Panasonic TH-42PHW6EX User manual

Table Of Contents
COVER
1 Applicable signals
2 Safety Precautions
2.1 General Guidelines
2.1.1 Leakage Current Cold Check
2.1.2 Leakage Current Hot Check (See
Figure 1 .)
3 Prevention of Electro Static
Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
4 About lead free solder (PbF)
5 PCB Structure sheet of GPH6D
chassis
6 Service Hint
7 Location of Lead Wiring
8 Adjustment Procedure
8.1 Driver Set-up
8.1.1 Item / Preparation
8.1.2 Adjustments
8.2 Initialization Pulse Adjust
8.3 P.C.B. (Printed Circuit Board)
exchange
8.3.1 Caution
8.3.2 Quick adjustment after P.C.B.
exchange
8.4 Adjustment Volume Location
8.5 Test Point Location
9 Service mode
9.1 CAT (computer Aided Test) mode
9.1.1 IIC mode
9.1.2 CD mode
9.1.3 SD mode
9.2 IIC mode structure (following
items value is sample data.)
10 Alignment
10.1 Pedestal setting (C)
10.2 Pedestal setting (B)
10.3 NTSC panel white balance
10.4 PAL / SECAM panel white
balance
10.5 PC / RGB panel white
balance
10.6 HD / 525i / 525p /
625I / 625P panel white balance
11 Trouble shooting guide
11.1 Self Check
11.1.1 Display Indication
11.1.2 Power LED Blinking timing
chart
11.2 No Power
11.3 No Picture
11.4 Local screen failure
12 Option Setting
12.1 How to access and setting
12.2 Contents of Option Menu
13 Conductor Views
13.1 PF-Board
13.2 P-Board
13.3 HX-Board
13.4 HY-Board
13.5 J-Board
13.6 D-Board
13.7 C1-Board
13.8 C2-Board
Service Manual
TOP NEXT
ORDER NO. ITD0308027C0
D10 Canada: B07
High Definition Plasma Display
●TH-42PHW6EX
TH-42PHD6EX
TH-42PHD6BX
TH-42PHD6UY
GPH6D Chassis
Specifications
Power Source: AC120V 50/60Hz (UY version)
AC220-240V 50/60Hz
(Except UY version model)
Power Consumption: 265 W
Save off 1.6 W, Save on 0.9 W (stand-by condition)
(UY version)
Save off 1.9 W, Save on 1.1 W (stand-by condition)
(Except UY version model)
0.2 W (Power off condition)
(UY version model)
0.4 W (Power off condition)
(Except UY version model)
Plasma Display panel: Drive method AC type
16:9 aspect ratio
Contrast Ratio 3000:1
Screen size: 920 mm (W)× 518 mm (H)
1,056 mm (diagonal)
No. of pixels
786,432 (1,024 (W)× 768 (H))
[3,072× 768 dots]
Operating condition:
Temperature 34°F - 104°F (0°C - 40°C)
Humidity 20% - 80%
Horizontal scanning frequency 15 - 110kHz
Vertical scanning frequency 48 - 120Hz
Connection terminals:
AV
Video in 1.0 Vp-p (75-ohm)
S-VIDEO IN
(MINI DIN 4PIN) Y: 1 Vp-p (75-ohm), C: 0.286 Vp-p (75-ohm)
AUDIO IN
(RCA PIN JACK× 2) 0.5 Vrms (high impedance)
COMPONENT/RGB

13.9 C3-Board
13.10 C4-Board
13.11 SC-Board
13.12 SU-Board
13.13 SD-Board
13.14 SS, SS2 and SS3-Board
13.15 Z-Board
13.16 V1, S1 and H3-Board
14 Schematic Diagrams
14.1 Schematic Diagram Notes
14.2 Main Block Diagram
14.3 PF-Board Schematic Diagram
14.4 Power Block Diagram
14.5 P-Board (1 of 6) Schematic
Diagram
14.6 P-Board (2 of 6) Schematic
Diagram
14.7 P-Board (3 of 6) Schematic
Diagram
14.8 P-Board (4 of 6) Schematic
Diagram
14.9 P-Board (5 of 6) Schematic
Diagram
14.10 P-Board (6 of 6) Schematic
Diagram
14.11 HX-Board Block Diagram
14.12 HX-Board Schematic Diagram
14.13 HY-Board Block Diagram
14.14 HY-Board (1 of 3) Schematic
Diagram
14.15 HY-Board (2 of 3) Schematic
Diagram
14.16 HY-Board (3 of 3) Schematic
Diagram
14.17 J-Board Block Diagram
14.18 J-Board (1 of 4) Schematic
Diagram
14.19 J-Board (2 of 4) Schematic
Diagram
14.20 J-Board (3 of 4) Schematic
Diagram
14.21 J-Board (4 of 4) Schematic
Diagram
14.22 D-Board (1 of 2) Block
Diagram
14.23 D-Board (2 of 2) Block
Diagram
14.24 D-Board (1 of 15) Schematic
Diagram
14.25 D-Board (2 of 15) Schematic
Diagram
14.26 D-Board (3 of 15) Schematic
Diagram
14.27 D-Board (4 of 15) Schematic
Diagram
14.28 D-Board (5 of 15) Schematic
Diagram
14.29 D-Board (6 of 15) Schematic
Diagram
14.30 D-Board (7 of 15) Schematic
Diagram
14.31 D-Board (8 of 15) Schematic
Diagram
14.32 D-Board (9 of 15) Schematic
Diagram
14.33 D-Board (10 of 15) Schematic
Diagram
Y/G 1.0 Vp-p/composite (75-ohm)
0.7 Vp-p/non-composite (75-ohm)
PB/B 0.7 Vp-p (75-ohm)
PR/R 0.7 Vp-p (75-ohm)
HD 1.0 - 5.0 Vp-p (high impedance)
VD 1.0 - 5.0 Vp-p (high impedance)
AUDIO IN
(RCA PIN JACK×2) 0.5 Vrms (high impedance)
PC
(HIGH-DENSITY
D-SUB15PIN) R,G,B/0.7 Vp-p (75-ohm)
HD, VD/1.0 - 5.0 Vp-p (high impedance)
AUDIO IN (M3 JACK) 0.5Vrms (high impedance)
SERIAL
EXTERNAL CONTROL
TERMINAL (D-SUB9PIN) RS-232C COMPATIBLE
SPEAKERS (External speakers) (6Ω)16W [8W+8W] (10% THD)
Dimensions (W×H×D): 1,020 mm× 610 mm 89 mm
Weight (Mass) approx. 29.5 kg net (main unit only)
approx. 33.7 kg net (with speakers)
© 2003 Matsushita Electric Industrial Co., Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law.
TOP NEXT

14.34 D-Board (11 of 15) Schematic
Diagram
14.35 D-Board (12 of 15) Schematic
Diagram
14.36 D-Board (13 of 15) Schematic
Diagram
14.37 D-Board (14 of 15) Schematic
Diagram
14.38 D-Board (15 of 15) Schematic
Diagram
14.39 C1-Board, C2-Board, C3-Board,
C4-Board and V1-Board Block Diagram
14.40 C1-Board (1 of 2) Schematic
Diagram
14.41 C1-Board (2 of 2) Schematic
Diagram
14.42 C2-Board (1 of 2) Schematic
Diagram
14.43 C2-Board (2 of 2) Schematic
Diagram
14.44 C3-Board (1 of 2) Schematic
Diagram
14.45 C3-Board (2 of 2) Schematic
Diagram
14.46 C4-Board (1 of 2) Schematic
Diagram
14.47 C4-Board (2 of 2) Schematic
Diagram
14.48 SC-Board Block Diagram
14.49 SC-Board (1 of 2) Schematic
Diagram
14.50 SC-Board (2 of 2) Schematic
Diagram
14.51 SU-Board Block Diagram
14.52 SU-Board (1 of 2) Schematic
Diagram
14.53 SU-Board (2 of 2) Schematic
Diagram
14.54 SD-Board Block Diagram
14.55 SD-Board (1 of 2) Schematic
Diagram
14.56 SD-Board (2 of 2) Schematic
Diagram
14.57 S1-Board, SS-Board, SS2-Board
and SS3-Board Block Diagram
14.58 SS-Board (1 of 2) Schematic
Diagram
14.59 SS-Board (2 of 2) Schematic
Diagram
14.60 Z-Board and H3-Board Block
Diagram
14.61 Z-Board (1 of 2) Schematic
Diagram
14.62 Z-Board (2 of 2) Schematic
Diagram
15 Parts Location
16 Mechanical Replacement Parts List
17 Replacement Parts List
17.1 Relpacement Parts List Notes
17.2 Electrical Replacement List
18 Schematic Diagram for printing
with A4
19 Cover for printing with A4

Table Of Contents
COVER
1 Applicable signals
2 Safety Precautions
2.1 General Guidelines
2.1.1 Leakage Current Cold Check
2.1.2 Leakage Current Hot Check (See Figure 1 .)
3 Prevention of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES) Devices
4 About lead free solder (PbF)
5 PCB Structure sheet of GPH6D chassis
6 Service Hint
7 Location of Lead Wiring
8 Adjustment Procedure
8.1 Driver Set-up
8.1.1 Item / Preparation
8.1.2 Adjustments
8.2 Initialization Pulse Adjust
8.3 P.C.B. (Printed Circuit Board) exchange
8.3.1 Caution
8.3.2 Quick adjustment after P.C.B. exchange

8.4 Adjustment Volume Location
8.5 Test Point Location
9 Service mode
9.1 CAT (computer Aided Test) mode
9.1.1 IIC mode
9.1.2 CD mode
9.1.3 SD mode
9.2 IIC mode structure (following items value is sample data.)
10 Alignment
10.1 Pedestal setting (C)
10.2 Pedestal setting (B)
10.3 NTSC panel white balance
10.4 PAL / SECAM panel white balance
10.5 PC / RGB panel white balance
10.6 HD / 525i / 525p / 625I / 625P panel white balance
11 Trouble shooting guide
11.1 Self Check
11.1.1 Display Indication
11.1.2 Power LED Blinking timing chart
11.2 No Power
11.3 No Picture

11.4 Local screen failure
12 Option Setting
12.1 How to access and setting
12.2 Contents of Option Menu
13 Conductor Views
13.1 PF-Board
13.2 P-Board
13.3 HX-Board
13.4 HY-Board
13.5 J-Board
13.6 D-Board
13.7 C1-Board
13.8 C2-Board
13.9 C3-Board
13.10 C4-Board
13.11 SC-Board
13.12 SU-Board
13.13 SD-Board
13.14 SS, SS2 and SS3-Board
13.15 Z-Board

13.16 V1, S1 and H3-Board
14 Schematic Diagrams
14.1 Schematic Diagram Notes
14.2 Main Block Diagram
14.3 PF-Board Schematic Diagram
14.4 Power Block Diagram
14.5 P-Board (1 of 6) Schematic Diagram
14.6 P-Board (2 of 6) Schematic Diagram
14.7 P-Board (3 of 6) Schematic Diagram
14.8 P-Board (4 of 6) Schematic Diagram
14.9 P-Board (5 of 6) Schematic Diagram
14.10 P-Board (6 of 6) Schematic Diagram
14.11 HX-Board Block Diagram
14.12 HX-Board Schematic Diagram
14.13 HY-Board Block Diagram
14.14 HY-Board (1 of 3) Schematic Diagram
14.15 HY-Board (2 of 3) Schematic Diagram
14.16 HY-Board (3 of 3) Schematic Diagram
14.17 J-Board Block Diagram
14.18 J-Board (1 of 4) Schematic Diagram
14.19 J-Board (2 of 4) Schematic Diagram

14.20 J-Board (3 of 4) Schematic Diagram
14.21 J-Board (4 of 4) Schematic Diagram
14.22 D-Board (1 of 2) Block Diagram
14.23 D-Board (2 of 2) Block Diagram
14.24 D-Board (1 of 15) Schematic Diagram
14.25 D-Board (2 of 15) Schematic Diagram
14.26 D-Board (3 of 15) Schematic Diagram
14.27 D-Board (4 of 15) Schematic Diagram
14.28 D-Board (5 of 15) Schematic Diagram
14.29 D-Board (6 of 15) Schematic Diagram
14.30 D-Board (7 of 15) Schematic Diagram
14.31 D-Board (8 of 15) Schematic Diagram
14.32 D-Board (9 of 15) Schematic Diagram
14.33 D-Board (10 of 15) Schematic Diagram
14.34 D-Board (11 of 15) Schematic Diagram
14.35 D-Board (12 of 15) Schematic Diagram
14.36 D-Board (13 of 15) Schematic Diagram
14.37 D-Board (14 of 15) Schematic Diagram
14.38 D-Board (15 of 15) Schematic Diagram
14.39 C1-Board, C2-Board, C3-Board, C4-Board and V1-Board Block Diagram

14.40 C1-Board (1 of 2) Schematic Diagram
14.41 C1-Board (2 of 2) Schematic Diagram
14.42 C2-Board (1 of 2) Schematic Diagram
14.43 C2-Board (2 of 2) Schematic Diagram
14.44 C3-Board (1 of 2) Schematic Diagram
14.45 C3-Board (2 of 2) Schematic Diagram
14.46 C4-Board (1 of 2) Schematic Diagram
14.47 C4-Board (2 of 2) Schematic Diagram
14.48 SC-Board Block Diagram
14.49 SC-Board (1 of 2) Schematic Diagram
14.50 SC-Board (2 of 2) Schematic Diagram
14.51 SU-Board Block Diagram
14.52 SU-Board (1 of 2) Schematic Diagram
14.53 SU-Board (2 of 2) Schematic Diagram
14.54 SD-Board Block Diagram
14.55 SD-Board (1 of 2) Schematic Diagram
14.56 SD-Board (2 of 2) Schematic Diagram
14.57 S1-Board, SS-Board, SS2-Board and SS3-Board Block Diagram
14.58 SS-Board (1 of 2) Schematic Diagram
14.59 SS-Board (2 of 2) Schematic Diagram
14.60 Z-Board and H3-Board Block Diagram

14.61 Z-Board (1 of 2) Schematic Diagram
14.62 Z-Board (2 of 2) Schematic Diagram
15 Parts Location
16 Mechanical Replacement Parts List
17 Replacement Parts List
17.1 Relpacement Parts List Notes
17.2 Electrical Replacement List
18 Schematic Diagram for printing with A4
19 Cover for printing with A4

Service Manual
TOP NEXT
ORDER NO. ITD0308027C0
D10 Canada: B07
High Definition Plasma Display
●TH-42PHW6EX
TH-42PHD6EX
TH-42PHD6BX
TH-42PHD6UY
GPH6D Chassis
Specifications
Power Source: AC120V 50/60Hz (UY version)
AC220-240V 50/60Hz
(Except UY version model)
Power Consumption: 265 W
Save off 1.6 W, Save on 0.9 W (stand-by condition)
(UY version)
Save off 1.9 W, Save on 1.1 W (stand-by condition)
(Except UY version model)
0.2 W (Power off condition)
(UY version model)
0.4 W (Power off condition)
(Except UY version model)
Plasma Display panel: Drive method AC type
16:9 aspect ratio
Contrast Ratio 3000:1
Screen size: 920 mm (W)× 518 mm (H)
1,056 mm (diagonal)
No. of pixels
786,432 (1,024 (W)× 768 (H))
[3,072× 768 dots]
Operating condition:
Temperature 34°F - 104°F (0°C - 40°C)
Humidity 20% - 80%
Horizontal scanning frequency 15 - 110kHz

Vertical scanning frequency 48 - 120Hz
Connection terminals:
AV
Video in 1.0 Vp-p (75-ohm)
S-VIDEO IN
(MINI DIN 4PIN) Y: 1 Vp-p (75-ohm), C: 0.286 Vp-p (75-ohm)
AUDIO IN
(RCA PIN JACK× 2) 0.5 Vrms (high impedance)
COMPONENT/RGB
Y/G 1.0 Vp-p/composite (75-ohm)
0.7 Vp-p/non-composite (75-ohm)
PB/B 0.7 Vp-p (75-ohm)
PR/R 0.7 Vp-p (75-ohm)
HD 1.0 - 5.0 Vp-p (high impedance)
VD 1.0 - 5.0 Vp-p (high impedance)
AUDIO IN
(RCA PIN JACK×2) 0.5 Vrms (high impedance)
PC
(HIGH-DENSITY
D-SUB15PIN) R,G,B/0.7 Vp-p (75-ohm)
HD, VD/1.0 - 5.0 Vp-p (high impedance)
AUDIO IN (M3 JACK) 0.5Vrms (high impedance)
SERIAL
EXTERNAL CONTROL
TERMINAL (D-SUB9PIN) RS-232C COMPATIBLE
SPEAKERS (External speakers) (6Ω)16W [8W+8W] (10% THD)
Dimensions (W×H×D): 1,020 mm× 610 mm 89 mm
Weight (Mass) approx. 29.5 kg net (main unit only)
approx. 33.7 kg net (with speakers)
© 2003 Matsushita Electric Industrial Co., Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law.
TOP NEXT

1 Applicable signals
TOP PREVIOUS NEXT
TOP PREVIOUS NEXT

2 Safety Precautions
TOP PREVIOUS NEXT
2.1 General Guidelines
2.1.1 Leakage Current Cold Check
2.1.2 Leakage Current Hot Check (See Figure 1 .)
TOP PREVIOUS NEXT

2.1 General Guidelines
TOP PREVIOUS NEXT
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts
which have been overheated or damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation
papers shields are properly installed.
3. After servicing, make the following leakage current checks to prevent the customer from being
exposed to shock hazards.
2.1.1 Leakage Current Cold Check
2.1.2 Leakage Current Hot Check (See Figure 1 .)
TOP PREVIOUS NEXT

2.1.1 Leakage Current Cold Check
TOP PREVIOUS NEXT
1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each
exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts,
etc. When the exposed metallic part has a return path to thechassis, the reading should be
between 1MΩand 5.2MΩ.
When the exposed metal does not have a return path to the chassis, the reading must be
.
Figure 1
TOP PREVIOUS NEXT

2.1.2 Leakage Current Hot Check (See
Figure 1 .)
TOP PREVIOUS NEXT
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this
check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15μF capacitors, between each
exposed metallic part on the set and a good earth ground such as a water pipe, as shown in
Figure 1 .
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across
the resistor.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester
(Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must
not exceed 1/2 milliamp. In case a measurement is outsideof the limits specified, there is a
possibility of a shock hazard, and the equipment should be repaired and rechecked before it is
returned to the customer.
TOP PREVIOUS NEXT

3 Prevention of Electro Static Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
TOP PREVIOUS NEXT
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices.
Examples of typical ES devices are integrated circuits and some field-effect transistorsand semiconductor "chip" components. The following techniques should be used
to help reduce the incidence of component damage caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth
ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, whichshould be removed for potential shock reasons prior to
applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge
sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by conductive foam, alminum foil or comparableconductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly
into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing together of your clothes fabric
or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient todamage an ES device).

TOP PREVIOUS NEXT

4 About lead free solder (PbF)
TOP PREVIOUS NEXT
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
stamped on the back of PCB.
Caution
●Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
●Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
●After applying PbF solder to double layered boards, please check the component side for excess solder which may flow
onto the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also beused.