Rigaku MFM65 User manual

Metal Film Monitor
MFM65
(Model : MFM65S2RFFFTFT)
Instruction Manual
2. Maintenance Section
Manual No. ME12058B02
Rigaku Corporation

Thank you for your purchase of Rigaku’s product.
This manual describes the correct use of the product as well the usage precautions to be observed.
To obtain full, expected performance from the product, thoroughly read this manual.
Also, store this manual at an easily accessible place so that you can promptly refer to it whenever
necessary.
If you have any questions, problems, or emergencies, please contact the personnel in charge of
Service at Rigaku at one of the addresses below.
USA
Rigaku Americas Corporation
9009 New Trails Drive
The Woodlands, TX 77381
USA
Tel : [phone]
Fax: [phone]
URL:http://www.Rigaku.com
JAPAN
Rigaku Corporation
Semiconductor Instruments Division
3-9-12 Matsubara-cho,
Akishima-shi,
Tokyo 196-8666, JAPAN
Tel : [phone]
Fax: [phone]
URL:http://www.rigaku.co.jp
NOTICE
1. This manual may not be disclosed to a third party or copied, in whole or in part, without the
written consent of Rigaku.
2. As a rule, one set of the instruction manual has to be purchased for each product.
3. If there are any missing or incorrectly collated pages in the delivered instruction manual,
contact the nearest Rigaku branch office or sales office for a replacement manual.
4. In no event will Rigaku be responsible for the results of the use of this manual.
5. The contents of this manual are subject to change without prior notice.

ME12058B−i
Maintenance Section
Safety Notes
Potentially Dangerous Parts within the MFM65 system components.
Warning labels have been affixed on or near potentially dangerous parts. They are expressed with
universal safety pictographs as described in the next paragraph. A summary label containing the main
hazards from these potentially dangerous parts appears on the front panel of this instrument. Warning
labels concerning prevention of exposure to X-rays, high voltage or other hazards use the signal word
“WARNING” or “CAUTION”. The use of Warning does not imply there is a hazard during ordinary
measurements, but a potential danger may arise due to carelessness or mishandling during maintenance
work or the like.
(1) Classification of Warning Indication. The degree of possible danger or damage in the case of
mishandling and the urgency of warning are classified into the following levels:
a) DANGER
In the case of carelessness or mishandling, an operator may immediately be killed or suffer a serious
injury to cause later death.
This indication is used very limitedly, and it must be strictly observed.
b) WARNING
In the case of mishandling, an operator may be killed or suffer a serious injury. It is also used to
denote an action that could cause serious damage to system components of the MFM65.
c) CAUTION
In the case of mishandling, an operator may suffer a slight or medium injury or material damage
alone is expected. The serious injury mentioned above means loss of eyesight, an injury, a burn
(high temperature or low temperature), an electric shock, a fracture, poisoning or the like which
involves an aftereffect, hospitalization or going to hospital for a long-term for medical treatment.
The slight injury means an injury, a burn, an electric shock or the like which does not involve
hospitalization or going to hospital for a long-term for medical treatment. Material damage means
damage to related facilities or acquired data.
(2) Pictographs for Warning Indication. Pictographs prepared according to ISO and ANSI guidelines are
attached. For details, see the list of warning labels. When a warning label is damaged, please contact
Rigaku to obtain a replacement label.
NOTE : Please read the SAFETY chapter in this manual before operating the MFM65 system.

ME12058B−ii
Maintenance Section
Contents
1. OVERVIEW ..............................................................................................................................................1
2. SAFETY .....................................................................................................................................................2
2.1 Hazards and Risks..............................................................................................................................2
2.2 Hazard Indications .............................................................................................................................5
2.3 Interlock List......................................................................................................................................9
2.4 Lock-out / Tag-out...........................................................................................................................11
2.5 EMO ................................................................................................................................................12
2.6 Maintenance Keys............................................................................................................................12
3. CONFIGURATION ................................................................................................................................13
3.1 MFM65 External Figure ..................................................................................................................13
3.2 MFM65 Configuration Block Diagram ...........................................................................................16
3.3 Functions..........................................................................................................................................17
3.4 Software Configuration....................................................................................................................18
3.5 Hardware Specifications ..................................................................................................................19
3.6 Explanation of Software ..................................................................................................................21
3.7 Utility Specifications .......................................................................................................................22
4. START UP ...............................................................................................................................................26
5. SHUTDOWN ...........................................................................................................................................27
6. DAILY CHECKS ....................................................................................................................................28
7. DAILY ANALYSIS .................................................................................................................................29
8. EDIT RECIPE .........................................................................................................................................30
8.1 Display the Edit Recipe Screen........................................................................................................30
8.2 Edit Recipe.......................................................................................................................................31
8.2.1 Process Recipe ......................................................................................................................32
8.2.2 Analysis recipe......................................................................................................................34
8.2.3 Wafer map recipe ..................................................................................................................40
8.2.4 Pattern map recipe.................................................................................................................42
9. MANUAL OPERATION........................................................................................................................50
9.1 Operation in the Chart Screen..........................................................................................................51
9.2 [EFEM] Control...............................................................................................................................52
9.3 [Optics1] ∼[Optics3]Control...........................................................................................................54
9.4 [Manual] Control .............................................................................................................................55
9.5 [Sequence Test] Control ..................................................................................................................57
9.6 [MFM Status] Control .....................................................................................................................58
10. SETUP ....................................................................................................................................................59
10.1 EFEM Settings...............................................................................................................................60
10.2 Optics Setup...................................................................................................................................61
11. DATA LOG............................................................................................................................................64
12. ALARMS................................................................................................................................................66
13. ROUTINE CHECKUP LIST ...............................................................................................................67
13.1 Checking cooling water, CDA and vacuum...................................................................................69
13.2 Cleaning of the transport line.........................................................................................................70

ME12058B−iii
Maintenance Section
14. MAINTENANCE ..................................................................................................................................71
14.1 Power Box......................................................................................................................................71
14.2 Using the handy light.....................................................................................................................72
14.3 Utility Adjustment .........................................................................................................................73
14.4 Exchanging Parts ...........................................................................................................................74
14.4.1 Cooling Water .....................................................................................................................74
14.4.2 UPS Battery.........................................................................................................................75
14.4.3 Accessories of PC ...............................................................................................................76
15. TROUBLE SHOOTING.......................................................................................................................77
15.1 Electric Power................................................................................................................................77
15.2 Startup............................................................................................................................................78
15.3 Beam Diagnosis .............................................................................................................................80
15.4 Loadport.........................................................................................................................................81
15.5 Wafer Transfer...............................................................................................................................82
15.6 Sample Alignment .........................................................................................................................83
15.7 XRR/XRD Measurement...............................................................................................................84
15.8 XRF Measurement.........................................................................................................................85
15.9 X-ray Trouble ................................................................................................................................86
APPENDIX 1 ..................................................................................................................................................87
A1.1 Consumables and Maintenance Parts............................................................................................87
A1.2 Disposing the Equipment and parts ..............................................................................................89
APPENDIX 2 ..................................................................................................................................................90
A2.1 Explanation of XRR (X-ray reflectometry method) .....................................................................90
A2.2 Analysis/Measurement Flow.........................................................................................................93
APPENDIX 3 ..................................................................................................................................................95
A3.1 Training for Using Equipment ......................................................................................................95
APPENDIX 4 ..................................................................................................................................................96
A4.1 Power Circuit Diagram .................................................................................................................96
A4.2 EMO Circuit..................................................................................................................................98
APPENDIX 5 ..................................................................................................................................................99
A5.1 List of Material Safety Database Sheet (MSDS) ..........................................................................99
A5.2 MSDS of Beryllium ....................................................................................................................100
A5.3 MSDS of Lead ............................................................................................................................111
A5.4 MSDS of Lithium .......................................................................................................................112
A5.5 MSDS of Mercury.......................................................................................................................115
A5.6 MSDS of Mechanical Lubricating Grease ..................................................................................121
A5.7 MSDS of Ethanol........................................................................................................................128
First Edition: October 19, 2005
Second Edition: March 5, 2008

−1−
ME12058B
Maintenance Section
1. OVERVIEW
This manual describes the user’s maintenance of the MFM65 system (model RRMWSFT Model).
Maintenance items except for descriptions in this manual should be performed by RIGAKU service
personnel in charge.
General information about the MFM65 system and its operation is found in a separate Operations
Manual.
NOTE : If the MFM65 system is modified without consulting RIGAKU, the system may not
satisfy the systems specifications, and RIGAKU does not warrant the modified system.
RIGAKU may change the specifications of the MFM65 system and the contents of the
printed materials, including the manual, without notice in the future.

−2−
ME12058B
Maintenance Section
2. SAFETY
Please read the following safety information before operating the MFM65 system.
2.1 Hazards and Risks
The MFM65 system has potential hazards and risks as follows.
(1) X-ray Hazards
WARNING
The red lamps turn on during X-ray generation. The MFM65 system has no
risk of X-ray exposure during normal operation, because this system has a
shielded radiation enclosure and interlocks to prevent X-ray exposure. (Refer to
“2.3 Interlock List”.)
Pay attention to the warning labels affixed on the enclosure of this system.
The border of the radiation-controlled area is defined at the outside surface of the enclosure. The dose
equivalent limit at the border of the radiation-controlled area is 1.3 mSv / 3 months by Publication 60
issued by the International Commission on Radiological Protection (ICRP). The dose equivalent limit
on the MFM65 is designed to be 2 micro Sv/H, that is based on Rigaku’s design standards. (1.3 mSv /
13 weeks / 6 days / 8 hours = 2 micro Sv/H)
NOTE : In fact, the dose of X-ray radiation outside the enclosure is almost zero.
(2) Electrical Hazards
WARNING
When performing maintenance inside the access panels where electrical hazard
has any potential of causing personal injury or damage to the system, strictly
follow lock-out/tag-out procedure of the instrument before starting the
maintenance work.
(Refer to “2.4 Lock-out/Tag-out”.)
Some electrical charge may remain in the capacitor of the HV transformer, and
electric shock may occur when the HV cable contacts are touched during
cleaning.
Do not disconnect the HV cables of the X-ray generators, and contact Rigaku
Service personnel.
If any fuse blows or if a thermal relay trips frequently in the instrument, its
peripherals, or main power supply, then stop using the equipment. Turn the power
off, and lock and tag the power in the “Off” position from the main Power Box,
Contact trained maintenance personnel or the Rigaku Service center.

−3−
ME12058B
Maintenance Section
(3) Laser Hazards
NOTE This instrument uses a wafer aligner which is an FDA Class 1 laser product (λ:
780 nm, Pmax. : 1.7 mW, Mode : Continuous).
The MFM65 system has no risk of laser exposure during normal operation
because this system has a complete enclosure shield for laser light and interlock to
avoid laser exposure.
(Refer to “2.3 Interlock List”.)
(4) Mechanical Hazards
WARNING Be sure that the power switch is off when maintenance within the equipment is
attempted. However, during the adjustment of some components, the power must
be on. In this case, take due care to avoid injury from mechanical parts.
When squatting down to work, for example when turning on the PC, take due care
to avoid injury from hitting your head against any mechanical projections.
NOTE When heavy parts or units are removed, for example a PC or an X-ray tube shield,
lift these objects with a coordinated effort by 2 or more persons.
(5) Material Hazards
WARNING Metal beryllium foil is used for the windows of X-ray tubes and X-ray
detectors (APD, SDD). Solid beryllium usually has no influence on human
health, but evidence exists that the person who inhales the beryllium powder or
vapor risks a possibility of serious injury or death. Do not scratch, polish, and
chemically clean beryllium foil, nor bake up to temperature so as to generate
vapor or powder. In case that beryllium window is ruptured, do not touch chips of
the beryllium window, and contact Rigaku Service personnel.
Then dispose them according to local regulations.
(Refer to the attached MSDS.)
WARNING Lead is used in the sealed maintenance-free built-in battery of the UPS.
Do not break up the battery when it is replaced.
Dispose of batteries according to local regulations.
(Refer to the attached MSDS.)

−4−
ME12058B
Maintenance Section
WARNING Mechanical lubricating grease is used in this equipment.
This grease usually has no influence on human health, but dispose according to
regulations and local regulations.
(Refer to the attached MSDS.)
WARNING Other toxic substances in the MFM65 system are lithium compound and mercury
compound.
A lithium compound is used in the built-in batteries of X-ray hour meter and
PC.
A mercury compound is used in the fluorescent light for maintenance.
These materials usually have no influence on human health, but dispose of them
according to local regulations.
(Refer to the attached MSDS.)
WARNING Ethanol of the customer’s FAB may be used to clean the transfer line by the
maintenance personnel.
(Refer to the attached MSDS.)
(6) Fire Hazards
WARNING Plastics and electric cables used in the MFM65 are class V0 or V1.
If smoke occurs from the equipment, push an EMO Switch.
(7) Hot Surface Hazards
CAUTION A halogen lamp is used in the light unit for pattern recognition.
Do not touch before cooling.
Wear safety gloves, when lamp exchanging this lamp.
(8) Trip Hazards
CAUTION The PC rack in the left lower side of the main module can be pulled out for the
maintenance.
Take care not to trip over it.

−5−
ME12058B
Maintenance Section
2.2 Hazard Indications
(1) Labels for hazard indications
The MFM65 system has the following labels for hazard indications.
4 Electric Hazard
Can shock, burn or cause
death.
Turn power off before
removing the cover.
HAZARDOUS
VOLTAGE INSIDE
SF002-10E
10E
5 Mechanical Hazard
PHYSICAL HAZARD
May result in severe
injury.
Watch your head.
SF007-10E
10E
1 X-ray Hazard
X-ray Hazard
Exposure to harmful
overriding safety interlock.
Please observe appropriate
safety guidelines.
Access should be limited
to authorized personnel
only.
radiation possible by
2 X-ray Hazard
harmful or fatal.
X-ray Hazard
This radiation can be
Please observe appropriate
radiation safety.
3 Mechanical Hazard
Mechanical Hazard
Moving parts insidemay
cause serious injury.
Access should be limited
tto authorized personnel
only.
6 Material Hazard
Material Hazard
(Beryllium)
Skin contact may be
hazardous to your health.
Wear safety gloves.
Fig. 2-2-1 Hazard Labels 1

−6−
ME12058B
Maintenance Section
8 Hot Hazard
HOT SURFACE
INSIDE
Contact may result in
severe burns.
Open only after safe
temperature is reached.
SF016-2C
Fig. 2-2-2 Hazard Labels 2
7 Material Hazard
Material Hazard
(Mercury)
Skin contact may be
hazardous to your health.
Wear safety gloves.
9 Caution

−7−
ME12058B
Maintenance Section
The locations of the hazard indication labels are shown in the following figure.
Fig. 2-2-3 Locations of Hazard Indication Labels

−8−
ME12058B
Maintenance Section
(2) Signal Towers and Buzzers
Front View
Left View
Ri
g
ht View
Fig. 2-2-4 Signal Towers and Buzzers
Maintenance Buzzer Maintenance Lamp
X-ray ON Lamp 1
X-ray ON Lamp 2
X-ray ON Lamp 3
EMO
Maintenance Buzzer Maintenance Lamp
X-ray ON Lamp 1
X-ray ON Lamp 2
X-ray ON Lamp 3
EMO
EMO Signal Tower

−9−
ME12058B
Maintenance Section
2.3 Interlock List
The interlock list in the following table helps operators and maintenance personnel avoid hazard risks.
NOTE : Refer to the “A4.1 Power Circuit Diagram” for the interlock circuit.
InterLockNameNo. Ariskofbeingprotected
MC1
none
TheworkingMCs/Thestoppingparts
MC5MC3 MC4 MC2
EMOcircuit
PC(UPS)
UPS
Display
LoadPort
Bar-code
Reader
FAN
I/O
PLC
AirValve
Light
SignalLamp
ROBOT
PatternNavi
MoterDriver
MoterController
MoterDriver
X-Ray(A)
HighVoltage
PowerSupply
X-Ray(B)
HighVoltage
PowerSupply
X-Ray(C)
HighVoltage
PowerSupply

InterLockName
99999
No. Ariskofbeingprotected
1 UpperDooratPowerBox Electricshock
&Fire
99999 9 999999 9
2EMO
Unexpecteddanger
9 99 9 999999 9
3Electricprotectionpanel
inthelowerrightofEFEM Electricshock
9 99 9 999999 9
4
Electricprotectionpanel
atthePowerdistribution
Box Electricshock
9 99 9 999999 9
5Electricprotectionpanel
attheMotordriverBox Electricshock
9 99 9 999999 9
6
Electricprotectionpanel
atthePatternNAVIBox Electricshock
9 99 9 999999 9
7Electricprotectionpanel
attheX-raypowersupply Electricshock
9 99 9 999999 9
8
Electricprotectionpanel
inthelowerof
PowerBox Electricshock
9 99 9 999999 9
9 Waterleaksensor Electricshock
9 99 9 999999 9
10
RearsideDoorof
mainmodule Theinjuryby theoperationpart
9 99 9 999999 9
11 RightsideDoorofEFEM Theinjuryby theoperationpart.
ExposureofX-rays
9
RightsideDoorofEFEM
(GateandCoveratWafer
alignerclosed) Theinjuryby
theoperationpart
9
12
LeftsideDoorofEFEM Theinjuryby theoperationpart.
ExposureofX-rays
9
LeftsideDoorofEFEM
(GateandCoveratWafer
alignerclosed) Theinjuryby
theoperationpart
9
13 RightsideDoorof
Mainmodule Theinjuryby
theoperationpart.
ExposureofX-rays
9
RightsideDoorof
Mainmodule
(GateandCoveratWafer
alignerclosed)
Theinjuryby
theoperationpart.
ExposureofX-rays
14
LeftsideDoorof
Mainmodule Theinjuryby
theoperationpart.
ExposureofX-rays
9
LeftsideDoorof
Mainmodule
(GateandCoveratWafer
alignerclosed)
Theinjuryby
theoperationpart.
ExposureofX-rays
15 RobotArmSensor (Therobotarmcomesin
contactwiththegate.) Theinjuryby
theoperationpart
9
16
LoadPort
(Remove) Theinjuryby theoperationpart
9
9
9
9
9999
9
9
9
9
9
9
999
99
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
999
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
999
9
999
9
9
9
9
9
9
9
9
9
9
9
999

−10 −
ME12058B
Maintenance Section
[Interlock location]
NOTE : The measurement software
displays the messages
during interlock operation.
Interlock Name
1 Upper Door at Power
Box
2 EMO
3
Electric protection panel
in the lower right of
EFEM
4
Electric protection panel
at the Power distribution
Box
5 Electric protection panel
at the Motor driver Box
6 Electric protection panel
at the Pattern NAVI Box
7
Electric protection panel
at the X-ray power
supply
8
Electric protection panel
in the lower of
Power Box
9 Water leak sensor
10 Rear side Door of
Main module
11 Right side Door of
EFEM
Right side Door of
EFEM
(Gate and Cover at
wafer aligner closed)
12 Left side Door of EFEM
Left side Door of EFEM
(Gate and Cover at
wafer aligner closed)
13 Right side Door of
Main module
Right side Door of
Main module
(Gate and Cover at
wafer aligner closed)
14 Left side Door of
Main module
Left side Door of
Main module
(Gate and Cover at
wafer aligner closed)
15
Gate Sensor
(The robot arm comes in
contact with gate)
16 Load Port
(Removed)
Fig. 2-3-1 Interlock Locations
9 : The sensor line is in the main module.
2
16
12
87
910
15
Rear View
Ri
g
ht View
Left View
Front View
14
6
2
12
4
3
2
5
11
13

−11 −
ME12058B
Maintenance Section
2.4 Lock-out / Tag-out
WARNING When electrical power off and isolating the cooling water of facility, strictly follow
lock-out/tag-out of the instrument as follows.
In the daily operation, the lock-out/tag-out of the cooling water is normally
unnecessary.
(1) The main breaker lock-out handle
1. Pull down the lock-out handle.
2. Set the tag to the lock-out handle.
3. Lock the tag.
(2) The cooling water lock-out
1. Open the lower panel on the left side.
2. Remove the internal cover.
.
The
p
ower box on the rear side
Fig. 2-4-1 Lock-out Handle
Fig. 2-4-2 Water Lock-out
4. Lock-out the bulbs.
3. Close the bulbs

−12 −
ME12058B
Maintenance Section
2.5 EMO
When the EMO button is pushed, electric power is OFF immediately. (See “2.3 Interlock List”.)
Push this button, when an accidental event occurs, for example loss of mechanical control, water
leakage, or fire.
The MFM65 system has four EMO buttons, one on each side of the tool. (See “2.3 Interlock List”.)
2.6 Maintenance Keys
The MFM65 system has many interlock functions for safety. When the enclosure covers of the
equipment are opened, electric power is OFF immediately. The X-ray generations are turned off, and
the mechanical systems, for example the goniometer, the robot, and so on, are turned off. But, some
items for maintenance need to be powered on with the covers open. In this case, maintenance keys are
used to release the interlock functions.
WARNING: There are two kinds of maintenance keys in the MFM65 system.
One is the key for mechanical maintenance. This key must be in safe keeping with
the maintenance personnel in charge, and only the service personnel can use these
keys for maintenance only.
Another is the key for X-ray maintenance. This key must be in safe keeping with
the service personnel in charge, and only the service personnel can use these keys
for maintenance only.
It is strictly prohibited to use these keys other than for maintenance operations.
If these keys are used, mechanical hazards, electric hazards and X-ray hazards
occur inside the main module or the EFEM.
[ Inside locations of the maintenance key switches ]
Mechanical key switch
for the goniometer X-ray key switch Mechanical key switch
for the goniometer
Mechanical key switch
for the transfer robo
t
Right View
Fig. 2-6-1 Maintenance Key Locations
Left View

−13 −
ME12058B
Maintenance Section
3. CONFIGURATION
3.1 MFM65 External Figure
[External Figure]
Si
g
nal Towe
r
EMO
Load Por
t
LCD
Keyboard/Trackball
Power Box
EFEM
Main Module
Load Port
Keyboard/
Trackball
FFU
Maintenance Panel
for Main Module
Maintenance Doo
r
for Main Module
Maintenance Doo
r
for EFEM
FFU
EMO
Power Cable Inlet
Power ON/OFF
Buttons
Main Breake
r
(Inside)
Maintenance
p
anels
EMO
Utility
connections
Front View
Ri
g
ht View
Rear View
To
p
View
Fig. 3-1-1 External Figure
Maintenance Doo
r
for Main Module
EMO
Maintenance Doo
r
for EFEM
Maintenance Panel
for Main Module
Lock-out/Tag-out
Handle
Le
f
t View
UPS for PC PC

−14 −
ME12058B
Maintenance Section
[Goniometer Figure]
Fig. 3-1-2 Gonimeter

−15 −
ME12058B
Maintenance Section
[EFEM Figure]
Fig. 3-1-3 EFEM Figure
Wafer Robo
t
Wafer Aligner
Load Port
To
p
View