Renesas ISL81601EVAL2Z User manual

Rev.0.00 Mar 2018
User’s Manual
ISL81601EVAL2Z
User’s Manual: Evaluation Board
Industrial Analog and Power

UG160 Rev.0.00 Page 2 of 19
Mar 23, 2018
UG160
Rev.0.00
Mar 23, 2018
ISL81601EVAL2Z
Evaluation Board
USER’S MANUAL
1. Overview
The ISL81601EVAL2Z evaluation board (shown in Figure 5 on page 8) features the ISL81601, a 60V high voltage
synchronous buck-boost controller that offers external soft-start, independent enable functions, and integrates
UV/OV/OC/OT protection. Programmable switching frequency ranging from 100kHz to 600kHz helps to optimize
inductor size while the strong gate driver delivers up to 20A for the buck-boost output.
1.1 Key Features
• Wide input range: 32V to 60V
• Bi-directional operation
• High light-load efficiency in pulse skipping DEM operation
• Programmable soft-start
• Optional DEM/PWM operation
• Optional CC/HICCUP OCP protection
• Supports prebias output with soft-start
• PGOOD indicator
• OVP, OTP, and UVP protection
1.2 Specifications
The ISL81601EVAL2Z evaluation board is designed for high current applications. The current rating of the
ISL81601EVAL2Z is limited by the FETs and inductor selected. The ISL81601EVAL2Z electrical ratings of are
shown in Table 1.
1.3 Ordering Information
1.4 Related Literature
• For a full list of related documents, visit our website
•ISL81601 product page
Table 1. Electrical Rating
Parameter Rating
Input Voltage 32V to 60V
Switching Frequency 200kHz
Output Voltage 48V
Output Current 5A
OCP Set Point Minimum 5.5A at ambient room temperature
Part Number Description
ISL81601EVAL2Z High Voltage BUCK-BOOST Controller Evaluation Board

UG160 Rev.0.00 Page 3 of 19
Mar 23, 2018
ISL81601EVAL2Z 1. Overview
Figure 1. ISL81601EVAL2Z Block Diagram
ISL81601
EXTBIAS
VDD
SS/TRK
RT/SYNC
FB_OUT
PGND
VIN
OV
EN/UVLO
SGND
VCC5V
COMP
ISEN- ISEN+ CS-
CS+/VINSEN
PHASE2
LG1
PWM_MODE
PHASE1
UG1
BOOT1
UG2
BOOT2
LG2
OC_MODE
VDD
VDD
PLL_COMP
VIN
VOUT
FB_IN
CLKOUT DITHER
IMON_IN
IMON_OUT
PGOOD
CLKEN
BSTEN

UG160 Rev.0.00 Page 4 of 19
Mar 23, 2018
ISL81601EVAL2Z 2. Functional Description
2. Functional Description
The ISL81601VAL2Z is the same test board used by Renesas application engineers and IC designers to evaluate the
performance of the ISL81601 HTSSOP IC. The board provides an easy and complete evaluation of all the IC and
board functions.
As shown in Figure 4 on page 6, 32V to 60V VIN is supplied to J1 (+) and J2 (-). The regulated 48V output on J4 (+)
and J5 (-) can supply up to 5A to the load. Due to the high power efficiency, the evaluation board can run at 5A
continuously without airflow at room temperature ambient conditions.
Test points TP1 through TP28 provide easy access to the IC pin and external signal injection terminals.
As shown in Table 2 on page 5, connector J8 provides selection of either Forced PWM mode (shorting Pin 1 and Pin 2)
or DEM mode (shorting Pin 2 and Pin 3). Connector J9 provides selection of either constant current limit (shorting Pin
1 and Pin 2) or HICCUP OCP(shorting Pin 2 and Pin 3). Connector J3 provides an option to disable the converter by
shorting its Pin 1 and Pin 2.
2.1 Recommended Testing Equipment
The following materials are recommended for testing:
• 0V to 60V power supply with at least 10A source current capability
• Electronic loads capable of sinking current up to 10A
• Digital Multimeters (DMMs)
• 100MHz quad-trace oscilloscope
2.2 Operating Range
The input voltage range is from 32V to 60V for an output voltage of 48V. If the output voltage is set to a lower
value, the minimum VIN can be reset to a lower value by changing the ratio of R2 and R3. The minimum EN
threshold that VIN can be set to is 4.5V.
The rated load current is 5A with the OCP point set at minimum 5.5A at ambient room temperature conditions. The
operating temperature range of this board is from -40°C to +85°C. Note that airflow is needed for higher
temperature ambient conditions.
2.3 Bi-Directional Operation
Refer to Figure 2 for proper setup. Float the FBI pin (J7) and set the mode to PWM before powering on the board.
The rated voltage of the super capacitor must be higher than 48V.
(1) Adjust the input voltage higher than 36V. Switch on the input power source.
(2) Switch off the input power source after the super capacitor is fully charged.
Figure 2. Proper Set-Up for Bi-Directional Operation
DC ISL81601EVAL2Z
VIN
GND
VOUT
GND
Load

UG160 Rev.0.00 Page 5 of 19
Mar 23, 2018
ISL81601EVAL2Z 2. Functional Description
2.4 Quick Test Guide
(1) Jumper J8 provides the option to select PWM or DEM. Jumper J9 provides the option to select Constant
current limit or HICCUP. Refer to Table 2 for the operating options. Ensure that the circuit is correctly
connected to the supply and electronic loads prior to applying any power. Refer to Figure 4 on page 6 for
proper setup.
(2) Turn on the power supply.
(3) Adjust input voltage VIN within the specified range and observe the output voltage. The output voltage
variation should be within 3%.
(4) Adjust the load current within the specified range and observe the output voltage. The output voltage variation
should be within 3%.
(5) Use an oscilloscope to observe output voltage ripple and phase node ringing. For accurate measurement, refer
to Figure 3 for proper test setup.
Table 2. Operating Options
Jumper Position Function
3 EN-GND Disable output
EN Floating Enable output
6I
IN Floating Enable input current limit
IIN-VCC5 Disable input current limit
7 FBI-GND Disable VIN limit
FBI Floating Enable VIN limit
8Pin 1-2 PWM
Pin 2-3 DEM
9 Pin 1-2 Constant current limit
Pin 2-3 HICCUP
Figure 3. Proper Probe Set-Up to Measure Output Ripple and Phase Node Ringing
Output Capacitor
or MOSFET

UG160 Rev.0.00 Page 6 of 19
Mar 23, 2018
ISL81601EVAL2Z 2. Functional Description
Figure 4. Proper Test Setup
+
-
VIN
A
+-
A
V
+
-
+
-
Load
VO

UG160 Rev.0.00 Page 7 of 19
Mar 23, 2018
ISL81601EVAL2Z 3. PCB Layout Guidelines
3. PCB Layout Guidelines
Careful attention to layout requirements is necessary for successful implementation of an ISL81601 based DC/DC
converter. The ISL81601 switches at a very high frequency; therefore the switching times are very short. At these
switching frequencies, even the shortest trace has significant impedance. The peak gate drive current also rises
significantly in an extremely short time. Transition speed of the current from one device to another causes voltage
spikes across the interconnecting impedances and parasitic circuit elements. These voltage spikes can degrade
efficiency, generate EMI, and increase device voltage stress and ringing. Careful component selection and proper PC
board layout minimizes the magnitude of these voltage spikes.
Three sets of components are critical when using the ISL81601 DC/DC converter:
• Controller
• Switching power components
• Small signal components
The switching power components are the most critical to the layout because they switch a large amount of energy,
which tends to generate a large amount of noise. The critical small signal components are those connected to sensitive
nodes or those supplying critical bias currents. A multilayer printed circuit board is recommended.
Complete the following steps to optimize the PCB layout.
(1) The input capacitors, buck FETs, inductor, boost FETs, and output capacitor should be placed first. Isolate these
power components on dedicated areas of the board with their ground terminals adjacent to one another. Place the
input and output high frequency decoupling ceramic capacitors very close to the MOSFETs.
(2) If signal components and the IC are placed separately from the power train, it is recommended to use full ground
planes in the internal layers with shared SGND and PGND to simplify the layout design. Otherwise, use separate
ground planes for the power ground and the small signal ground. Connect the SGND and PGND together close to
the IC. DO NOT connect them together anywhere else.
(3) The loop formed by the input capacitor, the buck top FET, and the buck bottom FET must be kept as small as
possible. Also, the loop formed by the output capacitor, the boost top FET, and the boost bottom FET must also be
kept as small as possible.
(4) Ensure the current paths from the input capacitor to the buck FETs, the power inductor, the boost FETs, and the
output capacitor are as short as possible with maximum allowable trace widths.
(5) Place the PWM controller IC close to the lower FETs. The low-side FETs gate drive connections should be short
and wide. The IC should be placed over a quiet ground area. Avoid switching ground loop currents in this area.
(6) Place the VDD bypass capacitor very close to the VDD pin of the IC and connect its ground end to the PGND pin.
Connect the PGND pin to the ground plane by a via. Do not connect the PGND pin directly to the SGND EPAD.
(7) Place the gate drive components (BOOT diodes and BOOT capacitors) together near the controller IC.
(8) Place the output capacitors as close to the load as possible. Use short, wide copper regions to connect output
capacitors to the load to avoid inductance and resistance.
(9) Use copper filled polygons or wide, short traces to connect the junction of the buck or boost upper FET, buck or
boost lower FET, and output inductor. Keep the buck and boost PHASE nodes connection to the IC short. DO
NOT unnecessarily oversize the copper islands for the PHASE nodes. Because the phase nodes are subjected to
very high dv/dt voltages, the stray capacitor formed between these islands and the surrounding circuitry will tend
to couple switching noise.
(10) Route all high speed switching nodes away from the control circuitry.
(11) Create a separate small analog ground plane near the IC. Connect the SGND pin to this plane. All small signal
grounding paths including feedback resistors, current monitoring resistors and capacitors, soft-starting capacitors,
loop compensation capacitors and resistors, and EN pull-down resistors should be connected to this SGND plane.
(12) Use a pair of traces with minimum loop for the input or output current sensing connection.
(13) Ensure the feedback connection to the output capacitor is short and direct.

UG160 Rev.0.00 Page 8 of 19
Mar 23, 2018
ISL81601EVAL2Z 3. PCB Layout Guidelines
3.1 ISL81601VAL2Z Evaluation Board
Figure 5. ISL81601VAL2Z Evaluation Board (Top)
Figure 6. ISL81601VAL2Z Evaluation Board (Bottom)

UG160 Rev.0.00 Page 9 of 19 Mar 23, 2018 ISL81601EVAL2Z 3. PCB Layout Guidelines
3.2 ISL81601VAL2Z Circuit Schematic
Figure 7. Schematic
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UG160 Rev.0.00 Page 10 of 19
Mar 23, 2018
ISL81601EVAL2Z 3. PCB Layout Guidelines
3.3 Bill of Materials
Qty Reference Designator Description Manufacturer Manufacturer Part
1 PWB-PCB, ISL81601EVAL2Z,
REVA, ROHS
IMAGINEERING INC ISL81601EVAL2ZREVAPCB
1 C33 CAP-AEC-Q200, SMD, 0603,
0.01µF, 50V, 10%, X7R,
ROHS
TDK CGA3E2X7R1H103K080AE
16 C1, C2, C5, C6, C7, C8, C9,
C10, C18, C19, C20, C21,
C22, C23, C24, C25
CAP-AEC-Q200, SMD, 1210,
4.7µF, 100V, 10%, X7S, ROHS
TDK CGA6M3X7S2A475K200AE
1 C39 CAP-AEC-Q200, SMD, 0603,
0.022µF, 25V, 10%, X7R,
ROHS
TDK CGJ3E2X7R1E223K080AA
1 C36 CAP-AEC-Q200, SMD, 0603,
0.033µF, 25V, 10%, X7R,
ROHS
TDK CGJ3E2X7R1E333K080AA
2 C14, C45 CAP-AEC-Q200, SMD, 0603,
0.047µF, 25V, 10%, X7R,
ROHS
TDK CGJ3E2X7R1E473K080AA
4 C12, C13, C41, C42 CAP-AEC-Q200, SMD, 0603,
0.01µF, 100V, 10%, X7R,
ROHS
MURATA GCM188R72A103KA37D
2 C16, C46 CAP-BOARDFLEX, SMD,
0603, 0.1µF, 100V, 10%, X7R,
ROHS
MURATA GRJ188R72A104KE11D
2 C31, C32 CAP, SMD, 0805, 10µF, 16V,
10%, X7S, ROHS
MURATA GRM21BC71C106KE11L
3 C11, C15, C43 CAP, SMD, 0603, 1000pF,
50V, 10%, X7R, ROHS
AVX 06035C102KAT2A
1 C40 CAP, SMD, 0603, 220pF, 50V,
10%, X7R, ROHS
MURATA GRM188R71H221KA01D
3 C29, C48, C53 CAP, SMD, 0603, 470pF,
100V, 5%, C0G, ROHS
TDK C1608C0G2A471J
2 C30, C37 CAP, SMD, 0603, 0.47µF, 25V,
10%, X7R, ROHS
MURATA GRM188R71E474KA12D
1 C34 CAP, SMD, 0603, 820pF, 50V,
10%, X7R, ROHS
KEMET C0603C821K5RACTU
0 C17, C28, C35, C38, C44,
C47, C49, C50, C51, C52
CAP, SMD, 0603,
DNP-PLACE HOLDER, ROHS
4 C3, C4, C26, C27 CAP, RADIAL, 12.5x26.5,
220µF, 100V, 20%,
ALUM.ELEC., 5mm, ROHS
UNITED CHEMI-CON EKZN101ELL221MK25S
1 L1 COIL-PWR INDUCTOR, SMD,
17.15mm, 22µH, 20%, 12A,
21mΩ, ROHS
VISHAY IHLP6767GZER220M11
27 TP1, TP2, TP4-TP28 CONN-COMPACT TEST PT,
VERTICAL, WHT, ROHS
KEYSTONE 5007
2 J3, J6 CONN-HEADER, 1x2,
BRKAWY 1x36, 2.54mm,
ROHS
BERG/FCI 68000-236HLF