Panasonic TC15DT2 - 15"WIDE LCD TV User manual

Power Source
AC 120V, 60Hz
Power Consumption
Average use: 54.2W (Maximum Current 3.62A)
tand-by condition: 0.45 W
LCD
TFT 15.2-inch, 16:9 aspect ratio, 854 x 480 dots, 409.920
pixel
Screen Size
13.19" (335mm)(W) x 7.4" (188mm)(H) x 15.12”(384mm)
(DIAGONAL)
Channel Capability-181
VHF-12: UHF-56: Cable-125
Sound
Speaker
3” 5/32 (8cm) x 2
Audio Output
6W [3W+3W] (10%THD) Power Frequency Response
35Hz~16kHz
Headphones
M3(3.5 mm) Jack (16Ω~32Ω)
EATURES
DVD Player 3D Y/C FILTER
CLO ED CAPTION V-Chip
Disc Played
DVD-VIDEO/DVD-AUDIO disc
12cm single-sided, single-layer
12cm single-sided, dual-layer
12cm double-sided, single-layer
8cm single-sided, single-layer
8cm single-sided, dual-layer
© 2000 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TC-15DT2
LV1M Chassis
8cm double-sided, single-layer
COMPACT disc (CD-DA, VIDEO CD)
12cm disc
8cm disc
Accessories Supplied
Remote control Transmitter
TNQE262
AAA (R03) Battery x 2
Operating Conditions
Temperature: 34°F - 104°F(5°C - 35°C)
Humidity: 20% - 80% (non-condensing)
Connection Terminals
VIDEO INPUT
-VIDEO (Mini DIN 4-pin)
Y:1Vp-p(75Ω)
C: 0.286Vp-p(75Ω)
VIDEO (Pin Jack) 1Vp-p(75Ω)
AUDIO L-R (Pin Jack x2) 0.5 Vrms (TV/Video)
2.0 Vrms (DVD/CD)
AUDIO OUT
5.1ch URROUND AUDIO OUT
FRONT L/R: TEREO M3 JACK
URROUND L/R: TEREO M3 JACK
CENTER/ UBWOOFER: TEREO M3 JACK
Dimensions (W x H x D)
15.24" (387mm) x 14.69" (373mm) x 8.9"(226mm)
Weight (Mass)
21.19lb. (about 9.6kg) Net
Note:
Design and pecifications are subject to change without notice.
Weight and Dimensions shown are approximate.
Combination 15.2” LCD TV/DVD Player
ORDER NO. ITD0011014C1
B05

1 Safety Precautions 4
1.1. General Guidelines 4
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 4
3 Precaution of Laser Diode 5
4 Handling Precautions or Traverse Deck 5
4.1. Handling of optical pickup 5
4.2. Grounding for electrostatic breakdown prevention 5
5 Self-check function 6
5.1. How to access 6
5.2. creen display 6
5.3. Display phenomenon and treatment method 6
5.4. DVD self-diagnosis 6
6 Servicing method (DVD unit) 8
6.1. When disc is unloadable 8
6.2. Replacing A-PCB 9
6.3. Replacing H-PCB and PD-PCB 14
6.4. Replacing HA-PCB 15
6.5. Replacing K-PCB (operation panel) and J-PCB (junction)
15
6.6. Replacing P -PCB (power supply switch) 16
6.7. Replacing speakers ( P) 16
7 Servicing method (LCD panel) 17
7.1. Replacing LCD panel PCB 17
7.2. Removing fluorescent lamp 18
7.3. Adjustment of LCD panel PCB 19
7.4. ervice Position 20
8 Assembling and Disassembling the Optical Pickup
(Mechanical Parts) 21
8.1. Handling the Optical Pickup 21
8.2. Disassembly Procedure 21
8.3. Disassembling the Clamp Base Unit 22
8.4. Disassembling the Clamper Weight, Clamper Yoke,
Magnet and Clamper 22
8.5. Disassembling the Traverse Unit 22
8.6. Disassembling the tepping Motor Unit 23
8.7. Disassembling the Optical Pickup Unit 23
8.8. Disassembling the Nut Unit 24
8.9. Disassembling the ub- haft Preload pring 24
8.10. Assembling the Optical Pickup 24
8.11. Disassembling the pindle Motor Unit 25
8.12. Disassembling the Intermediate Chassis 26
8.13. Disassembling the Vertical cam and Drive gear 26
8.14. Disassembling the Pulley Gear and Deceleration Gear 26
8.15. Disassembling the Mechanism Loading P.C.B. 26
9 Service Tools and Equipment 27
9.1. ervice Tools and Equipment Table 27
9.2. toring and Handling Test Discs 27
10 Adjustment method 28
10.1. How to enter into adjustment mode 28
10.2. Cancellation 28
10.3. Contents of adjustment mode 28
10.4. DVD level adjustment 29
10.5. Video level adjustment 31
11 Conductor Views 33
11.1. P-Board 33
11.2. A-Board 35
11.3. DG-Board 38
11.4. H, HA, J, K, PD, P and Z-Board 40
11.5. DVD Module-Board 41
12 Abbreviations 45
13 Voltage Chart 47
13.1. DVD Module Board 47
14 Block and Schematic Diagram 51
14.1. chematic Diagram Notes 51
14.2. DVD Overall Block Diagram 52
14.3. DVD ervo Block Diagram 53
14.4. Power Block Diagrams 54
14.5. ignal Block Diagrams 56
14.6. DG-Board Block Diagrams 58
14.7. Interconnection chematic Diagrams 59
14.8. H, HA, and A-Board (1/6) chematic Diagrams 60
14.9. A-Board (2/6) chematic Diagrams 61
14.10. A-Board (3/6) chematic Diagrams 62
14.11. A-Board (4/6) chematic Diagrams 63
14.12. A-Board (5/6) chematic Diagrams 64
14.13. A-Board (6/6) chematic Diagrams 65
14.14. DG-Board (1/4) chematic Diagram 66
14.15. DG-Board (2/4) chematic Diagram 67
14.16. DG-Board (3/4) chematic Diagram 68
14.17. DG-Board (4/4) chematic Diagram 69
14.18. J, K, and P -Board chematic Diagram 70
14.19. P-Board (1/3) and Z-Board chematic Diagram 71
14.20. P-Board (2/3) and PD-Board chematic Diagram 72
14.21. P-Board (3/3) chematic Diagram 73
14.22. AD C ection (DVD Module Board (1/8)) chematic
Diagram 74
14.23. AV Decorder ection (DVD Module Board (2/8))
chematic Diagram 75
CONTENTS
Page Page
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14.24. Video D/A Converter ection (DVD Module Board (3/8))
chematic Diagram 76
14.25. Audio ection (DVD Module Board (4/8)) chematic
Diagram 77
14.26. FEP ection (DVD Module Board (5/8)) chematic
Diagram 78
14.27. CPU ection (DVD Module Board (6/8)) chematic
Diagram 79
14.28. ODC ection (DVD Module Board (7/8)) chematic
Diagram 80
14.29. C 2 ection (DVD Module Board (8/8)) chematic
Diagram 81
15 Exploded Views 83
15.1. Casing Parts ection Exploded View 83
15.2. Packing ection Exploded View 84
15.3. DVD Loading Mechanism ection Exploded View 85
15.4. DVD Traverse ection Exploded View 86
16 Replacement Parts List 87
16.1. Relpacement Parts List Notes 87
16.2. Mechanical Replacement Parts List 88
16.3. DVD Mechanical Replacement Parts List 89
16.4. Electrical Replacement Parts List 90
16.5. DVD Electrical Replacement Parts List 102
17 Dimensions 107
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1.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MΩand 5.2MΩ.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
1.1.2. Leakage Current Hot Check (See
igure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RM . A leakage current tester ( impson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
1 Safety Precautions
1.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
ome semiconductor (solid state) devices can be damaged easily by static electricity. uch components commonly are called
Electrostatically ensitive (E ) Devices. Examples of typical E devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (E D).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any E D on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging E D wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with E devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder E devices.
4. Use only an anti-static solder removal device. ome solder removal devices not classified as "anti-static (E D protected)" can
generate electrical charge sufficient to damage E devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage E devices.
6. Do not remove a replacement E device from its protective package until immediately before you are ready to install it. (Most
replacement E devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement E device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
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The laser diode in the optical pickup may break down due to
potential difference caused by static electricity of clothes or
human body.
o be careful of electrostatic break down during repair of the
optical pickup.
4.1. Handling of optical pickup
1. Do not subject the optical pickup to static electricity as it is
extremely sensitive to electrical shock.
2. To prevent the breakdown of the laser diode, an antistatic
shorting pin is inserted into the flexible board (FPC Board).
When removing or connecting the short pin, finish the job in
as short times as possible.
3. Be careful not to apply excessive stress to the flexible board
(FPC Board).
4. Do not turn the variable resistor (Laser power adjustment).
1. Human body grounding
Use the antistatic wrist strap to discharge the static
electricity from your body.
2. Work table grounding
Put a conductive material (sheet) or steel sheet on the area
where the optical pickup is placed and ground the sheet.
Caution
The static electricity of your clothes will not be grounded
through the wrist strap. o take care not to let your
clothes touch the optical pickup.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement E devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (E D) sufficient to
damage an E device).
3 Precaution of Laser Diode
Caution
This unit utilizes a class I laser. Invisible laser radiation is emitted from the optical pickup lens when the unit is turned on:
1. Do not look directly into the pickup lens.
2. Do not use optical instruments to look at the pickup lens.
3. Do not adjust the preset variable resistor on the optical pickup.
4. Do not disassemble the optical pickup unit.
5. If the optical pickup is replaced, use the manufactures specified replacement pickup only.
6. Use of control or adjustment or performance of procedures other than those specified herin may result in hazardous radiation
exposure.
4 Handling Precautions or Traverse Deck
4.2. Grounding for electrostatic breakdown prevention
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5 Self-check function
When phenomena like "the power fails from time to time" or "the video/audio fails from time to time" can not be confirmed at the
time of servicing, the self-check function can be used to confirm the occurrence and to limit the scope for the defective circuits.Also,
when "the power fails from time to time", display of the color bar on the screen can be used to confirm the occurrence and to limit
the scope for the defective circuits.
5.1. How to access
5.1.1. Access
Produce TV reception screen and, while pressing [VOLUME-] button on the main unit, press [ LEEP] button on the remote
controller unit simultaneously.
5.1.2. Exit
When one of the buttons for channel selection etc. is pressed, the display returns to the normal screen.
5.2. Screen display
5.3. Display phenomenon and treatment method
Display symbol Phenomenon/condition Treatment method
H10 No output of video and audio. Replace tuner (TNR001).
H21 No audio output. urround function not effective. Replace IC2303.
H30 No video and audio output. Input switching disabled. Replace IC4003.
H32 Black and white stripes pattern. Enhanced back light. Replace DG digital core module.
H36 White stripes on black screen. (No synchronization) Replace DG digital core module.
H45 No video. O D and audio output are available. Replace DG digital core module.
H90 Power interrupted with self-check. Replace IC1005 on A-PCB.
H91 No O D. Replace IC1007 on A-PCB.
H92 Video flutter. Wrong tint for DVD picture. Replace IC1008 on A-PCB.
H93 No video. O D and audio output are available. Replace DG digital core module.
H00 DVD self-diagnosis.
H55 Abnormal voltage detected.
* Any button operation or switching off the power will reset the self-check data.
5.4. DVD self-diagnosis
Display Code Diagnosis
U- 11 Focus error
H 01 Tray loading error
02 pindle servo error
03 Traverse error
04 Tracking servo error
05 eek error
06 Power failure
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Display Code Diagnosis
F0** Disc format error
1** Disc code error
2** Decoder L error
3** Display
4** IIC BU error
5** D C
6** ECC error
7** Microcomputer failure
8** Microcomputer failure
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6 Servicing method (DVD unit)
6.1. When disc is unloadable
• • •
• When the disc cannot be unloaded even if the unload button on DVD main unit or on remote controller is pressed.
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6.2. Replacing A-PCB
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6.3. Replacing H-PCB and PD-PCB
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6.4. Replacing HA-PCB
6.5. Replacing K-PCB (operation panel) and J-PCB (junction)
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6.6. Replacing PS-PCB (power supply switch)
6.7. Replacing speakers (SP)
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7 Servicing method (LCD panel)
7.1. Replacing LCD panel PCB
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7.2. Removing fluorescent lamp
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7.3. Adjustment of LCD panel PCB
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7.4. Service Position
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