Panasonic TH-50PH10BK User manual

©2007 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-50PH10BK
TH-50PH10BS
TH-50PH10EK
TH-50PH10ES
GPH10D Chassis
High Definition Plasma Display
Specifications
Power Source 220-240 V
A
C, 50/60Hz
Power Consumption
Power on 485 W
Stand-b
y
condition Save OFF 0.8 W, Save ON 0.6 W
Power off condition 0.3W
Plasma Displa
y
panel Drive method:
A
C type 50-inch,
16:9 aspect ratio
Screen size 1,106 mm (W) × 622 mm (H) × 1,269 mm (diagonal)
(No. of pixels) 1,366 (W) × 768 (H) [4,098 × 768 dots]
Operating condition
Temperature 0 °C - 40 °C
Humidit
y
20 % - 80 %
Applicabl
e
signals
Color System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 525 (480) / 60i 60p, 625 (575)
/
50i 50p, 750 (720)
/
60p 50p, 1125 (1080) / 60i 50i 24p 25p 30p
24sF .... SMPTE274M, 1250 (1080) / 50i
PC signals VGA, SVGA, XGA,
SXGA, UXG
A
..... (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
Connection terminals
A
VIN VIDEO IN (BNC) 1.0 Vp-p (75-ohm)
S VIDEO IN (MINI DIN 4PIN) Y: 1 Vp-p (75-ohm), C: 0.286 Vp-p (75-ohm)
A
UDIO IN (RCA PIN JACK × 4) 0.5 Vrms (high impedance)
PC IN (HIGH-DENSIT
Y
Mini-D-SUB 15PIN)
Y
or G with/syn
c
1.0 Vp-p (75-ohm)
Y
or G without/syn
c
0.7 Vp-p (75-ohm)
OrderNo.PCZ0705049CE

1 Applicable signals 4
2 Safety Precautions 5
2.1. General Guidelines 5
2.2. Touch-Current Check 5
3 Prevention of Electro static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
4 About lead free solder (PbF) 7
5 Service Hint 8
6 Disassembly 9
6.1. Removal of the Back Cover 9
6.2. Removal the of HU-Board 9
6.3. Removal of the Slot Block 9
6.4. Removal of the DS-Board 9
6.5. Removal of the HX-Board 10
6.6. Removal of the D-Board 10
6.7. Removal of the P-Board 10
6.8. Removal of the DN-Board 10
6.9. Removal of the H3-Board (L, R) 11
6.10. Removal of the SU-Board and the SD-Board 11
6.11. Removal of the SC-Board 11
6.12. Removal of the SS2-Board and the SS3-Board 11
6.13. Removal of the SS-Board 12
6.14. Removal of the stand blocks 12
6.15. Removal of the C1, C2, and the C3-Board 13
6.16. Removal of the S1-Board 13
6.17. Removal of the Fan 14
6.18. Removal of the Escutcheon 14
6.19. Removal of the V1-Board and the V2-Board 14
6.20. Removal of the Plasma Panel 15
7 Location of Lead Wiring 19
7.1. Lead Wiring (1) 19
7.2. Lead Wiring (2) 20
8 Adjustment Procedure 21
8.1. Driver Set-up 21
8.2. Initialization Pulse Adjust 22
8.3. P.C.B. (Print Circuit Board) Remove 22
8.4. Adjustment Volume Location 23
8.5. Test Point Location 23
9 Service mode 24
9.1. CAT (Computer Aided Test) mode 24
9.2. IIC mode structure (following items value is sample data.)
27
10 Adjustment 28
10.1. RGB white balance adjustment 28
10.2. HD white balance adjustment 30
10.3. Power control adjustment 32
11 Trouble shooting guide 33
11.1. Self Check 33
B
/
PB
/
CB:0.7 Vp-p (75-ohm)
R
/
PR
/
CR:0.7 Vp-p (75-ohm)
HD
/
VD:1.0-5.0 Vp-p (high impedance)
VBS (use HD port) with/picture 1.0 Vp-p (high impedance)
without/picture 0.3 Vp-p (high impedance)
A
UDIO IN (M3 JACK) 0.5 Vrms (high impedance)
SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE
SPEAKERS (6Ω) 16 W [8 W + 8 W] (10 % THD)
Accessories Supplied
Remote Control Transmitter EUR7636090R
Batteries 2 × R6 Size
Fixing bands TMME203 × 2
Dimensions (
W
×H×D) 1,210 mm) × 724 mm × 95 mm
Mass (weight)
main unit onl
y
approx. 36.0 kg net
with speakers approx. 40.0 kg
Notes:
· Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
· This equipment complies with the EMC standards listed below.
· EN55022, EN55024, EN61000-3-2, EN61000-3-3. (EK/ES/BK/BS)
CONTENTS
Page Page
2
TH-50PH10BK / TH-50PH10BS / TH-50PH10EK / TH-50PH10ES

11.2. No Power 35
11.3. No Picture 35
11.4. Local screen failure 36
12 Option Setting 37
13 Conductor Views 39
13.1. P-Board 39
13.2. HU-Board 42
13.3. HX-Board 43
13.4. H3, S1, V1 and V2-Board 44
13.5. DS-Board 45
13.6. DN-Board 47
13.7. D-Board 49
13.8. C1-Board 51
13.9. C2-Board 52
13.10. C3-Board 53
13.11. SC-Board 54
13.12. SU-Board 57
13.13. SD-Board 58
13.14. SS-Board 59
13.15. SS2 and SS3-Board 61
14 Schematic and Block Diagram 63
14.1. Schematic Diagram Notes 63
14.2. Main Block Diagram 64
14.3. P-Board Block Diagram 65
14.4. P-Board (1 of 2) Schematic Diagram 66
14.5. P-Board (2 of 2) Schematic Diagram 67
14.6. HU-Board Block Diagram 68
14.7. HU-Board (1 of 2) Schematic Diagram 69
14.8. HU-Board (2 of 2) Schematic Diagram 70
14.9. HX-Board Block and Schematic Diagram 71
14.10. V1 and V2-Board Block and Schematic Diagram 72
14.11. DS-Board (1 of 2) Block Diagram 73
14.12. DS-Board (2 of 2) Block Diagram 74
14.13. DS-Board (1 of 5) Schematic Diagram 75
14.14. DS-Board (2 of 5) and H3-Board Schematic Diagram 76
14.15. DS-Board (3 of 5) Schematic Diagram 77
14.16. DS-Board (4 of 5) Schematic Diagram 78
14.17. DS-Board (5 of 5) Schematic Diagram 79
14.18. DN-Board (1 of 2) Block Diagram 80
14.19. DN-Board (2 of 2) Block Diagram 81
14.20. DN-Board (1 of 6) Schematic Diagram 82
14.21. DN-Board (2 of 6) Schematic Diagram 83
14.22. DN-Board (3 of 6) Schematic Diagram 84
14.23. DN-Board (4 of 6) Schematic Diagram 85
14.24. DN-Board (5 of 6) Schematic Diagram 86
14.25. DN-Board (6 of 6) Schematic Diagram 87
14.26. D-Board Block Diagram 88
14.27. D-Board (1 of 6) Schematic Diagram 89
14.28. D-Board (2 of 6) Schematic Diagram 90
14.29. D-Board (3 of 6) Schematic Diagram 91
14.30. D-Board (4 of 6) Schematic Diagram 92
14.31. D-Board (5 of 6) Schematic Diagram 93
14.32. D-Board (6 of 6) Schematic Diagram 94
14.33. C1, C2 and C3-Board Block Diagram 95
14.34. C1-Board (1 of 3) Schematic Diagram 96
14.35. C1-Board (2 of 3) Schematic Diagram 97
14.36. C1-Board (3 of 3) Schematic Diagram 98
14.37. C2-Board (1 of 2) Schematic Diagram 99
14.38. C2-Board (2 of 2) Schematic Diagram 100
14.39. C3-Board (1 of 2) Schematic Diagram 101
14.40. C3-Board (2 of 2) Schematic Diagram 102
14.41. SC, SU and SD-Board Block Diagram 103
14.42. SC-Board (1 of 3) Schematic Diagram 104
14.43. SC-Board (2 of 3) Schematic Diagram 105
14.44. SC-Board (3 of 3) Schematic Diagram 106
14.45. SU-Board (1 of 2) Schematic Diagram 107
14.46. SU-Board (2 of 2) Schematic Diagram 108
14.47. SD-Board (1 of 2) Schematic Diagram 109
14.48. SD-Board (2 of 2) Schematic Diagram 110
14.49. SS, S1, SS2 and SS3-Board Block Diagram 111
14.50. SS-Board (1 of 2) and S1-Board Schematic Diagram 112
14.51. SS-Board (2 of 2), SS2 and SS3-Board Schematic
Diagram 113
15 Parts Location 115
15.1. Exploded View 115
15.2. Fan part location enlarged views 116
15.3. Cable relation 117
15.4. Packing summary 118
16 Mechanical Replacement Parts List 120
17 Replacement Parts List 121
17.1. Replacement Parts List Notes 121
17.2. Electrical Replacement Parts List 122
3
TH-50PH10BK / TH-50PH10BS / TH-50PH10EK / TH-50PH10ES

1 Applicable signals
4
TH-50PH10BK / TH-50PH10BS / TH-50PH10EK / TH-50PH10ES

2 Safety Precautions
2.1. General Guidelines
1.When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2.When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the wires
have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3.When conducting repairs and servicing, do not twist the Faston connectors but plug them straight in or unplug them straight out.
4.When servicing, observe the original lead dress.If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
5.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.2. Touch-Current Check
1.Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2.Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such
as a water pipe, as shown in .
3.Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4.Check each exposed metallic part, and measure the voltage at each point.
5.Reserve the AC plug in the AC outlet and repeat each of the above measure.
6.The potential at any point (TOUGH CURRENT) expressed as voltage U1and U2, does not exceed the following values:
For a. c.: U1= 35 V (peak) and U2= 0.35 V (peak);
For d. c.: U1= 1.0 V,
Note:
The limit value of U2= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
mA d. c.
The limit value U1= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
7.In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
Figure 1
5
TH-50PH10BK / TH-50PH10BS / TH-50PH10EK / TH-50PH10ES

3 Prevention of Electro static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electro static charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder Remove device. Some solder Remove devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
6
TH-50PH10BK / TH-50PH10BS / TH-50PH10EK / TH-50PH10ES

4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
7
TH-50PH10BK / TH-50PH10BS / TH-50PH10EK / TH-50PH10ES

5 Service Hint
Board Name Function
DN Digital Signal Processor, Microcomputer
D Format Converter, Plasma Ai Processor
Sub-Filed Processor
DS Slot Interface (Audio / Video / Sync input Switch), SYNC processor,
Sound processor
SS Sustain drive
SC Scan drive
SU Scan out (Upper)
SD Scan out (Lower)
C1 Data Drive (Lower Right)
C2 Data Drive (Lower Center)
C3 Data Drive (Lower Left)
H3 Speaker terminal
S1 Power switch
SS2 Sustain out (Upper)
SS3 Sustain out (Lower)
V1 Remote receiver, LED-G, R
V2 Key switch
P Power supply
HX PC / RS-232C Input terminal
HU Dual Video terminal (BNC / S)
Note:
Extension cable kit for Slot Board is supplied as service fixtures and tools.
(Part No. TZSC07040)
8
TH-50PH10BK / TH-50PH10BS / TH-50PH10EK / TH-50PH10ES

6 Disassembly
· To disassemble P.C.B., wait for 1 minute after power was
off for discharge from electrolysis capacitors.
· and marks indicate screw positions.
6.1. Removal of the Back Cover
1.Remove screws (×7 ,×4 , ×10 , x12 ) and then
remove the Back Cover.
6.2. Removal the of HU-Board
1.Remove 4 screws (A) and then remove the HU Terminal
Block.
2.Remove 4 screws (B).
3.Remove 3 screws (C) and then remove HU-Board.
6.3. Removal of the Slot Block
1.Remove the HU Terminal Block.
(Reference to Removal of the HU-Board)
2.Remove the flexible cable from the connector (DS1).
3.Disconnect the connectors (DS2, DS4, DS6, DS7, DS8,
DS15).
4.Remove 4 screws and then remove the Slot-Block.
6.4. Removal of the DS-Board
1.Remove the HU Terminal Block.
(Reference to Removal of the HU- Board)
2.Remove the Slot Block.
(Reference to Removal of the Slot Block)
3.The Slot Block is turned inside out.
4.Remove 6 screws and then remove the Slot cover.
5.Remove 6 screws.
6.Remove the DS-Board.
9
TH-50PH10BK / TH-50PH10BS / TH-50PH10EK / TH-50PH10ES

6.5. Removal of the HX-Board
1.Remove the HU Terminal Block.
(Reference to Removal of the HU-Board)
2.Remove the Slot Block.
(Reference to Removal of the Slot Block)
3.Remove the DS-Board.
(Reference to Removal of the DS-Board)
4.Remove 2 screws and then remove the Slot Case.
5.Remove 4 Hexagonal-Head screws and 2 screws and then
remove the HX-Board.
6.6. Removal of the D-Board
1.Remove the Slot Block.
(Reference to Removal of the Slot Block)
2.Disconnect the connectors (D5, D25).
3.Remove the Flexible Cable from the connectors (D20, D31,
D32).
4.Remove 4 screws and then remove the D-Board.
6.7. Removal of the P-Board
1.Disconnect the connectors (P2, P6, P7, P9, P11, P12,
P25).
2.Remove 6 screws ( ) and then remove the P-Board Block.
6.8. Removal of the DN-Board
1.Remove the flexible cable from the connectors (DN1).
2.Disconnect the connectors (D6, D31, D33, D35).
3.Remove 4 screws and then remove the DN-Board.
10
TH-50PH10BK / TH-50PH10BS / TH-50PH10EK / TH-50PH10ES

6.9. Removal of the H3-Board (L,
R)
1.Remove each 1 screw and then remove the Speaker
Terminal Block (L, R).
2.Disconnect the connector (H37).
3.Remove 3 screws (F) and then remove the H3-Board.
6.10. Removal of the SU-Board and
the SD-Board
1.Remove the Speaker Terminal Block(R).
(Reference to Removal of the H3-Board (L, R))
2.Remove the Flexible cables (SU1, SU2, SU3, SU4,)
connected to the SU-Board and remove the connector
(SC45-SU45).
3.Remove 6 screws.
4.Slide the SU-Board to the left to disconnect from a
connector (SC41-SU41) on the SC-Board and remove the
SU-Board.
5.Disconnect the connectors(SU45, SD46).
6.Slide the SU-Board and the SD-Board to the left, remove
the SU-Board and the SD-Board from the connectors
(SC41, SC42).
6.11. Removal of the SC-Board
1.Remove the SU-Board and SD-Board (Reference to
removal SU-Board and SD-Board).
2.Disconnect the connector (SC2).
3.Disconnect the flexible cable (SC20).
4.Remove 9 screws ( ) and then slide the SC-Board to the
right.
6.12. Removal of the SS2-Board and
the SS3-Board
1.Disconnect the connector (SS23).
2.Disconnect the Flexible Cable (SS52).
11
TH-50PH10BK / TH-50PH10BS / TH-50PH10EK / TH-50PH10ES

3.Disconnect the connector (SS24).
4.Disconnect the Flexible Cable (SS57).
5.Remove each 2 screws and then remove the SS2-Board
and the SS3-Board.
6.13. Removal of the SS-Board
1.Disconnect the connectors (SS11, SS12, SS21, SS22,
SS33, SS34, SS35).
2.Remove the Flexible Cable from the connectors (SS53,
SS54, SS55, SS56).
3.Remove 7 screws and then remove the SS-Board.
6.14. Removal of the stand blocks
1.Remove the plasma panel section from the servicing stand
and lay on a flat surface such as a table (covered) with the
plasma panel surface facing downward.
2.Remove the stand blocks (left, right) fastening screws (x 4
each) and remove the stand blocks (left, right).
12
TH-50PH10BK / TH-50PH10BS / TH-50PH10EK / TH-50PH10ES

6.15. Removal of the C1, C2, and
the C3-Board
6.15.1. Removal of the C1-Board
1.Remove the Flexible Cable from the connectors (C10,
C11).
2.Remove 10 screws ( ) and then remove the Flexible Cable
from the connectors (CB1, CB2, CB3,CB4,CB5).
3.Remove 6 screws ( ) and then remove the C1-Board.
6.15.2. Removal of the C2-Board
1.Remove the Flexible Cable from the connectors (C20, C21,
C22).
2.Remove 6 screws ( ) and then remove the Flexible Cable
from the connectors (CB6, CB7, CB8).
3.Remove 4 screws ( ) and then remove the C5-Board.
6.15.3. Removal of the C3-Board
1.Remove the Flexible Cable from the connector (C32).
2.Remove the connectors (C33 and C35).
3.Remove 6 screws and ( ) then remove the Flexible Cable
from the connectors (CB9, CB10, CB11).
4.Remove 4 screws and ( ) then remove the C3-Board.
6.16. Removal of the S1-Board
1.Disconnect the connector (SS34).
2.Remove 2 screws(G) and then remove the S1-Board Block.
3.Disconnect the connector (S34).
4.Remove 1 screw(H) and then remove the S1-Board.
13
TH-50PH10BK / TH-50PH10BS / TH-50PH10EK / TH-50PH10ES

6.17. Removal of the Fan
1.Disconnect the Fan Relay Couplers.
2.Remove each 3 screws and then remove 2 Fan Blocks.
3.Remove each 4 screws (J) and then remove the Fans.
4.Reassemble the Fans in reverse order.
5.Stick the Cushion (Fan) around the Fan.
Note:
The Cushion (Fan) are unsuitable to reuse.
Please use a new one at the time of Fan exchange.
6.18. Removal of the Escutcheon
1.Remove the S1-Board Block.
(Refer to Removal of the S1-Board)
2.Remove 6 screws of the Escutcheon.
3.Pull the bottom of the Plasma Panel forward (arrow1).
4.Slide the Plasma Panel and then remove the Plasma Panel
(arrow2).
6.19. Removal of the V1-Board and
the V2-Board
1.Remove the Escutcheon.
(Reference to Removal of the Escutcheon)
2.Remove 6 screws and then remove the Fixed Angle.
3.Remove the 1 screw(K).
4.Disconnect the coupler(V2) and then remove the V1-Board.
5.Remove the operation button from the V2-Board.
6.Disconnect the coupler(V15) and then remove the V2-
Board.
14
TH-50PH10BK / TH-50PH10BS / TH-50PH10EK / TH-50PH10ES

6.20. Removal of the Plasma Panel
1.Disconnect the Fan Relay connectors.
2.Remove each 3 screws ( ) and then remove the 2 Fan
Blocks.
3.Remove each 4 screws ( ) and then remove the Stand
Black(L, R).
4.Remove each 1 screws ( ) and then remove the Speaker
Terminal Block(L, R).
5.Disconnect the connectors (DS1, DS2, DS4, DS6, DS7,
DS8, DS14, DS15).
6.Remove 4 screws and then remove the Slot Block.
7.Disconnect the connectors (DN6, DN31, DN33, DN35).
8.Remove the Flexible Cable from the connector (DN1).
9.Remove 4 screws and then remove the DN-Board Block.
10.Disconnect the connectors (P2, P6, P7, P9, P11, P12,
15
TH-50PH10BK / TH-50PH10BS / TH-50PH10EK / TH-50PH10ES

P25).
11.Remove 6 screws ( ) and then remove the P-Board.
12.Disconnect the connectors (D5, D25).
13.Remove the Flexible Cable from the connectors(D20, D31,
D32).
14.Remove 4 screws and then remove the D-Board.
15.Remove the Flexible Cable from the connectors (SU1, SU2,
SU3, SU4, SD1, SD2, SD3, SD4).
16.Remove 6 screws.
17.Disconnect the connectors (SU45, SD46).
18.Slide the SU-Board and the SD-Board to the left, remove
the SU-Board and the SD-Board from the connectors
(SC41, SC42).
19.Remove the SU-Board and SC-Board.
20.Disconnect the connector (SC2).
21.Disconnect the flexible cable (SC20).
22.Remove 9 screws and ( ) then remove the SC-Board.
23.Disconnect the connector (SS23).
24.Remove the Flexible Cable from the connector (SS52).
25.Disconnect the connector (SS24).
26.Remove the Flexible Cable from the connector (SS57).
27.Remove each 2 screws and then remove the SS2-Board
and the SS-3Board.
28.Disconnect the connectors (SS11, SS12, SS21, SS22,
SS33, SS34, SS35).
29.Remove the Flexible Cable from the connectors (SS53,
SS54, SS55, SS56).
30.Remove 7 screws and then remove the SS-Board.
16
TH-50PH10BK / TH-50PH10BS / TH-50PH10EK / TH-50PH10ES

31.Remove the plasma panel section from the servicing stand
and lay on a flat surface such as a t with the plasma panel
surface facing downward.
32.Remove the stand blocks (left, right) fastening screws (x4
each) and remove the stand blocks (left, right).
33.Remove the Flexible Cable from the connectors (C10,
C11).
34.Remove the Flexible Cable from the connector (C20).
35.Remove the connectors (C21 and C22).
36.Disconnect the connectors (C32, C33, C35).
37.Disconnect the connector (SS34).
38.Remove 2 screws(G) and then remove the S1-Board Block.
39.Disconnect the connector (S34).
40.Remove 1 screw(H) and then remove the S1-Board.
41.Remove the Flexible Cable from the connectors (C20, C21,
C22).
42.Disconnect the Fan Relay Couplers.
43.Remove each 3 screws and then remove 2 Fan Blocks.
17
TH-50PH10BK / TH-50PH10BS / TH-50PH10EK / TH-50PH10ES

44.Remove 2 screws and then remove the S1-Board Block.
45.Remove 3 screws and then remove the AC-Inlet Block.
46.Remove 6 screws of the Escutcheon.
47.Pull the bottom of the Plasma Panel forward (arrow1).
48.Slide the Plasma Panel and then remove the Plasma Panel
(arrow2).
18
TH-50PH10BK / TH-50PH10BS / TH-50PH10EK / TH-50PH10ES

7 Location of Lead Wiring
7.1. Lead Wiring (1)
The lead wiring is dressed as shown in figure.
19
TH-50PH10BK / TH-50PH10BS / TH-50PH10EK / TH-50PH10ES

7.2. Lead Wiring (2)
The lead wiring is dressed as shown in figure.
20
TH-50PH10BK / TH-50PH10BS / TH-50PH10EK / TH-50PH10ES