Samsung Mercury-27T User manual

Mercury-27T
DP700A7D
SERVICEMANUAL
DP700A7DContents
1.Precaution
2.Introduction
3.DesassemblyandReassembly
4.Troubleshooting
5.SystemWireDiagram
RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents
Contents
1.Precaution........................................................................................................................................1−1
1.1.GeneralAfter-SalesServicePrecautions.......................................................................................1−1
1.2.SafetyPrecautions...................................................................................................................1−2
1.3.Ground..................................................................................................................................1−3
1.4.StaticElectricityPrecautions......................................................................................................1−4
2.Introduction.....................................................................................................................................2−1
2.1.ProductFeatures......................................................................................................................2−1
2.2.Specication...........................................................................................................................2−2
2.3.Comparingproductspecications...............................................................................................2−10
2.4.OverviewandFeature..............................................................................................................2−11
2.5.NewTechnology/ability..........................................................................................................2−20
2.6.NewH/W(Platform)................................................................................................................2−34
2.7.SWList.................................................................................................................................2−38
2.8.SystemSetup(BiosSetup).........................................................................................................2−41
2.9.HWOptionalItems................................................................................................................2−52
3.DesassemblyandReassembly..............................................................................................................3−1
3.1.MainSystem............................................................................................................................3−1
4.Troubleshooting...............................................................................................................................4−1
4.1.Generalspec...........................................................................................................................4−1
4.2.DebuggingFlowChart..............................................................................................................4−2
4.3.HardwareTroubleshooting........................................................................................................4−6
4.3.1.LCD.........................................................................................................................4−6
4.3.2.MainSystem..............................................................................................................4−7
4.3.3.Others.......................................................................................................................4−11
4.4.Diagnosisapplication...............................................................................................................4−13
4.5.Bios&MicomUpdate..............................................................................................................4−15
4.6.CPUFANControl....................................................................................................................4−16
4.7.SystemDiagnosis....................................................................................................................4−17
4.8.HardwareUpgrade...................................................................................................................4−18
5.SystemWireDiagram........................................................................................................................5−1
5.1.SystemLayout........................................................................................................................5−1
5.2.BoardComponent...................................................................................................................5−2
iCopyright©1995-2012SAMSUNG.Allrightsreserved.

1.Precaution
1.Precaution
1.1.GeneralAfter-SalesServicePrecautions
1)Donotletcustomersrepairtheproductthemselves..
›Thereisadangerofinjuryandtheproductlifetimemaybeshortened.
2)Makesuretodisconnectthepowercordfromthewalloutletbeforerepairingtheproduct(especiallyforafter-sales
serviceofelectricparts).
›Thereisadangerofelectricshock.
3)Donotletcustomersplugseveralelectrichomeappliancesintoasinglewalloutletatthesametime.
›Thereisadangerofreduetooverheating.
4)Checkifthepowerplugorwalloutletaredamagedinanyway.
›Ifadefectisfound,repairorreplaceitimmediately.
(Thereisadangerofelectricshockorre)
5)Makesurethatitisproperlygrounded.
(Checkthegroundofthewalloutlet)
›Electricityleakagemaycauseelectricshock.
DEVICE
UNDER
TES T
(RE ADING S HOULD)
NOT BE ABO VE 0.5mA
LEAKAGE
CUR RENT
TES TE R
TES T ALL
EXP OS E D METAL
S URFACE S
2-WIRE C ORD
*ALS O TES T WITH
P LUG R EVER S ED
(US ING AC ADAP TER
P LUG AS RE QUIRE D) EARTH
GR OUND
Figure1.1LeakageCurrentTestCircuit
6)Donotspraywaterontotheproducttocleanit.
›Thereisadangerofelectricshockorreanditmayshortenthelifetimeoftheproduct..
7)Checktheassemblystatusoftheproductaftertheafter-salesservice..
›Theassemblystatusoftheproductmustbethesameasbeforetheafter-salesservice.
8)Unplugthepowercordholdingthepowerplug(andnotthecord).
›Ifthecordisdisconnected,itmaycauseelectricshockorre.
9)Repairtheproductusingonlyauthorizedparts
10)Keeptheproductawayfromheatingdevicessuchasheaters.
›Exposuretoheatersmaycausedeformationoftheproductorre.
Copyright©1995-2012SAMSUNG.Allrightsreserved.1-1

1.Precaution
1.2.SafetyPrecautions
1)EMI
ThisdevicehasbeenregisteredregardingEMIforresidentialuse.Itcanbeusedinallareas.
2)CircuitTest(LogicTest)Precautions
TheLSIandMSIusedinthisproductaresemiconductorintegratedcircuitsbasedonMOS-FETorCMOS.Since
thesetypesofdevicesarehighlysusceptibletostaticelectricityorcurrentleakage,anisolationbreakmaybecaused.
Thereforereadandfollowtheinstructionsbelow.
a)WhenhandlinganLSIorMSI,makesureyourbodyisgroundedthroughafewmega-ohmsofresistance.In
addition,wearglovesandajacketmadeofcottonandnotofsyntheticbersthateasilygeneratestaticelectricity.
b)Whenrepairingtheproduct,placeaconductivematerial(e.g.aluminumfoil)groundedtotheearthontheworktable.
c)Youmustuseasolderingironwithoutaleakagecurrent.
d)DonottouchthepinofanICandcarefullyinserttheICintotheblackplasticpackage.
e)WheninsertinganICintoaPCB,becarefulwiththedirectionoftheIC.WheninstallinganICinthewrong
direction,itmightbecomedamaged.
f)WhencarryinganIC,packagetheICwithconductingmaterialsuchasaluminumfoilorconductingspongesoasto
keepthevoltagelevelofeachoftheterminalsthesame.
g)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.
h)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.
i)WhensolderinganIC,solderitinasshortatimeaspossiblesothatunnecessaryheatisnotappliedtothedevice.
j)AvoidleavingexcessiveamountsofuxwithinacustomICorbetweenthepinswhensolderingacustomIC.
k)TakecaretonotdamagetheboardwheninstallingorseparatinganOptionBoard.
l)TakecaretonotbreaktheprintedcircuitpatternonthePCBwhenseparateanIC.
1-2Copyright©1995-2012SAMSUNG.Allrightsreserved.

1.Precaution
1.3.Ground
Theproductmustbegroundedtoprotectitfromstaticelectricityandotherdangers.Whenusingamultitap,pleaseusea
multitapwithagroundterminalonly.
Ifyouusea220Vwalloutletwithagroundterminal,youdonotneedtogrounditadditionally.Avoidusingwalloutletsif
theyarenotgroundedeveniftheyhaveagroundterminal.
Togroundtheproduct,connectthegroundtoanexclusivegroundterminalormetalwaterpipe.Connectthegroundcableto
thegroundterminalattherearofthemainbody.Togroundtheproduct,connectthegroundterminaloftheproducttoa
metalwaterpipe,walloutletorexclusivegroundterminalwithanelectricwireequaltoorthickerthan#18.
NevergroundtheproducttoaPVCwaterpipe,phoneline,TV,radioantenna,aluminumwindoworgaspipe,becausethis
doesnotactuallygroundtheproductandmaybedangerous.
Copyright©1995-2012SAMSUNG.Allrightsreserved.1-3

1.Precaution
1.4.StaticElectricityPrecautions
Manypartsofthesystemaresusceptibletostaticelectricity.Usinganelectrostaticdischarge(ESD)deviceisveryimportant
forthesafetyoftheuserandtheuser'ssurroundings.UsinganESDdeviceincreasestheprobabilityofasuccessfulrepair
andlowerstheexpensesfordamagedparts.
Topreventstaticelectricity,followtheinstructionsbelow.
1)Performtherepairinalocationwithoutstaticelectricity.
2)Touchyourhandstoametalwaterpipeorsomemetalobjectconnectedtothegroundtodischargeanystatic
Electricityfromyourbodybeforehandlingtheparts.
3)Touchonlytheedgesoftheboard,ifpossible.
4)Donottouchanypartsunlessabsolutelynecessary
5)Disassemblethepartsontheanti-static-electricitypad.
6)Whenaboardisnotinstalledinthesystem,packagetheboardwithananti-static-electricitypackaging.
1-4Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction
2.Introduction
2.1.ProductFeatures
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-1

2.Introduction
2.2.Specication
ProcessorandMotherboard
CPU***Intel®Pentium®G645TProcessor(2.50GHz,3MB)BGA
Intel®IvyBridgeCore™I3ProcessorDualCoreI3-3220T(2.80Hz)3MBBGA
Intel®IvyBridgeCore™I5ProcessorDualCoreI5-3470T(2.90Hz)3MBBGA
Intel®IvyBridgeCore™I5ProcessorQuadCoreI5-3570T(2.30Hz)6MB
-MaxspecBGA
Intel®IvyBridgeCore™I7Processor
QuadCoreI7-3770T(2.50Hz)8MB-MaxspecBGA
CacheL3:3~8MB
IntelTurboBoost
ChipsetIntelH61/IntelH77
BIOS32Mbit,Flashupgradable,SPIROM
(ROMsizeforWin8support)
ThermalDesignPerformance35W
Memory
Memory***/Max.MemoryMAX.8GB(1Slots:Max.4GB)
MemorytypePC3-10600/12800(1333/1600MHz)DDR3SODIMM
MemoryModules4/6/8GBDDR31333/1600MHz
Sockets(PGA)2SODIMMs(Total2Slots)forDDR3
※PC3-10600/12800(1333/1600MHz)conrmedthecompatibilitytest
DisplayandGraphics
LCD27"FHD(M270HW02V1)[NonGlare]
(TSPSupport:capacitancepanel)
TypeLEDLCD(NonGlare)
VendorAUO
LCDViewableArea597.6(W)*336.15(H)mm
LCDResolutionFHD(1920x1080)
DotPitch311.25(H)x311.25(V)um
ViewingangleHor.+89/-89,Ver.+89/-89(Typ)
ContrastRatioTyp.5000
BrightnessTyp.300(cd/m2)
ResponsetimeRising+Fallingtyp.12ms
tiltangle0~20˚(userangle)
PanelVA
TSPSupport:capacitancepanel
LCD27"QHD(LTM270DL02)[NonGlare]
(TSPSupport:capacitancepanel)
2-2Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction
TypeLEDLCD(NonGlare)
VendorSEC
LCDViewableArea(596.74*335.66)mm
LCDResolutionQHD(2560x1440)
DotPitch0.233(H)x0.233(V)
ViewingangleHor.+89/-89,Ver.+89/-89(Typ)
ContrastRatioTyp.1000
BrightnessTyp.300(cd/m2)
ResponsetimeRising+Fallingtyp.12ms
tiltangle0~20˚(userangle)
PanelPLS
TSPSupport:capacitancepanel
GraphicsControllerAMDHeathrow-ProHD7850M:G645/i3/i5/i7Support
VideoMemory1GBGDDR5/2GBGDDR5
Max.resolutionforBulit-inLCDWin8support:(2560X1440,1920X1200,1920x1080,1680x1050,
1600X1200,1600x900,1440x900,1400x1050,1280x1024
,1280x800,1280x768,1152x864,1024x768)
HDMI-InSupportv1.4acompliant/EnableHDCP
DP-INsupport:(2560X1440,1920X1200,1920x1080,1680x1050,
1600X1200,1600x900,1440x900,1400x1050,1280x1024
,1280x800,1280x768,1152x864,1024x768)
ControlsTouchBoard(Brightness,Sound,TouchLauncher,Backlight)
CameraSupport(1.0MHDmegapixel)
PowerexpressNotsupport
GraphicsControllerINTELHDGraphics2500(Option):i3/5Support
VideoMemorySharedvideomemoryupto1.8GBatover4GBSystemmemory(DVMT5.0)
Max.resolutionforBulit-inLCD1920x1080with32-bitcolorat60Hz
1920X1080,1680x1050,1600x900,1440X900,1400x1050,1366x768,
1280x1024,1280x960,1280x800,1280x768,1152x864,1024x768
HDMI-InSupportv1.4acompliant/EnableHDCP
DP-IN1920X1080,1680x1050,1600x900,1440X900,1400x1050,1366x768,
1280x1024,1280x960,1280x800,1280x768,1152x864,1024x768
ControlsTouchBoard(Brightness,Sound,TouchLauncher,Backlight)
CameraSupport
GraphicsControllerINTELHDGraphics4000(Option):i7Support
VideoMemorySharedvideomemoryupto1.8GBatover4GBSystemmemory(DVMT5.0)
Max.resolutionforBulit-inLCD1920x1080with32-bitcolorat60Hz
1920X1080,1680x1050,1600x900,1440X900,1400x1050,1366x768,
1280x1024,1280x960,1280x800,1280x768,1152x864,1024x768
HDMI-InSupportv1.4acompliant/EnableHDCP
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-3

2.Introduction
DP-IN1920X1080,1680x1050,1600x900,1440X900,1400x1050,1366x768,
1280x1024,1280x960,1280x800,1280x768,1152x864,1024x768
ControlsTouchBoard(Brightness,Sound,TouchLauncher,Backlight)
CameraSupport
GraphicsControllerINTELHDGraphics(Option)
VideoMemorySharedvideomemoryupto1.8GBatover4GBSystemmemory(DVMT5.0)
Max.resolutionforBulit-inLCD1920x1080with32-bitcolorat60Hz
1920X1080,1680x1050,1600x900,1440X900,1400x1050,1366x768,1280x1024,
1280x960,1280x800,1280x768,1152x864,1024x768
HDMI-InSupportv1.4acompliant/EnableHDCP
DP-IN1920X1080,1680x1050,1600x900,1440X900,1400x1050,1366x768,
1280x1024,1280x960,1280x800,1280x768,1152x864,1024x768
ControlsTouchBoard(Brightness,Sound,TouchLauncher,Backlight)
CameraSupport
AudioandVideo
SoundHighDenitionAudio
ControllerRealtekALC269Q-VC
ConversionBuilt-inhighperformance24-bitADC&24-bitDAC
SoundeffectSoundAive
InternalInterfacesEmbeddedstereospeakerswith2
Tweeters&integrated2xDigitalmicrophones
SpeakerPowerRating2Speakersx7W/6ohm
ExternalInterfacesHeadphone-out,microphone-in
ControlsMonitormode:TouchButtonVolumeControl
Microphone
TypeIntegrated2xDigitalmicrophones
Sensitivity-22±3dB
Outputimpedance
NolseReductionNoisesupression,AcousticEchoCancellation,BeamForming
Camera
ModelnameSC-10IRQ12340N
Imagesensor1/6.5"ColorCMOSHD(1,280x720)
StillImageCaptureResolution1,280x720(Max.)
VideoCaptureResolution1,280x720(Max.)
FrameRate30fps@HD,24MHzMCLK
OutputVideoFormatHD,SVGA,VGA,CIF,QVGA,QCIF,QQVGA
InterfaceUSB2.0(Highspeed)
UVCSupportsupport
2-4Copyright©1995-2012SAMSUNG.Allrightsreserved.