Sony XR-C5080R User manual

MICROFILM
SERVICE MANUAL
FM/MW/LW CASSETTE CAR STEREO
AEP Model
UK Model
Model Name Using Similar Mechanism XR-5800R
Tape Transport Mechanism Type MG-25G-136
SPECIFICATIONS
XR-C5080R/C5090R
Photo: XR-C5090R

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TABLE OF CONTENTS
1. GENERAL
Location of Controls ....................................................... 3
Setting the Clock ............................................................. 3
Using the Rotary Commander ........................................ 4
Adjusting the Sound Characteristics .............................. 4
Attenuating the Sound .................................................... 4
Changing the Sound and Beep Tone............................... 4
Installation....................................................................... 5
Connections ..................................................................... 6
2. DISASSEMBLY ......................................................... 9
3. ASSEMBLY OF MECHANISM DECK........... 11
4. MECHANICAL ADJUSTMENTS....................... 14
5. ELECTRICAL ADJUSTMENTS
Test Mode ........................................................................ 14
Tape Deck Section .......................................................... 14
Tuner Section .................................................................. 15
6. DIAGRAMS
6-1. Printed Wiring Boards – MAIN Section – .................... 18
6-2. Schematic Diagram – MAIN Section –.......................... 21
6-3. Printed Wiring Board – PANEL Section – .................... 26
6-4. Schematic Diagram – PANEL Section –....................... 28
6-5. IC Pin Function Description ........................................... 34
7. EXPLODED VIEWS................................................ 37
8. ELECTRICAL PARTS LIST ............................... 40
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

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SECTION 1
GENERAL This section is extracted from
instruction manual.

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FRONT PANEL ASS’Y
COVER ASS’Y
Note: Follow the disassembly procedure in the numerical order given.
SECTION 2
DISASSEMBLY
1 Push the button
(release).
2 Remove the front panel ass’y
to the direction of the arrow
A .
A
1
2
1
2
3
cover ass’y

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SUB PANEL, MECHANISM DECK (MG-25G-136)
MAIN BOARD, HEAT SINK
1 three screws
(PTT2.6 × 8)
1 three screws
(PTT2.6 × 8)
2 sub panel
3 connector
(CN352)
5 screw
(PTT2.6 × 6)
6 mechanism deck
(MG-25G-136)
4 flexible flat cabl
e
(CN351)
1 two screws
(PTT2.6
× 8)
7 heat sink
6 three screws
(PTT2.6
× 10
)
6 three screws
(PTT2.6
× 10)
5 two screws
(PTT2.6
× 14)
1 screw
(PTT2.6
× 8)
2 rubber cap (25)
4 MAIN board
3 two ground point
screws