Panasonic TH-42PF30U User manual

© Panasonic Corporation 2011
Unauthorized copying and distribution is a violation
of law.
Order Number MTNC110669CE
B34 Canada: B62
High Definition Plasma Display
Model No. TH-42PF30U
GPF14DMON Chassis
TABLE OF CONTENTS PAGE PAGE
1 Safety Precautions----------------------------------------------- 3
1.1. General Guidelines---------------------------------------- 3
2 Warning-------------------------------------------------------------- 4
2.1. Prevention of Electrostatic Discharge (ESD)
to Electrostatically Sensitive (ES) Devices---------- 4
2.2. About lead free solder (PbF)---------------------------- 5
3 Service Navigation----------------------------------------------- 6
3.1. Service Hint------------------------------------------------- 6
3.2. Applicable signals ----------------------------------------- 7
4 Specifications ----------------------------------------------------- 9
5 Operating Instructions-----------------------------------------10
6 Service Mode -----------------------------------------------------12
6.1. CAT (Computer Aided Test) mode -------------------12
6.2. IIC mode structure (following items value is
sample data)-----------------------------------------------16
7 Troubleshooting Guide----------------------------------------17
7.1. Self Check--------------------------------------------------17
7.2. No Power---------------------------------------------------20
7.3. No Picture --------------------------------------------------20
7.4. Local screen failure-------------------------------------- 21
8 Disassembly and Assembly Instructions--------------- 22
8.1. Removal of Rear Cover --------------------------------22
8.2. Removal of Slot Block ---------------------------------- 22
8.3. Removal of DS-Board----------------------------------- 22
8.4. Removal of D-Board------------------------------------- 22
8.5. Removal of HX-Board----------------------------------- 22
8.6. Removal of A-Board------------------------------------- 23
8.7. Removal of Fan-------------------------------------------23
8.8. Removal of P-Board------------------------------------- 24
8.9. Removal of AC Inlet Assy----------------------------- 24
8.10. Removal of H3-Board----------------------------------- 25
8.11. Removal of SN-Board-----------------------------------25
8.12. Removal of SS-Board----------------------------------- 25
8.13. Removal of S1-Board----------------------------------- 26
8.14. Removal of C1-Board----------------------------------- 26
8.15. Removal of C2-Board----------------------------------- 26
8.16. Removal of Front Glass, V1, V2-Board and
Cabinet Assy---------------------------------------------- 27

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8.17. Removal of Plasma Display Panel-------------------29
9 Measurements and Adjustments --------------------------33
9.1. Adjustment-------------------------------------------------33
9.2. Adjustment-------------------------------------------------34
10 Block Diagram ---------------------------------------------------39
10.1. Main Block Diagram ------------------------------------39
10.2. Block (1 of 5) Diagram----------------------------------40
10.3. Block (2 of 5) Diagram----------------------------------41
10.4. Block (3 of 5) Diagram----------------------------------42
10.5. Block (4 of 5) Diagram----------------------------------43
10.6. Block (5 of 5) Diagram----------------------------------44
11 Wiring Connection Diagram---------------------------------45
11.1. Wiring (1)---------------------------------------------------45
11.2. Wiring (2)---------------------------------------------------46
11.3. Wiring (2)---------------------------------------------------47
12 Schematic Diagram---------------------------------------------48
13 Printed Circuit Board ------------------------------------------48
14 Exploded View and Replacement Parts List-----------48
14.1. Exploded View--------------------------------------------48
14.2. Electrical Replacement Parts List--------------------48

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1 Safety Precautions
1.1. General Guidelines
1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the
wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3. When conducting repairs and servicing, do not twist the Fasten connectors but plug them straight in or unplug them straight
out.
4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the
two prongs on the plug.
2. Measure the resistance value, with an ohmmeter,
between the jumpered AC plug and each exposed metal-
lic cabinet part on the equipment such as screwheads,
connectors, control shafts, etc. When the exposed metal-
lic part has a return path to the chassis, the reading
should be between 1Mohm and 5.2Mohm.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
1.1.2. Leakage Current Hot Check (See
Figure 1 .)
1. Plug the AC cord directly into the AC outlet. Do not use
an isolation transformer for this check.
2. Connect a 1.5kohm, 10 watts resistor, in parallel with a
0.15µF capacitors, between each exposed metallic part
on the set and a good earth ground such as a water pipe,
as shown in Figure 1 .
3. Use an AC voltmeter, with 1000 ohms/volt or more sensi-
tivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the volt-
age at each point.
5. Reverse the AC plug in the AC outlet and repeat each of
the above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a mea-
surement is outside of the limits specified, there is a pos-
sibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the cus-
tomer.

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TH-42PF30U
2 Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-
ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).

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TH-42PF30U
2.2. About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

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TH-42PF30U
3 Service Navigation
3.1. Service Hint
Board Name Function Board Name Function
A Digital Signal Processor, Microcomputer
Audio Processor, Speaker Out Amplifier C2 Data drive (Left)
S1 Power switch
DS Slot Interface V1 Remote receiver, LED-G, R
D Format Converter, Plasma AI Processor
Sub-Field Processor, Sync Processor V2 Key switch
P Power supply
SN Scan drive, Scan out H3 Speaker terminal (R)
SS Sustain drive, Sustain out HX PC / RS-232C_Input terminal, 3D Signal out, speaker
terminal (L)
C1 Data drive (Right)

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3.2. Applicable signals

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4 Specifications
Power Source 110 - 127 V AC, 50/60Hz
Power Consumption
Rated Power Consumption 390 W
Stand-by condition Save OFF 0.7 W, Save ON 0.4 W
Power off condition 0.2 W
Plasma Display panel Drive method: AC type 42-inch,
16:9 aspect ratio
Screen size 36.2 inch (921 mm) (W) ×20.4 inch (518 mm) (H) ×41.6 inch (1,057 mm) (diagonal)
(No. of pixels) 2,073,600 (1,920 (W) ×1,080 (H)) [5,760 ×1,080 dots]
Operating condition
Temperature 32 °F - 104 °F (0 °C - 40 °C)
Humidity 20 % - 80 %
Applicable signals
Color System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 525 (480) / 60i 60p, 625 (575) / 50i 50p, 750 (720) / 60p 50p, 1125 (1080) /
60i 60p 50i 50p 24p 25p 30p 24sF, 1250 (1080) / 50i
PC signals VGA, SVGA, XGA, SXGA
UXGA ..... (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
Connection terminals
LAN RJ45 10BASE-T/100BASE-TX, compatible with PJLinkTM
AV IN VIDEO BNC 1.0 Vp-p (75-ohm)
AUDIO L-R RCA Pin jack ×2 0.5 Vrms
HDMI TYPE A Connector
COMPONENT / RGB IN
Y / G BNC with sync 1.0 Vp-p (75-ohm)
PB/CB/B BNC 0.7 Vp-p (75-ohm)
PR/CR/R BNC 0.7 Vp-p (75-ohm)
AUDIO L-R RCA PIN JACK ×2 0.5 Vrms
DVI-D IN DVI-D 24 Pin Compliance with DVI Revision 1.0
Content Protection Compatible with HDCP 1.1
AUDIO Stereo mini jack (M3) ×1 0.5 Vrms, Shared with PC IN
PC IN High-Density Mini D-sub 15 Pin Y or G with sync 1.0 Vp-p (75-ohm)
Y or G without sync 0.7 Vp-p (75-ohm)
PB/ CB/ B:0.7 Vp-p (75-ohm)
PR/ CR/ R:0.7 Vp-p (75-ohm)
HD / VD:1.0 - 5.0 Vp-p (high impedance)
AUDIO Stereo mini jack (M3) ×1 0.5 Vrms, Shared with DVI-D IN
SERIAL External Control Terminal
D-sub 9 Pin RS-232C compatible
3D SHUTTER OUT for 3D IR TRANSMITTER
3D SHUT-
TER OUT M3 jack ×1
DC 8V OUT Center plus, for EIAJ 4mm plug
EXT SP Speaker Terminal 6-ohm, 16 W [8 W + 8 W] (10 % THD)
Accessories Supplied
Remote Control Transmitter N2QAYB000535
Batteries AA Size ×2
Clamper TMME289 ×1
Dimensions (W ×H ×D) 40.2 inch (1,020 mm) ×24.1 inch (610 mm) ×3.5 inch (89 mm)
Mass (weight)
main unit only approx. 56.3 lbs
with speakers approx. 65.1 lbs
Note:
• Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.

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5 Operating Instructions