Sony MDR-IF5000 User manual

– 1 –
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
SERVICE MANUAL
E Model
MDR-IF5000
MICROFILM
CORDLESS STEREO HEADPHONES
SPECIFICATIONS
Modulation System Frequency modulation
Carrier wave frequency Right channel 2.8 MHz
Left channel 2.3 MHz
Frequency response 12 – 24,000 Hz
Power requirements Rechargeable Ni-Cd
batteries (supplied) or
R6 (size AA) batteries
(dry-cell or
rechargeable, sold
separately)
Mass Approx. 280 g
(including the
supplied rechargeable
Ni-Cd batteries)
Design and specifications are subject to
change without notice.
•MDR-IF5000 is the component model block one in
MDR-DS5000.
COMPONENT MODEL NAME FOR MDR-DS5000
DIGITAL SURROUND PROCESSOR DP-IF5000
CORDLESS STEREO HEADPHONES MDR-IF5000
Ver 1.0 1998. 11

– 2 –
SECTION 1
GENERAL This section is extracted
from instruction manual.

– 3 –

– 4 –
SECTION 2
DISASSEMBLY
1 pad (outer), ear
2 pad (inner), ear
4 driver assy
7 plate, front
3 claws
5 P 2.6X6
6 claws
8 frame assy
9 hanger
plate, fron
t
hanger
frame assy
spread
spread
Set Frame assy
Frame assy
Hanger (L)
Hanger (R)
Band Assy, Head
Band Assy, HeadRX board
2 P 2.6X6
1 P 2.6X6
5 RX PD2
board (L-CH)
4 RX PD1 board (L-CH
)
3 hanger (L)
1 P 2.6X6
4 RX PD2
board
(R-CH)
3 RX PD1 board (R-CH)
2 hanger (R)
2-1. FRAME ASSY
2-2. HANGER (L) 2-3. HANGER (R)
• The equipment can be removed using the following procedure.
Note : Follow the disassembly procedure in the numerical order given.
• Remove the left and right ear
pads in the same manner.

– 5 –
5 band assy, head
3 stopper, PC board
2 RX SW board
1 wire
When installing,
take care to avoid extrusion
of wire from the hanger.
4 claws
1 P 2.6X6
2 RX board
2-4. RX BOARD
2-5. BAND ASSY, HEAD

– 6 –
SECTION 3
ELECTRICAL ADJUSTMENTS
Notes:
1. These adjustments are performed in the order that they are
discribed.
2. Adjustment and measurement are performed for each channel
unless otherwise specified.
3. Adjustment is made for right channel first and then the left
channel.
4. The power voltage at the headphones section is supplied with
1.2 V.
5. The processor section is used as jig to adjust the headphones
section (MDR-IF5000).
6. Adjustment is made with the RX SW board and RX PD1 and
RX PD2 boards (for both L-ch and R-ch) connected to the RX
board with wires (normal part).
0 dB=0.775V
Tuning Adjustment
Preparation:
processor
(DP-IF5000) headphones (MDR-IF5000
)
1. Set the processor section (DP-IF5000) in test mode and operate
the set to generate a signal of 1 kHz and –10 dB. (Refer to
DP-IF5000 service manual page 7.)
2. Supply 1.2 V to between VCC and ground on the RX board.
3. Adjust RV11 (volume control) on the RX board to the minimum
level.
Adjustment Location:
TP9
TP11
L34
L35
TUNING
ADJUSTMENT
(L-ch)
TUNING
ADJUSTMENT
(R-ch)
L54
L55
– RX board (component side)
–
Setting:
+
–
distortion mete
r
RX board
TP11 (L-ch)
TP9 (R-ch)
1. Connect a distortion meter to TP11 (L-ch) and TP9 (R-ch) on
the RX board.
2. Adjust L34 and 35 for L-ch and L54 and 55 for R-ch on the
RX board so that the reading on the distortion meter is
minimized.

4-1. BLOCK DIAGRAM
– 7 – – 8 –
SECTION 4
DIAGRAMS
OSCILLATOR
OSCILLATOR
MIXER DEMODULATOR
MIXER
OUT
LIMITER
IN
2.3MHz BPF
L33
2.8MHz BPF
L53
LIMITER
AMP
AF
AMP
VCC
GND
AF
OUT -1
L
-2
R
MUTE
SQUELCH TRIGGER
WITH
HYSTERESIS
GND
MUTE
SQUELCH TRIGGER
WITH
HYSTERESIS
AUDIO (L) MIXER LIMITER
IC31
AUDIO (R) MIXER LIMITER
IC51
8
2
1
16
BPF
16
1
2
8
BPF
L34,35
TUNING
(L)
BUFFER
Q4
RF AMP
Q1-3 3 5 9
DEMODULATOR
LIMITER
IN
LIMITER
AMP
AF
AMP
AF
OUT 9
14
15
14
4
VCC 4
15
QUAD COIL
OSC
OSC
MIXER
IN
MIXER
MIXER
OUT
MIXER
IN
OSC
OSC
3 5
B+
(+3.0V)
B+
(+1.7V)
B+
(+3.0V)
RV10
BALANCE
RV11
VOL
+
–
+
–
++
BIAS
CIRCUIT
VCC
FC2
FC1
VIN
4
3
2
6
8
5
VO1
VO2
SP31
L-CH
+
–
+
–
++
BIAS
CIRCUIT
VCC
FC2
FC1
VIN
4
3
2
6
8
5
VO1
VO2
SP51
R-CH
D10
POWER
B+
(+1.8V)
B+
(+1.7V)
S10
(POWER)
DRY BATTERY
SIZE "AA"
(IEC DESIGNATION R6)
2PCS, 3V
OR
NICKEL CADMIUM
BATTERY
(NC-AA)
700mAh 2.4V
DRIVER AMP (R-CH)
IC52
DRIVER AMP (L-CH)
IC32
B+
(+3.0V)
INFRARED
SENSOR
D1-4
04
QUAD COIL
• Signal path
: RF
: ANALOG
L54,55
TUNING
(R)
B+
(+3.0V)
MDR-IF5000

MDR-IF5000
– 9 – – 10 –
Note:
•X: parts extracted from the component side.
•®:Through hole.
•: Pattern from the side which enables seeing.
•: Pattern of the rear side.
4-2. PRINTED WIRING BOARDS
DRY BATTERY
SIZE "AA"
(IEC DESIGNATION R6)
2PCS, 3V
OR
NICKEL CADMIUM
BATTERY
(NC-AA)
700mAh 2.4V
B+
GND
R-CH L-CH
-1
L TP11
TP9
-2
R
R-CH
L-CH
INFRARED
SENSOR
( )
1
A
B
C
D
E
F
G
2345678910111213
D1 C-13
D2 F-13
D3 C-10
D4 F-10
D10 D-2
D51 D-5
D52 D-5
IC31 D-3
IC32 F-3
IC51 D-4
IC52 F-4
Q1 B-3
Q2 B-4
Q3 B-4
Q4 B-5
• Semiconductor
Location
Ref.No. Location

– 11 –
4-3. SCHEMATIC DIAGRAM • Refer to page 13 for IC Block Diagrams.
– 12 –
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
•¢: internal component.
•C: panel designation.
•U: B+ Line.
•H: adjustment for repair.
• Power voltage is dc 3V and fed with regulated dc power
supply from battery terminal.
MDR-IF5000
• Total current is measured with POWER ON (no-sig-
nal) mode.
• Voltage is dc with respect to ground under no-signal
condition.
no mark : POWER ON
• Voltagesaretakenwith aVOM(Inputimpedance10MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Signal path.
J: RF
F: ANALOG

– 13 –
+
–
SQUELCH TRIGGER WITH
HYSTERESIS
MIXER
OSCILLATOR
CRYSTAL
OSC
MIXER
OUTPUT VCC
SCAN
CONTROL SQUELCH IN FILTER OUTPUT FILTER INPUT RECOVERD AUDIO
MIXER
INPUT GND MUTE
QUAD
COIL
LIMITER
INPUT DECOUPLING
FILTER
AMP
LIMITER
AMP
AF
AMP
DEMODULATOR
+
1 2 3 4 7 865
1516 14 13 12 11 10 9
+
8 7 6 5
4321
_
+
_
VO2
CD
CF 2 CF 1
V in
GND Vcc VO1
BIAS
CIRCUIT
• IC Block Diagrams
IC31, 51 SC111711DR2
IC32, 52 MC34119DTBEL