Renesas US159-DA14531EVZ User manual

Evaluation Board Manual
R15UZ0004EU0100 Rev.1.00 Page 1
Jun 27, 2022 © 2022 Renesas Electronics
The US159-DA14531EVZ is a low power Bluetooth
Pmod module that enables you to add a low power
Bluetooth™ capability to any evaluation kit or MCU
board equipped with a Pmod expansion capability.
The board provides a standard Pmod Type 3A
(expanded UART) connection for the onboard
Bluetooth 5.1 module.
The US159-DA14531EVZ features a Type 3A Pmod
connector and incorporates the DA14531 SmartBond
TINY™ Module, which uses the efficient Bluetooth 5.1
SoC. With a standard connector and software
support, the US159-DA14531EVZ is ideal for the
Renesas Quick-Connect IoT to rapidly create an IoT
system.
Kit Contents
▪ US159-DA14531EVZ Pmod Board
Features
▪ DA14531 SmartBond TINY Module
• Cortex M0+ at 16 MHz
• Memory: 4kB RAM, 32kB OTP and 1Mb Flash
• Bluetooth 5.1 core qualified
• Integrated chip antenna
• Worldwide certification
• IoTMark™, BLE score of 18300
• 3.3V supply voltage
• +2.2dBm maximum output power
• -93dBm sensitivity
• Rx current 2mA at 3.3V
• Tx current 4mA at 3.3V at 0dBm
▪ Standardized Type 3A Pmod connector supports
an expanded UART interface
▪ Optional battery operation with onboard CR1220
coin cell
▪ Momentary pushbutton switch (SW1) to aid in user
software debug
▪ LED (D1) to aid in user software debug
▪ 10-pin 1.27mm pitch Arm Cortex-Debug connector
(J2) for software development and debug support
Figure 1. US159-DA14531EVZ Pmod Board (XE Evaluation Board)
US159-DA14531EVZ
DA14531 Pmod™ Board

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US159-DA14531EVZ Evaluation Board Manual
Contents
1. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2. Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1 Required or Recommended User Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.2 Software Installation and Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.3 Kit Hardware Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3. Schematic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.1 Board Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

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US159-DA14531EVZ Evaluation Board Manual
1. Functional Description
The US159-DA14531EVZ module functions as a Bluetooth wireless building block to create a custom IoT system
solution. This module adds Bluetooth connectivity capability to any IoT system that supports Pmod expansion
modules. Visit the Renesas website for more details on the DA14531 SmartBond TINY Module.
2. Setup
2.1 Required or Recommended User Equipment
The following additional lab equipment is recommended using the module (and is sold separately):
▪ Any MCU board that supports Type 3A Pmod.
2.2 Software Installation and Usage
For the latest version of the e2 studio, use the Renesas website, and for the latest connectivity support and details
on creating customized IoT system solutions, visit the Quick-Connect IoT site.
The Renesas Flexible Software Package (FSP) is an enhanced software package that provides easy-to-use,
scalable, high-quality software for embedded system designs using the Renesas RA family of Arm
Microcontrollers. With the support of a new Arm TrustZone and other advanced security features, FSP provides a
quick and versatile way to build secure, connected IoT devices using production-ready drivers, Azure RTOS,
FreeRTOS, and other middleware stacks.
The firmware for evaluating the functioning of the module with a Renesas EK-RA2L1 evaluation kit and an
HS3001 PMOD board (for temperature and humidity) is pre-loaded on the US159-DA14531EVZ Pmod module.
For details on the application, see the guide, Quick-Connect IoT BLE Environmental Sensor Hub.
2.3 Kit Hardware Connections
Follow these procedures to set up the kit as shown on Figure 2.
1. Ensure the MCU evaluation kit being used has a Pmod connector set to Type 3A. (For help, refer to the kit
hardware manual.)
2. Plug in the US159-DA14531EVZ to the Pmod connector on the MCU evaluation kit, and be careful to align
Pin 1 on the module to Pin 1 on the MCU kit.
3. The US159-DA14531EVZ is now ready to be used in the system. Follow the MCU kit instructions for connecting
and powering up the evaluation kit.
Firmware
dsps_device_531_multi.bin For DA14531 SmartBond TINY Module

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US159-DA14531EVZ Evaluation Board Manual
Figure 2. Evaluation Kit Details
D1 – LED to aid in user software debug J2 – Arm Cortex-debug connector R14 – Be sure to remove before
installing coin cell
J1 – Pmod Connector to MCU Board
BT1 – Remove R14 before
installing the CR1220 coin cell; be
careful to observe polarity
(+ on cell facing upwards)
SW1 – Momentary pushbutton switch to aid in user software debug

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3. Schematic Diagram
Figure 3. US159-DA14531EVZ Application Schematic Diagram

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4. Bill of Materials
Qty Reference
Designator Description Manufacturer Manufacturer
Part Number
1 B1 Bumper, Cylindrical, 0.375" D, 0.19" HSM Bumper Specialities BS35CL01X02RP
1BT1
Battery Holder, 12mm Coin Cell, CR1220, SM,
RoHS Harwin S8411-45R
3 C1, C3, C4 Capacitor, 0.1µF, 50V, SM 0603, Multilayer
Ceramic, X7R, RoHS Yageo CC0603KRX7R9BB104
1C2
Capacitor, 10µF, 10V, SM 0603, Multilayer
Ceramic, X5R, RoHS Murata GRM188R61A106KE69D
1 D1 LED, Red, Clear, 0805, SM, RoHS Wurth Elektronik 150080RS75000
1J1
Connector, 2×6, 0.1", Pmod, Right Angle,
Unshrouded, RoHS Harwin M20-9950645
1J2
Connector, 2×5 Header, Vertical, 1.27mm Pitch,
Pin 7, SM, RoHS Samtec FTSH-105-01-L-DV-007-K
1Q1
Transistor, P-Ch Mosfet, 60V, 120mA, 10Ω,
SM, SOT23-3, RoHS Diodes Inc. DMP10H4D2S-7
2 R1, R4 Resistor, 4.7kΩ, 1/8W, 1%, 100ppm, SM,
75WV, 100OV, Thick Film, 0603, RoHS KOA Speer RK73H1JTTD4701F
8
R2, R5, R6,
R7, R8, R11,
R14, R15
Resistor, 0Ω, 1/8W, 1%, 100ppm, SM, 75WV,
100OV, Thick Film, 0603, RoHS KOA Speer RK73Z1JTTD
1R3
Resistor, 649Ω, 1/8W, 1%, 100ppm, SM,
75WV, 100OV, Thick Film, 0603, RoHS KOA Speer RK73H1JTTD6490F
2R9, R12
Resistor, 22Ω, 1/8W, 1%, 100ppm, SM,
75WV, 100OV, Thick Film, 0603, RoHS KOA Speer RK73H1JTTD22R0F
1R10
Resistor, 47kΩ, 1/8W, 1%, 100ppm, SM,
75WV, 100OV, Thick Film, 0603, RoHS KOA Speer RK73H1JTTD6802F
2 R16, R17 Resistor, 10kΩ, 1/8W, 1%, 100ppm, SM,
75WV, 100OV, Thick Film, 0603, RoHS KOA Speer RK73H1JTTD1002F
1 SW1 Switch, Pushbutton, Top Actuated, SM, RoHS C&K Components PTS810 SJG 250 SMTR LFS
1U1
DA14531MOD, Bluetooth Low Energy 5.1
Module, 128kB Flash, 144kB ROM, 48kB RAM,
16-SMD Module, SM, RoHS
Dialog
Semiconductor DA14531MOD-00F01002
1U2
IC, Digital, Buffer, Inverting, Open Drain, SM,
SC-70-5, RoHS Diodes Inc. 74LVC1G06SE-7

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4.1 Board Layout
Figure 4. Silkscreen Top
Figure 5. Copper Top

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Figure 6. Copper L1 Layer
Figure 7. Copper L2 Layer
Figure 8. Copper Bottom

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Figure 9. Silkscreen Bottom
5. Ordering Information
6. Revision History
Part Number Description
US159-DA14531EVZ DA14531 Pmod Board
Revision Date Description
1.00 Jun 27, 2022 Initial release

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(Rev.1.0 Mar 2020)