SG Wireless SGW101 Series User manual

SGW101X BLE Modules Series
Model：SGW1010，SGW1010A，SGW1011，SGW1011A

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1. Introduction
The SGW101X series is an advanced, highly flexible, ultra-low power multiprotocol SoM that enable Bluetooth (BLE)
connectivity for portable, extremely low power embedded systems.
The SGW101X series delivers robust RF performance, low energy consumption, a wide selection of MCU peripherals and
either an integrated PCB trace antenna or a u.FL connector for an external antenna. These modules are created to
minimize the engineering efforts and development costs associated with adding Bluetooth 5.0 to any product,
accelerating its time-to-market.
2. Features
oComplete RF solution with integrated antenna or external antenna.
oBluetooth 5 ready multi-protocol module:
o2Mbps
oLong Range
oAdvertising Extension support
oWireless System-on-Chip: Nordic nRF52840:
o32-bit ARM Cortex™-M4F CPU @64MHz
o1MB Flash program memory
o256kB RAM data memory
oWide selection of MCU Peripherals:
oFull-speed USB (12Mbps)
oFour SPI Master/Slave (8Mbps)
oTwo 2-wire Master/Slave (I2C compatible)
oTwo UARTs (with CTS/RTS)
oNFC Tag-A interface
o20 channel CPU independent Programmable Peripheral Interconnect (PPI)
o5x32 bit, 3x24bit Real Timer Counters (RTC)
o12-bit/200K SPS ADC
oSupport 128-bit AES HW encryption
o48 General Purpose I/O pins
oSupply voltage: 1.7–5.5V
oLow Energy Current consumption, 3V DCDC enabled:
oTx only, 0dBm: 4.8mA (typical)
oRx only @1Mbps: 4.6mA (typical)

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oSystem On mode, with full RAM retention: 2.35uA
oSystem Off mode, with full RAM retention: 1.86uA
oOperating Temperature: −40°C to 85°C
oCE Pending
oBQB: Pending
oFCC: 2AS9401
oIC: 25021-01
oMechanical Dimension: 10.2mm x 15.0mm x 2.1mm
APPLICATIONS
oConnected home
oSmart city infrastructure
oIndustrial mesh networks
oIndustrial smart lighting
oLogistics and transportation

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目录
1. Introduction................................................................................................................................................1
2. Features......................................................................................................................................................1
3. Ordering Information..................................................................................................................................4
4. Electrical Specifications.............................................................................................................................. 5
A. Absolute Maximum Ratings...............................................................................................................5
B. Operating Conditions......................................................................................................................... 5
5. Module Interface........................................................................................................................................6
A. Power Management.......................................................................................................................... 6
B. RF antenna interface..........................................................................................................................7
C. General Purpose I/O.......................................................................................................................... 7
6. Mechanical Dimension............................................................................................................................... 9
7. Module Marking....................................................................................................................................... 10
8. Soldering Temperature-Time Profile for Re-Flow Soldering......................................................................11
9. Certifications............................................................................................................................................ 12
A. Qualified Antenna Type................................................................................................................... 12
B. Bluetooth......................................................................................................................................... 12
C. FCC Statement..................................................................................................................................13
D. IC Statement.................................................................................................................................... 14
10. Product Packaging.................................................................................................................................. 16
11. Revision History...................................................................................................................................... 17
12. Useful Link.............................................................................................................................................. 17

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3. Ordering Information
Part No
Description
SGW1010
Bluetooth 5 module, Built-in antenna
SGW1011
Bluetooth 5 module, u.FL connector for external antenna
SGW1010A
Bluetooth 5 module, Built-in antenna, Low voltage operation
SGW1011A
Bluetooth 5 module, u.FL connector for external antenna, Low voltage operation
SGW1010–EVK
SGW1010 Bluetooth 5 module Evaluation Kit

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4. Electrical Specifications
A. Absolute Maximum Ratings
Symbol
Parameter
Min.
Max.
Unit
VCCmax
Voltage on VCC supply pin
-0.3
3.9
V
VCCHmax
Voltage on VCCH supply pin
-0.3
5.8
V
VBUSmax
Voltage on VBUS supply pin
-0.3
5.8
V
VIOmax
Voltage on GPIO pin (VCC > 3.6V)
-0.3
3.9
V
VIOmax
Voltage on GPIO pin (VCC ≤ 3.6V)
-0.3
VCC+0.3V
V
Tstorage
Storage Temperature Range
-40
125
℃
Table 3 Absolute Maximum Ratings
B. Operating Conditions
Symbol
Parameter
Min.
Typ.
Max.
Unit
VCC
VCC Operating supply voltage
1.7
3.0
3.6
V
VCC
VCC DCDC Startup voltage
1.75
3.0
3.6
V
VCCH
VCCH Operating supply voltage
2.5
3.7
5.5
V
VBUS
VBUS USB supply voltage
4.35
5.0
5.5
V
TR_VCC
VCC Supply Rise time (0V to 1.7V)
60
ms
TR_VCCH
VCCH Supply Rise time (0V to 3.7V)(1)
100
ms
TAmbient
Operating Temperature Range
-40
85
℃
REMARK:
(1): Applicable to module configures as nRF52840 HV mode.

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5. Module Interface
A. Power Management
i. Module supply input (VCC & VCCH)
The SGW101X series use integrated two step-down regulators (REG0 & REG1) to transform the supply voltage presented
at the VCC & VCCH pins into a stable system voltage. Each regulator can be programmed as Low-dropout regulator
(LDO) or Buck regulator (DC/DC), depends on the operating mode of the module. There are two operating modes for
the module which depends on the VCC and VCCH configuration:
oNormal/Low Voltage (LV) mode
oHigh Voltage (HV) mode
Mode
Pin No
Pin Name
Connection
Normal
17
VCC
1.7 V to 3.6 V supply source input
65
VCCH
Same as VCC
High Voltage
17
VCC
1.8 V to 3.3 V output voltage for module internal operating supply
65
VCCH
2.5 V to 5.5 V supply source input
REMARK: In LV or HV mode, the GPIO logic level is determined by the VCC pin.
Table 5 Power Mode Pin connections
ii. USB Power input (VBUS)
The USB interface of the SGW101X series can be used in either Normal (LV) or High voltage mode of the module. The
inside USB peripheral has a dedicated internal voltage regulator for converting the VBUS supply to 3.3 V.

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B. RF antenna interface
i. 2.4 GHz radio
The SGW101X series BLE module have their own 2.4 GHz antenna solutions respectively:
oThe SGW1010/SGW1010A modules use a PCB trace antenna integrated into the module’s PCB. This low-profile
antenna solution is useful in space constrained designs.
oThe SGW1011/SGW1011A modules provide an onboard antenna connector with a nominal characteristic
impedance of 50 Ω.
ii. Near Field Communication (NFC)
The SGW101X series modules include a Near Field Communication interface capable of operating as a 13.56 MHz NFC
tag, at a bit rate of 106 kbps. As an NFC tag, the data can be read from or written to the SGW101X modules using an
NFC reader.
Two pins are available for connecting to an external NFC antenna: NFC1 (P0.09) and NFC2(P0.10).
C. General Purpose I/O
There are total 48 available GPIO pins for user application. Each pin can be programmable individually with following
configurable features:
oInput/output direction
oOutput drive strength
oInternal pull-up and pull-down resistors
oWake-up from high or low-level triggers on all pins
oTrigger interrupt on all pins
oAll pins can be individually configured as serial interface or quadrature demodulator signals
Symbol
Parameter
Min.
Typ.
Max.
Unit
VIH
Input High Voltage
0.7 x VCC
VCC
V
VIL
Input Low Voltage
VSS
0.3 x VCC
V
VOH
Output High Voltage
VCC – 0.4
VCC
V
VOL
Output High Voltage
VSS
VSS + 0.4
V
RPU
Pull-up Resistance
11
13
16
kΩ

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RPD
Pull-down Resistance
11
13
16
kΩ
i. Serial interfaces
The SGW101X series provide the following serial communication interfaces:
o2x UART interfaces: 4-wire universal asynchronous receiver/transmitter interface used for AT command interface,
data communication, and u- connect software upgrades using the Software update +UFWUPD AT command.
o3x SPI interfaces: Up to three serial peripheral interfaces can be used simultaneously.
o1x QSPI interface: High speed interface used to connect to the external flash memories.
o2x I2C interfaces: Inter-Integrated Circuit (I2C) interface for communication with digital sensors.
o1x I2S interface: Used to communicate with external audio devices.
o1x USB 2.0 interface: The USB device interface to connect to the upstream host.
ii. Analog interfaces
8 out of the 48 digital GPIOs can be multiplexed to analog functions. The following analog functions are available:
o1x 8-channel ADC
o1x Analog comparator (*)
o1x Low-power analog comparator (*)
REMARK
(*): Only one comparator can be used at any given point of time.
iii. Module Reset
The modules can be reset using one of the following ways:
oLow level on the nRESET (P0.18) input pin, normally kept high using an internal pull-up. This causes an “external” or
“hardware” reset of the module.
oUsing the AT+CPWROFF command. This causes an “internal” or “software” reset of the module.
iv. Debug and Programming interfaces
The SGW101X series modules provide an SWD interface for flashing and debugging. The SWD interface consists of two
pins –SWDCLK and SWDIO.
The SGW101X series modules also support parallel trace output. This allows output from the Embedded Trace Macrocell
(ETM) and Instrumentation Trace Macrocell (ITM) embedded in the Arm Cortex-M4 core of the nRF52840 chip. The ETM

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trace data allows a user to record exactly how the application goes through the CPU instructions in real time. The
parallel trace interface uses 1 clock signal and 4 data signals respectively – TRACE_CLK, TRACE_D0, TRACE_D1,
TRACE_D2 and TRACE_D3.
6. Mechanical Dimension
Figure 7 SGW1010/SGW1010A (Embedded Antenna) Mechanical Information
Figure 8 SGW1011/SGW1011A (External Antenna) Mechanical Information

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7. Module Marking
Figure 10 SGW1010/SGW1010A/SGW1011/SGW1011A Module label

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8. Soldering Temperature-Time Profile for Re-Flow Soldering
Figure 11 Soldering Temperature-Time Profile for Re-Flow Soldering
Remark: SGW101X series are rated as MSL 3, 168-hour floor life after opening.

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9. Certifications
A. Qualified Antenna Type
The SGW1011 and SGW1011A module supporting an external antenna have been designed to operate with a standard 3
dBi dipole antenna. Any antenna of a different type or with a gain higher than 3 dBi is strictly prohibited for use with
this device. Using an antenna of a different type or gain more than 3 dBi will require additional testing for FCC, CE and IC.
The required antenna impedance is 50 Ω.
Manufacturer
Part Number
Max. Gain
Antenna Type
Size
Master Wireless
JZC-RPF-N-ZBG19
1/4 wave Dipole
1/4 wave Dipole
Length: 196mm
B. Bluetooth
The SGW101X series are pre-qualified as a Low Energy RF-PHY tested component, having Declaration ID of D046088 and
QDID of TBD. This allows customers to use different SoftDevices that have been qualified by Nordic without the need
to complete additional RF-PHY testing.
To achieve Bluetooth End Product qualification, the SG Wireless RF-PHY QDID can be combined with Nordic QDIDs for
the SoftDevice used when filing on the Bluetooth SIG website. The only testing required is for the Bluetooth profiles
supported by the customer’s product. Products with only custom profiles do not require any additional testing.

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C. FCC Statement
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference
to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to
try to correct the interference by one or more of the following measures:
oReorient or relocate the receiving antenna.
oIncrease the separation between the equipment and receiver.
oConnect the equipment into an outlet on a circuit different from that to which the receiver is connected.
oConsult the dealer or an experienced radio/TV technician for help
FCC RF Exposure Information and Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment
should be installed and operated with minimum distance of 20 cm between the radiator and your body. This transmitter
must not be co-located or operating in conjunction with any other antenna or transmitter.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesirable operation.
NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications to this
equipment. Such modifications could void the user’s authority to operate the equipment.
Instructions to the OEM/Integrator:
This module has been granted modular approval for mobile applications. OEM integrators for host products may use the
module in their final products without additional FCC certification if they meet the following conditions. Otherwise,
Additional FCC approvals must be obtained.
The OEM must comply with the FCC labeling requirements. If the module’s label is not visible when installed, then an
additional permanent label must be applied on the outside of the finished product which states: ”Contains transmitter
module FCC ID:2AS9401,Additionally, the following statement should be included on the label
and in the final product’s user manual:
“This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device

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may not cause harmful interferences, and (2) this device must accept any interference received, including interference
that may cause undesired operation.”
The user’s manual for the host product must clearly indicate the operating requirements and conditions that must be
observed to ensure compliance with current FCC RF exposure guidelines.
The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional
radiators in order to be properly authorized for operation as a Part 15 digital device.
This Module is full modular approval, it is limited to OEM installation ONLY.
The module is limited to installation in mobile application.
A separate approval is required for all other operating configurations, including portable configurations with respect to
Part 2.1093 and difference antenna configurations.
The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module.
The Grantee will provide guidance to the Host Manufacturer for compliance with the Part15B requirements if requested.
Important Note:
In the event that the above conditions cannot be met (for certain configurations or co-location with another transmitter),
then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these
circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate FCC authorization.
End Product Labeling
The variants of SGW101X series are labeled with their own FCC ID. If the FCC ID is not visible when the module is
installed inside another device, then the outside of the device into which the module is installed must also display a label
referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:
"Contains FCC ID: 2AS9401"
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this
RF module or change RF related parameters in the user manual of the end product.
D. IC Statement
This device complies with RSS-247 of Industry Canada. Operation is subject to the following two conditions: (1) this
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.

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Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2)
l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
RF exposure warning:
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment
should be installed and operated with minimum distance of 20 cm between the radiator and your body. This transmitter
must not be co-located or operating in conjunction with any other antenna or transmitter.
Avertissement d'exposition Cet équipement est conforme aux limites d’exposition aux rayonnements de la IC établies
pour unenvironnement non contrôé. Cet équipement doit être installé et fonctionner à au moins 20cm de distance d’un
radiateur ou de votre corps.
OEM Responsibilities to comply with IC Regulations
The SGW101X series have been certified for integration into products only by OEM integrators under the following
conditions:
oThe antenna(s) must be installed such that a minimum separation distance as stated above is maintained between
the radiator (antenna) and all persons at all times.
oThe transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter.
As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements required with this
module installed (for example, digital device emissions, PC peripheral requirements, etc.).
Important Note:
In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter),
then the ISEDC authorization is no longer considered valid and the IC ID cannot be used on the final product. In these
circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate ISEDC authorization.
End Product Labeling
The SGW101X series are labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another
device, then the outside of the device into which the module is installed must also display a label referring to the
enclosed module. In that case, the final end product must be labeled in a visible area with the following:
“Contains IC: 25021-01”
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this
RF module or change RF related parameters in the user manual of the end product.

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10. Product Packaging
Carrier Tape dimension for SGW1010/SGW1010A/SGW1011/SGW1011A.
Figure 12 SGW1010/SGW1010A/SGW1011/SGW1011A Tape Dimensions
Reel Packaging: 1000 modules will be loaded into the REEL. Each reel will be placed in an antistatic bag and put into
a 340 x350x45mm box as shown in below diagram.

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Figure 13 SGW1010/SGW1010A/SGW1011/SGW1011A Reel Packaging
Packaging Label
Figure 14 SGW1010/SGW1011 Packaging Label
11. Revision History
Revision
Date
Description
0.1
May 31, 2019
Initial Release
12. Useful Link
oNordic Infocenter:
ohttps://infocenter.nordicsemi.com/index.jsp
oAll the necessary technical files and software development kits of Nordic’s chip are on this website.
oNordic Developer Zone:
ohttps://devzone.nordicsemi.com/questions/
oA highly recommended website for firmware developer. Interact with other developers and Nordic’s employees
will help with your questions. The site also includes tutorials in detail to help you get started.
oOfficial Page of nRF52840:
ohttps://www.nordicsemi.com/eng/Products/nRF52840
oA brief introduction to nRF52840 and download links for Nordic’s developing software and Soft Devices.