sensl J series User manual

USER MANUAL
J-Series High PDE and Timing Resolution, TSV Package
SensL © 2015 1
Overview
J-Series SiPM sensors from SensL are based on a P-on-N diode structure
(Figure 1), which provides optimized PDE at the blue end of the visible
spectrum, and feature a number of signicant performance upgrades:
PDE: J-Series sensors feature increased microcell density, giving an overall
improvement to PDE (with a peak at 50%), along with other optimizations
that extend the sensitivity into the UV, (>5% PDE at 250nm). This PDE
improvement is achieved while keeping the dark count rate low.
High-Density Fill Factor Silicon Photomultipliers
Figure 1, P-on-N sensor structure
J-Series
Figure 2, Simplied microcell level schematic of
the J-Series SiPM.
Timing: J-Series sensors feature reduced microcell recovery time
and standard signal rise time. All J-Series sensors also feature
SensL’s proprietary fast output terminal (Figure 2), which is the
derivative of the internal fast switching of the microcell in response
to the detection of a single photon, which has sub-nanosecond
rise times and pulse-widths.
Package: J-Series sensors are available as either a 3mm or 6mm
chip packaged using a TSV (through-silicon via) process to create
a CSP (Chip Scale Package) with minimal deadspace. The TSV
sensors have a number of ball contacts on the reverse, giving
access to the fast output as well as the anode and cathode.
SensL’s J-Series low-light sensors feature an industry-leading low dark count rate and a high PDE that extends
much further into the blue part of the spectrum using a high-volume, P-on-N silicon process. Improvements have
been made to both the standard (anode-cathode) rise time and the recovery time, in addition to the inclusion of
SensL’s unique fast output that offers sub-nanosecond pulse widths. J-Series sensors are available in different sizes
(3mm and 6mm) and use TSV (Through Silicon Via) technology to create a CSP (Chip Scale Package) with minimal
deadspace, that is compatible with industry standard, lead-free, reow soldering processes.
The J-Series Silicon Photomultipliers (SiPM) form a range of high gain,
single-photon sensitive, UV-to-visible light sensors. They have performance
characteristics similar to a conventional PMT, while beneting from the
practical advantages of solid-state technology: low operating voltage,
excellent temperature stability, robustness, compactness, output uniformity,
and low cost. For more information on the J-Series sensors please refer to
the datasheet.

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USER MANUAL
J-Series High PDE and Timing Resolution, TSV Package
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Contents
Overview ............................................................................................................................................................ 1
Biasing and Readout .......................................................................................................................................... 3
Recommended Biasing ............................................................................................................................... 3
Recommended Readout and Amplication .................................................................................................. 3
Readout of the Fast Output ......................................................................................................................... 3
J-Series Mounted Sensors ................................................................................................................................. 4
MicroFJ-SMA .............................................................................................................................................. 4
MicroFJ-SMTPA .......................................................................................................................................... 5
Handling and Soldering ...................................................................................................................................... 6
Safe Handling of Sensors ............................................................................................................................ 6
Product Packaging ...................................................................................................................................... 6
Cleaning ...................................................................................................................................................... 6
Solder Reow Conditions ............................................................................................................................ 7
CAD and Solder Footprint Files........................................................................................................................... 8
Further Help ....................................................................................................................................................... 9
Appendix A - Biasing Alternatives & Signal Polarity ........................................................................................... 10

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USER MANUAL
J-Series High PDE and Timing Resolution, TSV Package
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Biasing and Readout
Recommended Biasing
The cathode needs to be held at a positive bias with respect to the anode, as in Figure 3. It is recommended that
bias voltage decoupling, such as the examples shown in Figure 4, is used to provide a stable operating condition.
Please refer to the Appendix for further information on biasing schemes and the resulting signal polarities.
Recommended Readout and Amplication
Figure 5 shows how the J-Series sensors can be connected to a standard high-speed amplier, such as the
OPA656, to convert the standard output signal current to a voltage. This particular arrangement is suitable for
either the 3mm or 6mm sensors.
Readout of the Fast Output
For extensive information about the fast output and its readout, please consult pages 4-8 of the C-Series User
Manual. In addition, Appendix A of this document shows the resulting signal polarities when various biasing
schemes are used.
Figure 4, Generic biasing set-up with decoupling capacitors.
Figure 5, Example circuit for readout of individual sensors.
Figure 3, Recommended biasing

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J-Series High PDE and Timing Resolution, TSV Package
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J-Series Mounted Sensors
MicroFJ-SMA
J-Series sensors are available ready-mounted on test boards, to allow for easy evaluation. The MicroFJ-SMA-XXXXX
sensors (Figure 6) feature the TSV-packaged SiPM sensor reow-soldered onto a small PCB. The board is simple to
use, having just three SMA (female) connectors: one delivers the bias voltage (Vbias) and the other two provide the
output signals: standard output from the anode (Sout) and the fast output (Fout). The SMA board requires a positive
bias, which allows the standard output to be referenced to ground rather than the bias. For the complete circuit
schematic, please consult the TSV Board Reference Design document.
Output Connector Function Comments
Vbias Standard female
SMA connector
bias input (cathode) positive bias input
Fout fast output if unused can be left open
Sout standard output (anode) if unused can be left open
Table 1, SMA Connections
The MicroFJ-SMA board is for users who require a plug-and-play set-up to quickly evaluate the TSV sensors with
optimal timing performance. The board provides outputs which can be connected directly to a 50W-terminated
oscilloscope for viewing signals. The board also allows the standard output from the anode to be observed at the
same time as the fast output. Table 1 summarizes the connections to the SMA board. Each board has two mounting
holes to allow secure placement during testing.
For more discussion regarding the readout of the fast output signals, please consult pages 4-8 of the C-Series User
Manual. In addition Appendix A of this document shows the signal output polarities when various biasing schemes
are used.
Figure 6, The MicroFJ-SMA-300XX board.
Bias
Fast
output
TSV
sensor
Mounting
holes
Standard
output

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MicroFJ-SMTPA
The TSV Pin Adapter board (SMTPA) is a small PCB board that houses the TSV sensor and has 5 through-hole pins
to allow its use with standard sockets or probe clips. This product is useful for those needing a quick way to evaluate
the TSV package without the need for specialist surface-mount soldering. While this is a ‘quick x’ suitable for many
evaluations, it should be noted that the timing performance from this board will not be optimized and if the best
possible timing performance is required, the MicroFJ-SMA-XXXXX is recommended. The SMTPA circuit schematic is
shown below in Figure 7. Please consult Appendix A for further information on biasing. The SMTPA board electrical
schematics are available to download in the TSV Board Reference Design document.
MicroFJ-SMTPA-XXXXX
Pin No. Connection
1 anode
2 fast output
3 cathode
4 ground
5 no connect
The SMTPA board does not include any on-board decoupling on the bias line. Therefore, bias decoupling, such as
that in Figure 4, should be included on the bias line at the relevant pin (see Table 2). The standard output can be
connected directly to an amplier or 50Wload oscilloscope. If the standard output is not used, then that pin should
be connected to zero Volts.
Due to the presence of the pins on the SMTPA board, it is not optimal for evaluation testing where timing with the
fast output signal is critical. For evaluations where the timing performance of the fast output is critical, the use of the
SMA board is recommended.
The connectors from Samtec used are:
BBL-103-G-E
BBL-102-G-E
Compatible sockets from Samtec are:
SL-103-G-10
SL-102-G-10
For more discussion regarding the readout of the fast output signals, please consult pages 4-8 of the C-Series
User Manual. In addition Appendix A of this document shows the signal output polarities when various biasing
schemes are used.
Figure 8, The top view of the SMTPA board, showing the
numbering of the pins
Table 2, Pin assignments for the
MicroFJ-SMTPA board
Figure 7, SMTPA circuit schematic

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Handling and Soldering
Safe Handling of Sensors
• When unpacking, care should be taken to prevent dropping or misorienting the sensors. The specic items
contained in the package and the type of packaging will depend on the parts ordered.
• Remember that the SiPM is a sensitive optoelectronic instrument; always handle the sensor as carefully as
possible.
• The sensor should be disconnected from the bias supply when not in use.
• SiPM sensors are ESD sensitive. The following precautions are recommended:
• Ensure that personal grounding, environmental controls and work surfaces are compliant with
recommendations in JESD625.
• Ensure that all personnel handling these devices are trained according to the recommendations in
JESD625.
• Devices must be placed in an ESD approved carrier during transport through an uncontrolled area.
• Complete handling information can be found in the TSV Handling and Soldering guide.
Product Packaging
The sensors are shipped in moisture barrier bags (MBBs) according to J-STD 033 standard. An unopened MBB
should be stored at a temperature below 40OC and relative humidity <90%. After the MBB has been opened, the
devices must be reow soldered within a period of time depending on the moisture sensitivity level (MSL), which is
MSL3 for sensors delivered on tape and reel and MSL4 for sensors on cut tape. See Table 3 for details.
Delivery format MSL Exposure time Condition
Tape and reel 3 168 hours
≤30 °C/60% RH
Cut tape 4 72 hours
Table 3, MSL denitions applicable to the J-Series sensors (reference J-STD 020).
Cleaning
The parts can be cleaned using Isopropyl alcohol.

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USER MANUAL
J-Series High PDE and Timing Resolution, TSV Package
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Solder Reow Conditions
The J-Series sensors must be mounted according to specied soldering pad patterns as given in the CAD les (see
links on the following page). The ‘No Connect’ pins are electrically isolated and should be soldered to a ground (or
bias) plane to help with heat dissipation.
Solder paste must be evenly applied to each soldering pad to insure proper bonding and positioning of the
component. After soldering, allow at least three minutes for the component to cool to room temperature before
further operations.
Solder reow conditions must be in compliance with J-STD-20, table 5.2. This is summarized in Figure 9. The
number of passes shall not be more than 2.
Complete soldering information can be found in the TSV Handling and Soldering guide.
0
50
100
150
200
250
300
0 50 100 150 200 250 300
Temperature (OC)
Time (sec)
Solder Reflow Profile
Max 4OC/sec
60 to 120 sec
Max 260OC
217OC
180OC60~100sec
Max 10sec at 260OC
Figure 9, Reow solder prole for use with J-Series sensors.

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CAD and Solder Footprint Files
• MicroFJ-60035-TSV-A2 sensor CAD, including tape and reel, and solder footprint.
• MicroFJ-30020-TSV-A1 sensor CAD, including tape and reel, and solder footprint.
• MicroFJ-30035-TSV-A2 sensor CAD, including tape and reel, and solder footprint.
(This PCN describes the changes to the tape and reel between revisions A1 and A2.)
• MicroFJ-SMA-300XX CAD
• MicroFJ-SMA-60035 CAD
• MicroFJ-SMTPA-300XX CAD
• MicroFJ-SMTPA-60035 CAD

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Further Help
If more help is required in the set-up or operation of J-Series sensors, there are several SensL resources that can
help.
• The J-Series Datasheet contains more detailed information on the physical and performance characteristics of the
sensors.
• A variety of Tech Notes are available on the website, www.sensl.com, such as:
• The TSV Handling and Soldering guide.
• The TSV Board Reference Design document.
• A guide on creating arrays of close-packed sensors.
• An extensive library of technical and scientic papers on the use of SensL SiPM sensors.
• If additional help is needed, please contact [email protected]

SensL © 2015 10 SensL © 2015 10
USER MANUAL
J-Series High PDE and Timing Resolution, TSV Package
Rev. 1.0, December 2016
www.sensl.com
[email protected]
[phone] (International)
[phone] (North America)
SensL © 2015 10
All specications are subject to change without notice
Appendix A - Biasing Alternatives & Signal Polarity
This Appendix lists all of the possible ways in which a J-Series SiPM can be biased. For each biasing arrangement,
the standard and fast signal polarities are given. Aand B are the recommended congurations. Cand Dwill work,
but are not recommended for use with the fast output. The following abbreviations are used throughout:
Vbias = bias voltage
Sout = standard output
Fout = fast output
Rs= load resistor for the standard output
Rf= load resistor for the fast output
Vs= standard output voltage
Vf= fast output voltage
RQ= quench resistor (included on the SiPM die)
C1 = decoupling capacitor 10nF (50V), low ESR, ceramic
AB
CD