load]
ccessories Supplied
Remote Control Transmitter EUR7636070R
(UK)
Remote Control Transmitter EUR7636090R
(EK)
Batteries (UK)
Batteries (EK)
Fixin bands
Dimensions (W x H x D)
Mass (weight)
main unit only (UK)
main unit only (EK)
AA Size x 2
R6 Size x 2
(TMME203) x 2
95.0” (2,414 mm) x 56.0” (1,421 mm) x 5.0” (129 mm) (5.6” (141 mm) when includin protrudin portion of
slots)
approx. 485.0 lbs
approx. 220.0 k net
Notes:
Desi n and specifications are subject to chan e without notice. Mass and dimensions shown are approximate.
This equipment complies with the EMC standards EN55022, EN55024, EN61000-3-2, EN61000-3-3. (TH-103PF10EK)
B/ Pb/ Cb
10

TH-103PF10UK/EK
5 Service Mode
5.1. C T (Computer ided Test) mode
To exit the C T mode, access the ID mode and switch off the main power.
5.1.1. IIC mode
Select the IIC mode by Up / Down button on the remote control at the front pa e of CAT mode and then press the ction button
on the remote control.
OSD
OTHER: JUST Mid
Panel W/B Adj. -
R-Drive •
E8 E8
T
Subject
Item
. New data
Ori inal data
How to use the 11C mode.
1. Select the ali nment Subject by Up/Down
buttons on the remote control.
2 Select the ali nment Item by Left/Right buttons
on the remote control.
3. Adjust optimum setting by Volume Up/Down
buttons on the remote control.
4. The data is memorized when press the R button
on the remote control or chan e the ali nment
Subject (or Items).
Subject and item are mentioned on “IIC mode structure”.
To exit the IIC mode, press the R button on the remote control.
11

TH-103PF10UK/EK
5.1.2. CD mode
Select the CD mode by Up / Down button on the remote control at the front pa e of CAT mode and then press the Mute button on
the remote control more than 3 seconds.
CD
MOSI I TOR—MCU 1.0100F10 OK !
MON 1 TOR—EEPROM DN 71.01 1 С 7C !
MONITOR-EEPROM H 7. 00 ED 4B ;
MONITOR-FPGA 1/2 10 5
MONITOR-EEPROM Change Addr 00 01
Data 01 01 ■
PANEL-MCU 7T00
PANEL-EEPROM 97103
PANEL-FPGA 97102
PANEL-PDROM 98100
PTCT 00. (10. 00. 00. 00. ■
Factory use
■ New data
■SOS history
■Ori inal data
Microcomputer software version (IC4002), this version can be up rade by
1. replace of new version IC
2. Loadin the new version software from loader tool, TZSC07036.
Memory data chan e
... Chan e by Up/Down buttons on the
Address 00
_ remote control.
Chan e by Left/Right buttons on the remote control.
Data 00■Chan e by
VOL Up /Down buttons on the
remote control.
The data is memorized when switch off the main power.
To exit the CD mode, press the R button on the remote control.
5.1.3. SD mode
Select the SD mode by Up / Down button on the remote control at the front pa e of CAT mode and then press the ction button
on the remote control.
To exit the SD mode, press the R button on the remote control.
12

TH-103PF10UK/EK
5.1.4. MS mode
Select the MS mode by Up / Down button on the remote control at the front pa e of CAT mode and then press the Mute button on
the remote control more than 3 seconds.
To exit the MS mode, press the R button on the remote control.
Caution:
Market Select should be set after exchange of DN-Board.
Destination number
Number Destination Number Destination
0 Japan 16 --
1 North America 17 --
2 Europe 18 China
3 Others 19 China (Hotel)
4 Britain 20 Russia
5 Taiwan 21 Russia (Hotel)
6 Thailand 22 Hon Kon
7-- 23 --
8 Japan (Hotel) 24 --
9 North America (Hotel) 25 --
10 Europe (Hotel) 26 --
11 -- 27 --
12 Britain (Hotel) 28 Middle East/Hon Kon
13 -- 29 Middle East/Hon Kon (Hotel)
14 Thailand (Hotel) 30 Australia
15 -- 31 Australia (Hotel)
Default settin
Number Destination
1 North America
13

TH-103PF10UK/EK
5.1.5. ID mode
Select the ID mode by Up / Down button on the remote control at the front pa e of CAT mode and then press the Mute button on
the remote control more than 3 seconds.
Qjj] N C O М С 2 П М С П М С 4 П s O
DNi IC4003 E ! i ! M » I I Dsf
IC4003 OK H90
IC4606 OK H61
IC5101 OK H56
IC5603 OK H57
IC4609 OK H31
IC5103 OK H32
IC5102 OK H33
IC5301 OK H51
IC8181 OK H51 I
IC3001 OK H22
IC3003 OK H63
IC3004 OK H64
IC3005 OK H65
IC2303 OK H21
PANEL OK ■
MON I TOR—MCU 1.0100F10 I
I OK I
MONITOR-EEPROM DN 71.00 1 С 7C
PANEL-MCU/EEPROM 7.00 97.03
To exit the ID mode, press the R button on the remote control.
14

TH-103PF10UK/EK
5.2. IIC mode structure (following items value is sample data)
15

TH-103PF10UK/EK
5.3. Option Setting
16

TH-103PF10UK/EK
Option Menu for GPF10D series
GPH10D chassis series have special function and operation setting facility called Option Menu. This Option Menu is use
ful for special function required customers. This should be set at the installation stage.
Option menus default settin Contents
Weekly Command Timer --- Off-timer Sets Weekly Command Timer. Enable/Disable.
Onscreen display On Enable/Disable to display input mode indication after power on and no si nal
indication.
Initial INPUT Off Sets the initial input mode when the power is turned on. Allow input mode selec
tion while power is on.
Initial VOL level Off Sets the initial volume level when the power is turned on. Allow Volume control
while power is on.
Maximum VOL Level Off Sets the maximum volume to desired level. Volume cannot exceed this level.
INPUT lock Off Fixes the input mode to AV, Component/RGB or PC. Can not chan e input
mode by input selection key
Button lock Off Enable/Disable bottom operation buttons (Input, Menu, Enter and/or volume up/
down)
Remocon User Level Off Remote key invalidation.
Off: Valid key is all key of remote.
User1: Valid key are only Stand-by (ON/OFF), Input, Direct input, Status, Sur
round, Sound mute On/Off, and volume adjustment.
User2: Valid key is only Stand-by (ON/OFF).
User3: All keys are null and void
Advanced PIP Off Off: Sets normal two screen display mode.
On: Sets Advanced PIP mode.
Off-timer function Enable Off-timer operation Enable/Disable.
Initial Power Mode Normal Sets the power mode of the unit for when the power recovers from failure or
after plu in off and in a ain.
ID select 0 Set ID number from 0 to 100.
Remote ID Off Remote ID function On/Off.
(While the Remote ID on, standard remote function can not control the unit.)
Serial ID Off Serial ID function On/Off
Display size Off Adjusts the ima e display size on screen.
On: Sets the ima e display size approximately 95% of the normal ima e dis
play.
Studio W/B Off Set warm mode color temperature to 3,200 Kelvin.
Studio Gain Off Sharpens the contrast for a better view when a part of the ima e is too li ht to
see
Slot power Off Sets the slot power mode while the power is turned on.
Allow Optional Terminal Board insert Slots while power is on.
Power On Screen Delay Off You can set the power-on delay time of the displays to reduce the power load,
when you press ([)/| to turn on the multiple displays that are set to ether, for
example, on MULTI DISPLAY system.
Set each display'fs settin individually.
V. Installation Off V. Installation function On/Off (Not used)
Rotate Off The ima e rotates 180 de rees (up-down)
Serial Slot Select Slot1 Selects the slot which communicates serial.
Note: The settin of an external command can be set only from the fixed serial
terminal.
Note:
When both main unit buttons and remote control are disabled due to the "Button lock", "Remocon User level" or "Remote ID"
adjustments, set all the values "Off" so that all the buttons are enabled a ain.
Press the "Volume down" button on main unit to ether with "R" button on the remote control and hold for more than 5 seconds.
The "SHIPPING" menu is displayed and the lock is released when it disappears.
17

TH-103PF10UK/EK
6 Troubleshooting Guide
6.1. Self Check
6.1.1. Display Indication
1. Self-check is used to automatically check the bus line controlled circuit of the Plasma display.
2. To et into the Self-check mode, press the volume down button on the customer controls at the side of the set, at the same
time pressin the OFF-TIMER button on the remote control, and the screen will show.
If the IIC ports have been checked and found to be incorrect.
Or not located then " - - " will appear in place of " OK ".
“ 01 “ in the line of the “ PTCT ” means the number of blinks of the Power LED is 1. (Refer to 7.1.2)
“ H09 “ in the line of the “ PTCT ” is the error code.
To exit Self Check mode, switch off the main power.
Note:
The line of the “ PTCT ” displays when you et into the Self-check mode for the first time only after the Power LED blinks.
0 3 I I C Q М С 2 П М С П М С 4 П s O
DN DSIC4003 OK H90
IC4606 OK H61
IC5101 OK H56
IC5603 OK H57
IC4609 OK H31
IC5103 OK H32
IC5102 OK H33
IC5301 OK H51
PTCT 01 H09
IC8181 OK H51 I
IC3001 OK H22
IC3003 OK H63
IC3004 OK H64
IC3005 OK H65
IC2303 OK H21
| PANEL OK U
INCHMXXXPXXX
MON I TOR—MCU 1. 01 OOF10 I
I 0K I
MONITOR-EEPROM DN 71.00 1 С 7C
PANEL-MCU/EEPROM 7.00 97.03
18

TH-103PF10UK/EK
6.1.2. Power LED Blinking timing chart
1. Subject
Information of LED Blinkin timin chart.
2. Contents
When an abnormality has occurred to the unit, the protection circuit operates and resets to the stand by mode. At this time,
the defective block can be identified by the number of blinks of the Power LED on the front panel of the unit.
3. Remarks
Above Fan function is operated durin the fans are installed.
bout blinking LED
[When blinkin four times] Li htin up
Ш Ш Ш
(1st
•* ----
olink 2nd blink 3rd blink 4th
One eye
Dlink N (
Pause for 3 seconds /
:le ^
19

6.2. No Power
First check point
There are followin 3 states of No Power indication by power LED.
1. No lit.
2. Green is lit then turns red blinkin a few seconds later.
3. Only red is lit.
TH-103PF10UK/EK
6.3. No Picture
NO Picture
20