Panasonic TH-103PF12E User manual

Order Number PCZ0912156CE
Service Manual
High Definition Plasma Display
Model No. TH- 03PF 2E
GPF 2D Chassis
A WARNING
This service informa ion is designed for experienced repair echnicians only and is no designed for use by he general public.
I does no con ain warnings or cau ions o advise non- echnical individuals of po en ial dangers in a emp ing o service a produc .
Produc s powered by elec rici y should be serviced or repaired only by experienced professional echnicians. Any a emp o service
or repair he produc or produc s deal wi h in his service informa ion by anyone else could resul in serious injury or dea h.
TABLE OF CONTENTS PAGE
Safety Precautions--------------------------------------------------------3
1.1. General Guidelines ------------------------------------------------3
1.2. Touch-Curren Check---------------------------------------------3
2 Warning------------------------------------------------------------------------- 4
2.1. Preven ion of Elec ros a ic Discharge (ESD)
o Elec ros a ically Sensi ive (ES) Devices ------------- 4
2.2. Abou lead free solder (PbF) ---------------------------------- 5
3 Service Navigation--------------------------------------------------------6
3.1. Service Hin ---------------------------------------------------------- 6
3.2. Applicable signals ------------------------------------------------- 8
4 Specifications---------------------------------------------------------------9
5 Operating Instructions------------------------------------------------- 0
6 Service M ode-------------------------------------------------------------- 2
6.1. CAT (Compu er Aided Tes ) mode ----------------------- 12
6.2. IIC mode s ruc ure (following i ems value is
sample da a)--------------------------------------------------------16
7 Troubleshooting Guide ----------------------------------------------- 7
7.1. Self Check -----------------------------------------------------------17
7.2. No Power ------------------------------------------------------------19
PAGE
7.3. No Pic ure------------------------------------------------------------19
7.4. Local screen failure --------------------------------------------- 20
8 Service Fixture & Tools-----------------------------------------------2
8.1. SC jig-------------------------------------------------------------------21
9 Disassembly and Assembly Instructions-------------------22
9.1. Rear Cover and Board-----------------------------------------22
9.2. Loca ion of Rear Cover screws -------------------------- 23
9.3. Removal of Side Angle (L), (R) ---------------------------25
9.4. Removal of HDE-Board ------------------------------------- 26
9.5. Removal of HL-Board-----------------------------------------27
9.6. Removal of H5-Board-----------------------------------------27
9.7. Removal of DS-Board----------------------------------------27
9.8. Removal of HX-Board-----------------------------------------28
9.9. Removal of DN-Board----------------------------------------28
9.10. Removal of PB-Board-----------------------------------------29
9.11. Removal of D-Board ------------------------------------------- 29
9.12. Removal of P-Board (MAIN_1) ---------------------------29
9.13. Removal of P-Board (MAIN_2)---------------------------30
9.14. Removal of P-Board (SUB)---------------------------------30
■ ®
Panasonic © Panasonic Corpora ion 2009
Unau horized copying and dis ribu ion is a viola ion
of law.

TH-103PF12E
9.15. Removal of S1-Board and V2-Board ------------------30
9.16. Removal of SU-Board---------------------------------------31
9.17. Removal of SM-Board---------------------------------------32
9.18. Removal of SD-Board---------------------------------------32
9.19. Removal of SC-Board----------------------------------------33
9.20. Removal of SS2-Board ------------------------------------ 34
9.21. Removal of SS3-Board ------------------------------------ 35
9.22. Removal of SS-Board----------------------------------------35
9.23. Removal of Fan -------------------------------------------------36
9.24. Removal of C1-Board (upper)----------------------------37
9.25. Removal of C2-Board (upper) ----------------------------37
9.26. Removal of C3-Board (upper) ----------------------------38
9.27. Removal of C4-Board (upper) ----------------------------38
9.28. Removal of C5-Board (upper) ----------------------------39
9.29. Removal of C6-Board (upper) ----------------------------39
9.30. Removal of C1-Board (lower)-----------------------------39
9.31. Removal of C2-Board (lower)-----------------------------40
9.32. Removal of C3-Board (lower)-----------------------------40
9.33. Removal of C4-Board (lower)-----------------------------40
9.34. Removal of C5-Board (lower) ----------------------------- 41
9.35. Removal of C6-Board (lower) ----------------------------- 41
9.36. Removal of AC Inle --------------------------------------------41
9.37. Removal of Fron Glass, V1, V3-Board and
Cabine Assy------------------------------------------------------42
9.38. Removal of Plasma Display Panel --------------------- 45
0 Measurements and Adjustments-------------------------------50
10.1. Adjus men Procedure ----------------------------------------50
10.2. Adjus men --------------------------------------------------------- 55
Block Diagram------------------------------------------------------------59
11.1. Diagram No es-------------------------------------------------- 59
11.2. Main Block (1 of 2) Diagram --------------------------------- 60
11.3. Main Block (2 of 2) Diagram --------------------------------- 61
11.4. Block (1 of 8) Diagram----------------------------------------62
11.5. Block (2 of 8) Diagram----------------------------------------63
11.6. Block (3 of 8) Diagram----------------------------------------64
11.7. Block (4 of 8) Diagram----------------------------------------65
11.8. Block (5 of 8) Diagram----------------------------------------66
11.9. Block (6 of 8) Diagram----------------------------------------67
11.10. Block (7 of 8) Diagram----------------------------------------68
11.11. Block (8 of 8) Diagram----------------------------------------69
2 Wiring Connection Diagram --------------------------------------- 7
12.1. Wiring (1) ------------------------------------------------------------71
12.2. Wiring (2)------------------------------------------------------------72
12.3. Wiring (3)------------------------------------------------------------73
3 Exploded View and Replacement Parts List ------------- 74
2

TH-103PF12E
Safety Precautions
. . General Guidelines
1. When conduc ing repairs and servicing, do no a emp o modify he equipmen , i s par s or i s ma erials.
2. When wiring uni s (wi h cables, flexible cables or lead wires) are supplied as repair par s and only one wire or some of he
wires have been broken or disconnec ed, do no a emp o repair or re-wire he uni s. Replace he en ire wiring uni ins ead.
3. When conduc ing repairs and servicing, do no wis he Fas on connec ors bu plug hem s raigh in or unplug hem s raigh
ou .
4. When servicing, observe he original lead dress.If a shor circui is found, replace all par s which have been overhea ed or
damaged by he shor circui .
5. Af er servicing, see o i ha all he pro ec ive devices such as insula ion barriers, insula ion papers shields are properly
ins alled.
6. Af er servicing, make he following leakage curren checks o preven he cus omer from being exposed o shock hazards.
.2. Touch-Current Check
1. Plug he AC cord direc ly in o he AC ou le . Do no use an isola ion ransformer for his check.
2. Connec a measuring ne work for ouch curren s be ween each exposed me allic par on he se and a good ear h ground
such as a wa er pipe, as shown in Figure 1.
3. Use Leakage Curren Tes er (Simpson 228 or equivalen ) o measure he po en ial across he measuring ne work.
4. Check each exposed me allic par , and measure he vol age a each poin .
5. Reserve he AC plug in he AC ou le and repea each of he above measure.
6. The po en ial a any poin (TOUGH CURRENT) expressed as vol age U1 and U2, does no exceed he following values:
For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);
For d. c.: U1 = 1.0 V,
Note:
The limi value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond o he values 0.7 mA (peak) a. c. and 2.0
mA d. c.
The limi value U1 = 35 V (peak) for a. c. correspond o he value 70 mA (peak) a. c. for frequencies grea er han 100 kHz.
7. In case a measuremen is ou of he limi s specified, here is a possibili y of a shock hazard, and he equipmen should be
repaired and rechecked before i is re urned o he cus omer.
Measuring network for TOUCH CURRENTS
COLD
WATER PIPE
(EARTH GROUND)
Rs=
500Q_ L Cs= 0.22|jF
0kQ
-I k
------- 1
Ro=
---------------
J 500Q
'
Ui =
r
= 0.022|jF ( V )
JQ LjJ JUUii U —|— и.игігфГ ^ V J | U2 (V)
APPLIANCES
EXPOSED
METAL PARTS
Resistance values in ohms (Q)
V: Voltmeter or oscilloscope
(r.m.s. or peak reading)
Input resistance: > MQ
Input capacitance: < 200 pF
Frequency range: 5 Hz to MHz and d.c. respectively
NOTE - Appropriate measures should be taken to obtain the correct value in case of non-sinusoidal waveforms.
Figure 1
3

TH-103PF12E
2 Warning
2. . Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi
tive (ES) Devices
Some semiconduc or (solid s a e) devices can be damaged easily by s a ic elec rici y. Such componen s commonly are called Elec
ros a ically Sensi ive (ES) Devices. Examples of ypical ES devices are in egra ed circui s and some field-effec ransis ors and
semiconduc or “chip” componen s. The following echniques should be used o help reduce he incidence of componen damage
caused by elec ros a ic discharge (ESD).
1. Immedia ely before handling any semiconduc or componen or semiconduc or-equipped assembly, drain off any ESD on your
body by ouching a known ear h ground. Al erna ively, ob ain and wear a commercially available discharging ESD wris s rap,
which should be removed for po en ial shock reasons prior o applying power o he uni under es .
2. Af er removing an elec rical assembly equipped wi h ES devices, place he assembly on a conduc ive surface such as alumi
num foil, o preven elec ros a ic charge buildup or exposure of he assembly.
3. Use only a grounded- ip soldering iron o solder or unsolder ES devices.
4. Use only an an i-s a ic solder removal device. Some solder removal devices no classified as “an i-s a ic (ESD pro ec ed)” can
genera e elec rical charge sufficien o damage ES devices.
5. Do no use freon-propelled chemicals. These can genera e elec rical charges sufficien o damage ES devices.
6. Do no remove a replacemen ES device from i s pro ec ive package un il immedia ely before you are ready o ins all i . (Mos
replacemen ES devices are packaged wi h leads elec rically shor ed oge her by conduc ive foam, aluminum foil or compara
ble conduc ive ma erial).
7. Immedia ely before removing he pro ec ive ma erial from he leads of a replacemen ES device, ouch he pro ec ive ma erial
o he chassis or circui assembly in o which he device will be ins alled.
Caution
Be sure no power is applied o he chassis or circui , and observe all o her safe y precau ions.
8. Minimize bodily mo ions when handling unpackaged replacemen ES devices. (O herwise ham less mo ion such as he brush
ing oge her of your clo hes fabric or he lif ing of your foo from a carpe ed floor can genera e s a ic elec rici y (ESD) sufficien
o damage an ES device).
4

TH-103PF12E
2.2. About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in i 's manufac ure due o environmen al conserva ion issues. For service and repair work, we'd
sugges he use of Pb free solder as well, al hough Pb solder may be used.
PCBs manufac ured using lead free solder will have he PbF wi hin a leaf Symbol PbF s amped on he back of PCB.
Caution
• Pb free solder has a higher mel ing poin han s andard solder. Typically he mel ing poin is 50 ~ 70 °F (30~40 °C) higher. Please
use a high empera ure soldering iron and se i o 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will end o splash when hea ed oo high (abou 1100 °F or 600 °C).
If you mus use Pb solder, please comple ely remove all of he Pb free solder on he pins or solder area before applying Pb sol
der. If his is no prac ical, be sure o hea he Pb free solder un il i mel s, before applying Pb solder.
• Af er applying PbF solder o double layered boards, please check he componen side for excess solder which may flow on o he
opposi e side. (see figure below)
component component
remove all of the ^ІП\
excess solder
slice
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This produc uses Sn+Ag+Cu ( in, silver, copper) solder. How
ever, Sn+Cu ( in, copper), Sn+Zn+Bi ( in, zinc, bismu h) solder can also be used.
5
www.panatex.com.ua

TH-103PF12E
3 Service Navigation
3. . Service Hint
6

TH-103PF12E
Board Name Func ion Board Name Func ion
DN Digi al Signal Processor, Microcompu er S1 Power swi ch
D Forma Conver er, Plasma AI Processor C1 (upper) Da a drive (1) (upper)
Sub-Field Processor C2 (upper) Da a drive (2) (upper)
DS Slo In erface (Audio / Video / Sync Inpu Swi ch), C3 (upper) Da a drive (3) (upper)
Sync Processor, Audio Processor, DC-DC Conver er C4 (upper) Da a drive (4) (upper)
SC Scan drive C5 (upper) Da a drive (5) (upper)
SU Scan ou (Upper) C6 (upper) Da a drive (6) (upper)
Non serviceable. C1 (lower) Da a drive (1) (lower)
SU-Board should be exchanged for service. C2 (lower) Da a drive (2) (lower)
SM Scan ou (Middle) C3 (lower) Da a drive (3) (lower)
Non serviceable. C4 (lower) Da a drive (4) (lower)
SM-Board should be exchanged for service. C5 (lower) Da a drive (5) (lower)
SD Scan ou (Lower) C6 (lower) Da a drive (6) (lower)
Non serviceable. P(MAIN_1) Power supply
SD-Board should be exchanged for service. P(MAIN_2) Power supply
SS Sus ain drive P(SUB) Power supply
SS2 Sus ain ou (Upper) PB Fan Con rol
SS3 Sus ain ou (Lower) HX PC / RS-232C
V1 LED-G, R H5 Audio Ou erminal
V2 Key swi ch HDE DVI-D erminal
V3 Remo e receiver HL Componen Video erminal (BNC), LAN erminal
7

TH-103PF12E
3.2. Applicable signals
*Mark: Applicable inpu signal
Signal name Horizon al frequency
(kHz) Ver ical frequency (Hz)
C O MPO NENT/
RGB IN/PC IN
(Do clock (MHz))
DVI-D IN
(Do clock (MHz))
1 525 (480) / 60І 15.73 59.94 * (13.5)
2 525 (480) / 60p 31.47 59.94 * (27.0) *5 * (27.0)
3 625 (575) / 50І 15.63 50.00 * (13.5)
4 625 (575) / 50p 31.25 50.00 * (27.0)
5 625 (576) / 50p 31.25 50.00 * (27.0)
6 750 (720) / 60p 45.00 60.00 * (74.25) * (74.25)
7 750 (720) / 50p 37.50 50.00 * (74.25) * (74.25)
8 1,125 (1,080) / 60p 67.50 60.00 * (148.5) *1 * (148.5)
91,125 (1,080) / 60І 33.75 60.00 * (74.25) *1 * (74.25)
10 1,125 (1,080) / 50p 56.26 50.00 * (148.5) *1 * (148.5)
11 1,125 (1,080) / 50І 28.13 50.00 * (74.25) *1 * (74.25)
12 1,125 (1,080) / 24sF 27.00 48.00 * (74.25) *2
13 1,125 (1,080) / 30p 33.75 30.00 * (74.25) *1 * (74.25)
14 1,125 (1,080) / 25p 28.13 25.00 * (74.25) *1 * (74.25)
15 1,125 (1,080) / 24p 27.00 24.00 * (74.25) *1 * (74.25)
16 1,250 (1,080) / 50І 31.25 50.00 * (74.25) *3
17 2,048 x 1,080 / 24sF * 7 27.00 48.00
18 2,048 x 1,080 / 24p *7 27.00 24.00
19 640 x 400 @70 Hz 31.46 70.07 * (25.17)
20 640 x 480 @60 Hz 31.47 59.94 * (25.18) *6 * (25.18)
21 640 x 480 @72 Hz 37.86 72.81 * (31.5)
22 640 x 480 @75 Hz 37.50 75.00 * (31.5)
23 640 x 480 @85 Hz 43.27 85.01 * (36.0)
24 800 x 600 @56 Hz 35.16 56.25 * (36.0)
25 800 x 600 @60 Hz 37.88 60.32 * (40.0) * (40.0)
26 800 x 600 @72 Hz 48.08 72.19 * (50.0)
27 800 x 600 @75 Hz 46.88 75.00 * (49.5)
28 800 x 600 @85 Hz 53.67 85.06 * (56.25)
29 852 x 480 @60 Hz 31.47 59.94 * (33.54) *6 * (34.24)
30 1,024 x 768 @50 Hz 39.55 50.00 * (51.89)
31 1,024 x 768 @60 Hz 48.36 60.00 * (65.0) * (65.0)
32 1,024 x 768 @70 Hz 56.48 70.07 * (75.0)
33 1,024 x 768 @75 Hz 60.02 75.03 * (78.75)
34 1,024 x 768 @85 Hz 68.68 85.00 * (94.5)
35 1,066 x 600 @60 Hz 37.64 59.94 * (53.0) * (53.0)
36 1,152 x 864 @60 Hz 53.70 60.00 * (81.62)
37 1,152 x 864 @75 Hz 67.50 75.00 * (108.0)
38 1,280 x 768 @60 Hz 47.70 60.00 * (80.14)
39 1,280 x 960 @60 Hz 60.00 60.00 * (108.0)
40 1,280 x 960 @85 Hz 85.94 85.00 * (148.5)
41 1,280 x 1,024 @ 60 Hz 63.98 60.02 * (108.0) * (108.0)
42 1,280 x 1,024 @75 Hz 79.98 75.03 * (135.0)
43 1,280 x 1,024 @85 Hz 91.15 85.02 * (157.5)
44 1,366 x 768 @50 Hz 39.55 50.00 * (69.92)
45 1,366 x 768 @60 Hz 48.36 60.00 * (86.71) * (87.44)
46 1,400 x 1,050 @60 Hz 65.22 60.00 * (122.61)
47 1,600 x 1,200 @60 Hz 75.00 60.00 * (162.0) * (162.0)
48 1,600 x 1,200 @65 Hz 81.25 65.00 * (175.5)
49 1,920 x 1,080 @60 Hz 67.50 60.00 * (148.5) *4 * (148.5)
50 1,920 x 1,200 @60 Hz 74.04 59.95 * (154.0)
51 Macin osh13” (640 x 480) 35.00 66.67 * (30.24)
52 Macin osh16” (832 x 624) 49.72 74.54 * (57.28)
53 Macin osh21 ” (1,152 x 870) 68.68 75.06 * (100.0)
*1: Based on SMPTE 274M s andard.
*2: Based on SMPTE RP211 s andard.
*3: Based on SMPTE 295M s andard.
*4: The inpu signal is recognized as 1,125 (1,080) / 60p.
*5: When selec ed he RGB forma and 525p signal inpu o he Mini D-sub 15P erminal, i is recognized as VGA60Hz signal.
*6: When inpu ed VGA60Hz forma signal from he o her han Mini D-sub 15P erminal, i is recognized as 525p signal.
*7: Based on SMPTE 292M and 372M s andards. These signals can be received when he Dual Link HD-SDI Terminal
Board (TY-FB11DHD) is ins alled.
Note: Signals wi hou above speci ea ion may no be displayed properly.
8

TH-103PF12E
4 Specifications
Power Source
Power Consump ion
Power on
S and-by condi ion
Power off condi ion
Plasma Display panel
Screen size
(No. of pixels)
Opera ing condi ion
Tempera ure
Humidi y
Applicable signals
Scanning forma
PC signals
Connec ion erm inals
DVI-D IN
LAN
COMPONENT / RGB IN
PC IN
SERIAL
AUDIO OUT
220-240 V AC, 50/60Hz
1450 W
Save OFF 1.2 W, Save ON 0.7 W
0.4 W
Drive me hod: AC ype 103-inch,
16:9 aspec ra io
2,269 mm (W) x 1,276 mm (H) x 2,603 mm (diagonal)
2,073,600 (1,920 (W) x 1,080 (H)) [5,760 x 1,080 do s]
0 °C - 40 °C
20 % - 80 %
50p, 750 (720) / 60p • 50p, 1125 (1080) /
24sF, 1250 (1080) / 50І
525 (480) / 60І • 60p, 625 (575) / 50І
60І • 60p • 50І • 50p • 24p • 25p • 30p
VGA, SVGA, XGA, SXGA
U XG A ..... (compressed)
Horizon al scanning frequency 15 - 110 kHz
Ver ical scanning frequency 48 - 120 Hz
Video Inpu DVI-D 24 Pin x 1
compliance wi h DVI Revision 1.0
Audio Inpu S ereo mini jack (M3) x 1
0.5 Vrms
Con en Pro ec ion Compa ible wi h HDCP 1.1
RJ45 10BASE-T / 100BASE-TX, compa ible wi h PJLink™
Y / G (BNC)
PB/B (BNC), Pr /R (BNC)
Audio Inpu
(HIGH-DENSITY Mini-D-SUB 15PIN)
VBS (use HD por )
B/ Pb/ Cb
R/ Pr/ Cr
HD / VD
Audio Inpu
EXTERNAL CONTROLTERMINAL (D-SUB 9PIN)
RCA PIN JACK x 2 (L / R)
wi h sync 1.0 Vp-p (75-ohm)
0.7 Vp-p (75-ohm)
S ereo mini jack (M3) x 1
0.5 Vrms
Y or G wi h sync 1.0 Vp-p (75-ohm)
Y or G wi hou sync 0.7 Vp-p (75-ohm)
0.7 Vp-p (75-ohm)
0.7 Vp-p (75-ohm)
1.0 - 5.0 Vp-p (high impedance)
wi h pic ure 1.0 Vp-p (high impedance)
wi hou pic ure 0.3 Vp-p (high impedance)
S ereo mini jack (M3) x 1
0.5 Vrms
RS-232C COMPATIBLE
[INPUT 1KHz / 0dB, 10Kohm Load]
EUR7636090R
OUTPUT LEVEL : VARIABLE ( <X> - 0 dB)
Accessories Supplied
Remo e Con rol Transmi 
er
Ba eries
Fixing band
Ferri e core
Noise cu fil er
Dimensions (W x H x D)
Mass (weigh )
No e:
• Design and specifica ions are subjec o change wi hou no ice. Mass and dimensions shown are approxima e
• This equipmen complies wi h he EMC s andards lis ed below.
EN55022, EN55024, EN61000-3-2, EN61000-3-3.
R6 Size x 2
TMME203 x 2
J0KG00000146 (Se of 2)
TXZDM011MBE
2,412 mm x 1,419 mm x 129 mm (141 mm when including pro ruding por ion of slo s)
approx. 201.0 kg ne
9

TH-103PF12E
5 Operating Instructions
10

TH-103PF12E
Op ion Menu for GPF12D series
GPF 2D chassis series have special function and operation setting facility called Option Menu. This Option Menu is useful
for special function required customers. This should be set at the installation stage.
Op ion menus defaul se ing Con en s
Weekly Command Timer --- Se s Weekly Command Timer.
Onscreen display On Enable/Disable o display inpu mode indica ion af er power on and no signal
indica ion.
Ini ial INPUT Off Se s he ini ial inpu mode when he power is urned on. Allow inpu mode selec
ion while power is on.
Ini ial VOL level Off Se s he ini ial volume level when he power is urned on. Allow Volume con rol
while power is on.
Maximum VOL Level Off Se s he maximum volume o desired level. Volume canno exceed his level.
INPUT lock Off Fixes he inpu mode o AV, Componen /RGB or PC. Can no change inpu
mode by inpu selec ion key.
Bu on lock Off Enable/Disable bo om opera ion bu ons (Inpu , Menu, En er and/or volume up/
down)
Remocon User Level Off Remo e key invalida ion.
Off: Valid key is all key of remo e.
User1: Valid key are only S and-by (ON/OFF), Inpu , Direc inpu , Pic ure, Sur
round, Sound mu e On/Off, and volume adjus men .
User2: Valid key is only S and-by (ON/OFF).
User3: All keys are null and void
Off- imer func ion Enable Off- imer opera ion Enable/Disable.
Ini ial Power Mode Normal Se s he power mode of he uni for when he power recovers from failure or
af er plugging off and in again.
ID selec 0 Se ID number from 0 o 100.
Remo e ID Off Remo e ID func ion On/Off.
(While he Remo e ID on, s andard remo e func ion can no con rol he uni .)
Serial ID Off Serial ID func ion On/Off
Display size Off Display size func ion On/Off
S udio W/B Off S udio W/B func ion On/Off
S udio Gain Off S udio Gain func ion On/Off
Slo power Off Se s he slo power mode while he power is urned on.
Allow Op ional Terminal Board inser Slo s while power is on.
Power On Screen Delay Off You can se he power-on delay ime of he displays o reduce he power load,
when you press (D/I o urn on he mul iple displays ha are se oge her, for
example, on MULTI DISPLAY sys em.
Se each display's se ing individually.
Clock Display Off Clock Display func ion On/Off.
All Aspec Defaul Aspec mode: defaul /All aspec mode.
Au o Se up Manual Se s he opera ional mode of he au oma ic posi ion adjus men in he POS./
SIZE memu.
Ro a e Off Ro a e func ion On/Off
Serial Slo Selec Slo 1 Selec s he slo which communica es serial.
No e: The se ing of an ex ernal command can be se only from he fixed serial
erminal.
Note:
When bo h main uni bu ons and remo e con rol are disabled due o he “Bu on lock”, “Remocon User level” or “Remo e ID”
adjus men s, se all he values “Off” so ha all he bu ons are enabled again.
Press he “Volume down” bu on on main uni oge her wi h “R” bu on on he remo e con rol and hold for more han 5 seconds.
The “SHIPPING" menu is displayed and he lock is released when i disappears.
11

TH-103PF12E
6 Service Mode
6. . CAT (Computer Aided Test) mode
To exi he CAT mode, access he ID mode and swi ch off he main power.
6. . . IIC mode
Selec he IIC mode by Up/Down button on he remo e con rol a he fron page of CAT mode and hen press he Action button on
he remo e con rol.
OSD
024x768/60Hz
6:9 DYNAMIC Hi
PANEL W/B Adj. <4-
R DRIVE <■
CO C 04-
-------------- Ж"
How to use the IIC mode.
■ Subject
■ Item
■ New data
■Original data
1. Selec he alignmen Subject by Up/Down
buttons on he remo e con rol.
2. Selec he alignmen I em by Left/Right buttons
on he remo e con rol.
3. Adjus optimum setting by Volume Up/Down
buttons on he remo e con rol.
4. The data is memorized when press he R button
on he remo e con rol or change he alignmen
Subjec (or I ems).
Subjec and i em are men ioned on “IIC mode s ruc ure”.
To exi he IIC mode, press he R button on he remo e con rol.
12

TH-103PF12E
6. .2. CD mode
Selec he CD mode by Up/Down button on he remo e con rol a he fron page of CAT mode and hen press he Mute button on
he remo e con rol more han 3 seconds.
CDMON ITOR-MCU
MONITOR-EEPROM
MONITOR-EEPROM Change Addr
Data
PANEL-MCU
PANEL-EEPROM
PANEL-FPGA
PANEL-PDROM
BOARD EEPROM *****
BOARD
PTCT
.0000Ғ 2 і OK ; ^
53. 00 і 6 2B :
4, -------------- i_
00 0
0 ж 0 *
.08 Чч
30. 27
.02
30. 09
------ ------
00. 00. 00. 00. 00. *
--- Factory use
New data
Original data
-- - SOS history
Memory da a change
Address . Change by Up/Down buttons on he
remo e con rol.
Change by Left/Right buttons on he remo e con rol.
Da a 0 0 ■ Change by VOL Up/Down buttons on he
remo e con rol.
The da a is memorized when swi ch off he main power.
To exi he CD mode, press he R button on he remo e con rol.
6. .3. NW mode
Note :
To use he ne work func ion, se each "Ne work Se up" se ing and make sure o se he "Con rol I/F Selec " o "LAN".
Selec he IIC mode by Up/Down button on he remo e con rol a he fron page of CAT mode and hen press he Action button on
he remo e con rol.
To exi he NW mode, press he R button on he remo e con rol.
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TH-103PF12E
6. .4. SD mode
Selec he SD mode by Up/Down button on he remo e con rol a he fron page of CAT mode and hen press he Action button on
he remo e con rol.
To exi he SD mode, press he R button on he remo e con rol.
6. .5. MS mode
Selec he MS mode by Up/Down button on he remo e con rol a he fron page of CAT mode and hen press he Mute button on
he remo e con rol more han 3 seconds.
To exi he MS mode, press he R button on he remo e con rol.
Caution:
Market Select should be set after exchange of DN-Board.
Destination number
Number Des ina ion Number Des ina ion
0 Japan 16 --
1 Nor h America 17 --
2 Europe 18 China
3 O hers 19 China (Ho el)
4 Bri ain 20 Russia
5 Taiwan 21 Russia (Ho el)
6 Thailand 22 Hong Kong
7-- 23 --
8 Japan (Ho el) 24 --
9 Nor h America (Ho el) 25 --
10 Europe (Ho el) 26 --
11 -- 27 --
12 Bri ain (Ho el) 28 Middle Eas /Hong Kong
13 -- 29 Middle Eas /Hong Kong (Ho el)
14 Thailand (Ho el) 30 Aus ralia
15 -- 31 Aus ralia (Ho el)
Defaul se ing
Number Des ina ion
1 Nor h America
14

TH-103PF12E
6. .6. ID mode
Selec he ID mode by Up/Down button on he remo e con rol a he fron page of CAT mode and hen press he Mute button on
he remo e con rol more han 3 seconds.
To exi he ID mode, press he R button on he remo e con rol.
15

TH-103PF12E
6.2. IIC mode structure (following items value is sample data)
16

TH-103PF12E
7 Troubleshooting Guide
7. . Self Check
7. . . Display Indication
1. Self-check is used o au oma ically check he bus line
con rolled circui of he Plasma display.
2. To ge in o he Self-check mode, press he volume down
bu on on he cus omer con rols a he bo om of he se ,
a he same ime pressing he OFF-TIMER bu on on he
remo e con rol, and he screen will show.
If he IIC por s have been checked and found o be incorrec
Or no loca ed hen “ - - ” will appear in place of “OK”
“01” in he line of he “PTCT” means he number of blinks of he
Power LED is 1. (Reference o 7.1.2)
“H09” in he line of he “PTCT” is he error code.
To exi he CAT mode swi ch off he main power.
Note:
The line of he “PTCT” displays when you ge in o he Self
check mode for he firs ime only af er he Power LED
blinks.
17

TH-103PF12E
7. .2. Power LED Blinking timing chart
1. Subjec
Informa ion of LED Blinking iming char .
2. Con en s
When an abnormali y has occurred o he uni , he pro ec ion circui opera es and rese s o he s and by mode. A his ime,
he defec ive block can be iden ified by he number of blinks of he Power LED on he fron panel of he uni .
Refer o 7.1.1 Display Indica ion
About blinking LED
18

TH-103PF12E
7.2. No Power
Firs check poin
There are following 3 s a es of No Power indica ion by power LED.
1. No li .
2. Green is li hen urns red blinking a few seconds la er.
3. Only red is li .
7.3. No Picture
NO Picture
Check NG
19

TH-103PF12E
Drive circui s LED indica or
SC board SS board
Ґ \ ґ \
LED LED ^ " n '
\
\ /
-o -
/ \
— D 6583 D 6253
V J
7.4. Local screen failure
Plasma display may have local area failure on he screen. Fig - 1 is he possible defec P.C.B. for each local area.
C6 board C5 board
(upper) (upper)
D board D board
_A ___
C4 board
(upper)
D board
'V '
C3 board
(upper)
D board
_ A _ _
C2 board C board
(upper) (upper)
D board D board
. .
__ __ . .
" ■ ■
V
\
r - - - - - - -
~ V
C board \ C2 board
(lower) \ (lower)
D board 'D board
V
C3 board
(lower)
D board
V
C4 board
(lower)
D board
~ V "
C5 board
(lower)
D board
SU board
■SM board
SD board
SS board
S- SC board
D board
C6 board
(lower)
D board
Panel (Thin vertical line)
<Local screen failure chart>
Fig - 1
20