Seco Qseven CQ7-D59 User manual

CQ7-D59
Carrier Board for Qseven®Rel. 2.0 / 2.1
Compliant Modules on 3.5”form factor

CQ7-D59
CQ7-D59 - Rev. First Edition: 1.0 - Last Edition: 1.1 - Author: S.O. - Reviewed by S.B. Copyright © 2021 SECO S.p.A.
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All rights reserved. All information contained in this manual is proprietary and confidential material of SECO S.p.A.
Unauthorised use, duplication, or modification by any means without prior consent of SECO S.p.A. is prohibited.
Every effort has been made to ensure the accuracy of this manual. However, SECO S.p.A. accepts no responsibility for any inaccuracies, errors or omissions herein.
SECO S.p.A. reserves the right to change precise specifications without prior notice to supply the best product possible.
For further information on this module or other SECO products, but also to get the required assistance for any and possible issues, please contact us using the
dedicated web form available at http://www.seco.com (registration required).
Our team is ready to assist you.
Revision
Date
Note
Rif
1.0
20th October 2021
First official release
AR
1.1
28th December 2021
Jumpers placement picture included
SO
REVISION HISTORY

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INDEX
INTRODUCTION.................................................................................................................................................................................5
1.1 Warranty........................................................................................................................................................................................................................................6
1.2 Information and assistance............................................................................................................................................................................................................. 7
1.3 RMA number request.....................................................................................................................................................................................................................7
1.4 Safety............................................................................................................................................................................................................................................ 8
1.5 Electrostatic Discharges................................................................................................................................................................................................................. 8
1.6 RoHS compliance..........................................................................................................................................................................................................................8
1.7 Safety Policy.................................................................................................................................................................................................................................. 9
1.8 Terminology and definitions ..........................................................................................................................................................................................................10
1.9 Reference specifications ..............................................................................................................................................................................................................12
OVERVIEW.......................................................................................................................................................................................13
2.1 Introduction.................................................................................................................................................................................................................................. 14
2.2 Technical Specifications............................................................................................................................................................................................................... 15
2.3 Electrical Specifications................................................................................................................................................................................................................16
2.3.1 RTC Battery.........................................................................................................................................................................................................................16
2.3.2 Power Rails meanings..........................................................................................................................................................................................................17
2.4 Mechanical Specifications............................................................................................................................................................................................................18
2.5 Block Diagram .............................................................................................................................................................................................................................19
CONNECTORS................................................................................................................................................................................20
3.1 Connectors placement.................................................................................................................................................................................................................21
3.2 Connectors overview ...................................................................................................................................................................................................................23
3.2.1 Connectors list.....................................................................................................................................................................................................................23
3.2.2 Jumpers list.........................................................................................................................................................................................................................23
3.3 Connectors description................................................................................................................................................................................................................24
3.3.1 Qseven®Connector.............................................................................................................................................................................................................24
3.3.2 Boot alternate jumper........................................................................................................................................................................................................... 28
3.3.3 Ethernet connectors.............................................................................................................................................................................................................29
3.3.4 USB connectors..................................................................................................................................................................................................................30
3.3.5 DP++/HDMI connectors....................................................................................................................................................................................................... 33
3.3.6 Embedded LCD displays connectors....................................................................................................................................................................................35

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3.3.7 Audio Interface.....................................................................................................................................................................................................................38
3.3.8 Switch / LED header interface ..............................................................................................................................................................................................39
3.3.9 S-ATA connectors ...............................................................................................................................................................................................................40
3.3.10 M.2 Socket 2 Key B SSD Slot..............................................................................................................................................................................................41
3.3.11 M.2 Socket 2 Key B WWAN Slot..........................................................................................................................................................................................42
3.3.12 μSD + miniSIM combo card slot........................................................................................................................................................................................... 44
3.3.13 Serial ports ..........................................................................................................................................................................................................................45
3.3.14 CAN terminal block ..............................................................................................................................................................................................................46
3.3.15 LPC/GPIO Pin header ..........................................................................................................................................................................................................47
3.3.16 SPI Pin header.....................................................................................................................................................................................................................47
3.3.17 Feature internal pin header ...................................................................................................................................................................................................48
3.3.18 GPIO internal pin header ......................................................................................................................................................................................................49
3.3.19 FAN Connector....................................................................................................................................................................................................................49
3.3.20 Optional Manufacturer and Debug Connectors .....................................................................................................................................................................50
Appendices .....................................................................................................................................................................................51
4.1 Thermal Design............................................................................................................................................................................................................................52
4.2 Accessories.................................................................................................................................................................................................................................53
4.2.1 Accessories kit CABKITD59 .................................................................................................................................................................................................53
4.2.2 HD Audio Adapter module VA67 ..........................................................................................................................................................................................53
4.2.3 I2S Audio Adapter module VA74 ..........................................................................................................................................................................................53

CQ7-D59
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•Warranty
•Information and assistance
•RMA number request
•Safety
•Electrostatic Discharges
•RoHS compliance
•Safety Policy
•Terminology and definitions
•Reference specifications

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1.1Warranty
This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers.
The warranty on this product lasts 1 year.
Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion.
Shipping costs that apply to non-conforming items or items that need replacement are to be paid by the customer.
Items cannot be returned unless previously authorised by the supplier.
The authorisation is released after completing the specific form available on the web-site https://www.seco.com/us/support/online-rma.html (RMA Online). The RMA
authorisation number must be put both on the packaging and on the documents shipped with the items, which must include all the accessories in their original
packaging, with no signs of damage to, or tampering with, any returned item.
The error analysis form identifying the fault type must be completed by the customer and has must accompany the returned item.
If any of the above-mentioned requirements for RMA is not satisfied, the item will be shipped back and the customer will have to pay any and all shipping costs.
Following a technical analysis, the supplier will verify if all the requirements, for which a warranty service applies, are met.If the warranty cannot beapplied, the Supplier
will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.
Warning!
All changes or modifications to the equipment not explicitly approved by SECO S.p.A. could impair the equipment and could void the warranty.

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1.2Information and assistance
What do I have to do if the product is faulty?
SECO S.p.A. offers the following services:
•SECO website: visit http://www.seco.com to receive the latest information on the product. In most cases it is possible to find useful information to solve the
problem.
•SECO Sales Representative: the Sales Rep can help to determine the exact cause of the problem and search for the best solution.
•SECO Help-Desk: contact SECO Technical Assistance. A technician is at disposal to understand the exact origin of the problem and suggest the correct
solution. E-mail: technical.se[email protected]
Fax [phone]
•Repair centre: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:
oReturned items must be accompanied by a RMA Number. Items sent without the RMA number will be not accepted.
oReturned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or
customer neglect.
Note: Please have the following information before requesting for technical assistance:
-Name and serial number of the product;
-Description of Customer’s peripheral connections;
-Description of Customer’s software (operating system, version, application software, etc.);
-A complete description of the problem;
-The exact words of every kind of error message encountered.
1.3RMA number request
To request a RMA number, please visit SECO’s web-site. On the home page, please select “RMA Online”and follow the procedure described.
A RMA Number will be released within 1 working day (only for on-line RMA requests).

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1.4Safety
The CQ7-D59 board uses only low voltages.
While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.
1.5 Electrostatic Discharges
The CQ7-D59 board, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or all the
devices and/or components on-board.
1.6 RoHS compliance
The CQ7-D59 board is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.
Always switch the power off, and unplug the power supply unit, before handling the board and/or connecting cables or other boards.
Avoid using metallic components - like paper clips, screws and similar - near the board when connected to a power supply, to avoid
short circuits due to unwanted contacts with other board components.
If the board has become wet, never connect it to any external power supply unit or battery.
Check carefully that all cables are correctly connected and that they are not damaged.
Whenever handling a CQ7-D59 board, ground yourself through an anti-static wrist strap. Placement of the board on an anti-static
surface is also highly recommended.

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1.7 Safety Policy
In order to meet the safety requirements of EN62368-1:2014 standard for Audio/Video, information and communication technology equipment, the CQ7-D59 Carrier
Board shall be:
-used inside a fire enclosure made of non-combustible material or V-1 material (the fire enclosure is not necessary if the maximum power supplied to the
board never exceeds 100 W, even in worst-case fault);
-used inside an enclosure provided with the symbol IEC 60417-5041(element 1a according to clause 9.5.2 of the IEC 62368-1) on the external part;
-installed inside an enclosure compliant with all applicable IEC 62368-1 requirements;
The manufacturer which includes a CQ7-D59 Carrier Board in his end-user product shall:
-verify the compliance with B.2 and B.3 clauses of the EN62368-1 standard when the module works in its own final operating condition
-prescribe temperature and humidity range for operating, transport and storage conditions;
-prescribe to perform maintenance on the board only when it is off and has already cooled down;
-prescribe that the connections from or to the board have to be compliant to ES1 requirements;
-the board in its enclosure must be evaluated for temperature and airflow considerations.

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1.8 Terminology and definitions
ACPI Advanced Configuration and Power Interface, an open industrial standard for the board’s devices configuration and power management
AC’97 Audio Codec’97, a standard for audio hardware codecs developed by Intel®in 1997
API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating
Systems
BIOS Basic Input / Output System, the Firmware Interface that initializes the board before the OS starts loading
CEC Consumer Electronics Control, an HDMI feature which allows controlling more devices connected together by using only one remote control
DDC Display Data Channel, a kind of I2C interface for digital communication between displays and graphics processing units (GPU)
DP Display Port, a type of digital video display interface
DVI Digital Visual interface, a type of digital video display interface
eDP embedded Display Port, a type of digital video display interface developed especially for internal connections between boards and digital displays
GbE Gigabit Ethernet
Gbps Gigabits per second
GND Ground
GPI/O General purpose Input/Output
HD Audio High Definition Audio, most recent standard for hardware codecs developed by Intel®in 2004 for higher audio quality
HDMI High Definition Multimedia Interface, a digital audio and video interface
I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability
I2S Inter-Integrated Circuit Sound, an audio serial bus protocol interface developed by Philips (now NXP) in 1986
JTAG Joint Test Action Group, common name of IEEE1149.1 standard for testing printed circuit boards and integrated circuits through the Debug port
LPC Bus Low Pin Count Bus, a low speed interface based on a very restricted number of signals, deemed to management of legacy peripherals
LVDS Low Voltage Differential Signalling, a standard for transferring data at very high speed using inexpensive twisted pair copper cables, usually used
for video applications
Mbps Megabits per second
N.A. Not Applicable
N.C. Not Connected
OS Operating System
PCI-e Peripheral Component Interface Express
PSU Power Supply Unit

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PWM Pulse Width Modulation
PWR Power
SATA Serial Advance Technology Attachment, a differential half duplex serial interface for Hard Disks
SD Secure Digital, a memory card type
SDIO Secure Digital Input/Output, an evolution of the SD standard that allows the use of the same SD interface to drive different Input/Output devices,
like cameras, GPS, Tuners and so on
SIM Subscriber Identity Module, a card which stores all data of the owner necessary to allow him accessing to mobile communication networks
SM Bus System Management Bus, a subset of the I2C bus dedicated to communication with devices for system management, like a smart battery and
other power supply-related devices
SPI Serial Peripheral Interface, a 4-Wire synchronous full-duplex serial interface which is composed a master and one or more slaves, individually
enabled through a Chip Select line
TBM To be measured
TMDS Transition-Minimized Differential Signalling, a method for transmitting high speed serial data, normally used on DVI and HDMI interfaces
TTL Transistor-transistor Logic
UIM User Identity Module, an extension of SIM modules.
USB Universal Serial Bus
V_REF Voltage reference Pin

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1.9 Reference specifications
Here below it is a list of applicable industry specifications and reference documents.
Reference
Link
ACPI
http://www.acpi.info
AC’97
http://download.intel.com/support/motherboards/desktop/sb/ac97_r23.pdf
DDC
http://www.vesa.org
DP, eDP
http://www.vesa.org
Gigabit Ethernet
http://standards.ieee.org/about/get/802/802.3.html
HD Audio
http://www.intel.com/content/dam/www/public/us/en/documents/product-specifications/high-definition-audio-specification.pdf
HDMI
http://www.hdmi.org/index.aspx
I2C
http://www.nxp.com/documents/other/UM10204_v5.pdf
I2S
https://www.sparkfun.com/datasheets/BreakoutBoards/I2SBUS.pdf
LPC Bus
http://www.intel.com/design/chipsets/industry/lpc.htm
LVDS
http://www.ti.com/ww/en/analog/interface/lvds.shtml
http://www.ti.com/lit/ml/snla187/snla187.pdf
PCI Express
http://www.pcisig.com/specifications/pciexpress
Qseven®specifications
Qseven Specification Rev. 2.1 (sget.org)
Qseven®Design Guide
https://sget.org/wp-content/uploads/2018/09/Qseven_Design_Guide_2_0.pdf
SATA
https://www.sata-io.org
SD Card Association
https://www.sdcard.org/home
SM Bus
http://www.smbus.org/specs
TMDS
http://www.siliconimage.com/technologies/tmds
USB 2.0 and USB OTG
http://www.usb.org/developers/docs/usb_20_070113.zip
USB 3.0
http://www.usb.org/developers/docs/usb_30_spec_070113.zip

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•Introduction
•Technical Specifications
•Electrical Specifications
•Mechanical Specifications
•Block Diagram

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2.1Introduction
CQ7-D59 is a carrier board for Qseven®rel. 2.0 / 2.1 compliant modules, in 3.5”mechanical Form Factor. It is specifically designed to support all features introduced
with release 2.1 of the specifications.
Qseven®is a form factor designed to minimize space consumption, since it integrates in only 70x70mm of space all core components of a common PC architecture
(CPU, RAM, Graphic, audio, etc.). All the functionalities are made available through a standardized card edge connector, from which all signals can be taken and
carried to the appropriate external connector in the carrier board and/or to other internal component, to implement more functionalities other than included in the
standard Qseven®bus interface.
The connection to the Qseven®board is implemented through a standardized MXM connector, which is a proven high speed signal interface connector.
The board has been specifically designed for taking advantage of all possible features that can be offered by x86 and/or ARM architectures on Qseven®modules.
All the features on the CQ7-D59 board are implemented according to the Qseven®standard bus interface, thus the board is fully Qseven®Rel. 2.1 compliant and
compatible with Qseven®Spec. 2.1 modules.
The list of features that are effectively available depends on the configuration of the carrier board and of the Qseven®module used.
CQ7-D59 board is specially designed for being both an advanced development board, for skilled users who want to design their own carrier boards, and a good
solution for mass production, for customers whose needing are satisfied by this compact and versatile Carrier Board.
All the components mounted onboard are certified for industrial temperature range.

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2.2Technical Specifications
Supported Modules
Qseven®Rel. 2.0 / 2.1 compliant modules
Mass Storage interfaces
1 x S-ATA 7-poles connector with HDD Power connector
1 x M.2 Socket 2 2242 Key B SSD slot
microSD Slot on combo microSD + miniSIM connector
Video Interfaces
LVDS Single/Dual Channel 18-/24-bit or 2 x eDP connectors
Multimode Display Port or HDMI Connector
Audio
Audio interface on internal pin header
USB
2 x USB 3.0 Host ports on double Type-A socket
1 x USB 2.0 Host port on Type-A socket
2 x USB 2.0 Host ports on internal pin header
1 x USB 2.0 OTG port on micro-AB socket (USB port shared with USB 2.0 lanes
of 1 x USB 3.0)
1 x USB 2.0 Host port on M.2 Socket 2 Key B Slot for WWAN
Networking
Up to 2 x Gigabit Ethernet connectors
1 x M.2 Socket 2 2242/3042 Key B Slot for WWAN Modem Modules, connected
to on-board miniSIM slot
Serial Ports
4-wires RS-232/RS-422/RS-485 configurable serial port on DB9 male connector
2 x RS-232 Full-modem serial ports on internal header (need LPC interface from
Qseven®module)
CAN interface on PCB terminal block
Other Interfaces
SPI internal pin header
LPC Bus internal pin header
SM Bus / I2C GPIO expander, makes available 16 x GPIOs on internal pin header
Front Panel Header
1 x 28 pin connector for additional features (I2C, ACPI signals, SM Bus, Watch
Dog, Thermal Management)
+12V Tachometric FAN connector
Optional Debug USB port on miniB socket
Optional MFG connector for JTAG programming of Qseven®module
Power supply voltage: 24VDC ±5% through Micro-fit 2x2 power connector
Coin cell battery Holder for CMOS and RTC
Operating temperature: -40°C ÷ +85°C (industrial temperature range)
Dimensions: 146 x 102 mm (5.75”x 4.02”)
* Temperature ranges indicated mean that all components available onboard
are certified for working with a Tcase included in these temperature ranges.
This means that it is customer ’ s responsibility to ensure that all components ’
Tcases remain in the range above indicated. Please also check paragraph
4.1.

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2.3Electrical Specifications
CQ7-D59 board needs tobe supplied with an external 24VDC ± 5% power supply. All the other voltages necessary for the working of the board and of the connected
peripherals are derived from the main VIN power rail.
Power Connector is a Micro-Fit Right-Angle header, type Molex p/n 43045-0400, or equivalent, with the pinout indicated in the following table.
Mating Connector, MOLEX p/n 43025-0400 or equivalent, with female crimp
terminal MOLEX series 43030. The use of wires with section 18 AWG or 20
AWG is recommended, in order to ensure the proper amperage of the power
section.
When choosing the power supply for CQ7-D59 board, please consider well what is the typical scenario for using the board (i.e., which peripherals will be connected).
Internal power section is able to supply a maximum of 3A @ 12V, 11A @ 5V and 6A @ 3.3V for Qseven module and for the external devices supplied directly by the
carrier board (i.e. USB devices, optionally SSD or SATA disks, display, etc).
It is very important to balance well the typical final configuration, summing all possible power consumptions of devices attached to carrier board.
This way it is possible to choose a PSU capable to supply enough current for the whole system.
2.3.1 RTC Battery
For the occurrences when the system (Carrier Board + Qseven®module) is not powered with an external power supply, on board there is a horizontal battery holder
CN22, for the use of standard coin battery type CR2032S with a nominal capacity of 220mAh, to supply, with a 3V voltage, the Real Time Clock and CMOS memory
mounted on the Qseven®module.
The batteries should only be replaced with devices of the same type. Always check the orientation before inserting and make sure that they are aligned correctly and
are not damaged or leaking.
Never allow the batteries to become short-circuited during handling.
Batteries supplied with CQ7-D59 board are compliant to requirements of European Directive 2006/66/EC regarding batteries and accumulators. When putting out
of order CQ7-D59 board, remove the batteries from the board in order to collect and dispose them according to the requirement of the same European Directive
above mentioned. Even when replacing the batteries, the disposal has to be made according to these requirements.
Power Connector - CN21
Pin
Signal
Pin
Signal
1
GND
3
VIN
2
GND
4
VIN
CAUTION: handling batteries incorrectly or replacing with not-approved devices may present a risk of fire or explosion.

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2.3.2 Power Rails meanings
In all the tables contained in this manual, Power rails are named with the following meaning:
VCC_RTC: Low current RTC circuit backup power. 3V coin cell voltage coming from the RTC Coin Cell Battery holder CN22 for supplying the RTC clock on Qseven®
module.
_RUN: Switched voltages, i.e. power rails that are active only when the board is in ACPI s S0 (Working) state. Examples:+3.3V_RUN, +5V_RUN, +12V_RUN
_ALW: Always-on voltages, i.e. power rails that are active both in ACPI s S0 (Working), S3 (Standby) and S5 (Soft Off) state. Examples: +5V_ALW, +3.3V_ALW

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2.4 Mechanical Specifications
The board dimensions: 147 x 102 mm (5.79”x 4.02”).
Printed circuit of the board is made of eight layers, some of them are ground planes, for
disturbance rejection.
In order to fix the Qseven®module to the carrier board, on CQ7-D59 are soldered two
metallic spacers (those farthest from MXM connector), height 7mm, 2.5mm diameter, that
can be used for the fixing of standard size Qseven®modules.
As a factory alternative, it is possible to solder two spacers for fixing of μQseven®modules:
this factory alternative has been done since the spacers needed for fixing of μQseven®
modules would interfere with electronic devices soldered on standard Qseven®modules.
Optionally, other two metallic spacers (those nearest to the MXM connector) can be
soldered on the carrier board, in order to have four fixing points and improve the mechanical
stability of the system
Considering possible application scenarios, please take notice of what kind of modules it
could be possible to use, before purchasing one of the possible configurations.

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2.5 Block Diagram

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•Connectors placement
•Connectors overview
•Connectors description