Panasonic TH-50VX100U User manual

© Panasonic Corporation 2009.
Unauthorized copying and distribution is a violation
of law.
Order Number ITD0901002CE
B34 Canada: D10
High Definition Plasma Display
Model No. TH-50VX100U
TH-50VX100E
GPF11D Chassis
TABLE OF CONTENTS PAGE PAGE
1 Safety Precautions----------------------------------------------- 3
1.1. General Guidelines---------------------------------------- 3
1.2. Touch-Current Check------------------------------------- 3
2 Warning-------------------------------------------------------------- 4
2.1. Prevention of Electrostatic Discharge (ESD)
to Electrostatically Sensitive (ES) Devices---------- 4
2.2. About lead free solder (PbF)---------------------------- 5
3 Service Navigation----------------------------------------------- 6
3.1. Service Hint------------------------------------------------- 6
3.2. Applicable signals ----------------------------------------- 7
4 Specifications ----------------------------------------------------- 9
5 Operating Instructions-----------------------------------------10
6 Service Mode -----------------------------------------------------12
6.1. CAT (Computer Aided Test) mode -------------------12
6.2. IIC mode structure (following items value is
sample data)-----------------------------------------------15
7 Troubleshooting Guide----------------------------------------16
7.1. Self Check--------------------------------------------------16
7.2. No Power---------------------------------------------------18
7.3. No Picture--------------------------------------------------18
7.4. Local screen failure--------------------------------------19
8 Disassembly and Assembly Instructions---------------20
8.1. Removal of Rear Cover --------------------------------20
8.2. Removal of HZ-Board-----------------------------------20
8.3. Removal of HHH-Board --------------------------------20
8.4. Removal of Slot Block ---------------------------------- 20
8.5. Removal of HX-Board-----------------------------------21
8.6. Removal of DS-Board-----------------------------------21
8.7. Removal of PB-Board-----------------------------------21
8.8. Removal of DN-Board ----------------------------------22
8.9. Removal of D-Board------------------------------------- 22
8.10. Removal of P-Board-------------------------------------22
8.11. Removal of H3-Board (L), (R)-------------------------22
8.12. Removal of Fan-------------------------------------------23
8.13. Removal of SU-Board and SD-Board---------------23
8.14. Removal of SC-Board-----------------------------------24
8.15. Removal of SS-Board-----------------------------------24
8.16. Removal of SS2-Board---------------------------------24

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8.17. Removal of C1, C2, C3-Board------------------------25
8.18. Removal of S1-Board -----------------------------------26
8.19. Removal of Front Glass, V1, V2-Board and
Cabinet Assy ----------------------------------------------26
8.20. Removal of Plasma Display Panel-------------------27
9 Measurements and Adjustments --------------------------31
9.1. Adjustment Procedure ----------------------------------31
9.2. Adjustment-------------------------------------------------34
10 Block Diagram ---------------------------------------------------39
10.1. Block (1 of 8) Diagram----------------------------------39
10.2. Block (2 of 8) Diagram----------------------------------40
10.3. Block (3 of 8) Diagram----------------------------------41
10.4. Block (4 of 8) Diagram----------------------------------42
10.5. Block (5 of 8) Diagram----------------------------------43
10.6. Block (6 of 8) Diagram----------------------------------44
10.7. Block (7 of 8) Diagram----------------------------------45
10.8. Block (8 of 8) Diagram----------------------------------46
11 Wiring Connection Diagram---------------------------------47
11.1. Wiring (1)---------------------------------------------------47
11.2. Wiring (2)---------------------------------------------------48
11.3. Wiring (3)---------------------------------------------------49
12 Schematic Diagram---------------------------------------------51
12.1. Schematic Diagram Notes-----------------------------51
12.2. P-Board (1 of 2) Schematic Diagram ---------------52
12.3. P-Board (2 of 2) Schematic Diagram ---------------53
12.4. PB, V1 and V2-Board Schematic Diagram--------54
12.5. HZ-Board Schematic Diagram------------------------55
12.6. HX-Board Schematic Diagram------------------------56
12.7. HHH-Board (1 of 4) Schematic Diagram-----------57
12.8. HHH-Board (2 of 4) Schematic Diagram-----------58
12.9. HHH-Board (3 of 4) Schematic Diagram-----------59
12.10. HHH-Board (4 of 4) Schematic Diagram-----------60
12.11. DS-Board (1 of 6) Schematic Diagram -------------61
12.12. DS-Board (2 of 6) and H3-Board Schematic
Diagram-----------------------------------------------------62
12.13. DS-Board (3 of 6) Schematic Diagram -------------63
12.14. DS-Board (4 of 6) Schematic Diagram -------------64
12.15. DS-Board (5 of 6) Schematic Diagram -------------65
12.16. DS-Board (6 of 6) Schematic Diagram -------------66
12.17. DN-Board (1 of 8) Schematic Diagram-------------67
12.18. DN-Board (2 of 8) Schematic Diagram-------------68
12.19. DN-Board (3 of 8) Schematic Diagram-------------69
12.20. DN-Board (4 of 8) Schematic Diagram-------------70
12.21. DN-Board (5 of 8) Schematic Diagram-------------71
12.22. DN-Board (6 of 8) Schematic Diagram-------------72
12.23. DN-Board (7 of 8) Schematic Diagram-------------73
12.24. DN-Board (8 of 8) Schematic Diagram-------------74
12.25. D-Board (1 of 7) Schematic Diagram ---------------75
12.26. D-Board (2 of 7) Schematic Diagram ---------------76
12.27. D-Board (3 of 7) Schematic Diagram ---------------77
12.28. D-Board (4 of 7) Schematic Diagram ---------------78
12.29. D-Board (5 of 7) Schematic Diagram ---------------79
12.30. D-Board (6 of 7) Schematic Diagram ---------------80
12.31. D-Board (7 of 7) Schematic Diagram ---------------81
12.32. C1-Board (1 of 2) Schematic Diagram--------------82
12.33. C1-Board (2 of 2) Schematic Diagram--------------83
12.34. C2-Board (1 of 2) Schematic Diagram--------------84
12.35. C2-Board (2 of 2) Schematic Diagram--------------85
12.36. C3-Board (1 of 2) Schematic Diagram--------------86
12.37. C3-Board (2 of 2) Schematic Diagram--------------87
12.38. SC-Board (1 of 3) Schematic Diagram -------------88
12.39. SC-Board (2 of 3) Schematic Diagram------------- 89
12.40. SC-Board (3 of 3) Schematic Diagram------------- 90
12.41. SU-Board (1 of 3) Schematic Diagram------------- 91
12.42. SU-Board (2 of 3) Schematic Diagram------------- 92
12.43. SU-Board (3 of 3) Schematic Diagram------------- 93
12.44. SD-Board (1 of 3) Schematic Diagram------------- 94
12.45. SD-Board (2 of 3) Schematic Diagram------------- 95
12.46. SD-Board (3 of 3) Schematic Diagram------------- 96
12.47. SS-Board (1 of 2) and S1-Board Schematic
Diagram---------------------------------------------------- 97
12.48. SS-Board (2 of 2) and SS2-Board Schematic
Diagram---------------------------------------------------- 98
13 Printed Circuit Board------------------------------------------ 99
13.1. P-Board ---------------------------------------------------- 99
13.2. PB-Board -------------------------------------------------103
13.3. HZ-Board -------------------------------------------------104
13.4. HX-Board -------------------------------------------------105
13.5. HHH-Board-----------------------------------------------106
13.6. V1, V2, S1 and H3-Board ----------------------------107
13.7. DS-Board -------------------------------------------------108
13.8. DN-Board-------------------------------------------------110
13.9. D-Board ---------------------------------------------------112
13.10. C1-Board--------------------------------------------------114
13.11. C2-Board--------------------------------------------------115
13.12. C3-Board--------------------------------------------------116
13.13. SC-Board -------------------------------------------------117
13.14. SU-Board -------------------------------------------------120
13.15. SD-Board -------------------------------------------------121
13.16. SS2-Board------------------------------------------------122
13.17. SS-Board -------------------------------------------------123
14 Exploded View and Replacement Parts List----------125
14.1. Exploded View and Mechanical Replacement
Parts List--------------------------------------------------125
14.2. Electrical Replacement Parts List ------------------125

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TH-50VX100U / TH-50VX100E
1 Safety Precautions
1.1. General Guidelines
1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the
wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3. When conducting repairs and servicing, do not twist the Faston connectors but plug them straight in or unplug them straight
out.
4. When servicing, observe the original lead dress.If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.2. Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground
such as a water pipe, as shown in Figure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUGH CURRENT) expressed as voltage U1and U2, does not exceed the following values:
For a. c.: U1= 35 V (peak) and U2= 0.35 V (peak);
For d. c.: U1= 1.0 V,
Note:
The limit value of U2= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
mA d. c.
The limit value U1= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
Figure 1

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TH-50VX100U / TH-50VX100E
2 Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-
ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).

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TH-50VX100U / TH-50VX100E
2.2. About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

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TH-50VX100U / TH-50VX100E
3 Service Navigation
3.1. Service Hint
Board Name Function Board Name Function
DN Digital Signal Processor, Microcomputer C1 Data drive (Right)
D Format Converter, Plasma AI Processor
Sub-Field Processor C2 Data drive (Center)
C3 Data drive (Left)
H3 Speaker terminal
DS Slot Interface (Audio / Video / Sync Input Switch),
Sync Processor, Audio Processor,
Speaker Out Amplifier, DC-DC Converter
S1 Power switch
V1 Remote receiver, LED-G, R
V2 Key switch
SS Sustain drive PB Fan control
SS2 Sustain Out P Power supply
SC Scan drive HX PC / RS-232C_Input terminal
SU Scan out (Upper) HHH Dual HDMI terminal
SD Scan out (Lower) HZ RCA Component Video terminal

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TH-50VX100U / TH-50VX100E
3.2. Applicable signals

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TH-50VX100U / TH-50VX100E
4 Specifications
Power Source 110 - 127 V AC, 50/60Hz (U) 220 - 240 V AC, 50/60Hz (E)
Power Consumption
Power on 605 W (U) 485 W (E)
Stand-by condition Save OFF 0.9 W, Save ON 0.5 W (U) Save OFF 1.2 W, Save ON 0.7 W (E)
Power off condition 0.1 W (U) 0.4 W (E)
Plasma Display panel Drive method: AC type 50-inch,
16:9 aspect ratio
Screen size 43.5" (1,106 mm) (W) ×24.4" (622 mm) (H) ×49.9" (1,269 mm) (diagonal)
(No. of pixels) 2,073,600 (1,920 (W) ×1,080 (H) [5,760 ×1,080 dots]
Operating condition
Temperature 32 °F - 104 °F (0 °C - 40 °C)
Humidity 20 % - 80 %
Applicable signals
Scanning format 525 (480) / 60i 60p, 625 (575) / 50i 50p, 750 (720) / 60p 50p, 1125 (1080) /
60i 60p 50i 50p 24p 25p 30p 24sF, 1250 (1080) / 50i
PC signals VGA, SVGA, XGA, SXGA
UXGA ..... (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
Connection terminals
HDMI A-B TYPE A Connector ×4
COMPONENT / RGB IN Y/G (RCA PIN JACK) with sync 1.0 Vp-p (75-ohm)
PB/B, PR/R (RCA PIN JACK) 0.7 Vp-p (75-ohm)
AUDIO IN (RCA PIN JACK ×2) 0.5 Vrms
PC IN (HIGH-DENSITY Mini-D-SUB 15PIN) Y or G with sync 1.0 Vp-p (75-ohm)
Y or G without sync 0.7 Vp-p (75-ohm)
B / PB/ CB: 0.7 Vp-p (75-ohm)
R / PR/ CR: 0.7 Vp-p (75-ohm)
HD / VD: 1.0 - 5.0 Vp-p (high impedance)
VBS (use HD port) (E) with picture 1.0 Vp-p (high impedance) (E)
without picture 0.3 Vp-p (high impedance) (E)
AUDIO IN (M3 JACK) 0.5 Vrms
SERIAL EXTERNAL CONTROLTERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE
Speaker terminal 6-ohm, 16 W [8 W + 8 W] (10 % THD)
Accessories Supplied
Remote Control Transmitter N2QAYB000323
Batteries AA Size ×2 (U) 2 ×R6 Size (E)
Fixing band TMME203 ×1
Dimensions (W ×H ×D) 47.7" (1,210 mm) ×28.5" (724 mm) ×3.7" (93 mm)
Mass (weight) approx. 81.6 lbs (U) approx. 37.0 kg net (E)
Note:
• Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
• This equipment complies with the EMC standards listed below. (E)
EN55022, EN55024, EN61000-3-2, EN61000-3-3.

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TH-50VX100U / TH-50VX100E
5 Operating Instructions

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TH-50VX100U / TH-50VX100E
GPF11D chassis series have special function and operation setting facility called Option Menu. This Option Menu is useful
for special function required customers. This should be set at the installation stage.
Option Menu for GPF11D series
Option menus default setting Contents
Onscreen display On Enable/Disable to display input mode indication after power on and no signal
indication.
All Aspect Off Aspect mode: default/All aspect mode.
Studio mode Off Sets for switching functions in setting menus used for television studio applica-
tions.
Function button assign Scrolling bar Specifies the function activated when the "FUNCTION" button on the remote
control is pressed.
Memory lock －Locks or unlocks saved profiles. Also for setting passwords.

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TH-50VX100U / TH-50VX100E
6 Service Mode
6.1. CAT (Computer Aided Test) mode
To exit the CAT mode, access the ID mode and switch off the main power.
6.1.1. IIC mode
Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode and then press the OK button on the
remote control.
Subject and item are mentioned on “IIC mode structure”.
To exit the IIC mode, press the RETURN button on the remote control.

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TH-50VX100U / TH-50VX100E
6.1.2. CD mode
Select the CD mode by Up/Down button on the remote control at the front page of CAT mode and then press the [5] button on the
remote control more than 3 seconds.
Memory data change
To exit the CD mode, press the RETURN button on the remote control.
6.1.3. SD mode
Select the SD mode by Up/Down button on the remote control at the front page of CAT mode and then press the OK button on the
remote control.
To exit the SD mode, press the RETURN button on the remote control.

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TH-50VX100U / TH-50VX100E
6.1.4. MS mode
Select the MS mode by Up/Down button on the remote control at the front page of CAT mode and then press the [5] button on the
remote control more than 3 seconds.
To exit the MS mode, press the RETURN button on the remote control.
Caution:
Market Select should be set after exchange of DN-Board.
Destination number
Default setting
6.1.5. ID mode
Select the ID mode by Up/Down button on the remote control at the front page of CAT mode and then press the [5] button on the
remote control more than 3 seconds.
To exit the ID mode, press the RETURN button on the remote control.
Number Destination Number Destination
0 Japan 16 --
1NorthAmerica 17 --
2 Europe 18 China
3 Others 19 China (Hotel)
4 Britain 20 Russia
5 Taiwan 21 Russia (Hotel)
6 Thailand 22 Hong Kong
7-- 23--
8 Japan (Hotel) 24 --
9 North America (Hotel) 25 --
10 Europe (Hotel) 26 --
11 -- 27 --
12 Britain (Hotel) 28 Middle East/Hong Kong
13 -- 29 Middle East/Hong Kong (Hotel)
14 Thailand (Hotel) 30 Australia
15 -- 31 Australia (Hotel)
Number Destination
1 North America

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TH-50VX100U / TH-50VX100E
6.2. IIC mode structure (following items value is sample data)

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TH-50VX100U / TH-50VX100E
7 Troubleshooting Guide
7.1. Self Check
7.1.1. Display Indication
1. Self-check is used to automatically check the bus line
controlled circuit of the Plasma display.
2. To get into the Self-check mode, press the Down button
on the customer controls at the bottom of the set, at the
same time pressing the OFF-TIMER button on the remote
control, and the screen will show.
If the IIC ports have been checked and found to be incorrect
Or not located then “ - - ” will appear in place of “ OK ”
“ 01 ” in the line of the “ PTCT ” means the number of blinks of
the Power LED is 1. (Reference to 7.1.2)
“ H09 ” in the line of the “ PTCT ” is the error code.
To exit the CAT mode switch off the main power.
Note:
The line of the “ PTCT ” displays when you get into the Self-
check mode for the first time only after the Power LED
blinks.

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TH-50VX100U / TH-50VX100E
7.1.2. Power LED Blinking timing chart
1. Subject
Information of LED Blinking timing chart.
2. Contents
When an abnormality has occurred to the unit, the protection circuit operates and resets to the stand by mode. At this time,
the defective block can be identified by the number of blinks of the Power LED on the front panel of the unit.
About blinking LED

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TH-50VX100U / TH-50VX100E
7.2. No Power
First check point
There are following 3 states of No Power indication by power LED.
1. No lit.
2. Green is lit then turns red blinking a few seconds later.
3. Only red is lit.
7.3. No Picture

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TH-50VX100U / TH-50VX100E
7.4. Local screen failure
Plasma display may have local area failure on the screen. Fig - 1 is the possible defect P.C.B. for each local area.
Fig - 1

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TH-50VX100U / TH-50VX100E
8 Disassembly and Assem-
bly Instructions
• To disassemble P.C.B., wait for 1 minute after power was off
for discharge from electrolysis capacitors.
• , , , and marks indicate screw positions.
8.1. Removal of Rear Cover
1. Remove screws ( ×8 , ×28 , ×4 ) and then remove
the Rear Cover.
8.2. Removal of HZ-Board
1. Remove 4 screws (A) and then remove the HZ Terminal
Block.
2. Remove 4 screws (B).
3. Remove 3 screws (C) and then remove HZ-Board.
8.3. Removal of HHH-Board
1. Remove 4 screws (D) and then remove the HHH Terminal
Block.
2. Remove 4 screws (E).
3. Remove 4 screws (F) and then remove HHH-Board.
8.4. Removal of Slot Block
1. Disconnect the connectors (DS2, DS4, DS6, DS7, DS8,
DS15).
2. Remove the flexible cables from the connectors (DS1,
DS3).
3. Remove 2 screws ( ).
4. Remove 4 screws ( ) and then remove the Slot Block.