Panasonic KX-TG5571BXM User manual

© 2005 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
KX-TG5571BXM
KX-TGA550BXM
Expandable Digital Cordless Answering
System
Metallic Gray Version
(for Asia, Middle Near East and Other Areas)
Telephone Equipment
ORDER NO. KM40502620CE

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 4
1.1. Suggested PbF Solder 4
1.2. How to Recognize that Pb Free Solder is Used 5
2 FOR SERVICE TECHNICIANS 5
3 CAUTION 5
4 OPERATING INSTRUCTIONS 6
4.1. Battery 6
4.2. Location of Controls 8
4.3. Displays 10
4.4. Settings 13
4.5. Troubleshooting 20
5 DISASSEMBLY INSTRUCTIONS 25
5.1. Base Unit 25
5.2. Handset 26
5.3. Charger Unit 27
6 ASSEMBLY INSTRUCTIONS 28
6.1. Fix the LCD and the Receiver Guide to the Main P.C.
Board (Handset) 28
7 TROUBLESHOOTING GUIDE 29
7.1. Check Power 30
7.2. Error Message Table 30
7.3. Check Record 31
7.4. Check Playback 32
7.5. Check Sp-phone Transmission 32
7.6. Check Sp-phone Reception 33
7.7. Check Battery Charge 33
7.8. Check Link 34
7.9. Check the RF part 35
7.10. Check Handset Transmission 42
7.11. Check Handset Reception 42
7.12. Check Caller ID 42
8 ADJUSTMENT AND TEST MODE 43
8.1. Test Mode Flow Chart for Base Unit 43
8.2. Test Mode Flow Chart for Handset 47
8.3. X501 (Base Unit), X201 (Handset) Check 51
8.4. Adjust Battery Low Detector Voltage (Handset) 51
8.5. Base Unit Reference Drawing 52
8.6. Handset Reference Drawing 53
8.7. Frequency Table 54
8.8. How to Clear User Setting 56
9 DESCRIPTION 57
9.1. Frequency 57
9.2. FHSS (Frequency Hopping Spread Spectrum) 57
9.3. Signal Flowchart in the Whole System 59
10 EXPLANATION OF LINK DATA COMMUNICATION 60
10.1. Calling 60
10.2. To Terminate Communication 60
10.3. Ringing 60
11 BLOCK DIAGRAM (BASE UNIT_MAIN) 61
12 CIRCUIT OPERATION (BASE UNIT_MAIN) 62
12.1. DSP (Digital Speech/Signal Processing: IC501) 62
12.2. Flash Memory (IC601) 62
12.3. Power Supply Circuit 63
12.4. Reset Circuit 65
12.5. Intercom Mode 66
12.6. Telephone Line Interface 66
12.7. Auto Disconnect Circuit 67
12.8. Parallel Connection Detect Circuit 68
12.9. Calling Line Identification (Caller ID) 69
13 BLOCK DIAGRAM (BASE UNIT_RF PART) 70
14 BLOCK DIAGRAM (HANDSET_RF PART) 71
15 CIRCUIT OPERATION (RF PART) 72
15.1. Power Supply Circuit 73
15.2. 2.4GHz Mod/Demod Circuit 74
15.3. 5.8GHz Converter Circuit 75
15.4. 5.8GHz LNA (Low Noise Amplifier) Circuit 76
15.5. 5.8GHz Power Amplifier and Antenna Switch Circuit 77
16 BLOCK DIAGRAM (HANDSET) 78
17 CIRCUIT OPERATION (HANDSET) 79
17.1. Construction 79
17.2. Power Supply Circuit 80
17.3. Charge Circuit 81
Note:
Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can
download and refer to the original Operating Instructions on TSN Server for further information.
CONTENTS
Page Page
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KX-TG5571BXM / KX-TGA550BXM

17.4. Ringer and Handset SP-Phone 81
17.5. Sending Signal 82
17.6. Reception Signal 82
18 CIRCUIT OPERATION (CHARGER UNIT) 83
19 SIGNAL ROUTE 84
20 CPU DATA (BASE UNIT) 86
20.1. IC501 86
21 CPU DATA (HANDSET) 87
21.1. IC201 87
22 EXPLANATION OF IC TERMINALS (RF PART) 88
22.1. IC701 88
22.2. IC801 89
22.3. IC851 90
23 HOW TO REPLACE THE FLAT PACKAGE IC 91
23.1. PREPARATION 91
23.2. FLAT PACKAGE IC REMOVAL PROCEDURE 91
23.3. FLAT PACKAGE IC INSTALLATION PROCEDURE 92
23.4. BRIDGE MODIFICATION PROCEDURE 92
24 CABINET AND ELECTRICAL PARTS (BASE UNIT) 93
25 CABINET AND ELECTRICAL PARTS (HANDSET) 94
26 CABINET AND ELECTRICAL PARTS (CHARGER UNIT) 95
27 ACCESSORIES AND PACKING MATERIALS 96
27.1. KX-TG5571BXM 96
27.2. KX-TGA550BXM (Optional Set) 97
28 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
98
28.1. Base Unit 98
28.2. Handset 98
28.3. Charger Unit 99
29 REPLACEMENT PARTS LIST 100
29.1. Base Unit 100
29.2. Handset 102
29.3. Charger Unit 104
29.4. Accessories and Packing Materials 105
30 FOR SCHEMATIC DIAGRAM 107
30.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT_MAIN))
107
30.2. Handset (SCHEMATIC DIAGRAM (HANDSET_MAIN))
107
30.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
107
31 SCHEMATIC DIAGRAM (BASE UNIT_MAIN) 108
32 SCHEMATIC DIAGRAM (BASE UNIT_RF PART) 110
33 SCHEMATIC DIAGRAM (BASE UNIT_OPERATION) 112
34 SCHEMATIC DIAGRAM (HANDSET_MAIN) 114
35 SCHEMATIC DIAGRAM (HANDSET_RF PART) 116
36 SCHEMATIC DIAGRAM (CHARGER UNIT) 118
37 CIRCUIT BOARD (BASE UNIT_MAIN) 119
37.1. Component View 119
37.2. Flow Solder Side View 120
38 CIRCUIT BOARD (BASE UNIT_OPERATION) 121
38.1. Component View 121
38.2. Flow Solder Side View 122
39 CIRCUIT BOARD (BASE UNIT_RF PART) 123
40 CIRCUIT BOARD (HANDSET_MAIN) 125
40.1. Component View 125
40.2. Flow Solder Side View 126
41 CIRCUIT BOARD (HANDSET_RF PART) 127
42 CIRCUIT BOARD (CHARGER UNIT) 128
42.1. Component View 128
42.2. Flow Solder Side View 128
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KX-TG5571BXM / KX-TGA550BXM

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
• PbF solder has a melting point that is 50°F ~ 70° F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20° F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
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KX-TG5571BXM / KX-TGA550BXM

1.2. How to Recognize that Pb Free Solder is Used
(Example: Handset P.C.B.)
IC201
IC246
IC221
IC371 IC381
CN331
C335
C321
C317
D354
D352 R368
R367
R366
C307
C304
C208
R208
C306
C354
R354
D223 D324
D231
D323
1
114
28 15
25 26
50
5175
76
100 C386
C382
L331
L334
L211
C361
R206 C206
C281
C282
C204
C219
R207
C261
C242 C209
C262
R234
C263
C264
C334
R324
R323
L332
R232 C231
R231
C246
R246 R247
C223
R362
R352
R361
R363
R351
C313
C311
R376 R377
C312
C353
R241
C241
R225 C225
R224
R228
C224
R223
C315 R318
R315
C314
R314
C316
R312
C221
C222
R222
R201
C201
C215C212
C214
C202
C332
R331
R261
R262
R263
R242
C322
R227C227
R340C340
R317
R205
PDN
C244R243
C243 R226C226
R209
R333
R334 C336
C377
C333
C303
C305
C383
C275 C274 C278 C277
R286
C284 C283
C279
C286
C371
C381
C211
L326
D326
L327
D327
D313
D312
D351
L351
L352
D353
X201
MICM
MICP
Q243
Q261
Q262
Q231
Q251
D363
Q221
RA251
Q331
Q363 Q362
Q361
CHG1
MIC
CHG2
SPP
PbF
RECEIVER
SPM
RX
TX
VBAT2
BATTM
BATTP
VBAT1
VSS2 VSS1
IC241
IC261
RA201
RA255
TXO
RXI
CI
JTAG
SI
C
TXE
RXE
TE
C701
IC761
IC841
Q871
IC701
IC851
IC801
SHIELD
KX-TGA550R A
PQUP 11292Z
LED261
Marked
(Component View)
Note:
The location of the “PbF” mark is subject to change without notice.
2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1.Cover plastic parts boxes with aluminum foil.
2.Ground the soldering irons.
3.Use a conductive mat on worktable.
4.Do not grasp IC or LSI pins with bare fingers.
3 CAUTION
1.Danger of explosion if battery is incorrectly replaced.
2.Replace only with the same or equivalent type recommended by the manufacturer.
3.Dispose of used batteries according to the manufacturer´s Instructions.
5
KX-TG5571BXM / KX-TGA550BXM

4 OPERATING INSTRUCTIONS
4.1. Battery
4.1.1. Battery Installation
4.1.2. Battery Charge
4.1.3. Recharging the Battery
Note for service:
The battery strength may not be indicated correctly if the battery is disconnected and connected again, even after it is fully
charged. In that case, by recharging the battery as mentioned above, you will get a correct indication of the battery strength.
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KX-TG5571BXM / KX-TGA550BXM

4.1.4. Battery Strength
4.1.5. Battery Replacement
4.1.6. Battery Performance
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KX-TG5571BXM / KX-TGA550BXM

4.2. Location of Controls
4.2.1. Base Unit
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KX-TG5571BXM / KX-TGA550BXM

4.2.2. Handset
4.2.3. Charger Unit (for Optional Handset)
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KX-TG5571BXM / KX-TGA550BXM

4.3. Displays
4.3.1. Display Items
4.3.2. Menu Icons
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KX-TG5571BXM / KX-TGA550BXM

4.3.3. Troubleshooting (Handset LCD)
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KX-TG5571BXM / KX-TGA550BXM

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KX-TG5571BXM / KX-TGA550BXM

4.4. Settings
4.4.1. Connections
13
KX-TG5571BXM / KX-TGA550BXM

4.4.2. Guide to Handset Programming
14
KX-TG5571BXM / KX-TGA550BXM

15
KX-TG5571BXM / KX-TGA550BXM

4.4.3. Dial Lock
For Service Hint:
*: If the current password is forgotten, enter “726276642” and you will be able to go to next step.
16
KX-TG5571BXM / KX-TGA550BXM

4.4.4. Direct Commands
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KX-TG5571BXM / KX-TGA550BXM

18
KX-TG5571BXM / KX-TGA550BXM

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KX-TG5571BXM / KX-TGA550BXM

4.5. Troubleshooting
If the handset display shows error messages, see “Troubleshooting (Handset LCD) (P.11)” for the Cause & Solution.
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KX-TG5571BXM / KX-TGA550BXM