Sony XR-C6090 User manual

MICROFILM
XR-C6090
E Model
SERVICE MANUAL
FM/AM CASSETTE CAR STEREO
SPECIFICATIONS
Model Name Using Similar Mechanism XR-C450
Tape Transport Mechanism Type MG-25J-136
Dolby noise reduction manufactured under license
from Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol aare trade-
marks of Dolby Laboratories Licensing Corporation.
Photo: XR-5800R
For RM-X4S (Remote Commander),
please refer to RM-X4S Service Manual
(9-925-698-∏) previously issued.

– 2 –
TABLE OF CONTENTS
1. GENERAL
Location of Controls ....................................................... 3
Setting the Clock ............................................................. 3
Installation....................................................................... 4
Connection ...................................................................... 6
2. DISASSEMBLY ......................................................... 8
3. ASSEMBLY OF MECHANISM DECK........... 10
4. MECHANICAL ADJUSTMENTS....................... 13
5. ELECTRICAL ADJUSTMENTS
Tape Deck Section .......................................................... 13
Tuner Section .................................................................. 13
6. DIAGRAMS
6-1. Printed Wiring Board – Main Section – ........................ 15
6-2. Schematic Diagram – Main Section – ............................ 17
6-3. Printed Wiring Board – Panel Section –........................ 21
6-4. Schematic Diagram – Panel Section – .......................... 23
6-5. IC Pin Function Description ........................................... 27
7. EXPLODED VIEWS................................................ 30
8. ELECTRICAL PARTS LIST ............................... 33
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

– 3 –
SECTION 1
GENERAL This section is extracted from
instruction manual.

– 4 –

– 5 –

– 6 –

– 7 –

– 8 –
FRONT PANEL ASS’Y, COLLAR
COVER ASS’Y
Note: Follow the disassembly procedure in the numerical order given.
SECTION 2
DISASSEMBLY
1 Push the button
(release).
3 claw
3 claw
4 collar
2 Remove the front panel ass’y
to the direction of the arrow
A .
A
1
2
1
2
3
cover ass’y

– 9 –
SUB PANEL, MECHANISM DECK (MG-25J-136)
MAIN BOARD, HEAT SINK
3 connector
(CN351)
2 sub panel
1 three screws
(PTT2.6
× 8)
1 three screws
(PTT2.6
× 8)
5 screw
(PTT2.6
× 6)
6 mechanism dec
k
(MG-25F-136)
4 flexible flat cable
(CN301)

3 two ground point
screws
5 three screws
(PTT 2.6
× 10)
5 two screws
(PTT 2.6
× 10)
1 screw
(PTT2.6
× 8)
5 two screws
(PTT 2.6
× 10)
6 heat sink
2 rubber cap (25)
1 two screws
(PTT2.6
× 8)
4 main board

– 10 –
HOUSING
ARM (SUCTION)
Note: Follow the assembly procedure in the numerical order given.
SECTION 3
ASSEMBLY OF MECHANISM DECK
2 Move the arm (suction) in the arrow
direction and fit on profection.
1 Fit the arm (suction) on the shaft.
projection
A part
C part
B part
D part
8 Hold the hanger by
bending the claw.
6 Fit projection on D part.
4 Fit claw on B part.
3 Put the housing
under A part.
5 Fit projection on C part.
1 Install the catch to the hanger.
2 Install the hanger onto
two claws of the housing.
7 Holder the hanger by bending the claw.
hanger
housing