Seco Sbc-a62-j User manual

SBC-A62-J

Single Board Computer

with NXP i.MX6 Processor

SBC-A62-J

Unauthorized use, duplication, modification or disclosure of the information to a third-party by any means without prior consent of SECO S.r.l. is prohibited.

Every effort has been made to ensure the accuracy of this manual. However, SECO S.r.l. accepts no responsibility for any inaccuracies, errors or omissions herein.

SECO S.r.l. reserves the right to change precise specifications without prior notice to supply the best product possible.

For further information on this module or other SECO products, but also to get the required assistance for any and possible issues, please contact us using the

dedicated web form available at http://www.seco.com (registration required).

Our team is ready to assist.

Revision

Date

Note

Ref

1.0

18th May 2015

First Official Release.

1.1

11th June 2015

J29 connector pinout corrected

1.2

9th September 2015

J27 jumper description added. Minor corrections.

2.0

17th February 2016

Product name change. Power rail names updated.

2.1

28th July 2016

description updated.

2.2

10th May 2017

Specifications updated (i.MX6Dual Plus added)

Typo corrected in paragraph 3.3.17

2.3

4th August 2017

Typo corrected in paragraph 3.3.2 (wrong mating connector s part number)

REVISION HISTORY

SBC-A62-J

INDEX

INTRODUCTION.......................................................................................................................................................................... 5Chapter 1.

1.1 Warranty........................................................................................................................................................................................................................................ 6

1.2 Information and assistance............................................................................................................................................................................................................. 7

1.3 RMA number request..................................................................................................................................................................................................................... 7

1.4 Safety............................................................................................................................................................................................................................................ 8

1.5 Electrostatic discharges ................................................................................................................................................................................................................. 8

1.6 RoHS compliance.......................................................................................................................................................................................................................... 8

1.7 Terminology and definitions ............................................................................................................................................................................................................9

1.8 Reference specifications ..............................................................................................................................................................................................................11

OVERVIEW ............................................................................................................................................................................... 12Chapter 2.

2.1 Introduction..................................................................................................................................................................................................................................13

2.2 Technical specifications ...............................................................................................................................................................................................................14

2.3 Electrical specifications ................................................................................................................................................................................................................15

2.3.1 RTC Battery.........................................................................................................................................................................................................................15

2.3.2 Power rails...........................................................................................................................................................................................................................16

2.4 Mechanical specifications............................................................................................................................................................................................................. 17

2.5 Block diagram..............................................................................................................................................................................................................................18

CONNECTORS......................................................................................................................................................................... 19Chapter 3.

3.1 Introduction..................................................................................................................................................................................................................................20

3.2 Connectors overview ...................................................................................................................................................................................................................21

3.3 Connectors description................................................................................................................................................................................................................22

3.3.1 LVDS + backlight connector................................................................................................................................................................................................. 22

3.3.2 I2C Touch Screen Connector...............................................................................................................................................................................................23

3.3.3 Optional HDMI connector.....................................................................................................................................................................................................24

3.3.4 Optional Camera connector .................................................................................................................................................................................................25

3.3.5 Ethernet connector ..............................................................................................................................................................................................................26

3.3.6 USB ports............................................................................................................................................................................................................................27

3.3.7 S-ATA connectors (i.MX6DP and i.MX6Q versions only)........................................................................................................................................................28

3.3.8 μSD card slot ......................................................................................................................................................................................................................29

3.3.9 Optional Audio Jacks ...........................................................................................................................................................................................................30

SBC-A62-J

3.3.10 CAN Bus connector.............................................................................................................................................................................................................30

3.3.11 Optional FAN/GPIO connector..............................................................................................................................................................................................30

3.3.12 Recovery jumper JP1...........................................................................................................................................................................................................31

3.3.13 Boot Selection jumper J27...................................................................................................................................................................................................31

3.3.14 Power and Reset buttons.....................................................................................................................................................................................................31

3.3.15 Expansion connector ...........................................................................................................................................................................................................32

3.3.16 Optional JTAG connector.....................................................................................................................................................................................................34

3.3.17 Debug UART connector....................................................................................................................................................................................................... 34

APPENDICES............................................................................................................................................................................ 35Chapter 4.

4.1 Thermal Design............................................................................................................................................................................................................................36

4.2 Accessories.................................................................................................................................................................................................................................37

4.2.1 RS-232 programming kit......................................................................................................................................................................................................37

4.2.2 WiFi Modules.......................................................................................................................................................................................................................37

4.2.3 Cabled RTC battery. ............................................................................................................................................................................................................38

4.2.4 CSI Dongle Camera VA09....................................................................................................................................................................................................38

SBC-A62-J

Chapter 1.

Warranty

Information and assistance

RMA number request

Safety

Electrostatic discharges

RoHS compliance

Terminology and definitions

Reference specifications

SBC-A62-J

1.1Warranty

This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers.

The warranty on this product lasts for 1 year.

Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion.

Shipping costs that apply to non-conforming items or items that need replacement are to be paid by the customer.

Items cannot be returned unless previously authorized by the supplier.

The authorization is released after completing the specific form available on the web-site http://www.seco.com/en/prerma (RMA Online). The RMA authorization

number must be put both on the packaging and on the documents shipped with the items, which must include all the accessories in their original packaging, with

no signs of damage to, or tampering with, any returned item.

The error analysis form identifying the fault type must be completed by the customer and has must accompany the returned item.

If any of the above mentioned requirements for RMA is not satisfied, the item will be shipped back and the customer will have to pay any and all shipping costs.

Following a technical analysis, the supplier will verify if all the requirements, for which a warranty service applies, are met. If the warranty cannot be applied, the

Supplier will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.

Warning!

All changes or modifications to the equipment not explicitly approved by SECO S.r.l. could impair the equipment’

s functionalities and could void

the warranty

SBC-A62-J

1.2Information and assistance

What do I have to do if the product is faulty?

SECO S.r.l. offers the following services:

SECO website: visit http://www.seco.com to receive the latest information on the product. In most of the cases it is possible to find useful information to

solve the problem.

SECO Sales Representative: the Sales Rep can help to determine the exact cause of the problem and search for the best solution.

SECO Help-Desk: contact SECO Technical Assistance. A technician is at disposal to understand the exact origin of the problem and suggest the correct

solution. E-mail: technical.servic[email protected]

Fax (+39) 0575 340434

Repair center: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:

oReturned items must be accompanied by a RMA Number. Items sent without the RMA number will be not accepted.

oReturned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or

customer neglect.

Note: Please have the following information before asking for technical assistance:

Name and serial number of the product;

Description of Customer’s peripheral connections;

Description of Customer’s software (operative system, version, application software, etc.);

A complete description of the problem;

The exact words of every kind of error message encountered.

1.3RMA number request

To request a RMA number, please visit SECO’s web-site. On the home page, please select “RMA Online”and follow the procedure described.

A RMA Number will be sent within 1 working day (only for on-line RMA requests).

SBC-A62-J

Whenever handling a SBC-A62-J board, ground yourself through an anti-static wrist strap. Placement of the board on an anti-static

surface is also highly recommended.

1.4Safety

The SBC-A62-J board uses only extremely-low voltages.

While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.

1.5 Electrostatic discharges

The SBC-A62-J board, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or all

the devices and/or components on-board.

1.6 RoHS compliance

The SBC-A62-J board is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.

Always switch the power off, and unplug the power supply unit, before handling the board and/or connecting cables or other

boards.

Avoid using metallic components - like paper clips, screws and similar - near the board when connected to a power supply, to avoid

short circuits due to unwanted contacts with other board components.

If the board has become wet, never connect it to any external power supply unit or battery.

Check carefully that all cables are correctly connected and that they are not damaged.

SBC-A62-J

1.7 Terminology and definitions

AC’97 Audio Codec’97, a standard for audio hardware codecs developed by Intel®in 1997

AHCI Advanced Host Controller Interface, a standard which defines the operation modes of SATA interface

API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating

Systems

CAN Bus Controller Area network, a protocol designed for in-vehicle communication

CEC Consumer Electronics Control, an HDMI feature which allows controlling more devices connected together by using only one remote control

CSI2 MIPI Camera Serial Interface, 2nd generation standard regulating communication between a peripheral device (camera) and a host processor

DDC Display Data Channel, a kind of I2C interface for digital communication between displays and graphics processing units (GPU)

DDR Double Data Rate, a typology of memory devices which transfer data both on the rising and on the falling edge of the clock

DDR3 DDR, 3rd generation

FFC/FPC Flexible Flat Cable / Flat Panel Cable

GBE Gigabit Ethernet

Gbps Gigabits per second

GND Ground

GPI/O General purpose Input/Output

HDMI High Definition Multimedia Interface, a digital audio and video interface

I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability

LVDS Low Voltage Differential Signaling, a standard for transferring data at very high speed using inexpensive twisted pairs copper cables, usually used

for video applications

MAC Medium Access Controller, the hardware implementing the Data Link Layer of ISO/OSI-7 model for communication systems

Mbps Megabits per second

MIPI Mobile Industry Processor Interface Alliance

MMC/eMMC MultiMedia Card / embedded MMC, a type of memory card, having the same interface of SD. The eMMC are the embedded version of the

MMC. They are devices that incorporate both the memory controller and the flash memories on a single BGA chip

N.A. Not Applicable

N.C. Not Connected

OpenCL Open Computing Language, a software library based on C99 programming language, conceived explicitly to realise parallel computing using

Graphics Processing Units (GPU)

SBC-A62-J

OpenGL Open Graphics Library, an Open Source API dedicated to 2D and 3D graphics

OpenVG Open Vector Graphics, an Open Source API dedicated to hardware accelerated 2D vector graphics

OS Operating System

OTG On-the-Go, a specification that allows to USB devices to act indifferently as Host or as a Client, depending on the device connected to the port

PHY Abbreviation of Physical, it is the device implementing the Physical Layer of ISO/OSI-7 model for communication systems

PSU Power Supply Unit

PWM Pulse Width Modulation

PWR Power

RGMII Reduced Gigabit Media Independent Interface, a particular interface defining the communication between an Ethernet MAC and a PHY

SATA Serial Advance Technology Attachment, a differential half duplex serial interface for Hard Disks

SD Secure Digital, a memory card type

SM Bus System Management Bus, a subset of the I2C bus dedicated to communication with devices for system management, like a smart battery and

other power supply-related devices

SPI Serial Peripheral Interface, a 4-Wire synchronous full-duplex serial interface which contemplates a master and one or more slaves, individually

enabled through a Chip Select line

TBM To be measured

TMDS Transition-Minimized Differential Signaling, a method for transmitting high speed serial data, normally used on DVI and HDMI interfaces

TTL Transistor-transistor Logic

USB Universal Serial Bus

uSDHC Ultra Secure Digital Host Controller

V_REF Voltage reference Pin

SBC-A62-J

1.8 Reference specifications

Here below it is a list of applicable industry specifications and reference documents.

Reference

Link

AC’97

http://download.intel.com/support/motherboards/desktop/sb/ac97_r23.pdf

AHCI

http://www.intel.com/content/www/us/en/io/serial-ata/ahci.html

CAN Bus

http://www.bosch-semiconductors.de/en/ubk_semiconductors/safe/ip_modules/can_literature/can_literature.html

CSI

http://www.mipi.org/specifications/camera-interface

Gigabit Ethernet

http://standards.ieee.org/about/get/802/802.3.html

HDMI

http://www.hdmi.org/index.aspx

I2C

http://www.nxp.com/documents/other/UM10204_v5.pdf

LVDS

http://www.ti.com/ww/en/analog/interface/lvds.shtml

http://www.ti.com/lit/ml/snla187/snla187.pdf

MIPI

http://www.mipi.org

MMC/eMMC

http://www.jedec.org/committees/jc-649

OpenCL

http://www.khronos.org/opencl

OpenGL

http://www.opengl.org

OpenVG

http://www.khronos.org/openvg

SATA

https://www.sata-io.org

SD Card Association

https://www.sdcard.org/home

SM Bus

http://www.smbus.org/specs

TMDS

http://www.siliconimage.com/technologies/tmds

USB 2.0 and USB OTG

http://www.usb.org/developers/docs/usb_20_070113.zip

NXP i.MX6 processor

http://www.nxp.com/products/microcontrollers-and-processors/arm-processors/i.mx-applications-processors-based-on-arm-

cores/i.mx-6-processors:IMX6X_SERIES?cof=0&am=0

SBC-A62-J

Chapter 2.

Introduction

Technical specifications

Electrical specifications

Mechanical specifications

Block diagram

SBC-A62-J

2.1Introduction

SBC-A62-J is a Single Board Computer, measuring just 110 x 86.5 mm (4.5”x 3.7”) based on embedded NXP i.MX6 processors, an ARM®Cortex®-A9

processor, Single-, Dual- and Quad-Core, with frequencies up to 1GHz, which is ideal for applications requiring multimedia capabilities and/or high levels of parallel

computing maintaining advantages offered by low-power consuming ARM architecture in an extremely reduced space.

Graphics features of the board are managed directly by NXP i.MX6 processors, which integrate up to three separated accelerators for 2D, OpenGL®ES2.0 3D

and OpenVG , giving the processor incredible graphical performances (OpenVG accelerator is not available with i.MX6 Solo and Dual Lite processors).

The board is able to support up to 3 independent displays (with i.MX6DP Dual Core and i.MX6Q Quad core processor), which can be driven through the HDMI

connector and/or the LVDS connector. LVDS interface is also able to drive one 18/24 bit Single / Dual Channel display as well as two independent 18/24 bit

Single Channel displays. Using i.MX6 Dual Lite and Solo processors, support is limited to 2 independent displays.

The board is completed with up to 1GB DDR3L (up to 512MB with i.MX6 Solo) directly soldered on board, and one eMMC Flash Disk, directly accessible like any

standard Hard Disk, with up to 16GB of capacity. Mass storage capabilities are completed by the SATA connector (with i.MX6DP and i.MX6Q processors only),

which can be used to connect any external SATA disk, and a microSD Card slot.

RGMII i.MX6 native interface is internally carried to a Micrel KSZ9031RN Ethernet Transceiver, allowing the implementation of a Gigabit Ethernet interface.

USB native port is carried to an USB2.0 USB Hub controller, which allows implementing two standard USB 2-0 Type A ports, an internal USB port on dedicated

connector, and another USB port on a 6-pin or 7-pin female header, intended for the connection of optional WiFi modules.

The i.MX6 OTG port, instead, is carried to a USB micro-B connector, thus supporting the client mode only functionality.

An embedded AC’97 Audio Codec, then, manages two audio jacks for LineOut and Mic in.

The standard functionalities of this board are then completed by a 32-pin expansion connector, which carries out directly 28 signals coming from the i.MX6

processor. These signals can all be used as Generic Purpose Input/Outputs (GPIOs). Due to the pin multiplexing possibilities offered by the i.MX6 processor,

however, it is possible to use some groups of these pins to implement other functionalities, like 3 x UARTs (which can also be offered with RS-232 or RS-485

interface), SPI, 2 x CAN interfaces and more.

It is possible to have the board in EXTREME version, where all the components mounted onboard are certified to work in industrial range, therefore the board is

specifically developed to work in range -40°C ÷ +85°C..

Please refer to following chapter for a complete list of all peripherals integrated and characteristics. Not all combinations of these features are offered

simultaneously; please visit SECO’s website for a description of standard configuration modules offered. Configurations different from the standard offered must be

evaluated singularly; please contact a SECO’s sales representative / distributor for this.

2.2 Technical specifications

Processors

NXP i.MX6 Family, based on ARM®CORTEX-A9 processors

-i.MX6S Solo - Single core up to 1GHz

-i.MX6DL Dual Lite - Dual core up to 1GHz per core

-i.MX6DP Dual Plus - Dual core up to 1GHz per core

-i.MX6Q Quad - Quad core up to 1GHz per core

Memory

Soldered down DDR3L memory

i.MX6DP: 2GB 64-bit interface

i.MX6Q, i.MX6DL: 1GB 64-bit interface

i.MX6S: up to 512MB 32-bit

Graphics

Dedicated 2D Hardware accelerator

Dedicated 3D Hardware accelerator, supports OpenGL®ES2.0 3D

Dedicated Vector Graphics accelerator, supports OpenVG™(only i.MX6DP and

i.MX6Q)

Supports up to 3 independent displays with i.MX6DP and i.MX6Q

Supports 2 independent displays with i.MX6DL and i.MX6S

Video Interfaces

1 x LVDS Dual Channel or 2 x LVDS Single Channel 18/24 bit interface

HDMI Interface

MIPI-CSI Camera connector

Video Resolution

LVDS, up to 1920x1200

HDMI, resolution up to 1080p

Mass Storage

Optional on-board eMMC Disk, up to 16GB *

SATA connector (only i.MX6DP and i.MX6Q)

microSD card slot

SPI Flash soldered onboard

* Please consider that for HDD and Flash Disk manufacturers, 1GB = 10^9 Byte.

Some OS (like, for example, Windows) intends 1GB = 1024^3 byte, so global

capacity shown for Disk Properties will be less than expected. Please also consider

that a portion of disk capacity will be used by internal Flash Controller for Disk

management, so final capacity will be lower

Networking

Gigabit Ethernet connector

USB

2 x standard USB 2.0 Type A

Internal USB 2.0 connector

1 x USB micro-B client connector

Audio

AC’97 Audio Codec Realtek ALC655

Mic In, Line out Audio jacks

Serial Ports

Optional CAN Bus connector

Other interfaces

I2C touch Connector

32-pin expansion connector, configurable to offer:

Up to 28 GPIO

SPI interface

SPDIF Audio interface

2 x CAN interface (TTL level)

SDIO interface

3 x PWM

2 x I2C

3 x UARTs (TTL, RS-232, RS-485 modes)

Debug UART on dedicated connector

Power and reset buttons

Power supply voltage: +12VDC ± 10%

Embedded additional RTC circuitry for lowest power consumption

Operating temperature: 0°C ÷ +60°C** (commercial version)

-40°C ÷ +85°C** (industrial version)

Dimensions: 110 x 86.5 mm (4.5”x 3.7”).

Supported Operating Systems:

Linux

Android

** is to be considered at any point of the heatspreader/heatsink. Actual

temperature will widely depend on application, enclosure and/or

environment. p to the customer to consider specific cooling solutions

for the final system.

Please also check paragraph 4.1

CAUTION: handling batteries incorrectly or replacing with not-approved devices may present a risk of fire or explosion.

2.3Electrical specifications

SBC-A62-J needs to be supplied only with an external 12VDC ± 10% power supply, with a minimal 35W power rating.

This voltage can be supplied through an optional standard 6.3mm (internal pin, diameter 2.0 mm) Power Jack. Internal pin is VIN power line.

As an alternative, +12VDC can also be supplied using dedicated internal connector J26, which is a JST

XH series connector or equivalent, p/n B2B-XH-A(LF)(SN), 3A max current per contact, with pinout shown in the

table on the left.

Mating connector: JST XHP-2 receptacle with JST SXH-001T-P0.6 series of female crimp terminals.

2.3.1 RTC Battery

The SBC-A62-J board can be equipped with an optional low-power Real Time Clock embedded on the module (which is a NXP PCF2123). In this case, the board

also mounts a soldered horizontal 3V coin cell lithium battery to supply such a RTC.

The battery used is a not-rechargeable Panasonic BR-1225HCN Lithium coin-cell battery, with a nominal capacity of 48mAh.

As a factory alternative, it is possible to connect external cabled RTC batteries to supply the RTC clock embedded on the i.MX6 processor.

The battery used for this purpose must be not rechargeable, and can be connected to the board using dedicated

connector, J1, which is a 2-pin p1.27 mm type MOLEX p/n 89400-0220 or equivalent, with pinout shown in the table

on the left.

Mating connector: MOLEX 87369-0200 receptacle with MOLEX 50212-8000 female crimp terminals.

Please be aware that such a connector is optional, it will be present only in case that there isn’t the additional low-power

external RTC

In case of exhaustion, the battery should only be replaced with devices of the same type. Always check the orientation before inserting and make sure that they are

aligned correctly and are not damaged or leaking.

Never allow the batteries to become short-circuited during handling.

Batteries supplied with SBC-A62-J are compliant to requirements of European Directive 2006/66/EC regarding batteries and accumulators. When putting out of

order SBC-A62-J, remove the batteries from the board in order to collect and dispose them according to the requirement of the same European Directive above

mentioned. Even when replacing the batteries, the disposal has to be made according to these requirements.

Power In Connector - J26

Signal

VIN

GND

Battery connector - J1

Signal

VRTC

GND

SBC-A62-J

2.3.2 Power rails

In all the tables contained in this manual, Power rails are named with the following meaning:

VIN: +12VDC voltage directly coming from the Power Supply connectors CN22 or J26

VRTC: +3V external voltage for supplying the RTC clock embedded on the i.MX6.

+5V_SB: +5V stand-by voltage directly derived from VIN voltage

+3P3V_SB: +3.3V stand-by voltage derived from VIN voltage after that +5V_SB Power Good has been asserted.

3P3V: +3.3V voltage derived from VIN voltage after that +3P3V_SB Power Good has been asserted.

SBC-A62-J

2.4 Mechanical specifications

Board dimensions are 110 x 86.5 mm (4.33”x 3.41”).

The printed circuit of the board is made of ten layers, some of them are ground planes, for disturbance rejection.

SBC-A62-J

2.5 Block diagram

eMMC

Micrel KSZ9031RN

Gigabit Ethernet

Transceiver

Optional RS-232

and/or RS-485

transceiver

Power section

+12VDC

Debug UART

Touch Screen

LVDS Connector

Realtek ALC655

AC’97 Audio

Codec

Line Out, Mic In

audio jacks

USB micro-B client

Dual USB 2.0

Type-A connector

WiFi Internal USB

USB 2.0 internal

connector

microSD Card Slot

Power and reset

pushbuttons

USB_OTG

USB_HI

Gigabit Ethernet

interface

RGMII

NXP i.MX6

processor

HDMI Connector

SATA

DDR3L System

Memory

LVDS0 / LVDS1

I2C

SMSC USB2514

USB2.0 Hi-Speed

Hub Controller

NXP TJA1051TK/3

High-Speed CAN

transceiver

CAN Interface

NXP PCF2123 SPI

Low Power RTC

EcSPI3

FlexCAN1

Camera interface

CSI

SATA connector

Power and reset

connector Expansion

connector

External battery

FAN + GPIO

JTAG

CAN TTL

SBC-A62-J

Chapter 3.

Introduction

Connectors overview

Connectors description

SBC-A62-J

3.1Introduction

On SBC-A62-J board, there are several connectors located on the upper plane. Standard connectors are placed on the same side of PCB, so that it is possible to

place them on a panel of an eventual enclosure.

TOP SIDE

BOTTOM SIDE