Diamond Systems Jackson JAX-BB01 User manual

JACKSON
Carrier for NVIDIA
®
Orin Nano / NX
User Manual
Copyright 2023
Diamond Systems Corporation
www.diamondsystems.com
Revision Date Comment
1.01 22 Feb 2023 Initial version
FOR TECHNICAL SUPPORT
PLEASE
CONTACT:
Email: [email protected]

Table of Contents
1.IMPORTANT SAFE HANDLING INFORMATION....................................................................3
1.INTRODUCTION .......................................................................................................................5
1.1MODULE FEATURES ............................................................................................................................. 5
1.2I/O FEATURES &CONNECTORS ........................................................................................................... 6
1.3JACKSON ORDERING GUIDE (TBD) ..................................................................................................... 7
2.PRODUCT PHOTOS ................................................................................................................8
3.CONNECTOR AND JUMPER LOCATIONS ............................................................................9
4.BASE DIMENSION DRAWING ..............................................................................................10
5.FUNCTIONAL OVERVIEW.....................................................................................................12
5.1PROCESSOR MODULE ........................................................................................................................ 12
5.2POWER SUPPLY.................................................................................................................................. 12
5.3ETHERNET ......................................................................................................................................... 12
5.4DISPLAY ............................................................................................................................................ 12
5.5EXPANSION CONNECTOR.................................................................................................................... 12
5.6CAMERA ............................................................................................................................................ 13
5.7SERIAL PORTS.................................................................................................................................... 13
5.8PCIE LINK ROUTING.......................................................................................................................... 13
5.9M.2 SOCKET ...................................................................................................................................... 13
5.10MINICARD ......................................................................................................................................... 13
5.11USB .................................................................................................................................................. 13
5.12DIGITAL I/O....................................................................................................................................... 14
5.13CONTROLLER AREA NETWORK (CAN).............................................................................................. 14
5.14UTILITY ............................................................................................................................................. 14
5.15LED INDICATORS .............................................................................................................................. 14
6.JUMPER CONFIGURATIONS................................................................................................15
7.BLOCK DIAGRAM..................................................................................................................16
8.HEAT SINK .............................................................................................................................17
9.I/O CONNECTORS .................................................................................................................18
9.1POWER IN.......................................................................................................................................... 18
9.2RTC BATTERY................................................................................................................................... 18
9.3FAN ................................................................................................................................................... 18
9.4ETHERNET ......................................................................................................................................... 19
9.5HDMI................................................................................................................................................ 19
9.6CAMERA ............................................................................................................................................ 20
9.7SERIAL PORTS.................................................................................................................................... 21
9.8EXPANSION CONNECTOR.................................................................................................................... 22
9.9USB 3.0/2.0....................................................................................................................................... 22
9.10M.2 PCIE SSD SOCKET ..................................................................................................................... 24
9.11M.2 E-KEY ........................................................................................................................................ 25
9.12MINICARD ......................................................................................................................................... 26
9.13DIGITAL I/O....................................................................................................................................... 27
9.14CAN.................................................................................................................................................. 27
9.15UTILITY ............................................................................................................................................. 28
10.DESIGN AND LABELING GUIDELINES .................... ERROR! BOOKMARK NOT DEFINED.
10.1CONNECTOR LABELING ............................................................... ERROR!BOOKMARK NOT DEFINED.
10.2TEST POINTS................................................................................ ERROR!BOOKMARK NOT DEFINED.
10.3OPERATING TEMPERATURE ......................................................... ERROR!BOOKMARK NOT DEFINED.
10.4COMPONENT AVAILABILITY ........................................................ ERROR!BOOKMARK NOT DEFINED.
10.5LABELING.................................................................................... ERROR!BOOKMARK NOT DEFINED.
10.6ORIN NX B2B CONNECTOR INTERFACE ............................................................................................ 29
10.7ORIN NANO /NX MODULE BLOCK DIAGRAM ................................................................................... 31

1. IMPORTANT SAFE HANDLING INFORMATION
WARNING!
ESD-Sensitive Electronic Equipment
Observe ESD-safe handling procedures when working with this product.
Always use this product in a properly grounded work area and wear
appropriate ESD-preventive clothin
g
and/or accessories.
Always store this product in ESD-protective packaging when not in use.
Safe Handling Precautions
Diamond Systems boards are designed with complex circuitry and electronic components that are ESD-sensitive.
This increases the likelihood of the boards incurring accidental damage during handling, installation, and
connection to other equipment.
It is highly recommended that the following precautionary measures and best practices be observed in sequential
order:
Wear an anti-static Wristband/Strap or/and an antistatic Lab Coat or/and Rubber-soled shoes.
Spread anti-static mats over the table or work surface or/and anti-static mats on the floor.
Unpack components and remove them from their anti-static bags only when they are ready to be
used.
Avoid ungrounded surfaces such as plastic, carpets, floors, or tables, in the work area.
Handle boards by the edges and their metal mounting brackets. Avoid touching components on the
boards and the edge connectors that connect to expansion slots.
The following information describes common causes of failure found on boards and components returned to
Diamond Systems for repair. It is provided as a guideline to avoid accidental damage.
ESD Damage: This type of damage is typically impossible to detect because there is no visual sign of failure or
damage. In this type of damage, the board eventually stops functioning because of some defective components.
Usually, the failure can be identified, and the chip can be replaced. To prevent ESD damage, always follow proper
ESD-prevention practices when handling computer boards.
Damage During Handling or Storage: Physical damage on boards also occur due to mishandling. A common
observation is that of a screwdriver slipping on the board during installation, causing a gouge on the PCB surface,
cutting signal traces or damaging components.
Another common observation is damaged board corners, indicating the board was dropped. This may or may not
cause damage to the circuitry, depending on components located near the edges. Most Diamond System boards
are designed with a minimum 25 mils clearance between the board edge and component pad. The ground/power
planes are located a minimum of 20 mils from the edge to avoid possible shorting from this type of damage.
However, these design rules do not prevent damage in all situations.
Sometimes boards are stored in racks with slots that grip the edge of the board. This is a common practice for
board manufacturers. Though Diamond Systems boards are resilient to damages, the components located close
to the board edges can be damaged or even knocked off the board if the board lies tilted in the rack.
Diamond Systems recommends that all boards be stored only in individual ESD-safe packaging units. If multiple
boards are stored together, they should be contained in bins with dividers placed between the boards. Do not pile
boards on top of each other or cram too many boards within a small location. This can cause damage to connector
pins or fragile components.

Bent Connector Pins: This type of problem can be resolved by re-bending the pins to their original shape using needle-
nose pliers.
The most common cause of a bent connector pin is pulling a ribbon cable off a pin header in a manner not directly in
line with the mating direction. To remove a ribbon cable, rock the cable back and forth on an axis parallel to the length
of the connector until it can be easily pulled off. If the pins are bent too severely, bending them back can cause them
to weaken or break. In this case, the connector must be replaced.
Power Damage: There are various causes of power-specific damage that can occur while handling the board. Some
common causes such as –a metal screwdriver tip slipping, or a screw dropping onto the board while it is powered-
up, causes a short between a power pin and a signal pin on a component.
These faults can cause over-voltage/power supply problems besides other causes described below.
To avoid such damages, assembly operations must be performed when the system is powered off.
Power Supply Wired Backwards: Diamond Systems power supplies and boards are not designed to withstand a
reverse power supply connection. This will destroy almost all ICs connected to the power supply. In this case, the
board will likely be irreparable and must be replaced. A chip destroyed by reverse or excessive power will often have
a visible hole or show some deformation on the surface due to vaporization inside the package.
Overvoltage on Analog Input: If a voltage applied to an analog input exceeds the power specification of the board, the
input multiplexer and/or parts behind it can be damaged. Most Diamond Systems boards will withstand an erroneous
connection of up to 36V on the analog inputs, even when the board is powered off, but not on all boards, and not
under all conditions.
Overvoltage on Analog Output: If an Analog output is accidentally connected to another output signal or a power
supply voltage, the output can be damaged. On most Diamond boards, a short circuit to ground on an analog output
will deter any damage to the board.
Overvoltage on Digital I/O Line: If a Digital I/O signal is connected to a voltage above the maximum specified voltage,
the digital circuitry can be damaged. The acceptable voltage range on most Diamond Systems boards connected to
digital I/O signals is 0-5V, with overvoltage protection up to 5.5V (-0.5 to 5.5V). Overvoltage beyond this limit can
damage the circuitry.
IMPORTANT! Always check twice before Powering Up!

DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 5 of 31
1. INTRODUCTION
Jackson is an Nvidia Jetson Orin Nano / Orin NX module-based board with rich graphics and camera input capability. This base
board converts the module into a complete embedded system by providing interface circuitry, I/O connectors for all the major
features of the module, camera interface, power supply and additional I/O capabilities.
This Base Board redefines possibility; a combination of performance, power efficiency, integrated deep learning capabilities and
rich I/O remove the barriers to a new generation of low-cost products.
The base board also contains M.2 x4 lane PCIe SSD as storage options along with interfaces like HDMI, USB3.2, CAN, Serial
ports, Utility connector etc.
1.1 Module features
Features Jetson Orin Nano 4GB/8GB
AI Performance 20 TOPS (Sparse) |10 TOPS (Dense) / 40 TOPS (Sparse) |20 TOPS (Dense)
GPU 512 core NVIDIA Ampere GPU with 16 Tensor Cores /
1024 core NVIDIA Ampere GPU with 32 Tensor Cores
CPU 6core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU, 1.5 GHz 1.5MB L2 + 4MB L3
VIDEO 1x 8K @ 30 Encode (HEVC)
1x 4K @ 60 Decode (HEVC)
MEMORY 4GB 64bit LPDDR5 @2133 MHZ, 34 GB/s /
8GB 128bit LPDDR5 @2133 MHZ, 68 GB/s
CAMERA 8 lanes (2x4 or 4x2) MIPI CSI-2 D-PHY 1.2 (2.5 Gb/s per pair)
CONNECTIVITY 1 Gigabit Ethernet, 3 x1 + 1 x4 PCIe lanes
DISPLAY HDMI 2.1 and eDP 1.4
USB 3x USB 3.2, 3x USB 2.0
OTHERS GPIO, I2C, I2S, SPI, UART
POWER 5W to 10W / 7W to 15W
Features Jetson Orin N
X
8GB/16GB
AI Performance 70 INT8 Sparse TOPs /100 INT8 Sparse TOPS
GPU 1024 core NVIDIA Ampere GPU with 32 Tensor Cores
CPU 6-core NVIDIA A78 CPU /8-core NVIDIA A78 CPU
VIDEO 1x 8K @ 30 Encode (HEVC)
1x 4K @ 60 Decode (HEVC)
MEMORY 8GB 128bit LPDDR5 @2133 MHZ, 102GB/s /
16 GB 128-bit LPDDR5, 3200MHz 102GB/s
CAMERA 8 lanes (2x4 or 4x2) MIPI CSI-2 D-PHY 1.2 (2.5 Gb/s per pair)
CONNECTIVITY 1 Gigabit Ethernet, 3 x1 + 1 x4 PCIe lanes
DISPLAY HDMI 2.1 and eDP 1.4
USB 3x USB 3.2, 3x USB 2.0
OTHERS GPIO, I2C, I2S, SPI, UART
POWER 10W to 20W / 10W to 25W

DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 6 of 31
1.2 I/O Features & Connectors
Feature Description Connector Type
Power 7V - 20V wide input supply DC barrel jack (J3) or
Terminal Block (J2)
RTC 1.85V – 5.5V power input for RTC functionality 1x2 connector (J16)
Ethernet
1x 10/100/1000Mbps from the Orin NX module
1x Dual port RJ45 (J5)
1x 10/100/1000Mbps from the I210 controller
(Not supported when expansion card is used)
Mass Storage 1x M.2 PCIe SSD socket M.2 2280/2242 (J20)
1x M.2 E key M.2 2230 (J17)
Minicard Minicard expansion with x1 PCIe and x1 USB2.0 with
SIM connector Mini Card Connector (J18)
USB
2x USB 3.2 / USB 2.0 1x USB3 Dual port RA (J4)
1x USB2.0 1x4 Header (J21)
1x USB3.2 / USB2.0
(Not supported when expansion card is used)
2x5 Header (J12)
Serial Ports
1x RS-232/485 port via jumper configuration 1 x DB9 Connector (J1)
1x RS232
1xRS232/RS485 (Shared with DB9 port) 2x5 Header (J7)
Display 1x HDMI 2.1 a/b directly from the module with audio 1x Upright HDMI connector
(J6)
Camera 2x4 lane CSI-2 Camera Interface 2x 22-pin FPC cable
connector (J22 & J23)
Digital IOs 16x Digital IOs 3.3V/5V realized using I2C GPIO
expander 2x10 Header (J10)
Expansion
Connector
1x USB3.2, 1x USB2.0 and PCIe x1 lane
FPC 40-Pin 0.5mm Pitch
(J9)
CAN 1x CAN interface 1x4 SMD connector (J14)
Fan Active Thermal Solution with PWM & Tach Input 1x4 SMD connector (J15)
Utility Power Button, Reset, Force Recovery Force OFF,
I2C(3.3V), SPI(3.3V), Debug UART 2x10 Header (J13)
Operating System Support
Linux Kernel version 4.9
Mechanical, Electrical and Environmental Properties
Form-Factor 85mm x 110mm
Cooling Mechanism Conduction Cooling
Power Input Range 7V – 20V; 12V Typical
Operating Temperature
Range
-25°C to +80°C at Thermal Transfer Plate (TTP) surface of
Orin Module

DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 7 of 31
1.3 Jackson Ordering Guide
The table below lists the current and planned part numbers.
JAX-BB01 Jackson carrier board for Nvidia Jetson Orin Nano and Orin NX
JAX-ASY-ONA8 Jackson carrier board with Orin Nano 8GB module installed and
programmed, with fan sink
JAX-ASY-ONX8 Jackson carrier board with Orin NX 8GB module installed and
programmed, with fan sink
JAX-ASY-ONX16 Jackson carrier board with Orin NX 16GB module installed and
programmed, with fan sink

DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 8 of 31
2. PRODUCT PHOTOS
Figure 2-1: Orin Nano / NX module installation side
Figure 2-2: IO Expansion Side

DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 9 of 31
3. CONNECTOR AND JUMPER LOCATIONS
J14
CAN
J12
USB3.0
J16
BAT
J9
Expansion
J8
CAMPower
J2/J3
PowerIN
J6
HDMI
J4
2xUSB3.0/2.0
J5
2xEthernet
J1
1xRS232/RS485
J7
1xRS232
J10
16xDIO
J13
Utility
J15
1xFAN SW3
Zeroize
JP1
JP2
Figure 3-1: Orin Nano / NX module installation side
J23
CAM‐2
J22
CAM‐1
J21
USB2.0
SW1ForceRecovery SW2Reset
J20
M.2Mkey
(2242/2280
)
J18
Minicard
J17
M.2Ekey
(2230)
Figure 3-2: IO Expansion Side

DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 10 of 31
4. BASE DIMENSION DRAWING
Below figures represent the board dimension drawing.
Figure 4-1: Dimension Drawing of module installation side

DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 11 of 31
Figure 4-2: Dimension Drawing of IO Expansion side

DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 12 of 31
5. FUNCTIONAL OVERVIEW
5.1 Processor Module
The baseboard supports the Orin NX / Nano module. NVIDIA® Jetson Orin™ NX brings AI supercomputer performance to the
edge in a compact system-on-module (SOM) which is smaller than a credit card. Jetson Orin NX is built around a low-power
version of the NVIDIA Orin SoC, combining the NVIDIA Ampere™ GPU architecture with 64-bit operating capability, integrated
advanced multi-function video and image processing, and NVIDIA Deep Learning Accelerators, loaded with 16 GB of memory
and 102 GB/s of memory bandwidth. It features a variety of standard hardware interfaces that make it easy to integrate it into a
wide range of products and form factors.
5.2 Power Supply
The board can be powered from wide input voltage range of +5V to +20V for full feature.
All required supply voltages for the board are derived from the +(5V-20V) input. These power supplies must be sized to support
the highest capacity on-board memory and have enough reserve capacity to support the below add-on features.
Input 5V 3.3V 1.5V Feature
5A Orin Nano/ NX Module
2.7A USB3.0/2.0
1.3A 0.15A mPCIe
1.5A M.2
0.5A CSI Camera
0.2A HDMI
2.5A Daughte
r
card/Expansion
5.3 Ethernet
The base board provides two 10/100/1000 Ethernet ports, one directly from the module and second 10/100/1000 Ethernet port
is derived from the Intel WGI210IT PCIe Ethernet controller. This controller is accessed via x1 PCIe lane from the Orin NX /
Nano module which is also muxed with the expansion connector used to plug expansion cards. Either the second ethernet port
or expansion cards are supported by the base board.
The ethernet ports are terminated on R/A dual port RJ45 MagJack connector. Connectors are equipped with LINK and ACT
LEDs on the front.
5.4 Display
The board offers one HDMI2.1 a/b video output option with audio. The HDMI video output is terminated on a single port vertical
RA type HDMI connector.
5.5 Expansion connector
The board offers an optional Expansion connector for customers who want additional Ethernet, USB3.0 and USB2.0 options.
The expansion board will have a PCIe Ethernet controller and an Ethernet switch to support additional Ethernet ports. USB3.0
as well as USB2.0 hub are provided on the expansion board to support additional USB3.0 and USB2.0 ports. The power to the
Expansion board will be provided by the carrier board through the FFC connector. The variable input power is routed to the FFC
connector; 5V and 3.3V are also routed to the FFC connector.
The PCIex1 lane is muxed with I210 ethernet controller and the expansion connector; one of the two features are supported by
the base board.
Also, the USB3.0 and USB2.0 interfaces on the expansion connector are made available at 2x5 pin header through a mux and
either of the one is supported by the base board.

DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 13 of 31
5.6 Camera
The module brings eight MIPI CSI lanes to the connector. Two quad-lane camera streams or four dual lane camera streams are
supported. Each data lane has a peak bandwidth of up to 2.5Gbps.
The board supports 2 MIPI CSI x4 cameras which are interfaced through 22-pin connectors. Supporting signals like I2C and
control signals for the CSI are available through connector so that user can directly interface the camera to the board. Both the
connectors support Quad-lane CSI channels.
5.7 Serial Ports
The baseboard provides two serial ports, one with jumper selectable RS232/RS485 protocol modes and one with RS232 mode.
RS232 port is made available on 2x5 pin header. RS232/RS485 are available via DB9 connector on the front edge and part of
2x5 serial port header. For RS232/RS485 either of the one connector can be used at a time.
5.8 PCIe Link Routing
The base board utilizes the PCIe lanes from module as per below table:
Lane Port Lane width Peripheral
UPHY0, Lane 4
C4 x4 M.2 PCIe SSD
UPHY0, Lane 5
UPHY0, Lane 6
UPHY0, Lane 7
UPHY0, Lane 3 C1 x1 I210/ Expansion
UPHY2, Lane 0 C7 x1 M.2 E Key
UPHY2, Lane 1 C9 x1 Minicard
5.9 M.2 Socket
The board is equipped with an M.2 M-Key socket to plug-in 2280/2242 x4 PCIe NVMe cards. As there is no onboard memory
on the Orin NX/Nano module, a PCIe SSD must be utilized always.
Base board provides onboard M3 4mm spacer along with a screw to mount M.2 2280 module.M3 4mm spacer along with 2nos
of screws are provided to mount M.2 2242 SSD.
The board supports M.2 E key with x1 PCIe and x1 USB2.0 interfaces which provides additional options for expansion.
Base board provides onboard M3 2mm spacer along with a screw to mount M.2 E key 2230 module.
5.10 Minicard
The board offers one full (51mm length) size Minicard socket. Minicard interface supports PCIex1 lane and USB2.0 x1 interfaces.
Nano sim connector is also supported to extend the functionality.
Baseboard provides 2nos onboard M2 4mm spacer and screws on the minicard sockets to mount the modules.
5.11 USB
The board provides access to 3x USB3.2 ports and 3x USB2.0 ports.
1x USB3.2 and 1x USB2.0 ports from the module are muxed between the expansion connector and the header; It will be
available only in the expansion connector on plugging the expansion card.
2x USB3.2 and 1x USB2.0 ports from the module, along with x1 USB2.0 port from the USB2.0 hub is provided on dual RA
stacked USB3.0 connector where x1 USB2.0 port from the module can be used for programming in the recovery mode. No
separate connector is provided for recovery mode.

DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 14 of 31
The USB3.2 / USB2.0 port mapping is done as per the below table:
USB3.2 Ports
Port from Module Port Termination
Port 0 USB3 Connector 1
Port 1 Expansion Connecto
r
/ Heade
r
Port 2 USB3 Connector 2
USB2.0 Ports
Port from Module Port Termination
Port 0 (Recovery) USB3 Connector 1
Port 1 Expansion Connector / Heade
r
Port 2
USB 2.0 HUB
(1:4)
M.2 E Key
Minicard Socket
USB3 Connector 2
1x4 Heade
r
5.12 Digital I/O
The board provides 16x digital I/Os, which are individually configurable as an output or input. Digital I/Os are realized using an
I2C GPIO expander. The I2C control for the expander is directly fed from the module. This I2C is 3.3V compliant, hence no level
translation is necessary. This expander device is accessible on the I2C address 0x22.The I/Os are made available on a 2x10
header.
5.13 Controller Area Network (CAN)
The base board is equipped with a CAN interface. The interface can be realized with a non-isolated TJA1042T,118 transceiver
or with an isolated ADM3053BRWZ transceiver, available as assembly options. By default, the CAN is realized with the non-
isolated TJA1042T,118 transceiver.
5.14 Utility
Some of the house keeping & additional interfaces signals like Power button, Debug TTL UART, Reset, I2C, SPI and Force
recovery signals are available through a 2x10 utility header.
5.15 LED Indicators
The board provides the following LED indicators. All LEDs are located near to board edge or their respective features. All LEDs
are labeled in silkscreen with their function.
PWIN Green LED for Power IN
PWGD Green LED for Power Good indication.
USER Green LED for user /boot indication

DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 15 of 31
6. JUMPER CONFIGURATIONS
6.1.1 JP1 Jumper Configuration
JP1 Jumpers are provided to select the voltage level and Pullup/pull down configuration of the DIO. By default, the DIOs
are 3.3 Voltage pulled down. The configuration is as shown below:
Position Function IN OUT
3P3 DIO Voltage Level *3.3V
5P0 DIO Voltage Level 5V
PDB DIO PORT B Pull Down Enable *Enabled Disabled
PUB DIO PORT B Pull up Enable Enabled Disabled
PDA DIO PORT A Pull Down Enable *Enabled Disabled
PUA DIO PORT A Pull up Enable Enabled Disabled
*Default Mode

6.1.2 JP2 Jumper Configuration
USB1 port of the base board is used as a device in the recovery mode to flash the module and is used as a Host in normal
operation. This selection is achieved by changing the jumper positions on Jp2 as tabulated below:
Position Function IN OUT
AUT Auto Power ON Disabled *Enabled
DEV USB2 J4 Bottom Port Device Mode Enabled Disabled
HST USB2 J4 Bottom Port Host Mode *Enabled Disabled
S1 Serial Port Protocol Select1 Refer Table
S0 Serial Port Protocol Select0
TER RS485 Termination Enabled *Disabled
*Default Mode
Serial port Protocol selection Jumper (Detailed):
S1 S0 Protocol
OUT OUT Not Valid
OUT IN RS232
IN OUT RS485
IN IN Not Valid

DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 16 of 31
7. BLOCK DIAGRAM
The overview of the key functional blocks of the Orin NX / Nano Base Board is shown below.
Figure 7-1: Block Diagram of Orin NX / Nano Baseboard

DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 17 of 31
8. HEAT SINK
The heat sink is constructed of a single piece of aluminum with Black finish. The custom shaped heat sink has a
form factor of 90mm x 50mm. The heat sink not only covers entire the module but has extended wings to cope up
for the additional power dissipation from the module. The mounting posts are integrated into the heat sink and not
provided as press-in or bolted-on components. All exterior corners and edges are slightly beveled for handling
comfort. Deburring / tumbling are kept to a minimum to retain a smooth surface finish uniform in appearance. The
heat sink is mounted on the top side of the board to contact the processor surface on the module. The heat sink
uses thermal pads with 1mm thickness and 4.5 W/m Kthermal conductivity. The thermal pads are provided with
approximately 10% crush at nominal dimensions of all related components.
The heat sink also contains a recess in the middle with four M2.5 threaded bosses. These bosses are used to
mount an optional fan in the heat sink to act as an active thermal solution.
Figure 8-1: Heat Sink Top View
Figure 8-2: Heat Sink Bottom View

DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 18 of 31
9. I/O CONNECTORS
9.1 Power In
The pinouts for power input are as shown below:
VIN 1
GND 2
GND 3
VIN = +7V to +20V
Connector PN: PJ-202BH
Mating Cable PN: TBD
9.2 RTC Battery
The pinouts for RTC battery power input are as shown below:
RTC_BATT 1
GND 2
RTC BATT = +1.85V – +5.5V
Connector PN: 0022035025
Mating Cable PN: 6980524
9.3 Fan
The pinouts for the fan connector are as shown below:
PWM 1
TACH 2
5V 3
GND 4
Connector PN: 0533980471
Supported fan: ASB0305HP-00CP4

DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 19 of 31
9.4 Ethernet
The Ethernet ports are terminated on a double stacked R/A RJ45 connector with integrated transformer (Magjacks).
The Top as well as bottom ports follows standard pinouts.

J1 TX1+
J2 TX1-
J3 RX+
J6 RX-
J4 TX2+
J5 TX2-
J7 TX3+
J8 TX3-
Connector PN: LPJG17561BHNL
Mating Cable PN: Standard LAN cable
9.5 HDMI
HDMI port is available from module and will be available on an HDMI vertical stacked standard connector as shown below:
The connector follows standard pinouts.

1 DATA2+
2 GND_2
3 DATA2-
4 DATA1+
5 GND_5
6 DATA1-
7 DATA0+
8 GND_8
9 DATA0-
10 CLK+
11 GND_11
12 CLK-
13 CEC
14 NC
15 DDC CLCK
16 DDC DATA
17 GND_17
18 +5V
19 HPD

DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 20 of 31
Connector PN: QJ3119C-WFB1-4F
Mating cable PN: Standard HDMI cable
9.6 Camera
There are two identical 22-pin connectors on board connectors for CSI Cameras. FFC cable is used to directly plug the camera
modules. Pinouts is compatible with Raspberry Pi 22 camera connector.
The pinouts for CSI connectors are as shown below:
Connector -1 Connector -2
1 GND_DIG 1 GND_DIG
2 CSI0_D0_N 2 CSI2_D0_N
3 CSI0_D0_P 3 CSI2_D0_P
4 GND_DIG 4 GND_DIG
5 CSI0_D1_N 5 CSI2_D1_N
6 CSI0_D1_P 6 CSI2_D1_P
7 GND_DIG 7 GND_DIG
8 CSI0_CLK_N 8 CSI2_CLK_N
9 CSI0_CLK_P 9 CSI2_CLK_P
10 GND_DIG 10 GND_DIG
11 CSI0_D2_N 11 CSI2_D2_N
12 CSI0_D2_P 12 CSI2_D2_P
13 GND_DIG 13 GND_DIG
14 CSI0_D3_N 14 CSI2_D3_N
15 CSI0_D3_P 15 CSI2_D3_P
16 GND_DIG 16 GND_DIG
17 CAM0_PWDN_1P8 17 CAM2_PWDN_1P8
18 CAM0_MCLK_1P8 18 CAM2_MCLK_1P8
19 GND_DIG 19 GND_DIG
20 CAM1_I2C_SCL_3P3 20 CAM2_I2C_SCL_3P3
21 CAM1_I2C_SDA_3P3 21 CAM2_I2C_SDA_3P3
22 V_3P3 22 V_3P3