Seco Qseven cq7-a30 User manual

CQ7-A30

Cross Platform Carrier Board for Qseven®

Rel.2.0 Compliant modules

CQ7-A30

Unauthorised use, duplication, modification or disclosure of the information to a third-party by any means without prior consent of SECO S.r.l. is prohibited.

Every effort has been made to ensure the accuracy of this manual. However, SECO S.r.l. accepts no responsibility for any inaccuracies, errors or omissions herein.

SECO S.r.l. reserves the right to change precise specifications without prior notice to supply the best product possible.

For further information on this module or other SECO products, but also to get the required assistance for any and possible issues, please contact us using the

dedicated web form available at http://www.seco.com (registration required).

Our team is ready to assist you.

Revision

Date

Note

Rif

1.0

7th May 2015

First official release

2.0

26th January 2016

Product name Change

REVISION HISTORY

CQ7-A30

INDEX

INTRODUCTION.......................................................................................................................................................................... 5Chapter 1.

1.1 Warranty........................................................................................................................................................................................................................................ 6

1.2 Information and assistance............................................................................................................................................................................................................. 7

1.3 RMA number request..................................................................................................................................................................................................................... 7

1.4 Safety............................................................................................................................................................................................................................................ 8

1.5 Electrostatic Discharges.................................................................................................................................................................................................................8

1.6 RoHS compliance.......................................................................................................................................................................................................................... 8

1.7 Terminology and definitions ............................................................................................................................................................................................................ 9

1.8 Reference specifications ..............................................................................................................................................................................................................11

OVERVIEW ............................................................................................................................................................................... 13Chapter 2.

2.1 Introduction.................................................................................................................................................................................................................................. 14

2.2 Technical Specifications...............................................................................................................................................................................................................15

2.3 Electrical Specifications................................................................................................................................................................................................................16

2.3.1 RTC Battery.........................................................................................................................................................................................................................16

2.3.2 Power Rails meanings.......................................................................................................................................................................................................... 17

2.3.3 Power LEDs.........................................................................................................................................................................................................................17

2.4 Mechanical Specifications............................................................................................................................................................................................................18

2.5 Block Diagram .............................................................................................................................................................................................................................19

OVERVIEW ............................................................................................................................................................................... 20Chapter 3.

3.1 Connectors placement.................................................................................................................................................................................................................21

3.2 Connectors overview ...................................................................................................................................................................................................................22

3.2.1 Connectors list.....................................................................................................................................................................................................................22

3.2.2 Jumpers list.........................................................................................................................................................................................................................23

3.2.3 Dip Switch list......................................................................................................................................................................................................................23

3.3 Connectors description................................................................................................................................................................................................................24

3.3.1 Qseven®Connector.............................................................................................................................................................................................................24

3.3.2 Boot selector jumper............................................................................................................................................................................................................28

3.3.3 GP_1-Wire Bus mode selector............................................................................................................................................................................................. 28

3.3.4 Ethernet connector ..............................................................................................................................................................................................................29

3.3.5 USB connectors ..................................................................................................................................................................................................................30

CQ7-A30

3.3.6 DP++/HDMI Slot..................................................................................................................................................................................................................33

3.3.7 LVDS/eDP Slot....................................................................................................................................................................................................................36

3.3.8 SATA connectors.................................................................................................................................................................................................................39

3.3.9 mSATA slot.......................................................................................................................................................................................................................... 41

3.3.10 SD card slot.........................................................................................................................................................................................................................42

3.3.11 Audio Interface.....................................................................................................................................................................................................................43

3.3.12 PCI-express slots.................................................................................................................................................................................................................45

3.3.13 miniPCI-express slot ............................................................................................................................................................................................................ 51

3.3.14 miniSIM Card Slot................................................................................................................................................................................................................52

3.3.15 Serial ports ..........................................................................................................................................................................................................................53

3.3.16 CAN Interface ......................................................................................................................................................................................................................56

3.3.17 PS/2 Mouse + Keyboard Pin header ....................................................................................................................................................................................57

3.3.18 LPC/GPIO Pin header.......................................................................................................................................................................................................... 57

3.3.19 POST Codes section ...........................................................................................................................................................................................................58

3.3.20 SPI Pin header.....................................................................................................................................................................................................................59

3.3.21 SPI Flash socket..................................................................................................................................................................................................................59

3.3.22 I2C EEPROM socket............................................................................................................................................................................................................60

3.3.23 Pushbuttons........................................................................................................................................................................................................................60

3.3.24 Feature internal pin header ...................................................................................................................................................................................................61

3.3.25 FAN Connectors..................................................................................................................................................................................................................62

3.3.26 Manufacturer and Debug Connectors...................................................................................................................................................................................63

Development Kit Accessories..................................................................................................................................................... 65Chapter 4.

4.1 LVDS/eDP Adapter Module VA64................................................................................................................................................................................................. 66

4.1.1 LVDS working mode ............................................................................................................................................................................................................67

4.1.2 eDP working mode ..............................................................................................................................................................................................................69

4.2 DP++/HDMI Adapter Module VA65 .............................................................................................................................................................................................. 73

4.2.1 DP++ working mode............................................................................................................................................................................................................74

4.2.2 HDMI working mode ............................................................................................................................................................................................................75

4.3 Accessories Kit............................................................................................................................................................................................................................76

CQ7-A30

Chapter 1.

Warranty

Information and assistance

RMA number request

Safety

Electrostatic Discharges

RoHS compliance

Terminology and definitions

Reference specifications

CQ7-A30

1.1Warranty

This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers.

The warranty on this product lasts 1 year.

Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion.

Shipping costs that apply to non-conforming items or items that need replacement are to be paid by the customer.

Items cannot be returned unless previously authorised by the supplier.

The authorisation is released after completing the specific form available on the web-site http://www.seco.com/en/prerma (RMA Online). The RMA authorisation

number must be put both on the packaging and on the documents shipped with the items, which must include all the accessories in their original packaging, with

no signs of damage to, or tampering with, any returned item.

The error analysis form identifying the fault type must be completed by the customer and must accompany the returned item.

If any of the above mentioned requirements for RMA is not satisfied, the item will be shipped back and the customer will have to pay any and all shipping costs.

Following a technical analysis, the supplier will verify if all the requirements for which a warranty service applies are met. If the warranty cannot be applied, the

Supplier will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.

Warning!

All changes or modifications to the equipment not explicitly approved by SECO S.r.l. could impair the equipment and could void the warranty.

CQ7-A30

1.2Information and assistance

What do I have to do if the product is faulty?

SECO S.r.l. offers the following services:

SECO website: visit http://www.seco.com to receive the latest information on the product. In most cases it is possible to find useful information to solve the

problem.

SECO Sales Representative: the Sales Rep can help to determine the exact cause of the problem and search for the best solution.

SECO Help-Desk: contact SECO Technical Assistance. A technician is at disposal to understand the exact origin of the problem and suggest the correct

solution. E-mail: technical.se[email protected]

Fax (+39) 0575 340434

Repair centre: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:

oReturned items must be accompanied by a RMA Number. Items sent without the RMA number will be not accepted.

oReturned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or

customer neglect.

Note: Please have the following information before requesting for technical assistance:

-Name and serial number of the product;

-Description of Customer’s peripheral connections;

-Description of Customer’s software (operating system, version, application software, etc.);

-A complete description of the problem;

-The exact words of every kind of error message encountered.

1.3RMA number request

To request a RMA number, please visit SECO’s web-site. On the home page, please select “RMA Online”and follow the procedure described.

A RMA Number will be released within 1 working day (only for on-line RMA requests).

CQ7-A30

Whenever handling a CQ7-A30 board, ground yourself through an anti-static wrist strap. Placement of the board on an antistatic surface is

also highly recommended.

1.4Safety

The CQ7-A30 board uses only extremely-low voltages.

While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.

1.5 Electrostatic Discharges

The CQ7-A30 board, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or all the

devices and/or components on-board.

1.6 RoHS compliance

The CQ7-A30 board is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.

Always switch the power off, and unplug the power supply unit, before handling the board and/or connecting cables or other boards.

Avoid using metallic components - like paper clips, screws and similar - near the board when connected to a power supply, to avoid short

circuits due to unwanted contacts with other board components.

If the board has become wet, never connect it to any external power supply unit or battery.

Check carefully that all cables are correctly connected and that they are not damaged.

CQ7-A30

1.7 Terminology and definitions

ACPI Advanced Configuration and Power Interface, an open industrial standard for the board’s devices configuration and power management

AC’97 Audio Codec’97, a standard for audio hardware codecs developed by Intel®in 1997

API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating

Systems

BIOS Basic Input / Output System, the Firmware Interface that initializes the board before the OS starts loading

CAN Bus Controller Area network, a protocol designed for in-vehicle communication

CEC Consumer Electronics Control, an HDMI feature which allows controlling more devices connected together by using only one remote control

CPLD Complex Programmable Logic Device, types of programmable logical devices

DDC Display Data Channel, a kind of I2C interface for digital communication between displays and graphics processing units (GPU)

DP Display Port, a type of digital video display interface

DVI Digital Visual interface, a type of digital video display interface

eDP embedded Display Port, a type of digital video display interface developed especially for internal connections between boards and digital

displays

GbE Gigabit Ethernet

Gbps Gigabits per second

GND Ground

GPI/O General purpose Input/Output

HD Audio High Definition Audio, most recent standard for hardware codecs developed by Intel®in 2004 for higher audio quality

HDMI High Definition Multimedia Interface, a digital audio and video interface

I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability

I2S Inter-Integrated Circuit Sound, an audio serial bus protocol interface developed by Philips (now NXP) in 1986

JTAG Joint Test Action Group, common name of IEEE1149.1 standard for testing printed circuit boards and integrated circuits through the Debug port

LPC Bus Low Pin Count Bus, a low speed interface based on a very restricted number of signals, deemed to management of legacy peripherals

LVDS Low Voltage Differential Signalling, a standard for transferring data at very high speed using inexpensive twisted pair copper cables, usually used

for video applications

Mbps Megabits per second

MMC MultiMedia Card, a type of memory card, with same interface of SD.

N.A. Not Applicable

CQ7-A30

N.C. Not Connected

OS Operating System

OTG On-the-Go, a specification that allows to USB devices to act indifferently as Host or as a Client, depending on the device connected to the port

PCI-e Peripheral Component Interface Express

PSU Power Supply Unit

PWM Pulse Width Modulation

PWR Power

SATA Serial Advance Technology Attachment, a differential half duplex serial interface for Hard Disks

SD Secure Digital, a memory card type

SDIO Secure Digital Input/Output, an evolution of the SD standard that allows the use of the same SD interface to drive different Input/Output devices,

like cameras, GPS, Tuners and so on

SIM Subscriber Identity Module, a card which stores all data of the owner necessary to allow him accessing to mobile communication networks

SM Bus System Management Bus, a subset of the I2C bus dedicated to communication with devices for system management, like a smart battery and

other power supply-related devices

SPI Serial Peripheral Interface, a 4-Wire synchronous full-duplex serial interface which is composed a master and one or more slaves, individually

enabled through a Chip Select line

TBM To be measured

TMDS Transition-Minimized Differential Signalling, a method for transmitting high speed serial data, normally used on DVI and HDMI interfaces

TTL Transistor-transistor Logic

UIM User Identity Module, an extension of SIM modules.

USB Universal Serial Bus

V_REF Voltage reference Pin

CQ7-A30

1.8 Reference specifications

Here below it is a list of applicable industry specifications and reference documents.

Reference

Link

ACPI

http://www.acpi.info

AC’97

http://download.intel.com/support/motherboards/desktop/sb/ac97_r23.pdf

CAN Bus

http://www.bosch-semiconductors.de/en/ubk_semiconductors/safe/ip_modules/can_literature/can_literature.html

DDC

http://www.vesa.org

DP, eDP

http://www.vesa.org

Gigabit Ethernet

http://standards.ieee.org/about/get/802/802.3.html

HD Audio

http://www.intel.com/content/dam/www/public/us/en/documents/product-specifications/high-definition-audio-specification.pdf

HDMI

http://www.hdmi.org/index.aspx

I2C

http://www.nxp.com/documents/other/UM10204_v5.pdf

I2S

https://www.sparkfun.com/datasheets/BreakoutBoards/I2SBUS.pdf

LPC Bus

http://www.intel.com/design/chipsets/industry/lpc.htm

LVDS

http://www.ti.com/ww/en/analog/interface/lvds.shtml

http://www.ti.com/lit/ml/snla187/snla187.pdf

MMC

http://www.jedec.org/committees/jc-649

PCI Express

http://www.pcisig.com/specifications/pciexpress

Qseven®Design Guide

http://www.sget.org/uploads/media/Qseven_Design_Guide_2_0.pdf

Qseven®specifications

http://www.sget.org/uploads/media/Qseven-Spec_2.0_SGET.pdf

Qseven®Errata to Rel. 2.0

http://www.sget.org/uploads/media/Qseven-Spec_2.0_SGET_errata_sheet_E2.00-001.pdf

SATA

https://www.sata-io.org

SD Card Association

https://www.sdcard.org/home

SDIO

https://www.sdcard.org/developers/overview/sdio

SM Bus

http://www.smbus.org/specs

CQ7-A30

TMDS

http://www.siliconimage.com/technologies/tmds

USB 2.0 and USB OTG

http://www.usb.org/developers/docs/usb_20_070113.zip

USB 3.0

http://www.usb.org/developers/docs/usb_30_spec_070113.zip

CQ7-A30

Chapter 2.

Introduction

Technical Specifications

Electrical Specifications

Mechanical Specifications

Block Diagram

CQ7-A30

2.1Introduction

CQ7-A30 is a carrier board for Qseven®rel. 2.0 compliant modules, specifically designed to support and test the features included in the release 2.0 of the

specifications, including those introduced with the Errata to rel. 2.0 published by SGET consortium.

Qseven®is a form factor designed to minimize space consumption, since it integrates in only 70x70mm of space all core components of a common PC

architecture (CPU, RAM, Graphic, audio, etc.). All the functionalities are made available through a standardized card edge connector, from which all signals can be

taken and carried to the appropriate external connector in the carrier board and/or to other internal component, to implement more functionalities other than those

included in the standard Qseven®bus interface.

The connection to the Qseven®board is implemented through a standardized MXM connector, which is a proven high speed signal interface connector.

All the features on the CQ7-A30 board are implemented according to the Qseven®standard bus interface, thus the board is fully Qseven®Rel. 2.0 compliant and

compatible with Qseven®Spec. 2.0 modules. Furthermore, the board can take advantage of all possible features that can be offered by x86 and/or ARM

architectures on Qseven®modules.

The list of features that can effectively be used depends on the Qseven®module used on the Carrier Board.

CQ7-A30 board is specially designed for being an advanced development board, for skilled users who want to design their own carrier boards. Indeed, the

electrical schematics of the boards included in the Development Kit will be available for developers that begin testing with this board, and want to recycle portions

of it for their own-designed Carrier Boards, allowing thus a significant reduction of time for Hardware Development.

“Recycling”of the schematic is also useful for Software Development, since SECO offers also the BSP and/or drivers for the Qseven®boards used with the

Development board. By using the same components in customer’s own design, a great spare in Software Development can be achieved.

The schematics of CQ7-A30 have also been used as a base for the writing of the “Qseven®Design Guide Version 2.0”. Indeed, this is the board that is indicated

as the Qseven V2.0 reference Carrier Board.

Both Windows (Embedded and standard versions) and Linux are supported.

All the materials is available through web-site http://www.seco.com/, where it is possible to find any kind of information needed, and is also possible to ask for help

of SECO’s Developers team to solve technical issues related to customer’s development.

2.2Technical Specifications

Supported Modules

Qseven®Rel. 2.0 compliant modules

Mass Storage interfaces

SATA Female 7p connector with dedicated Power connector, interface shared

with mSATA Slot

SATA Male 7+15p connector

SD/MMC Card Slot

SPI Flash Sock

I2C EEPROM Socket

Video Interfaces

HDMI / Display port interface on PCI-e x16 slot

LVDS / eDP interface on PCI-e x8 slot

USB

1 x USB3.0 Host port on type-A socket

1 x USB 3.0 OTG port on micro-AB socket

2 x USB2.0 Host ports on internal pin header (alternative to USB 3.0 port #0)

Up to 4 x USB2.0 Host ports on quad Type-A socket

PCI Express

PCI-e x 4 interface on dedicated PCI-e x 16 slot shared with 3 x PCI-e x1 slots +

miniPCI-e slot (selection via jumper)

Networking

Gigabit Ethernet connector

Audio

Embedded HD Audio Codec, Realtek ALC888

2 x Triple HD Audio jacks

2 x S/P-DIF connectors (In & Out)

Audio Expansion Slot

Serial Ports

CAN Bus (both at TTL interface on internal pin header, and with CAN transceiver

on DB9 connector)

3 x RS-232 only ports

2 x RS-232/RS/422/RS-485 configurable serial ports

Other Interfaces

Feature Connector, with I2C, SM Bus, Watchdog, Thermal and Power

Management Signals

LPC Bus Header

SPI Pin Header

SIM Card slot

4 x 7-segment LCD displays for POST codes

PS/2 Mouse/keyboard internal pin strip

2 x tachometric FAN connectors

Power, Reset, LID and Sleep Buttons

Debug Port on mini-B USB connector

Power supply: +12VDC power Jack and Mini-fit Standard ATX power connector

Coin cell battery Holder for CMOS and RTC

Operating temperature: 0°C ÷ +60°C (commercial temperature range) *

Dimensions: 345 x 170 mm (13.58”x 6.69”)

* Temperature ranges indicated mean that all components available onboard

are certified for working with a Tcase included in these temperature ranges.

This means that it is customer

’

s responsibility to ensure that all components

’

Tcases remain in the range above indicated.

CQ7-A30

CAUTION: handling batteries incorrectly or replacing with not-approved devices may present a risk of fire or explosion.

Never use two different PSUs connected simultaneously to Power connectors CN30 and CN40

2.3Electrical Specifications

CQ7-A30 board needs to be supplied using a standard ATX Power Supply (only +12VDC ± 5% voltage is needed).

This voltage can be supplied through a standard 6.3mm (internal pin, diameter 2.5 mm) DC Power Jack, CN40. Internal pin is VIN power line.

Alternatively, it is possible to use an internal Molex Mini-Fit Jr. connector, p/n 39-28-1043, or equivalent, with the pinout indicated in the following table.

The mating Connector is MOLEX p/n 39-01-3042 or equivalent, with female

crimp terminal MOLEX series 5566. The use of wires with section 18 AWG

or 20AWG is recommended, in order to ensure the proper amperage of the

power section.

All the voltages that are necessary for board’s working are derived internally

from +12V_A power rail.

When choosing the power supply unit for CQ7-A30 board, please take into account all the possible consumptions of the Qseven®module and of all the external

devices and/or the adapter boards connected to the system, which take their power supply directly from the carrier board.

This way it will be possible to choose a PSU capable to supply enough current for the whole system.

2.3.1 RTC Battery

For the occurrences when the system (Carrier Board + Qseven®module) is not powered with an external power supply, on board there is a horizontal battery

holder, for the use of standard coin cell batteries type CR2032 with a nominal capacity of 220mAh, to supply, with a 3V voltage, the Real Time Clock and CMOS

memory mounted on the Qseven®module. It is possible to exclude the coin cell battery from supplying the VCC_RTC pin, simply by jumper JP13, ,

which is a standard pin header, P2.54mm, 1x3 pin, according to the table on the left.

The batteries should only be replaced with devices of the same type. Always check the orientation before inserting and make sure that they are aligned correctly

and are not damaged or leaking.

Never allow the batteries to become short-circuited during handling.

Batteries supplied with CQ7-A30 board are compliant to requirements of European Directive 2006/66/EC regarding batteries and accumulators. When putting out

Power Connector - CN30

Signal

GND

+12V_A

GND

+12V_A

JP13 position

VCC_RTC voltage

1-2

Coming from Coin Cell Battery

2-3

Tied to GND through 1kΩresistor

CQ7-A30

of order CQ7-A30 board, remove the batteries from the board in order to collect and dispose them according to the requirement of the same European Directive

above mentioned. When replacing the batteries, the disposal too has to be made according to these requirements.

2.3.2 Power Rails meanings

In all the tables contained in this manual, Power rails are named with the following meaning:

_S: Switched voltages, i.e. power rails that are active only when the board is in ACPI’s S0 (Working) state. Examples: +3.3V_S, +5V_S.

_A: Always-on voltages, i.e. power rails that are active both in ACPI’s S0 (Working), S3 (Standby) and S5 (Soft Off) state. Examples: +5V_A, +3.3V_A.

_U: unswitched ACPI S3 voltages, i.e. power rails that are active both in ACPI’s S0 (Working) and S3 (Standby) state. Examples: +1.5V_U

+5V_SB_Q7: Qseven Module Standby voltage. This power rail is used exclusively to supply the Standby power rail of the Qseven®module plugged in slot CN1.

In all the cases when switched power rails are not required (including +5V_SB_Q7, it is possible to use the

jumper JP23, which is a standard pin header, P2.54mm, 1x3 pin.

2.3.3 Power LEDs

In order to show the voltage presence of specific power rails, onboard there are five LEDs.

Red LED D18: +12V_A power rail active.

Red LED D19: +5V_A power rail active.

Green LED D21: +12V_S power rail active.

Green LED D22: +5V_S power rail active.

Green LED D23: +3.3V_S power rail active.

All five LEDs are off only when the board doesn’t receive any power supply input.

JP23 position

AT/ATX mode

1-2

ATX mode (switched power rails

available)

2-3

AT mode (switched and always

power rails correspondence)

CQ7-A30

2.4 Mechanical Specifications

The board dimensions are 345 x 170 mm (13.58”x 6.69”).

Printed circuit of the board is made of six layers, some of them are ground planes, for disturbance rejection.

In order to fix the Qseven®module to the carrier board, on CQ7-A30 are soldered four metallic spacers, height 5mm, 2.5mm diameter, that can be used for the

fixing of standard size Qseven®modules.

It is possible to solder two further spacers for fixing of μQseven®modules. They are not directly soldered on the evaluation platform since the spacers needed for

fixing of μQseven®modules would interfere with electronic devices soldered on standard Qseven®modules.

CQ7-A30

2.5 Block Diagram

PCI-e x16 Slot

Audio Slot

3 x PCI-e x 1 slots

miniSIM slot

miniPCI-e Slot

USB 3.0 micro-AB

Socket

SD Card Slot RJ-45 Ethernet

Connector

USB miniB Socket

SATA M 7p

connector

Dual DB-9

connector

Dual DB-9

connector

Dual DB-9

connector

PS/2 Mouse +

Keyboard header

mSATA Slot

HDD Power

EXAR XR28V384

SuperI/O

UART-to-USB

bridge

Nuvoton

W83627DHG

SuperI/O

CAN Transceiver

USB 3.0 Type-A

Socket

Realtek ALC888

HD Audio Codec

6 x Audio jacks,

S/PDIF IN, S/PDIF

Out (POF)

LPC Bus/GPIO

header

HDMI/DP Slot

SPI Pin Header

SPI Flash Socket

I2C EEPROM

Socket

FAN connectors

Feature Pin

header

2 x RS-232 / 422

/ 485 Transceiver

Coin Cell battery

holder

Power Section

Power connectors

Audio

PCI-e lane #0

USB lanes

Debug UART

MFG

VCC_RTC

I2C interface

+5V_S, +5V_A

Qseven MXM

connector

MFG / JTAG

connector

Quad USB 2.0

Type A Socket

Dual USB 2.0 Pin

Header

PCI-e lanes #1÷#3

PCI-e lanes #0÷#3

USB SS #1

USB SS #0

USB 2.0 #4 / #5

USB 2.0 #6 / #7

USB 2.0 #2

USB 2.0 #1

USB 2.0 #0

USB 2.0 #3

PCI-e lanes #0÷#3

CAN Pin Header

UART + CAN

Double DB9

Connector

SATA F 7+15p

connector

LVDS/eDP +

backlight

management slot

CAN

SATA #1

RS-232

Transceiver

SATA #0

2 x RS-232

Transceiver

2 x RS-232

Transceiver

POST-Code 4 x 7

Segment displays

Various

FAN

SPI interface

HDMI / DP++

LVDS / eDP

CPLD

LPC Bus

UART

Gigabit Ethernet

SDIO

CQ7-A30

Chapter 3.

Connectors placement

Connectors overview

Connectors description

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