Quectel QuecOpen BG952A-GL Supplement

BG952A-GL QuecOpen
Hardware Design
LPWA Module Series
Version: 1.0.0
Date: 2022-04-30
Status: Preliminary
www.quectel.com

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Our aim is to provide customers with timely and comprehensive service. For any assistance,
please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd.
Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai
200233, China
Tel: [phone]
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General Notes
Quectel offers the information as a service to its customers. The information provided is based upon
customers’ requirements. Quectel makes every effort to ensure the quality of the information it makes
available. Quectel does not make any warranty as to the information contained herein, and does not
accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the
information. All information supplied herein is subject to change without prior notice.
Disclaimer
While Quectel has made efforts to ensure that the functions and features under development are free
from errors, it is possible that these functions and features could contain errors, inaccuracies and
omissions. Unless otherwise provided by valid agreement, Quectel makes no warranties of any kind,
implied or express, with respect to the use of features and functions under development. To the maximum
extent permitted by law, Quectel excludes all liability for any loss or damage suffered in connection with
the use of the functions and features under development, regardless of whether such loss or damage
may have been foreseeable.
Duty of Confidentiality
The Receiving Party shall keep confidential all documentation and information provided by Quectel,
except when the specific permission has been granted by Quectel. The Receiving Party shall not access
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Furthermore, the Receiving Party shall not disclose any of the Quectel's documentation and information
to any third party without the prior written consent by Quectel. For any noncompliance to the above
requirements, unauthorized use, or other illegal or malicious use of the documentation and information,
Quectel will reserve the right to take legal action.

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Copyright
The information contained here is proprietary technical information of Quectel. Transmitting, reproducing,
disseminating and editing this document as well as using the content without permission are forbidden.
Offenders will be held liable for payment of damages. All rights are reserved in the event of a patent grant
or registration of a utility model or design.
Copyright © Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved.
Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that the radio equipment type [BG952A-GL] is in
compliance with Directive 2014/53/EU.
The full text of the EU declaration of conformity is available at the following internet address:
http://www.quectel.com
The device could be used with a separation distance of 20cm to the human body.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergency help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives
and transmits radio frequency signals. RF interference can occur if it is used close
to TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other cellular
terminals. Areas with explosive or potentially explosive atmospheres include
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,
and areas where the air contains chemicals or particles such as grain, dust or

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metal powders.

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About the Document
Revision History
Version
Date
Author
Description
-
2022-04-30
Arvin WU/
Ben JIANG
Creation of the document
1.0.0
2022-04-30
Arvin WU/
Ben JIANG
Preliminary

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Contents
Safety Information ........................................................................................................................................ 3
About the Document .................................................................................................................................... 5
Contents .........................................................................................................................................................6
Table Index .................................................................................................................................................... 8
Figure Index .................................................................................................................................................10
1Introduction ..........................................................................................................................................11
1.1. Special Mark ..............................................................................................................................11
2Product Concept ................................................................................................................................. 12
General Description .................................................................................................................. 12
2.1. 12
2.2. Key Features .............................................................................................................................13
2.3. Functional Diagram ...................................................................................................................15
2.4. Evaluation Board .......................................................................................................................16
3Application Interfaces .........................................................................................................................17
3.1. General Description .................................................................................................................. 17
3.2. Pin Assignment ......................................................................................................................... 18
3.3. Pin Description ..........................................................................................................................19
3.4. Pins Multiplexing ....................................................................................................................... 25
3.5. Operating Modes ...................................................................................................................... 25
3.5.1. Recovery Mode ............................................................................................................... 26
3.6. Power Saving Mode* ................................................................................................................ 27
3.7. Power Supply ............................................................................................................................28
3.7.1. Power Supply Pins .......................................................................................................... 28
3.7.2. DVoltage Stability Requirements .................................................................................... 28
3.7.3. Power Supply Monitoring ................................................................................................ 29
3.8. Turn on ...................................................................................................................................... 29
3.8.1. Turn on Module with PWRKEY .......................................................................................29
3.8.2. Turn off Module ............................................................................................................... 32
3.8.2.1. Turn off Module with PWRKEY .............................................................................32
3.9. Reset the Module ......................................................................................................................33
3.10. PON_TRIG Interface ................................................................................................................ 35
3.11. (U)SIM Interface ........................................................................................................................36
3.12. USB Interface* .......................................................................................................................... 38
3.13. UART Interfaces ........................................................................................................................39
3.14. I2C Interface* ............................................................................................................................ 41
3.15. SPI Interfaces* .......................................................................................................................... 42
3.16. ADC Interfaces* ........................................................................................................................ 42
3.17. Network Status Indication .........................................................................................................43

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3.18. STATUS .....................................................................................................................................44
3.19. GRFC Interfaces* ......................................................................................................................45
4GNSS Receiver .................................................................................................................................... 46
4.1. General Description .................................................................................................................. 46
4.2. GNSS Performance .................................................................................................................. 46
4.3. Layout Guidelines ..................................................................................................................... 47
5Antenna Interfaces .............................................................................................................................. 48
5.1. Main Antenna Interface .............................................................................................................48
5.1.1. Pin Definition ................................................................................................................... 48
5.1.2. Operating Frequency ...................................................................................................... 48
5.1.3. Reference Design ............................................................................................................49
5.2. GNSS Antenna Interface .......................................................................................................... 50
5.2.1. Pin Definition ................................................................................................................... 50
5.2.2. GNSS Operating Frequency ........................................................................................... 50
5.2.3. Reference Design ............................................................................................................50
5.3. Reference Design of RF Layout ............................................................................................... 51
5.4. Antenna Installation .................................................................................................................. 53
5.4.1. Antenna Requirements ................................................................................................... 53
5.4.2. Recommended RF Connector for Antenna Installation ..................................................53
6Reliability, Radio and Electrical Characteristics .............................................................................56
6.1. Absolute Maximum Ratings ......................................................................................................56
6.2. Power Supply Ratings .............................................................................................................. 56
6.3. Operating and Storage Temperatures ......................................................................................57
6.4. Power Consumption ................................................................................................................. 57
6.5. Tx Power ................................................................................................................................... 60
6.6. RF Receiving Sensitivity ...........................................................................................................60
6.7. ESD ........................................................................................................................................... 61
7Mechanical Dimensions ..................................................................................................................... 62
7.1. Mechanical Dimensions ............................................................................................................62
7.2. Recommended Footprint .......................................................................................................... 64
7.3. Top and Bottom Views .............................................................................................................. 65
8Storage, Manufacturing and Packaging ........................................................................................... 66
8.1. Storage ......................................................................................................................................66
8.2. Manufacturing and Soldering ....................................................................................................67
8.3. Packaging ................................................................................................................................. 68
8.3.1. Carrier Tape .....................................................................................................................68
8.3.2. Plastic Reel ......................................................................................................................69
8.3.3. Packing Process ..............................................................................................................70
9Appendix A References ......................................................................................................................71

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Table Index
Table 1: Special Mark ...................................................................................................................................11
Table 2: Frequency Bands and GNSS Types of BG952A-GL QuecOpen ..................................................12
Table 3: Key Features of BG952A-GL QuecOpen ...................................................................................... 13
Table 4: Definition of I/O Parameters .......................................................................................................... 19
Table 5: Pin Description ............................................................................................................................... 20
Table 6: Overview of MAP Operating Modes .............................................................................................. 25
Table 7: Overview of MCU Operating Modes ..............................................................................................26
Table 8: Maximum Device Sleep Level of MAP-MCU Mode Combinations ...............................................27
Table 9: Power Supply Pin Definition .......................................................................................................... 28
Table 10: PWRKEY Pin Definition ............................................................................................................... 30
Table 11: Pin Definition of RESET_N .......................................................................................................... 33
Table 12: Pin Definition of PON_TRIG Interface .........................................................................................35
Table 13: Pin Definition of (U)SIM Interface ................................................................................................36
Table 14: Pin Definition of USB Interface .................................................................................................... 38
Table 15: Pin Definition of Main UART Interface .........................................................................................39
Table 16: Pin Definition of CLI UART Interface ...........................................................................................40
Table 17: Pin Definition of ADC Interfaces .................................................................................................. 42
Table 18: Characteristics of ADC Interfaces ............................................................................................... 43
Table 19: Pin Definition of NET_STATUS ....................................................................................................43
Table 20: Operating Status of NET_STATUS ..............................................................................................44
Table 21: Pin Definition of STATUS ............................................................................................................. 44
Table 22: Pin Definition of GRFC Interfaces ............................................................................................... 45
Table 23: Truth Table of GRFC Interfaces ...................................................................................................45
Table 24: GNSS Performance ..................................................................................................................... 46
Table 25: Pin Definition of the Main Antenna Interface ...............................................................................48
Table 26: BG952A-GL QuecOpen Operating Frequency ........................................................................... 48
Table 27: Pin Definition of GNSS Antenna Interface ...................................................................................50
Table 28: GNSS Operating Frequency ........................................................................................................50
Table 29: Antenna Requirements ................................................................................................................ 53
Table 30: Absolute Maximum Ratings ......................................................................................................... 56
Table 31: Power Supply Ratings ..................................................................................................................56
Table 32: Operating and Storage Temperatures ......................................................................................... 57
Table 33: Power Consumption (Power Supply: 3.3 V, Room Temperature) ...............................................57
Table 34: GNSS Current Consumption of (3.3 V Power Supply, Room Temperature) .............................. 59
Table 35: Tx Power ...................................................................................................................................... 60
Table 36: Conducted RF Receiving Sensitivity of BG952A-GL QuecOpen ............................................... 60
Table 37: Electrostatic Discharge Characteristics (25 ºC, 45 % Relative Humidity) .................................. 61
Table 38: Recommended Thermal Profile Parameters ...............................................................................68
Table 39: Carrier Tape Dimension Table (Unit: mm) ................................................................................... 69
Table 40: Plastic Reel Dimension Table (Unit: mm) ....................................................................................69
Table 41: Related Documents ..................................................................................................................... 71

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Table 42: Terms and Abbreviations ............................................................................................................. 71

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Figure Index
Figure 1: Functional Diagram of BG952A-GL ............................................................................................. 15
Figure 2: Pin Assignment (Top View) .......................................................................................................... 18
Figure 3: Power Supply Limits during Burst Transmission ......................................................................... 28
Figure 4: Star Structure of the Power Supply ............................................................................................. 29
Figure 5: Auto Power-on Circuit ...................................................................................................................30
Figure 6: Turn on the Module with a Driving Circuit ....................................................................................31
Figure 7: Turn on the Module with a Button ................................................................................................ 31
Figure 8: Power-up Timing ...........................................................................................................................32
Figure 9: Power-down Timing (PWRKEY) .................................................................................................. 33
Figure 10: Reference Circuit of RESET_N with a Driving Circuit ............................................................... 34
Figure 11: Reference Circuit of RESET_N with a Button ............................................................................34
Figure 12: Reset Timing ...............................................................................................................................34
Figure 13: Reference Circuit of PON_TRIG ................................................................................................35
Figure 14: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector ......................... 36
Figure 15: Reference Circuit of (U)SIM Interface with a 6-Pin (U)SIM Card Connector ............................37
Figure 16: Reference Design of USB Interface ...........................................................................................38
Figure 17: Main UART Reference Design (Translator Chip) ...................................................................... 40
Figure 18: Main UART Reference Design (Transistor Circuit) ....................................................................41
Figure 19: Reference Design of I2C Interface with an External I2C Interface Sensor .............................. 42
Figure 20: Reference Design of NET_STATUS .......................................................................................... 44
Figure 21: Reference Design of STATUS ....................................................................................................45
Figure 22: Reference Design of Main Antenna Interface ............................................................................49
Figure 23: Reference Design of GNSS Antenna Interface ......................................................................... 50
Figure 24: Microstrip Design on a 2-layer PCB ...........................................................................................51
Figure 25: Coplanar Waveguide Design on a 2-layer PCB ........................................................................ 51
Figure 26: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) .................... 52
Figure 27: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) .................... 52
Figure 28: Dimensions of the U.FL-R-SMT Connector (Unit: mm) .............................................................54
Figure 29: Mechanicals of U.FL-LP Connectors ......................................................................................... 54
Figure 30: Space Factor of Mated Connectors (Unit: mm) .........................................................................54
Figure 31: Module Top and Side Dimensions ............................................................................................. 62
Figure 32: Bottom Dimensions (Bottom View) ............................................................................................ 63
Figure 33: Recommended Footprint (Top View) ......................................................................................... 64
Figure 34: Top and Bottom Views ................................................................................................................65
Figure 35: Recommended Reflow Soldering Thermal Profile .................................................................... 67
Figure 36: Carrier Tape Dimension Drawing ............................................................................................... 69
Figure 37: Plastic Reel Dimension Drawing ................................................................................................69
Figure 38: Packaging Process .....................................................................................................................70

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1Introduction
QuecOpen®is an application solution where the module acts as a main processor. With the development
of communication technology and the ever-changing market demands, more and more customers have
realized the advantages of QuecOpen®solution, especially the advantage in reducing product cost. With
QuecOpen®solution, development flow for wireless applications and hardware designs will be simplified.
Main features of QuecOpen®solution are listed below:
Simplify the development of embedded applications, and shorten the product development cycle
Simplify circuit design, and reduce product cost
Decrease the size of terminal products
Reduce power consumption
Support firmware update via DFOTA, and provide a mechanism for APP binary image update
Improve cost-performance ratio of products, and enhance product competitiveness
BG952A-GL QuecOpen®is based on the processor core is ARM Cortex-M4, the maximum frequency is
up to 80 MHz, and the RAM size is 128K byte. You can use this module as the basis for developing
QuecOpen®applications.
This document, describing BG952A-GL QuecOpen module and its air interface and hardware interfaces
connected to your applications, provides you with the interface specifications, electrical and mechanical
details, as well as other related information of the module.
With the application notes and user guides provided separately, you can easily use the module to design
and set up mobile applications.
1.1. Special Mark
Table 1: Special Mark
Mark
Definition
*
When an asterisk (*) is used after a function, feature, interface, pin name, AT command, or
argument, it indicates that the function, feature, interface, pin name, AT command, or
argument is under development and currently not supported, unless otherwise specified.

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2Product Concept
2.1. General Description
As an embedded IoT (LTE Cat M1, LTE Cat NB2 and EGPRS) wireless communication module, it
provides data connectivity on LTE-FDD and GPRS/EGPRS networks, and supports half-duplex operation
in LTE network. It also provides GNSS function to meet your specific application demands.
The module is based on an architecture in which WWAN (LTE) and GNSS Rx chains share certain
hardware blocks. However, the module does not support concurrent operation of WWAN and GNSS. The
solution adopted in the module is a form of coarse time-division multiplexing (TDM) between WWAN and
GNSS Rx chains. Given the relaxed latency requirements of most LPWA applications, time-division
sharing of resources can be made largely transparent to applications. For more details, see document
[1].
BG952A-GL QuecOpen is an industrial-grade module for industrial and commercial applications only.
The following table shows the frequency bands of BG952A-GL QuecOpen module.
Table 2: Frequency Bands and GNSS Types of BG952A-GL QuecOpen
BG952A-GL QuecOpen, an SMD type module, can be embedded into applications through its 102 LGA
1LTE Cat NB2*is backward compatible with LTE Cat NB1.
Supported Bands Supported Bands
LTE Bands Power Class
GNSS
Cat M1:
LTE HD-FDD:
B1/B2/B3/B4/B5/B8/B12/B13/B18/B19/B20/B25/
B26/B27/B28/B66
Cat NB1/NB2*1:
LTE HD-FDD:
B1/B2/B3/B4/B5/B8/B12/B13/B17/B18/B19/B20/
B25/B28/B66
Power Class 3
(23 dBm ± 2.7 dB)
GPS,
GLONASS.

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pins. With a compact profile of 23.6 mm × 19.9 mm × 2.2 mm, it can meet almost all requirements for
M2M applications such as security, smart metering, tracking system, and wireless POS.
2.2. Key Features
Table 3: Key Features of BG952A-GL QuecOpen
Features
Details
Power Supply
Supply voltage: 2.2–4.35 1) V
Typical supply voltage: 3.3 V
Transmitting Power
Class 3 (23 dBm ±2.7 dB) for LTE HD-FDD bands
LTE Features
Supports 3GPP Rel-13/Rel-14*
Supports LTE Cat M1, NB1/NB2*
Supports 1.4 MHz RF bandwidth for LTE Cat M1
Supports 200 kHz RF bandwidth for LTE Cat NB1/NB2*
Rel-13:
Cat M1: 300 kbps (DL)/375 kbps (UL)
Cat NB1: 27.2 kbps (DL)/62.5 kbps (UL)
Rel-14*:
Cat M1: 588 kbps (DL)/1119 kbps (UL)
Cat NB2*: 127 kbps (DL)/158 kbps (UL)
Internet Protocol
Features
PPP/TCP/UDP/SSL/MQTT/FTP(S)/HTTP(S)/LwM2M/IPv4/IPv6/
TLS/DTLS/PING/CoAP/NITZ protocols
Supports PAP and CHAP for PPP connections
SMS
Text and PDU mode
Point-to-point MO and MT
SMS cell broadcast
SMS storage: ME by default
(U)SIM Interface
Supports 1.8 V external (U)SIM/eSIM card only
USB Interface
Compliant with USB 2.0 specifications
Supports full speed mode only
Used for AT command communication, data transmission, software
debugging and firmware upgrade*
USB serial driver:
-Windows 7/8/8.1/10
Linux 2.6–5.15
UART Interfaces
Main UART:
Used to connect with external peripherals of the module for customer
configuration.

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2BG952A-GL supports two CLI UART interfaces, more precisely, pin 27 (CLI_TXD1) and pin 28 (CLI_RXD1) are
connected to pin 95 (CLI_TXD2) and pin 94 (CLI_RXD2) respectively inside the module.
115200 bps baud rate by default
The default frame format is 8N1 (8 data bits, no parity, 1 stop
bit)115200 bps baud rate by default
CLI UART 2:
Used for firmware upgrade, software debugging, log output, GNSS
data and NMEA sentence output
Supports RTS and CTS hardware flow control
Default frame format: 8N1 (8 data bits, no parity, 1 stop bit)
Supports RTS and CTS hardware flow control
SPI Interfaces
Supports 3 SPI interfaces, 2 SPI master and 1 SPI slave, which can be
multiplexed from GPIOs.
MCU SPIM0:
Supports master mode only
Up to 25 MHz
MCU SPIM1:
Supports master mode only
Up to 25 MHz
MCU SPIS:
Supports slave mode only
Up to 25 MHz
I2C Interface
Supports 2 channels of MCU I2C interfaces
GNSS
GPS, GLONASS
AT Commands
3GPP TS 27.007 and 3GPP TS 27.005 AT commands
Quectel enhanced AT commands
Network Indication
One NET_STATUS pin for network connectivity status indication
Antenna Interfaces
Main antenna interface (ANT_MAIN)
GNSS antenna interface (ANT_GNSS)
Physical Characteristics
Dimensions: (23.6 ±0.2) mm × (19.9 ±0.2) mm × (2.2 ±0.2) mm
Weight: approx. 2.15 g
Temperature Range
Operating temperature range: -35 °C to +75 °C 2)
Extended temperature range: -40 °C to +85 °C 3)
Storage temperature range: -40 °C to +90 °C
Firmware Upgrade
CLI UART interface
USB interface*
DFOTA
RoHS
All hardware components are fully compliant with EU RoHS directive
NOTES

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1. 1) When the module starts up normally, to ensure full functionality, the minimum supply voltage should
be higher than 2.2 V. For every VBAT transition/re-insertion from 0 V, VBAT slew rate < 25 mV/μs. To
ensure normal module startup, pulling down PWRKEY to turn on the module after VBAT remains
stable for 100 ms.
2. 2) Within the operating temperature range, the module meets 3GPP specifications.
3. 3) Within the extended temperature range, the module remains the ability to establish and maintain
functions such as SMS and data transmission, without any unrecoverable malfunction. Radio
spectrum and radio network are not influenced, while one or more specifications, such as Pout, may
exceed the specified tolerances of 3GPP. When the temperature returns to the operating temperature
range, the module meets 3GPP specifications again.
2.3. Functional Diagram
The following figures show the block diagram of the modules and illustrates the major functional parts.
Power management
Baseband
Radio frequency
Peripheral interfaces
Figure 1: Functional Diagram of BG952A-GL

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2.4. Evaluation Board
To facilitate application design with the module conveniently, Quectel supplies the evaluation board (LTE
OPEN EVB), a USB to RS-232 converter cable, a micro-USB cable, an earphone, antennas and other
peripherals to control or test the module. For more details, see document [2].

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3Application Interfaces
3.1. General Description
BG952A-GL QuecOpen is equipped with 102 LGA pins. The subsequent chapters provide detailed
descriptions of the following interfaces:
Power supply
PON_TRIG interface
(U)SIM interface
USB interface
UART interfaces
PCM and I2C interfaces*
SPI interfaces*
ADC interfaces*
Status indication interfaces
GRFC interfaces

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3.2. Pin Assignment
The following figure shows the pin assignment of the module.
Figure 2: Pin Assignment (Top View)

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
1. ADC input voltage must not exceed 1.8 V.
2. Keep all RESERVED pins and unused pins unconnected.
3. GND pins should be connected to ground in the design.
4. On BG952A-GL, pin 27 (CLI_TXD1) and pin 28 (CLI_RXD1) are connected to pin 95 (CLI_TXD2) and
pin 94 (CLI_RXD2) respectively inside the module.
5. The LNA is integrated inside the module. It is not recommended to use an external LNA. It is strongly
recommended to keep GNSS_LNA_EN (pin 51) and VDD_RF (pin 99) unconnected.
3.3. Pin Description
The following tables show the pin definition, alternate functions and GPIO pull up/down resistance of the
module.
Table 4: Definition of I/O Parameters
Type
Description
AI
Analog Input
AO
Analog Output
AIO
Analog Input/Output
DI
Digital Input
DO
Digital Output
DIO
Digital Input/Output
PI
Power Input
PO
Power Output
PD
Pull down
PU
Pull up
NOTES