Panasonic KX-TG1061M - Cordless Phone Base Station User manual

© Panasonic Communications Co., Ltd. 2009.
Unauthorized copying and distribution is a violation
of law.
ORDER NO. KM40901800CE
F13
Telephone Equipment
Model No. KX-TG1061M
KX-TG1062M
KX-TGA106M
Expandable Digital Corded/Cordless
Answering System
M: Metallic Grey Version
(for U.S.A.)

2
KX-TG1061M/KX-TG1062M/KX-TGA106M

3
KX-TG1061M/KX-TG1062M/KX-TGA106M
TABLE OF CONTENTS
PAGE PAGE
1 Safety Precautions----------------------------------------------- 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (Pbf: Pb free)--------------- 4
2.3. Discarding of P. C. Board-------------------------------- 5
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7
4.1. US-DECT Description ------------------------------------ 7
4.2. Block Diagram (Base Unit) ------------------------------ 8
4.3. Circuit Operation (Base Unit)--------------------------- 9
4.4. Block Diagram (Cordless Handset) ------------------13
4.5. Circuit Operation (Cordless Handset) ---------------14
4.6. Circuit Operation (Charger Unit) ----------------------15
4.7. Signal Route -----------------------------------------------16
5 Location of Controls and Components ------------------19
5.1. Controls -----------------------------------------------------19
6 Installation Instructions ---------------------------------------20
6.1. Setting up---------------------------------------------------20
6.2. Battery-------------------------------------------------------20
7 Operating Instructions-----------------------------------------22
7.1. Programmable settings ---------------------------------22
7.2. Registering a Cordless Handset to a Base
Unit -----------------------------------------------------------27
7.3. Copying Phonebook Entries ---------------------------27
7.4. Dialing Mode ----------------------------------------------28
7.5. Error Messages -------------------------------------------28
7.6. Troubleshooting-------------------------------------------29
8 Service Mode -----------------------------------------------------32
8.1. Engineering Mode ----------------------------------------32
8.2. Copying Phonebook Items when Repairing -------36
8.3. How to Clear User Setting------------------------------38
9 Troubleshooting Guide ----------------------------------------39
9.1. Troubleshooting Flowchart -----------------------------39
9.2. Troubleshooting by Symptom (Base Unit and
Charger Unit) ----------------------------------------------51
9.3. Troubleshooting by Symptom (Cordless
Handset) ----------------------------------------------------55
10 Disassembly and Assembly Instructions ---------------59
10.1. Disassembly Instructions -------------------------------59
10.2. Assembly Instructions -----------------------------------63
11 Measurements and Adjustments---------------------------65
11.1. Equipment Required -------------------------------------65
11.2. The Setting Method of JIG (Base Unit) -------------65
11.3. Adjustment Standard (Base Unit)---------------------67
11.4. Adjustment Standard (Charger Unit)-----------------68
11.5. The Setting Method of JIG (Cordless
Handset) ----------------------------------------------------69
11.6. Adjustment Standard (Cordless Handset)----------71
11.7. Things to Do after Replacing IC or X'tal ------------72
11.8. RF Specification-------------------------------------------74
11.9. How to Check the Cordless Handset Speaker
or Receiver -------------------------------------------------75
11.10. Frequency Table (MHz) ---------------------------------75
12 Miscellaneous ----------------------------------------------------76
12.1. CPU Data (Base Unit)-----------------------------------76
12.2. CPU Data (Cordless Handset) ------------------------78
12.3. How to Replace the Flat Package IC----------------80
12.4. How to Replace the LLP (Leadless Leadframe
Package) IC ----------------------------------------------- 82
12.5. How to Replace the LLP (Leadless Leadframe
Package) IC ----------------------------------------------- 84
12.6. Terminal Guide of the ICs, Transistors and
Diodes ------------------------------------------------------ 86
13 Schematic Diagram -------------------------------------------- 87
13.1. For Schematic Diagram -------------------------------- 87
13.2. Schematic Diagram (Base Unit_Main)-------------- 88
13.3. Schematic Diagram (Base Unit_RF Part)---------- 90
13.4. Schematic Diagram (Base Unit_Operation)------- 91
13.5. Schematic Diagram (Cordless Handset)----------- 92
13.6. Schematic Diagram (Charger Unit)------------------ 94
14 Printed Circuit Board ------------------------------------------ 95
14.1. Circuit Board (Base Unit_Main) ---------------------- 95
14.2. Circuit Board (Base Unit_Operation)---------------- 97
14.3. Circuit Board (Cordless Handset)-------------------- 99
14.4. Circuit Board (Charger Unit)------------------------- 101
15 Exploded View and Replacement Parts List --------- 102
15.1. Cabinet and Electrical Parts (Base Unit)--------- 102
15.2. Cabinet and Electrical Parts (Cordless
Handset)-------------------------------------------------- 103
15.3. Cabinet and Electrical Parts (Charger Unit)----- 104
15.4. Accessories and Packing Materials --------------- 105
15.5. Replacement Parts List------------------------------- 108

4
KX-TG1061M/KX-TG1062M/KX-TGA106M
1 Safety Precautions
1.1. For Service Technicians
•Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
•ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2Warning
2.1. Battery Caution
Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the instructions.
2.2. About Lead Free Solder (Pbf: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with tem-
perature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).

5
KX-TG1061M/KX-TG1062M/KX-TGA106M
2.2.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac-
turer’s specific instructions for the melting points of their products and any precautions for using their product with other materi-
als.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3. Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.