Panasonic TH-42PW6EX User manual

Power Source: AC120V 50/60Hz (UY version)
AC220-240V 50/60Hz
(Except UY version model)
Power Consumption: 265 W
Save off 1.5 W, Save on 0.6 W (stand-by
condition)
(UY version)
Save off 1.8 W, Save on 0.8 W (stand-by
condition)
(Except UY version model)
0.4 W (Power off condition)
(UY version model)
0.6 W (Power off condition)
(Except UY version model)
Plasma Display panel: Drive method AC type
16:9 aspect ratio
Contrast Ratio 4000:1
Screen size: 818 mm (W) × 461 mm (H)
939 mm (diagonal) (37 inch)
920 mm (W) × 518 mm (H)
1,056 mm (diagonal) (42 inch)
No. of pixels
408,960 (852 (W) × 480 (H))
[2,556 × 480 dots]
Operating condition:
Temperature 34 °F - 104 °F (0 °C - 40 °C)
Humidity 20 % - 80 %
©2003 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-42PW6EX
TH-42PW6BX
TH-42PWD6EX
TH-42PWD6BX
TH-42PWD6UY
GP6D Chassis
Horizontal scanning frequency 15.6 - 110kHz
Vertical scanning frequency 48 - 120Hz
Connection terminals:
AV
Video in 1.0 Vp-p (75-ohm)
S-VIDEO IN
(MINI DIN 4PIN) Y: 1 Vp-p (75-ohm), C: 0.286 Vp-p (75-ohm)
AUDIO IN
(RCA PIN JACK × 2) 0.5 Vrms (high impedance)
COMPONENT/RGB
Y/G 1.0 Vp-p/composite (75-ohm)
0.7 Vp-p/non-composite (75-ohm)
PB/B 0.7 Vp-p (75-ohm)
PR/R 0.7 Vp-p (75-ohm)
HD 1.0 - 5.0 Vp-p (high impedance)
VD 1.0 - 5.0 Vp-p (high impedance)
AUDIO IN
(RCA PIN JACK×2)
0.5 Vrms (high impedance)
PC
(HIGH-DENSITY
D-SUB15PIN)
R,G,B/0.7 Vp-p (75-ohm)
HD, VD/1.0 - 5.0 Vp-p (high
impedance)
AUDIO IN (M3 JACK) 0.5Vrms (high impedance)
SERIAL
EXTERNAL CONTROL
TERMINAL (D-SUB9PIN)
RS-232C COMPATIBLE
Wide Plasma Display
Specifications
ORDER NO. ITD0306012C0
D10 Canada: B07

SPEAKERS (External
speakers) (69
99
9)16W [8W+8W] (10% THD)
Dimensions (W×H×D): 1,020 mm × 610 mm 89 mm
1 Applicable signals 3
2 Safety Precautions 4
2.1. General Guidelines 4
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 5
4 About lead free solder (PbF) 6
5 PCB Structure sheet of GP6D chassis 7
6 Service Hint 8
7 Location of Lead Wiring 9
8 Adjustment Procedure 10
8.1. +B Set-up 10
8.2. Driver Set-up 10
8.3. Initialization Pulse Adjust 11
8.4. P.C.B. (Printed Circuit Board) exchange 12
8.5. Adjustment Volume Location 12
8.6. Test Point Location 12
9 Service mode 13
9.1. CAT (computer Aided Test) mode 13
9.2. IIC mode structure (following items value is sample data.)
15
10 Alignment 16
10.1. Pedestal setting (C) 16
10.2. Pedestal setting (B) 17
10.3. NTSC panel white balance 18
10.4. PAL/SECAM panel white balance 19
10.5. PC/RGB panel white balance 21
10.6. HD/ 525i /525p /625I /625P panel white balance 23
11 Trouble shooting guide 25
11.1. Self Check 25
11.2. No Power 26
11.3. No Picture 27
11.4. Local screen failure 27
12 Option Setting 28
13 Conductor Views 31
13.1. PF-Board 31
13.2. P-Board 32
13.3. HX-Board 35
13.4. HY-Board 36
13.5. J-Board 38
13.6. D-Board 40
13.7. C1-Board 42
13.8. C2-Board 43
Weight (Mass) approx. 28.9 kg net (main unit only)
approx. 33.1 kg net (with speakers)
13.9. SC-Board 44
13.10. SU and SD-Board 47
13.11. SS, SS2 and SS3-Board 48
13.12. Z-Board 50
13.13. V1, S1 and H3-Board 51
14 Block and Schematic Diagrams 53
14.1. Schematic Diagram Notes 53
14.2. Main Block Diagram 54
14.3. PF-Board Block Diagram 55
14.4. PF-Board Schematic Diagram 56
14.5. P-Board Block Diagram 57
14.6. P-Board (1 of 2) Schematic Diagram 58
14.7. P-Board (2 of 2) Schematic Diagram 59
14.8. HX-Board Schematic Diagram 60
14.9. HY-Board Block Diagram 61
14.10. HY-Board (1 of 2) Schematic Diagram 62
14.11. HY-Board (2 of 2) Schematic Diagram 63
14.12. J-Board Block Diagram 64
14.13. J-Board (1 of 4) Schematic Diagram 65
14.14. J-Board (2 of 4) Schematic Diagram 66
14.15. J-Board (3 of 4) Schematic Diagram 67
14.16. J-Board (4 of 4) Schematic Diagram 68
14.17. D-Board Block Diagram 69
14.18. D-Board (1 of 11) Schematic Diagram 70
14.19. D-Board (2 of 11) Schematic Diagram 71
14.20. D-Board (3 of 11) Schematic Diagram 72
14.21. D-Board (4 of 11) Schematic Diagram 73
14.22. D-Board (5 of 11) Schematic Diagram 74
14.23. D-Board (6 of 11) Schematic Diagram 75
14.24. D-Board (7 of 11) Schematic Diagram 76
14.25. D-Board (8 of 11) Schematic Diagram 77
14.26. D-Board (9 of 11) Schematic Diagram 78
14.27. D-Board (10 of 11) Schematic Diagram 79
14.28. D-Board (11 of 11) Schematic Diagram 80
14.29. C1, C2 and V1-Board Block Diagram 81
14.30. C1-Board Schematic Diagram 82
14.31. C2 and V1-Board Schematic Diagram 83
14.32. SC-Board Block Diagram 84
14.33. SC-Board (1 of 2) Schematic Diagram 85
14.34. SC-Board (2 of 2) Schematic Diagram 86
14.35. SU-Board Block Diagram 87
14.36. SU-Board Schematic Diagram 88
CONTENTS Page Page
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TH-42PW6EX / TH-42PW6BX / TH-42PWD6EX / TH-42PWD6BX / TH-42PWD6UY

14.37. SD-Board Block Diagram 89
14.38. SD-Board Schematic Diagram 90
14.39. SS, S1, SS2 and SS3-Board Block Diagram 91
14.40. SS, S1, SS2 and SS3-Board Schematic Diagram 92
14.41. Z and H3-Board Block Diagram 93
14.42. Z and H3-Board (1 of 2) Schematic Diagram 94
14.43. Z and H3-Board (2 of 2) Schematic Diagram 95
15 Parts Location 97
16 Mechanical Replacement Parts List 98
17 Replacement Parts List 100
17.1. Relpacement Parts List Notes 100
17.2. Electrical Replacement List 101
1 Applicable signals
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TH-42PW6EX / TH-42PW6BX / TH-42PWD6EX / TH-42PWD6BX / TH-42PWD6UY

2.1.1. Leakage Current Cold Check
1.Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2.Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1M9and 5.2M9.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1.Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2.Connect a 1.5k9, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3.Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4.Check each exposed metallic part, and measure the
voltage at each point.
5.Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6.The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
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TH-42PW6EX / TH-42PW6BX / TH-42PWD6EX / TH-42PWD6BX / TH-42PWD6UY

3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
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TH-42PW6EX / TH-42PW6BX / TH-42PWD6EX / TH-42PWD6BX / TH-42PWD6UY

4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution


·

Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).


·

Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.


·

After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
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TH-42PW6EX / TH-42PW6BX / TH-42PWD6EX / TH-42PWD6BX / TH-42PWD6UY

5 PCB Structure sheet of GP6D chassis
Board Name Function Remarks
DDigital Signal Processor 1
JSlot Interface & SYNC processor 1
ZAudio out, DC-DC converter
SS Sustain Out 1
SC Scan out 1
SU Sustain connection (Upper) 1
SD Sustain connection (Lower) 1
C1 Data Drive (Lower Right)
C2 Data Drive (Lower Left)
H3 Speaker terminal
S1 Power switch
SS2 Sustain connection (Upper)
SS3 Sustain connection (Lower)
V1 Front SW. & Remote receiver
PF Line filter
PPower supply 1
HX PC_type_Input terminal
HY BNC Composite/Component Video 2
HZ BNC Component Video 3
Remarks
1.Recommend PCB´s for initial service for GP6D chassis.
2.For System model except BX, EX version
3.For Consumer model except BX, EX version
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TH-42PW6EX / TH-42PW6BX / TH-42PWD6EX / TH-42PWD6BX / TH-42PWD6UY

6 Service Hint
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TH-42PW6EX / TH-42PW6BX / TH-42PWD6EX / TH-42PWD6BX / TH-42PWD6UY

7 Location of Lead Wiring
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TH-42PW6EX / TH-42PW6BX / TH-42PWD6EX / TH-42PWD6BX / TH-42PWD6UY

8.1. +B Set-up
8.1.1. Item / Preparation
1.Input a Grey scale signal.
2.Set the picture controls: -
Picture mode: Normal
White balance: Normal
8.1.2. Adjustments
Adjust and confirm indicated test point for the specified voltage.
Adjust
Name Volume Voltage Test Point Remarks
Vsus R605 170V ± 1V P11 pin 2
Vda R590 67V ± 0.5V P12 pin 1
Confirm
Name Voltage Test Point Remarks
15V 15.4V ± 0.5V P23 pin 1
15V 15.2V ± 0.5V P7 pin 1
12V 11.8V ± 0.5V P25 pin 1
Audio 12V 12.5V ± 0.8V P5 pin 7
5V 5.1V ± 0.3V P25 pin 5
STB 5V 5.0V ± 0.3V P27 pin 4
Fan 15V 15.4V ± 0.5V P10 pin 1
Fan 5V 5.1V ± 0.3V P10 pin 4
PFC 380V ± 15V C468(+), C468(-)
8.2. Driver Set-up
8.2.1. Item / Preparation
1.Input an APL 100 % white signal.
2.Set the picture controls: -
Picture mode: Normal
White balance: Cool
Aspect: 16:9
8.2.2. Adjustments
Adjust driver section voltages referring the panel data on the
panel data label.
Name Test Point Voltage Volume Remarks
Vsus TPVSUS
(SS) 170V ± 1V R605 (P)
Vbk TPVBK (SC) 155V ± 5V R6443 (SC)
Ve TPVE (SS) 158V ± 1V R6774 (SS)
Vset TPVSET
(SC) 218V ± 6V ---
Vad TPVAD (SC) -90V ± 1V R6477 (SC)
Vscn TPVSCN
(SC) Vad*+118V ± 2V ---
Vda TPVDA (SS) 67V ± 1V R590 (P)
*See the Panel label.
8 Adjustment Procedure
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TH-42PW6EX / TH-42PW6BX / TH-42PWD6EX / TH-42PWD6BX / TH-42PWD6UY

8.3. Initialization Pulse Adjust
1.Input a Cross hatch signal.
2.Set the picture controls: -
Picture mode: Normal
White balance: Cool
Adjust the indicated test point for the specified wave form.
Test point Volume Level
T1 TPSC1 (SC) R6523 (SC) 20 ± 15µ Sec
T2 TPSS1 (SS) R6557 (SC) 170 ± 20µ Sec
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TH-42PW6EX / TH-42PW6BX / TH-42PWD6EX / TH-42PWD6BX / TH-42PWD6UY

8.4. P.C.B. (Printed Circuit Board) exchange
8.4.1. Caution
1.To remove P.C.B. , wait 1 minute after power was off for discharge from electrolysis capacitors.
8.4.2. Quick adjustment after P.C.B. exchange
P.C.B. Name Test Point Voltage Volume Remarks
P Board Vsus TPVSUS (SS) 170V ± 1V R605 (P)
Vda TPVDA (SS) 67V ± 1V R590 (P)
SC Board Vbk TPVBK (SC) 155V ± 5V R6443 (SC)
Vad TPVAD (SC) -90V ± 1V R6477 (SC)
Vset TPVSET (SC) 218V ± 6V ---
Vscn TPVSCN (SC) Vad + 118 ± 2V ---
SS Board Ve TPVE (SS) 158V ± 1V R6774 (SS)
D, J Board White blance, Pedestal and Sub brightness for NTSC, PAL, HD, PC and 625i signals
*See the Panel label.
8.5. Adjustment Volume Location
8.6. Test Point Location
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TH-42PW6EX / TH-42PW6BX / TH-42PWD6EX / TH-42PWD6BX / TH-42PWD6UY

9 Service mode
9.1. CAT (computer Aided Test) mode
To exit the CAT mode, access the ID mode and switch off the main power.
9.1.1. IIC mode
Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode then press the Action button on
the remote control.
Subject and item are mentioned on page 14.
To exit the IIC mode, press the R button on the remote control.
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TH-42PW6EX / TH-42PW6BX / TH-42PWD6EX / TH-42PWD6BX / TH-42PWD6UY

9.1.2. CD mode
Select the CD mode by Up/Down button on the remote control at the front page of CAT mode then press the Mute button on the
remote control more than 5 sec.
Micom software version (IC9354), this version can be upgrade by
1.replace of new version IC
2.Loading the new version software from loader tool, TZSC07036.
Memory data change
To exit the CD mode, press the R button on the remote control.
9.1.3. SD mode
Select the SD mode by Up/Down button on the remote control at the front page of CAT mode then press the Action button on the
remote control.
To exit the SD mode, press the R button on the remote control.
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TH-42PW6EX / TH-42PW6BX / TH-42PWD6EX / TH-42PWD6BX / TH-42PWD6UY

9.2. IIC mode structure (following items value is sample data.)
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TH-42PW6EX / TH-42PW6BX / TH-42PWD6EX / TH-42PWD6BX / TH-42PWD6UY

10 Alignment
10.1. Pedestal setting (C)
** Adjust at the dark room.
1
Component
Picture: PANEL W/B
( 2 i, 2 p, 62 i,
Normal R cut off 1) Set R,G and B cut off to " 80 ".
720i or 1080i)
White balance: G cut off
Cool B cut off
Gray Scale
Aspect: Chroma Control:
Pattern
16:9
COMPONENT
/RGB-IN: RGB
Gun off 2) Set Gun off to "5". (Only green pixels can emit.)
RGB Sub Adjust:
G Sub Bright 1 3) Adjust G Sub bright to start some of green pixels emission
at black 2% area and no emission at black 0% area.
Chroma Control:
Gun off 4) Set Gun off to "3". (Only blue pixels can emit.)
RGB Sub Adjust:
Black 2 %
B Sub Bright 1 ) Adjust B Sub bright to start some of blue pixels emission
Black 0 %
at black 2% area and no emission at black 0% area.
Chroma Control:
Gun off 6) Set Gun off to "6". (Only red pixels can emit.)
RGB Sub Adjust:
R Sub Bright 1 7) Adjust R Sub bright to start some of red pixels emission
at black 2% area and no emission at black 0% area.
2
RGB(PC)
Picture: 1) Change input to Component signal.
Gray Scale
Normal PANEL W/B
Pattern
White balance: R,G,B cut off 2) Repeat procedure 1) to 7) of RGB input signal.
Cool PANEL W/B
Aspect: R,G,B Drive
16:9
Black 2 %
Black 0 %
INPUT Alignment menu ProcedureEquipment Setting
Note:
OSD is the difference between UY model and Except UY model.
Picture: Normal (Except UY)/Standard (UY model)
White balance (Except UY)/Color Temp (UY model)
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TH-42PW6EX / TH-42PW6BX / TH-42PWD6EX / TH-42PWD6BX / TH-42PWD6UY

10.2. Pedestal setting (B)
** Adjust at the dark room.
1
Component
Picture: PANEL W/B
( 2 i, 2 p, 62 i,
Normal R cut off 1) Press the SWAP button, change input to signal path.
2) Set R,G and B cut off to "
720i or 1080i)
White balance: G cut off
Cool B cut off
Gray Scale
Aspect: Chroma Control:
Pattern
16:9
COMPONENT
/RGB-IN: RGB
Gun off 3) Set Gun off to "5". (Only green pixels can emit.)
RGB Sub Adjust:
G Sub Bright 2 4) Adjust G Sub bright to start some of green pixels emission
at black 2% area and no emission at black 0% area.
Chroma Control:
Gun off ) Set Gun off to "3". (Only blue pixels can emit.)
RGB Sub Adjust:
Black 2 %
B Sub Bright 2 6) Adjust B Sub bright to start some of blue pixels emission
Black 0 %
at black 2% area and no emission at black 0% area.
Chroma Control:
Gun off 7) Set Gun off to "6". (Only red pixels can emit.)
RGB Sub Adjust:
R Sub Bright 2 8) Adjust R Sub bright to start some of red pixels emission
at black 2% area and no emission at black 0% area.
2
RGB(PC)
Picture: 1) Change input to Component signal.
Gray Scale
Normal PANEL W/B
Pattern
White balance: R,G,B cut off 2) Repeat procedure 1) to 7) of RGB input signal.
Cool PANEL W/B
Aspect: R,G,B Drive
16:9
Black 2 %
Black 0 %
INPUT Alignment menu ProcedureEquipment Setting
Note:
OSD is the difference between UY model and Except UY model.
Picture: Normal (Except UY)/Standard (UY model)
White balance (Except UY)/Color Temp (UY model)
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TH-42PW6EX / TH-42PW6BX / TH-42PWD6EX / TH-42PWD6BX / TH-42PWD6UY

10.3. NTSC panel white balance
1 NTSC Color Picture: 1) Find the nearest area to brightness of 10 cd/m 2 as Low
Gray Scale Analyzer Normal Sub Adjust light by color sensor.
Pattern White balance: Sub Bright 2) Adjust Sub bright to set Low light level to 10 cd/m
2
Cool exactly.
Aspect: PANEL W/B
16:9 G cut off 3) Set G cut off to " 80 ".
PANEL W/B
B cut off 4) Adjust B and R cut off to set color temperature as
R cut off shown Fig.-01.
High light 7 % Sub Adjust
Low light 1 % Sub Bright ) If Sub Bright is changed re-adjust it to set Low light
to 10 cd/m
2 .
6)Find 7 % of white area by color sensor.
PANEL W/B
G Drive 7) Set G Drive to " D8 ".
PANEL W/B
B Drive 8) Adjust B and R Drive to set color temperature
R Drive as shown Fig.-01.
9) Repeat item 4) to 7) to set both Low light and
high light.
PANEL W/B
R,G,B Drive 10) Increase same steps of R, G and B Drive to set
R,G,B Drive largest level of 3 color drive to "FC".
PANEL W/B
R,G,B cut off 11) Re-adjust Low light level again.
Color Temp. x y
Cool(Hi) 0.276 0.276
Normal(Mid) 0.288 0.296
Warm(Low) 0.313 0.329
Fig. -01
2 Picture: 1) Change white balance to "Normal".
Normal PANEL W/B
White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.
Normal PANEL W/B
Aspect: R,G,B Drive
16:9
3 Picture: 1) Change white balance to "Warm".
Normal PANEL W/B
White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.
Warm PANEL W/B
Aspect: R,G,B Drive
16:9
4 Picture: Picture Menu 1) Change color templature to "Cool".
Normal Sub Adjust
White balance: Sub Bright 2)Re-set Sub bright to "30"
Cool
Aspect:
16:9
INPUT Alignment menu ProcedureEquipment Setting
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TH-42PW6EX / TH-42PW6BX / TH-42PWD6EX / TH-42PWD6BX / TH-42PWD6UY

10.4. PAL/SECAM panel white balance
1 PAL Color Picture: 1) Find the nearest area to brightness of 10 cd/m2 as Low
Gray Scale Analyzer Normal Sub Adjust light by color sensor.
Pattern White balance: Sub Bright 2) Adjust Sub bright to set Low light level to 10 cd/m2
Cool exactly.
Aspect: PANEL W/B
16:9 G cut off 3) Set G cut off to " 80 ".
PANEL W/B
B cut off 4) Adjust B and R cut off to set color temperature as
R cut off shown Fig.-02.
High light 7 % Sub Adjust
Low light 1 % Sub Bright ) If Sub Bright is changed re-adjust it to set Low light
to 10 cd/m2.
6)Find 7 % of white area by color sensor.
PANEL W/B
G Drive 7) Set G Drive to " D8 ".
PANEL W/B
B Drive 8) Adjust B and R Drive to set color temperature
R Drive as shown Fig.-02.
9) Repeat procedure 4) to 7) to set both Low light and
high light.
PANEL W/B
R,G,B Drive 10) Increase same steps of R, G and B Drive to set
R,G,B Drive largest level of 3 color drive to "FC".
PANEL W/B
R,G,B cut off 11) Re-adjust Low light level again.
Color Temp. x y
Cool(Hi) 0.276 0.276
Normal(Mid) 0.288 0.296
Warm(Low) 0.313 0.329
Fig. -02
2 Picture: 1) Change white balance to "Normal".
Normal PANEL W/B
White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.
Normal PANEL W/B
Aspect: R,G,B Drive
16:9
3 Picture: 1) Change white balance to "Warm".
Normal PANEL W/B
White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.
Warm PANEL W/B
Aspect: R,G,B Drive
16:9
4 Picture: Picture Menu 1) Change color templature to "Cool".
Normal Sub Adjust
White balance: Sub Bright 2)Re-set Sub bright to "30"
Cool
Aspect:
16:9
INPUT Alignment menu ProcedureEquipment Setting
19
TH-42PW6EX / TH-42PW6BX / TH-42PWD6EX / TH-42PWD6BX / TH-42PWD6UY

Picture: 1) Write down each color temaparature of R,G,B drive and
Normal Cut off data as follows.
Aspect:
16:9
White balance:
White
Balance Cool Normal Warm
Cool R Drive
Normal G Drive
Warm B Drive
R Cut off
G Cut off
B Cut off
SECAM signal 2) Input SECAM signal.
3) Copy PAL R,G,B drive and cut off data of each white
balance mode to SECAM position.
Alignment menu ProcedureEquipment Setting
20
TH-42PW6EX / TH-42PW6BX / TH-42PWD6EX / TH-42PWD6BX / TH-42PWD6UY