Samsung NP540U3C User manual

NP540U3C
Lotus-13R-TSP
SERVICEMANUAL
540U3CContents
1.Precaution
2.Introduction
3.DesassemblyandReassembly
4.Troubleshooting
5.SystemWireDiagram
RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents
Contents
1.Precaution........................................................................................................................................1−1
1.1.GeneralAfter-SalesServicePrecautions.......................................................................................1−1
1.2.SafetyPrecautions...................................................................................................................1−2
1.3.Ground..................................................................................................................................1−3
1.4.StaticElectricityPrecautions......................................................................................................1−4
2.Introduction.....................................................................................................................................2−1
2.1.ProductFeatures......................................................................................................................2−1
2.2.Specication...........................................................................................................................2−2
2.3.Comparingproductspecications...............................................................................................2−8
2.4.FunctionofProduct..................................................................................................................2−9
2.5.NewTechnology/ability..........................................................................................................2−13
2.6.Hardware...............................................................................................................................2−31
2.7.Software................................................................................................................................2−38
2.8.SystemSetup(BiosSetup).........................................................................................................2−41
2.9.HW&OptionMaterials............................................................................................................2−48
3.DesassemblyandReassembly..............................................................................................................3−1
3.1.MainSystem............................................................................................................................3−1
3.2.LCD......................................................................................................................................3−4
4.Troubleshooting...............................................................................................................................4−1
4.1.Generalspec...........................................................................................................................4−1
4.2.DebuggingFlowChart..............................................................................................................4−2
4.3.HardwareTroubleshooting........................................................................................................4−5
4.3.1.LCD.........................................................................................................................4−5
4.3.2.MainSystem..............................................................................................................4−6
4.4.Diagnosisapplication...............................................................................................................4−11
4.5.Bios&MicomUpdate..............................................................................................................4−13
4.6.RTCReset..............................................................................................................................4−14
4.7.BatteryUsetime......................................................................................................................4−15
4.8.CPUFANControl....................................................................................................................4−16
4.9.SystemDiagnosis....................................................................................................................4−18
4.10.HardwareUpgrade...................................................................................................................4−19
5.SystemWireDiagram........................................................................................................................5−1
5.1.SystemLayout........................................................................................................................5−1
5.2.BoardComponent....................................................................................................................5−4
iCopyright©1995-2012SAMSUNG.Allrightsreserved.

1.Precaution
1.Precaution
1.1.GeneralAfter-SalesServicePrecautions
1)Donotletcustomersrepairtheproductthemselves..
›Thereisadangerofinjuryandtheproductlifetimemaybeshortened.
2)Makesuretodisconnectthepowercordfromthewalloutletbeforerepairingtheproduct(especiallyforafter-sales
serviceofelectricparts).
›Thereisadangerofelectricshock.
3)Donotletcustomersplugseveralelectrichomeappliancesintoasinglewalloutletatthesametime.
›Thereisadangerofreduetooverheating.
4)Checkifthepowerplugorwalloutletaredamagedinanyway.
›Ifadefectisfound,repairorreplaceitimmediately.
(Thereisadangerofelectricshockorre)
5)Makesurethatitisproperlygrounded.
(Checkthegroundofthewalloutlet)
›Electricityleakagemaycauseelectricshock.
DEVICE
UNDER
TES T
(RE ADING S HOULD)
NOT BE ABO VE 0.5mA
LEAKAGE
CUR RENT
TES TE R
TES T ALL
EXP OS E D METAL
S URFACE S
2-WIRE C ORD
*ALSO TES T WITH
P LUG R EVER S ED
(US ING AC ADAP TE R
P LUG AS RE QUIRE D) EARTH
GR OUND
Figure1.1LeakageCurrentTestCircuit
6)Donotspraywaterontotheproducttocleanit.
›Thereisadangerofelectricshockorreanditmayshortenthelifetimeoftheproduct..
7)Checktheassemblystatusoftheproductaftertheafter-salesservice..
›Theassemblystatusoftheproductmustbethesameasbeforetheafter-salesservice.
8)Unplugthepowercordholdingthepowerplug(andnotthecord).
›Ifthecordisdisconnected,itmaycauseelectricshockorre.
9)Repairtheproductusingonlyauthorizedparts
10)Keeptheproductawayfromheatingdevicessuchasheaters.
›Exposuretoheatersmaycausedeformationoftheproductorre.
Copyright©1995-2012SAMSUNG.Allrightsreserved.1-1

1.Precaution
1.2.SafetyPrecautions
1)EMI
ThisdevicehasbeenregisteredregardingEMIforresidentialuse.Itcanbeusedinallareas.
2)CircuitT est(LogicTest)Precautions
TheLSIandMSIusedinthisproductaresemiconductorintegratedcircuitsbasedonMOS-FETorCMOS.Since
thesetypesofdevicesarehighlysusceptibletostaticelectricityorcurrentleakage,anisolationbreakmaybecaused.
Thereforereadandfollowtheinstructionsbelow.
a)WhenhandlinganLSIorMSI,makesureyourbodyisgroundedthroughafewmega-ohmsofresistance.In
addition,wearglovesandajacketmadeofcottonandnotofsyntheticbersthateasilygeneratestaticelectricity.
b)Whenrepairingtheproduct,placeaconductivematerial(e.g.aluminumfoil)groundedtotheearthontheworktable.
c)Youmustuseasolderingironwithoutaleakagecurrent.
d)DonottouchthepinofanICandcarefullyinserttheICintotheblackplasticpackage.
e)WheninsertinganICintoaPCB,becarefulwiththedirectionoftheIC.WheninstallinganICinthewrong
direction,itmightbecomedamaged.
f)WhencarryinganIC,packagetheICwithconductingmaterialsuchasaluminumfoilorconductingspongesoasto
keepthevoltagelevelofeachoftheterminalsthesame.
g)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.
h)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.
i)WhensolderinganIC,solderitinasshortatimeaspossiblesothatunnecessaryheatisnotappliedtothedevice.
j)AvoidleavingexcessiveamountsofuxwithinacustomICorbetweenthepinswhensolderingacustomIC.
k)TakecaretonotdamagetheboardwheninstallingorseparatinganOptionBoard.
l)TakecaretonotbreaktheprintedcircuitpatternonthePCBwhenseparateanIC.
1-2Copyright©1995-2012SAMSUNG.Allrightsreserved.

1.Precaution
1.3.Ground
Theproductmustbegroundedtoprotectitfromstaticelectricityandotherdangers.Whenusingamultitap,pleaseusea
multitapwithagroundterminalonly.
Ifyouusea220Vwalloutletwithagroundterminal,youdonotneedtogrounditadditionally.Avoidusingwalloutletsif
theyarenotgroundedeveniftheyhaveagroundterminal.
Togroundtheproduct,connectthegroundtoanexclusivegroundterminalormetalwaterpipe.Connectthegroundcableto
thegroundterminalattherearofthemainbody.Togroundtheproduct,connectthegroundterminaloftheproducttoa
metalwaterpipe,walloutletorexclusivegroundterminalwithanelectricwireequaltoorthickerthan#18.
NevergroundtheproducttoaPVCwaterpipe,phoneline,TV ,radioantenna,aluminumwindoworgaspipe,becausethis
doesnotactuallygroundtheproductandmaybedangerous.
Theredboxofeachimageisearthwithoverlapwheninsertingaplugormultiple-tabintothesocket.
Pleasecheckthatitshouldbeputtheoutletcompletely.
Copyright©1995-2012SAMSUNG.Allrightsreserved.1-3

1.Precaution
1.4.StaticElectricityPrecautions
Manypartsofthesystemaresusceptibletostaticelectricity.Usinganelectrostaticdischarge(ESD)deviceisveryimportant
forthesafetyoftheuserandtheuser'ssurroundings.UsinganESDdeviceincreasestheprobabilityofasuccessfulrepair
andlowerstheexpensesfordamagedparts.
Topreventstaticelectricity,followtheinstructionsbelow.
1)Performtherepairinalocationwithoutstaticelectricity.
2)Touchyourhandstoametalwaterpipeorsomemetalobjectconnectedtothegroundtodischargeanystatic
Electricityfromyourbodybeforehandlingtheparts.
3)Touchonlytheedgesoftheboard,ifpossible.
4)Donottouchanypartsunlessabsolutelynecessary
5)Disassemblethepartsontheanti-static-electricitypad.
6)Whenaboardisnotinstalledinthesystem,packagetheboardwithananti-static-electricitypackaging.
1-4Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction
2.Introduction
2.1.ProductFeatures
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-1

2.Introduction
2.2.Specication
Processor*andMotherboard
CPUIntel®IvyBridgeProcessori33217U1.50Hz,3MB
Intel®IvyBridgeProcessori53317U1.70Hz,3MB(Upto2.6GHz)
Intel®IvyBridgeProcessori73517U1.9GHz,4MB(Upto3GHz)-MaxSpec
CacheL3:3~4MB
ChipsetIntelHM76
BIOS64MbitSPIash,upgradeable
ThermalDesign(TDP)MAX.17W
Memory*
MaximumCapacityMAX.12GB(onBD4GB+8GBx1)
Type(MHz)DDR3(1333MHz/1600MHz)
Modules4GB((onBD4GB)
6GB(onBD4GB+2GBx1)
8GB(onBD4GB+4GBx1,Laterintroductionschedule)SODIMM
Sockets1-slotSODIMM&On-board(upto4GB)'1SlotPerMax.8GBSupport'
UpgradeablebyusersYes
※PC3-10600(1333Mhz),PC3-12800(1600Mhz)conrmedthecompatibilitytest.
DisplayandGraphics*
LCD13.3"WithTSP(TouchScreenPanel:electrostatic,temperedglass)
*Notsupport3Display
Ratio16:9
PanelTN
SurfaceTypeNonGlare
BackLightLED
InterfaceLED
VendorSamsung
Resolution(NumberofPixel)HD(1366x768)Win7Support/Win8Support
(1366X768,1360X768,1280X768,1280X720,1280x600,1024X768,800X
600)
ViewableArea293.42(H)X164.97(V)
ViewingangleHor.+45/-45,Ver.+15/-30(typ)
PixelPitch0.2148(H)x0.2148(V)
ContrastRatioMin.300,Typ.400
Brightnesstyp.300(cd/m2)
Colors16.2M
ResponsetimeTyp.16ms,Max.25ms(Rising+Falling=LCDresponsespeed)
GraphicsController11.IntelHDGraphics4000(Internal)
2-2Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction
Max.resolutionforVGAMaxresolutionof2560x1600at60Hzat85Hzrefreshrate(ext.)
Supportedresolution(640x480,800x600,1024x768,1152x864,
1280x800,1280x960,1280x1024,1400x1050,1440x900,1600x1024,1600x1200,
1680x1050,1920x1200,1920x1440,2560x1600)
[Ext.monitorresolutionssupportedbyEDIDinformation]
Max.resolutionforHDMISupportv1.4acompliant/aresolutionof1920x1200pixelswith32-bitcolor
at60Hz
Max.ResolutionforLFPLVDSduallinkresolutionof2560X2048perlink/amaximumtheoreticalpixelrate
of224MP/s
(640x480,800x600,1024x768,1152x864,1280x800,1280x960,1280x1024,
1400x1050,1440x900,1600x1024,1600x1200,1680x1050,2560x2048)
[Ext.monitorresolutionssupportedbyEDIDinformation]
Multimedia
SoundHighDenitionAudio
ControllerHDAudioCodec,ALC269Q-VC2-GR
ConversionBuilt-inhighperformance24-bitADC&24-bitDAC
InternalInterfacesEmbeddedstereospeakers,InternalMonoMIC
SpeakerPowerRating2Speakersx2Wattwithenclosureeach
ExternalInterfacesHeadphone/MicCombo,NotSupportS/PDIF
ControlsKeyboardvolumecontrol
Camera
Imagesensor1.3MegaCMOSColorImageSensor
StillImageCaptureResolution1280*1024(Max.),1280*720,800*600,640*480,352*288,320*240
VideoCaptureResolution1280*1024(Max.),1280*720,800*600,640*480,352*288,320*240
FrameRate30fps@HD,24MHzMCLK
OutputVideoFormatSXGA,HD,SVGA,VGA,CIandQVGA
InterfaceUSB2.0
UVCSupportSupported
Storage*
HardDiskDrive7mmH2.5"HDD,Removable(withExpresscache24GB=iSSDSATA3)
*9.5mmH2.5"HDDinstallationimpossibility
VendorHITACHI(BA59-03210A)
SupportsSATAhostcontrollersupport48bitLBA
AverageAccessTime12msec.
InterfaceSATA2(3.0Gbps)*SATA1Support,SATA3NotSuppot.
Speed5400rpm
Capacity500GB(Max)
SolidStateDrivemSATASSD,Removable
VendorSanDisk(BA59-03232C)
SupportsSATAhostcontrollersupport48bitLBA
AverageAccessTimeRead:Upto450MB/SWrite:Upto350MB/s
InterfaceSATA3(6.0Gbps)*SA TA1,2Support.
Speed6.0Gbps
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-3

2.Introduction
Capacity128GB(Max.256GB)
NetworkTools
LANIntegrated10/100/1000MbpsEthernet
ControllerRTL8111E
VendorRealtek
FeaturesRJ45Output
WirelessLANJacksonPeak22x2Combo(BA59-03294A)*WiDiSupport
Module802.11a/g/n2x2WLANandBT4.0(BLE,BT3.0+HS)
TypeMiniCardhalfsize
InterfaceWLAN(PCI-E),BT(USB2.0)
ChipsetIntelCentrinoAdvanced-N6235
Max.LinkSpeedWi-FiRx/TxThroughput300Mbps(LinkSpeedisonlystandardvalue,Actually
valuewilldecidedbyeachenvironmant)
Antenna2AntennaSupport:WLAN(2Tx/Rx)
WirelessLANAtherosWB225(BA92-08418A)
Module802.11b/g/n1x1WLANandBT4.0(BLE,BT3.0+HS)
TypeMiniCardhalfsize
InterfaceWLAN(PCI-E),BT(USB2.0)
ChipsetAR9485(WLAN)+AR3012(Bluetooth)
Max.LinkSpeedWi-FiRx/TxThroughput150Mbps(LinkSpeedisonlystandardvalue,Actually
valuewilldecidedbyeachenvironmant)
Antenna1AntennaSupport:WLAN(1TX,1RX),BT(1TX/RX)
I/OInterface
MemoryCardReader
-maximumsupportcapacity
3-in-1(SD/SDHC/SDXC)
SD(SDHC+SDXC)
SDHC:32GB
SDXC:1TB
ControllerGL823
VendorGENESY
Vendor
ExpressCardSlotsN/A
I/OPorts
USBPort1XUSB3.0(Chargeable→iphoneRecharge),2XUSB2.0
VGAPortminiVGAAdapter(Option)[BA39-01189A]
AudioJacksHeadPhone-out,MIC-inCombo(4pole)*US,L/R/G/M
WiredLANRJ45
HDMI1xHDMI
SecuritySlotN/A
Power1xDC-injackforACadapter(3Pie)
InputDevices
Keyboard
TypeChicklets
2-4Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction
SpecicationTravellength:1.5mm,height:3.9mm,Pitch:19.05mm
Keynumbers80-key(US,KOR,RUS,SEK)81-Key(UK,FRA,GER,SP A,ITA)
NumKeypadN/A
TouchpadStandardTouchpadwith2buttons(withgesturefunction),99.0x53.0
LEDIndicatorPower,AC-in/battery,HDD,WLAN
SecuritySolutions
TPM(Option)TrustedPlatformModule1.2
InterfaceLPC
ControllerSLB9635TT1.2
VendorInneon
ApplicationOmnipass/TPMHostSW
PowerandPowerManagement
Systempowermanagement
PowermanagementfeaturesACPIV2.0compliantS0~S5,C1~C6Mode
Standardbattery
ModelcodeAA-PLWN4AB
TypeLi-Polymer
Detailsofcell4cells
Batterycapacity6890mAh
Batteryrating52Wh
V oltage7.56V
ColorBlack
Dimension265.8*104.11*6mm(WxDxH)
Weightapproximate315g
RechargingTimeapproximate3hours
VendorSDI,Dynapack
ACAdapter
ModelNameAD-4019P(BA44-00279A)
OutputPower40W
Dimension92.5x38.5x27.5mm(WxHxD)
Weight(ACAdapter)175g(Max)
WorldwideCompatibilityAuto-sensing100-240V AC
LineFrequency50/60Hz
AdapterRating-Input100V AC~240V AC,1.0A
AdapterRating-Output19.0VDC/2.1A
SystemDimensions
PyxicalInformation
Dimensions(WXDXH)315.1x218.9x19.9mm
Weight1.64Kg(W/SSD)1.69Kg(W/HDD)
-ConditionFullSystemwith4cellBattery(WithBag:±0.06Kg,WithOutBag:±0.04)
Packagedimensions(WxDxH)AllNationCommon(Withbag)386x136x345mm(Withoutbag)395x330
x82mm
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-5

2.Introduction
Design
LCDBackAluminum
LCDFrontGlass
SystemTopAluminum
SystemBottomPA/GF50%
OS
OperatingsystemWin8
2-6Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction
LabelLocation
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-7

2.Introduction
2.3.Comparingproductspecications
2-8Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction
2.4.FunctionofProduct
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-9

2.Introduction
2-10Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction
Keyboard
Keyboardarrangementandsizecandiffertobyeachcountry.
○:KBDWaterChecksheetLocation
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-11

2.Introduction
2-12Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction
2.5.NewTechnology/ability
InnerBattery
※PleaseRefertotheTrainingmanualchapter1.
TPM(Option)
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-13

2.Introduction
2-14Copyright©1995-2012SAMSUNG.Allrightsreserved.