
Document No.: 1P0446-1 Rev. B, April 7, 2014
Section 1 - Introduction
The
IoN 3 MHz Operation and Maintenance Technical Manual
provides a complete reference to all
system controls. All user-level hardware, interfaces and directions are described, along with their
associated operating procedures.
The safety section points out any risks involved with equipment operation along with
recommendations for safely operating and maintaining the system. The safety features included with
the system are also outlined.
The unpacking and installation sections help with initial first time startup.
The theory section explains the principals behind plasma generation and the variables that are under
operator control during process development and optimization. The goal is to give the beginning
plasma process engineer a starting point for developing plasma treatments for various applications
using the IoN 3 MHz equipment. The user should contact PVA TePla America Inc. if more detailed
process development assistance is required for a specific application.
The equipment section gives a detailed description of the controls and indicators.
The operation section gives step by step instructions for operation of the equipment.
The service section contains the information on warranties, preventative maintenance, trouble
shooting, and parts replacement.
Text conventions used in the manual are as follows:
buttons the operator is instructed to actuate are listed in all CAPITAL LETTERS.
section headings are in color, bold print and/or UNDERLINED.
Nomenclature for data entry in this manual and on the system itself uses:
Torr in reference to pressure
Watts (w) for power
seconds (secs) or minutes (mins) for time
1.1 Overview
The IoN 3 MHz plasma system is a tabletop plasma chemistry reactor designed to provide the failure
analysis, medical, scientific and educational community with a plasma system at moderate cost. It is
designed to provide repeatable plasma processing for ashing, cleaning or etching.
The IoN 3 MHz a batch-mode plasma system for etch, strip, clean, and surface treatment. It
combines field-proven features, which minimize machine-generated particulate with the process
flexibility of computer control. This combination offers ultimate performance: high throughput, low
particulate generation, process versatility, precise parameter control, and fault isolation.