Quectel SC200K Series User manual

SC200K Series
Hardware Design
Smart Module Series
Version: 1.0
Date: 2022-02-21
Status: Released

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Copyright © Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergency help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives
and transmits radio frequency signals. RF interference can occur if it is used close
to TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other cellular
terminals. Areas with explosive or potentially explosive atmospheres include
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,
and areas where the air contains chemicals or particles such as grain, dust or
metal powders.

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About the Document
Revision History
Version
Date
Author
Description
-
2022-01-05
Kevin SU/
Jerry WANG
Creation of the document
1.0
2022-02-21
Kevin SU/
Jerry WANG
First official release

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Contents
Safety Information.......................................................................................................................................3
About the Document...................................................................................................................................4
Contents.......................................................................................................................................................5
Table Index...................................................................................................................................................8
Figure Index...............................................................................................................................................10
1Introduction........................................................................................................................................12
2Product Overview ..............................................................................................................................13
2.1. Frequency Bands and Functions............................................................................................13
2.2. Key Features...........................................................................................................................14
2.3. Functional Diagram.................................................................................................................17
2.4. Pin Assignment........................................................................................................................18
2.5. Pin Description........................................................................................................................19
2.6. EVB .........................................................................................................................................32
3Operating Characteristics.................................................................................................................33
3.1. Power Supply..........................................................................................................................33
3.1.1. Power Supply Interface...........................................................................................33
3.1.2. Battery Charge and Management ..........................................................................33
3.1.3. Reference Design for Power Supply ......................................................................35
3.1.4. Voltage Stability Requirements...............................................................................35
3.2. Turn On ...................................................................................................................................37
3.2.1. Turn On Module with PWRKEY..............................................................................37
3.2.2. Turn On Module Automatically Through CBL_PWR_N..........................................38
3.3. Turn Off....................................................................................................................................39
3.4. VRTC.......................................................................................................................................40
3.5. Power Output ..........................................................................................................................40
4Application Interfaces .......................................................................................................................42
4.1. USB Interfaces........................................................................................................................42
4.2. UART Interfaces......................................................................................................................45
4.3. (U)SIM Interfaces....................................................................................................................47
4.4. SD Card Interface....................................................................................................................50
4.5. GPIO Interfaces.......................................................................................................................52
4.6. I2C Interfaces..........................................................................................................................54
4.7. ADC Interface..........................................................................................................................54
4.8. LCM Interface..........................................................................................................................55
4.9. Touch Panel Interface .............................................................................................................57
4.10. Camera Interfaces...................................................................................................................58
4.10.1. MIPI Design Considerations...................................................................................63
4.11. Sensor Interface......................................................................................................................65
4.12. Audio Interfaces ......................................................................................................................65

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4.12.1. Reference Design for Microphone Interfaces.........................................................66
4.12.2. Reference Design for Earpiece Interface...............................................................67
4.12.3. Reference Circuit Design for Headset Interface.....................................................68
4.12.4. Reference Circuit Design for Loudspeaker Interface.............................................68
4.12.5. Audio Signal Design Considerations......................................................................69
4.13. USB_BOOT Interface..............................................................................................................69
5RF Characteristics.............................................................................................................................71
5.1. GNSS ......................................................................................................................................71
5.1.1. Antenna Interface & Frequency Bands ..................................................................71
5.1.2. GNSS Performance................................................................................................71
5.1.3. Reference Design...................................................................................................72
5.1.3.1. Reference Circuit Design for GNSS PassiveAntenna...................................72
5.1.3.2. Reference Circuit Design for GNSSActive Antenna...................................... 73
5.1.4. GNSS RF Design Guidelines..................................................................................73
5.2. Cellular Network......................................................................................................................74
5.2.1. Antenna Interfaces & Frequency Bands.................................................................74
5.2.2. Tx Power.................................................................................................................75
5.2.3. Rx Sensitivity ..........................................................................................................75
5.2.4. Reference Design...................................................................................................76
5.3. Wi-Fi/Bluetooth........................................................................................................................77
5.3.1. Antenna Interface & Frequency Bands ..................................................................77
5.3.2. Wi-Fi........................................................................................................................78
5.3.2.1. Wi-Fi performance.......................................................................................... 78
5.3.3. Bluetooth.................................................................................................................80
5.3.3.1. Bluetooth Performance................................................................................... 81
5.3.4. Reference Design...................................................................................................81
5.4. RF Routing Guidelines............................................................................................................82
5.5. Antenna Design Requirements...............................................................................................84
5.6. RF Connector Recommendation ............................................................................................85
6Electrical Charastics and Reliability................................................................................................87
6.1. Absolute Maximum Ratings ....................................................................................................87
6.2. Power Supply Ratings.............................................................................................................87
6.3. Power Consumption................................................................................................................88
6.4. ESD Protection........................................................................................................................90
6.5. Operating and Storage Temperatures.....................................................................................91
7Mechanical Information.....................................................................................................................92
7.1. Mechanical Dimensions..........................................................................................................92
7.2. Recommended Footprint.........................................................................................................94
7.3. Top and Bottom Views.............................................................................................................95
8Storage, Manufacturing and Packaging..........................................................................................96
8.1. Storage Conditions..................................................................................................................96
8.2. Manufacturing and Soldering..................................................................................................97

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8.3. Packaging Specifications ........................................................................................................98
8.3.1. Carrier Tape............................................................................................................98
8.3.2. Plastic Reel.............................................................................................................99
8.3.3. Packaging Process...............................................................................................100
9Appendix References......................................................................................................................101

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Table Index
Table 1: Brief Introduction of the Module...................................................................................................13
Table 2: Supported Frequency Bands and GNSS Functions ....................................................................13
Table 3: Key Features................................................................................................................................14
Table 4: I/O Parameters Definition............................................................................................................. 19
Table 5: Pin Description ............................................................................................................................. 19
Table 6: Pin Definition of Charging Interface .............................................................................................33
Table 7: Pin Definition of PWRKEY............................................................................................................37
Table 8: Pin Definition of CBL_PWR_N Interface......................................................................................38
Table 9: Power Supply Description............................................................................................................40
Table 10: Pin Definition of USB Interfaces.................................................................................................42
Table 11: USB Trace Length Inside Module............................................................................................... 45
Table 12: Pin Definition of UART Interfaces............................................................................................... 46
Table 13: Pin Definition of (U)SIM Interfaces............................................................................................. 47
Table 14: Pin Definition of SD Card Interface............................................................................................50
Table 15: SD Card Signal Trace Length Inside Module.............................................................................51
Table 16: Pin Definition of GPIOs ..............................................................................................................52
Table 17: Pin Definition of I2C Interfaces................................................................................................... 54
Table 18: Pin Definition ofADC Interface...................................................................................................54
Table 19: Pin Definition of LCM Interface ..................................................................................................55
Table 20: Pin Definition of Touch Panel Interface...................................................................................... 57
Table 21: Pin Definition of Camera Interfaces ...........................................................................................58
Table 22: MIPI Trace Length Inside Module ..............................................................................................63
Table 23: Pin Definition of Sensor Interface...............................................................................................65
Table 24: Pin Definition ofAudio Interfaces............................................................................................... 65
Table 25: Pin Definition of USB_BOOT Interface ......................................................................................69
Table 26: Pin Definition of GNSSAntenna Interface .................................................................................71
Table 27: Operating Frequency..................................................................................................................71
Table 28: GNSS Performance.................................................................................................................... 71
Table 29: Pin Definition of Cellular Antenna Interfaces.............................................................................. 74
Table 30: SC200K-CE Operating Frequency............................................................................................. 74
Table 31: SC200K-CE RF Output Power...................................................................................................75
Table 32: SC200K-CE Receiving Sensitivity.............................................................................................. 75
Table 33: Pin Definition of Wi-Fi/Bluetooth Interface.................................................................................77
Table 34: Wi-Fi/Bluetooth Frequency.........................................................................................................78
Table 35: Wi-Fi Transmitting Performance.................................................................................................78
Table 36: Wi-Fi Receiving Performance..................................................................................................... 79
Table 37: Bluetooth Data Rate and Version...............................................................................................80
Table 38: Bluetooth Transmitting and Receiving Performance.................................................................. 81
Table 39: Antenna Requirements............................................................................................................... 84
Table 40:Absolute Maximum Ratings........................................................................................................ 87
Table 41: Module Power Supply Ratings...................................................................................................87

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Table 42: SC200K-CE Power Consumption.............................................................................................. 88
Table 43: Electrostatics Discharge Characteristics (Temperature: 25 °C, Humidity: 45 %)...................... 90
Table 44: Operating and Storage Temperatures........................................................................................ 91
Table 45:Recommended Thermal Profile Parameters...............................................................................98
Table 46: Carrier Tape Dimension Table (Unit: mm).................................................................................. 99
Table 47: Plastic Reel Dimension Table (Unit: mm)...................................................................................99
Table 48: Related Documents..................................................................................................................101
Table 49: Terms and Abbreviations..........................................................................................................101

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Figure Index
Figure 1: Functional Diagram..................................................................................................................... 17
Figure 2: PinAssignment (Top View).........................................................................................................18
Figure 3: Schematic Diagram of Connection Between Battery and Module.............................................34
Figure 4: Reference Design of Power Supply............................................................................................ 35
Figure 5: Power Supply Voltage Drop Example......................................................................................... 36
Figure 6: Reference Circuit of Power Supply.............................................................................................36
Figure 7: Turn On Module with Open Collector Driver...............................................................................37
Figure 8: Turn On Module Using Button ....................................................................................................37
Figure 9: Turn-on Timing............................................................................................................................ 38
Figure 10: Reference Circuit of Automatic Turn-on....................................................................................39
Figure 11: Forced Turn-off Timing.............................................................................................................. 39
Figure 12: RTC Powered by Rechargeable Button Battery....................................................................... 40
Figure 13: Reference Circuit of USB1 Type-C Interface............................................................................43
Figure 14: Reference Design of USB1 Micro Interface ............................................................................. 44
Figure 15: Reference Design of USB2 Micro Interface .............................................................................44
Figure 16: Reference Circuit of Level Translator Chip (For UART0).........................................................46
Figure 17: RS-232 Level Match Circuit (For UART0)................................................................................47
Figure 18: Reference Circuit of (U)SIM Interfaces with 8-Pin (U)SIM Card Connector............................ 48
Figure 19: Reference Circuit of (U)SIM Interfaces with 6-Pin (U)SIM Card Connector............................ 49
Figure 20: Reference Circuit for SD Card Interface................................................................................... 50
Figure 21: Reference Circuit Design for LCM Interface.............................................................................56
Figure 22: Reference Cicuit for LCM External Backlight Driver................................................................. 57
Figure 23: Reference Circuit Design for Touch Panel Interface................................................................ 58
Figure 24: Reference Circuit Design for Dual-Camera Applications.........................................................61
Figure 25: Reference Circuit Design for Three-CameraApplications ....................................................... 62
Figure 26: Reference Circuit Design for Main Microphone........................................................................66
Figure 27: Reference Circuit Design forAuxiliary Microphone..................................................................67
Figure 28: Reference Design for Earpiece Interface................................................................................. 67
Figure 29: Reference Circuit Design for Headset Interface....................................................................... 68
Figure 30: Reference Circuit Design for Loudspeaker Interface............................................................... 68
Figure 31: Reference Circuit Design for Download Interface.................................................................... 70
Figure 32: Reference Circuit Design for GNSS PassiveAntenna............................................................. 72
Figure 33: Reference Circuit Design for GNSSActive Antenna................................................................ 73
Figure 34: Reference Circuit Design for Cellular Antennas....................................................................... 77
Figure 35: Reference Circuit Design for Wi-Fi/Bluetooth Antenna............................................................81
Figure 36: Microstrip Design on a 2-layer PCB ......................................................................................... 82
Figure 37: Coplanar Waveguide Design on a 2-layer PCB.......................................................................82
Figure 38: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground).................... 83
Figure 39: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground).................... 83
Figure 40: Dimensions of U.FL-R-SMT Connector (Unit: mm)..................................................................85
Figure 41: Mechanicals of U.FL-LP Connectors........................................................................................ 85
Figure 42: Space Factor of Mated Connector (Unit: mm)..........................................................................86

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Figure 43: Module Top and Side Dimensions (Unit: mm).......................................................................... 92
Figure 44: Module Bottom Dimensions (Unit: mm)....................................................................................93
Figure 45: Recommended Footprint (Top View)........................................................................................94
Figure 46: Top & Bottom Views of Module................................................................................................. 95
Figure 47: Recommended Reflow Soldering Thermal Profile ...................................................................97
Figure 48: Carrier Tape Dimension Drawing..............................................................................................99
Figure 49: Plastic Reel Dimension Drawing ..............................................................................................99
Figure 50: Packaging Process.................................................................................................................100

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1Introduction
This document defines SC200K series module and describes its air interfaces and hardware interfaces
which relate to customers’ applications.
It can help you quickly understand interface specifications, electrical and mechanical details, as well as
other related information of the module. Associated with application notes and user guides, you can use
this module to design and to set up mobile applications easily.

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2Product Overview
SC200K series is a series of Smart LTE modules based on Android operating system, and provides
industrial grade performance. It supports multiple audio and video codecs, built-in high performance
GE8322 graphics processing unit and multiple audio and video input/output interfaces as well as
abundant GPIO interfaces.
The module is a series of SMD modules with a total of 274 pins, including 146 LCC pins and 128 LGA
pins. The module package is compact, with a size of only 40.5 mm ×40.5 mm ×2.85 mm. With these, the
module is engineered to meet the demanding requirements in M2M applications, such as POS, on-board
computers, multimedia terminals, smart home products, IoT terminals, etc.
Table 1: Brief Introduction of the Module
2.1. Frequency Bands and Functions
The following table shows the supported frequency bands and GNSS functions of the module.
Table 2: Supported Frequency Bands and GNSS Functions
Function
Description
Wireless Network Type
GSM/WCDMA/LTE-FDD/LTE-TDD
Wi-Fi/Bluetooth
Wi-Fi 802.11a/b/g/n/ac
Bluetooth 1.2/2.1 + EDR/4.2/5.0
GNSS
GPS + GLONASS or GPS + BDS
Wireless Network Type
SC200K-CE
SC200K-WF
LTE-FDD
B1/B3/B5/B8
-
LTE-TDD
B34/B38/B39/B40/B41 (140 MHz)
-
WCDMA
B1/B8
-

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2.2. Key Features
The following table describes the detailed features of the module.
Table 3: Key Features
GSM/EDGE
EGSM900/DCS1800
-
GNSS
GPS: 1575.42 ±1.023 MHz
GLONASS: 1597.5–1605.8 MHz
BDS: 1561.098 ±2.046 MHz
GPS: 1575.42 ±1.023 MHz
GLONASS: 1597.5–1605.8 MHz
BDS: 1561.098 ±2.046 MHz
Wi-Fi 802.11a/b/g/n/ac
2402–2482 MHz
5180–5825 MHz
2402–2482 MHz
5180–5825 MHz
Bluetooth 5.0
2402–2480 MHz
2402–2480 MHz
Parameter
Details
Application
Processor
⚫Octa-core ARM 64-bit Cortex-A55 CPU
⚫Up to 1.6 GHz
⚫32 KB L1 I-cache, 32 KB L1 D-cache, 128 KB L2 cache, 512 KB L3 cache
GPU
⚫GE8322 GPU, working frequency 550 MHz
Memory
SC200K-CE:
⚫16 GB eMMC + 2 GB LPDDR4X (default)
⚫32 GB eMMC + 2 GB LPDDR4X
⚫64 GB eMMC + 4 GB LPDDR4X
SC200K-WF:
⚫32 GB eMMC + 2 GB LPDDR4X
Operating System
⚫Android 10
Power Supply
⚫Supply voltage range: 3.5–4.2 V
⚫Typical supply voltage: 3.8 V
Transmitting Power
⚫EGSM900: Class 4 (33 dBm ±2 dB)
⚫DCS1800: Class 1 (30 dBm ±2 dB)
⚫EGSM900 8-PSK: Class E2 (27 dBm ±3 dB)
⚫DCS1800 8-PSK: Class E2 (26 dBm ±3 dB)
⚫Class 3 (23 dBm ±2 dB) for WCDMAbands
⚫Class 3 (23 dBm ±2 dB) for LTE-FDD bands
⚫Class 3 (23 dBm ±2 dB) for LTE-TDD bands
LTE Features
⚫Supports 3GPP Cat 4 FDD and TDD
⚫Supports 1.4/3/5/10/15/20 MHz RF bandwidth
⚫Supports downlink 2 ×2 MIMO

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⚫Supports uplink QPSK, 16QAM and 64QAM modulation
⚫Supports downlink QPSK, 16QAM, 64QAM and 256QAM modulation
⚫LTE-FDD: Max. 150 Mbps (DL)/ 50 Mbps (UL)
⚫LTE-TDD: Max. 130 Mbps (DL)/ 30 Mbps (UL)
UMTS Features
⚫Supports 3GPP R9 DC-HSDPA/DC-HSUPA/HSPA+/HSDPA/
HSUPA/WCDMA
⚫Supports QPSK, 16QAM and 64QAM modulation
⚫DC-HSDPA: Max. 42 Mbps (DL)
⚫DC-HSUPA: Max. 11.2 Mbps (UL)
⚫WCDMA: Max. 384 Kbps (DL)/ 384 Kbps (UL)
GSM Features
R99:
⚫CSD transmission rate: 9.6 kbps, 14.4 kbps
GPRS:
⚫Supports GPRS multi-slot class 33 (33 by default)
⚫Coding schemes: CS-1, CS-2, CS-3 and CS-4
⚫Max. 107 kbps (DL)/ 85.6 kbps (UL)
EDGE:
⚫Supports EDGE multi-slot class 33 (33 by default)
⚫Supports GMSK and 8-PSK modulation and coding methods
⚫Downlink coding schemes: MCS 1–9
⚫Uplink coding schemes: MCS 1–9
⚫Max. 296 kbps (DL)/ 236.8 kbps (UL)
SMS
⚫Text and PDU modes
⚫Point-to-point MO and MT
⚫SMS cell broadcast
⚫SMS storage: ME by default
LCM Interface
⚫Supports one group of 4-lane MIPI_DSI, the highest rate is up to
1.5 Gbps/lane
⚫Supports up to FHD+ (2160 ×1080) @ 60 fps
Camera Interfaces
⚫Supports two groups of 4-lane MIPI_CSI, the highest rate is up to 1.5
Gbps/lane
⚫Supports two cameras (4-lane + 4-lane) or three cameras (4-lane + 2-lane +
1-lane)
⚫Supports up to 16 MP camera
Video Codec
⚫Video Codec: encoding + decoding: 1080P @ 30 fps + 1080P @ 30 fps
⚫Wi-Fi Codec: encoding: up to 720P @ 30 fps, decoding: up to 1080P
@ 30 fps
Audio Interfaces
Audio inputs：
⚫Three analog microphone inputs, integrated with internal bias voltage
Audio outputs：
⚫Class AB stereo headphone output
⚫Class AB earpiece differential output
⚫Class D loudspeaker differential amplifier output

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1
Within operating temperature range, the module meets 3GPP specification.
Audio Codec
⚫AMR-NB, AMR-WB, EVS-NB, EVS-WB, EVS-SWB, MP3, AAC, AAC+, AMR,
PCM
(U)SIM Interfaces
⚫Two (U)SIM interfaces
⚫Supports (U)SIM card: 1.8 V, 2.95 V
⚫Supports Dual SIM Dual Standby (supported by software by default)
I2C Interfaces
⚫Four I2C interfaces, used for peripherals such as TP, camera, sensor, etc.
ADC Interface
⚫One general purposeADC interface, supports up to 12-bit resolution
Real Time Clock
⚫Supported
WLAN Features
⚫Supports AP mode and STAmode
⚫2.4 GHz: supports 802.11b/g/n, the highest rate is up to 150 Mbps
⚫5 GHz: supports 802.11a/n/ac, the highest rate is up to 433 Mbps
Bluetooth Features
⚫Bluetooth 1.2/2.1 + EDR/4.2/5.0
USB Interfaces
USB1:
⚫Compliant with USB 2.0 specification, with transmission rate up to 480 Mbps
⚫Supports USB OTG, supports host and device modes, supports Type-C, USB
hub expansion is not supported
⚫Used for AT command communication, data transmission, software
debugging, firmware upgrade
USB2:
⚫Compliant with USB 2.0 specification, with transmission rate up to 100 Mbps
⚫Supports host mode only, supports USB hub expansion
SD card Interface
⚫Supports SD 3.0 protocol
⚫Supports 1.8 V or 3.0 V SD card
⚫Supports SD card hot-plug
UART Interfaces
⚫One four-wire UART interface, which supports hardware flow control
⚫Two two-wire UART interfaces, one of which is debug UART only used for
debugging
⚫Highest rate up to 3.0 Mbps
GNSS Features
⚫Supports GPS+GLONASS or GPS + BDS
Antenna Interfaces
⚫Main antenna, diversity antenna, GNSS antenna, Wi-Fi/Bluetooth antenna
Physical
Characteristics
⚫Size: (40.5 ±0.15) mm ×(40.5 ±0.15) mm ×(2.85 ±0.2) mm
⚫Package: LCC + LGA
⚫Weight:
SC200K-CE: approx. 10.60 g
SC200K-WF: approx. 10.48 g
Operating
Temperature
⚫Operating temperature range: -30 °C to +75 °C 1
⚫Storage temperature range: -40 °C to +90 °C
Firmware Upgrade
⚫Via USB interface or OTA

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2.3. Functional Diagram
The following figure shows a block diagram of the module and illustrates the major functional parts.
⚫Power management
⚫Baseband
⚫LPDDR4X + eMMC flash
⚫Radio frequency
⚫Peripheral interfaces
Baseband
Transceiver
LPDDR
eMMC
ANT_GNSS ANT_WIFI/BT
GPIOs
I2C
SD 3.0
UART
2×(U)SIM
USB1
2×CSI
TPLCM
EAR
SPK
MICs
ADC
BBCLK
MEM
Multimedia Connectivity
Air Interface
Processors
Codec
Power
Signal
Power
Function
SAW Duplex
PA
SWITCH SAW
LNA
SAW
Switch
SAW
ANT_DRX
ANT_MAIN
PMU
ADC
HPH
PWRKEY
VOL_UP
VOL_DOWN
VDDSD
USIM1_VDD
USIM2_VDD
VDD1V85
VDDCAMIO
VDDCAMMOT
VBAT_BB
VBAT_RF
2.4G SAW
32K
26M
VDDSDIO
VDD28
VDDCAMA
Wi-Fi/
Bluetooth
FEM
USB2
26M
VDDCAMD
32K
DUPLEX
VBAT_BK
Figure 1: Functional Diagram
RoHS
⚫All hardware components are fully compliant with EU RoHS directive

Smart Module Series
SC200K_Series_Hardware_Design 18 / 105
2.4. Pin Assignment
The following figure illustrates the pin assignment of the module.
146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73
186 185 184 183 182 181 180 179 178 177
147 187 222 221 220 219 218 217 216 215 214 176
148 188 223 250 249 248 247 246 245 244 213 175
149 189 224 251 270 269 268 267 266 243 212 174
150 190 225 252 265 242 211 173
151 191 226 253 264 241 210 172
152 192 227 254 263 240 209 171
153 193 228 255 262 239 208 170
154 194 229 256 257 258 259 260 261 238 207 169
155 195 230 231 232 233 234 235 236 237 206 168
156 196 197 198 199 200 201 202 203 204 205 167
157 158 159 160 161 162 163 164 165 166
24
272
271
273
274
Power Pins
GND Pins Audio Pins USBPins
(U)SIM Pins UART Pins GPIO Pins ANT Pins
TP Pins
LCM Pins
Camera Pins
Other Pins
RESERVED
Pins SD Card Pins
254
VBAT_BB
VBAT_BB
GND
MIC1_P
MIC1_M
MIC2_P
GND
EAR_P
EAR_M
SPK_P
SPK_M
GND
USB1_DM
USB1_DP
GND
USB_ID
USIM2_DET
USIM2_RST
USIM2_CLK
USIM2_DATA
USIM2_VDD
USIM1_DET
USIM1_RST
USIM1_CLK
USIM1_DATA
USIM1_VDD
GND
VDDCAMMOT
PWM
TP_INT
TP_RST
VDDSDIO
GPIO_34
UART0_TXD
UART0_RXD
UART0_CTS
UART0_RTS
VDDSD
SD_CLK
SD_CMD
SD_DATA0 SD_DATA1 SD_DATA2 SD_DATA3
SD_DET
USB_BOOT
TP_I2C_SCL
TP_I2C_SDA
LCD_RST
LCD_TE
GND
DSI_CLK_N
DSI_CLK_P
DSI_LN0_N
DSI_LN0_P
DSI_LN1_N
DSI_LN1_P
DSI_LN2_N
DSI_LN2_P
DSI_LN3_N
DSI_LN3_P
GND
CSI0_CLK0_N
CSI0_CLK0_P
CSI0_LN0_N
CSI0_LN0_P
CSI0_LN1_N
CSI0_LN1_P
CSI0_LN3_N
CSI0_LN3_P
CSI0_LN2_N
CSI0_LN2_P
GND
MCAM_MCLK
SCAM_MCLK
GND
GND
ANT_WIFI/BT
MCAM_RST
MCAM_PWDN
SCAM_RST
SCAM_PWDN
CAM_I2C_SCL
CAM_I2C_SDA
GND
GND
ANT_MAIN
GND
GND
GPIO_87
SENSOR_I2C_SCL
SENSOR_I2C_SDA
DBG_RXD
DBG_TXD
VOL_UP
VOL_DOWN
GPIO_154
GPIO_155
GPIO_122
GPIO_156
GPIO_131
GPIO_133
GPIO_132
GPIO_35
GPIO_54
GPIO_52
GPIO_28
GPIO_123
GPIO_55
GPIO_130
VDD1V85 GPIO_91 GPIO_92 PWRKEY GPIO_134 GPIO_139 GPIO_135 GPIO_136 GND ANT_GNSS GND GPIO_90 GPIO_94 GPIO_93 VDDCAMIO VBAT_BK CHG_SEL ADCI3 VDD28 GND ANT_DRX GND VBAT_SNS BAT_THERM GND HPH_R HPH_GND HPH_L HS_DET GND USB_VBUS USB_VBUS GND GND VBAT_RF VBAT_RF
Figure 2: Pin Assignment (Top View)
Keep all RESERVED pins and unused pins unconnected.
NOTE

Smart Module Series
SC200K_Series_Hardware_Design 19 / 105
2.5. Pin Description
The following table shows the DC characteristics and pin descriptions of the module.
Table 4: I/O Parameters Definition
Table 5: Pin Description
Type
Description
AI
Analog Input
AO
Analog Output
AIO
Analog Input/Output
DI
Digital Input
DO
Digital Output
DIO
Digital Input/Output
OD
Open Drain
PI
Power Input
PO
Power Output
PIO
Power Input/Output
Power Supply
Pin Name
Pin
No.
I/O
Description
DC
Characteristics
Comment
VBAT_BB
1, 2
PIO
Power supply for the
module’s baseband
part
Vmax = 4.20 V
Vmin = 3.50 V
Vnom = 3.80 V
It must be provided
with sufficient current
up to 3 A.
It is suggested to use a
TVS for surge
protection.
VBAT_RF
145,
146
PI
Power supply for the
module’s RF part
VDD1V85
111
PO
1.85 V output
Vnom = 1.85 V
IOmax = 100 mA
Power supply only for
I/O’s pull-up circuits
and level-shifting
circuit.
Cannot supply power