Sony MDR-IF5000 User manual

– 1 –
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
SERVICE MANUAL
E Model
MDR-IF5000
MICROFILM
CORDLESS STEREO HEADPHONES
SPECIFICATIONS
Modulation System Frequency modulation
Carrier wave frequency Right channel 2.8 MHz
Left channel 2.3 MHz
Frequency response 12 – 24,000 Hz
Power requirements Rechargeable Ni-Cd
batteries (supplied) or
R6 (size AA) batteries
(dry-cell or
rechargeable, sold
separately)
Mass Approx. 280 g
(including the
supplied rechargeable
Ni-Cd batteries)
Design and specifications are subject to
change without notice.
•MDR-IF5000 is the component model block one in
MDR-DS5000.
COMPONENT MODEL NAME FOR MDR-DS5000
DIGITAL SURROUND PROCESSOR DP-IF5000
CORDLESS STEREO HEADPHONES MDR-IF5000
Ver 1.0 1998. 11

– 2 –
SECTION 1
GENERAL This section is extracted
from instruction manual.

– 3 –

– 4 –
SECTION 2
DISASSEMBLY
1 pad (outer), ear
2 pad (inner), ear
4 driver assy
7 plate, front
3 claws
5 P 2.6X6
6 claws
8 frame assy
9 hanger
plate, fron
t
hanger
frame assy
spread
spread
Set Frame assy
Frame assy
Hanger (L)
Hanger (R)
Band Assy, Head
Band Assy, HeadRX board
2 P 2.6X6
1 P 2.6X6
5 RX PD2
board (L-CH)
4 RX PD1 board (L-CH
)
3 hanger (L)
1 P 2.6X6
4 RX PD2
board
(R-CH)
3 RX PD1 board (R-CH)
2 hanger (R)
2-1. FRAME ASSY
2-2. HANGER (L) 2-3. HANGER (R)
• The equipment can be removed using the following procedure.
Note : Follow the disassembly procedure in the numerical order given.
• Remove the left and right ear
pads in the same manner.

– 5 –
5 band assy, head
3 stopper, PC board
2 RX SW board
1 wire
When installing,
take care to avoid extrusion
of wire from the hanger.
4 claws
1 P 2.6X6
2 RX board
2-4. RX BOARD
2-5. BAND ASSY, HEAD

– 6 –
SECTION 3
ELECTRICAL ADJUSTMENTS
Notes:
1. These adjustments are performed in the order that they are
discribed.
2. Adjustment and measurement are performed for each channel
unless otherwise specified.
3. Adjustment is made for right channel first and then the left
channel.
4. The power voltage at the headphones section is supplied with
1.2 V.
5. The processor section is used as jig to adjust the headphones
section (MDR-IF5000).
6. Adjustment is made with the RX SW board and RX PD1 and
RX PD2 boards (for both L-ch and R-ch) connected to the RX
board with wires (normal part).
0 dB=0.775V
Tuning Adjustment
Preparation:
processor
(DP-IF5000) headphones (MDR-IF5000
)
1. Set the processor section (DP-IF5000) in test mode and operate
the set to generate a signal of 1 kHz and –10 dB. (Refer to
DP-IF5000 service manual page 7.)
2. Supply 1.2 V to between VCC and ground on the RX board.
3. Adjust RV11 (volume control) on the RX board to the minimum
level.
Adjustment Location:
TP9
TP11
L34
L35
TUNING
ADJUSTMENT
(L-ch)
TUNING
ADJUSTMENT
(R-ch)
L54
L55
– RX board (component side)
–
Setting:
+
–
distortion mete
r
RX board
TP11 (L-ch)
TP9 (R-ch)
1. Connect a distortion meter to TP11 (L-ch) and TP9 (R-ch) on
the RX board.
2. Adjust L34 and 35 for L-ch and L54 and 55 for R-ch on the
RX board so that the reading on the distortion meter is
minimized.

4-1. BLOCK DIAGRAM
– 7 – – 8 –
SECTION 4
DIAGRAMS
OSCILLATOR
OSCILLATOR
MIXER DEMODULATOR
MIXER
OUT
LIMITER
IN
2.3MHz BPF
L33
2.8MHz BPF
L53
LIMITER
AMP
AF
AMP
VCC
GND
AF
OUT -1
L
-2
R
MUTE
SQUELCH TRIGGER
WITH
HYSTERESIS
GND
MUTE
SQUELCH TRIGGER
WITH
HYSTERESIS
AUDIO (L) MIXER LIMITER
IC31
AUDIO (R) MIXER LIMITER
IC51
8
2
1
16
BPF
16
1
2
8
BPF
L34,35
TUNING
(L)
BUFFER
Q4
RF AMP
Q1-3 3 5 9
DEMODULATOR
LIMITER
IN
LIMITER
AMP
AF
AMP
AF
OUT 9
14
15
14
4
VCC 4
15
QUAD COIL
OSC
OSC
MIXER
IN
MIXER
MIXER
OUT
MIXER
IN
OSC
OSC
3 5
B+
(+3.0V)
B+
(+1.7V)
B+
(+3.0V)
RV10
BALANCE
RV11
VOL
+
–
+
–
++
BIAS
CIRCUIT
VCC
FC2
FC1
VIN
4
3
2
6
8
5
VO1
VO2
SP31
L-CH
+
–
+
–
++
BIAS
CIRCUIT
VCC
FC2
FC1
VIN
4
3
2
6
8
5
VO1
VO2
SP51
R-CH
D10
POWER
B+
(+1.8V)
B+
(+1.7V)
S10
(POWER)
DRY BATTERY
SIZE "AA"
(IEC DESIGNATION R6)
2PCS, 3V
OR
NICKEL CADMIUM
BATTERY
(NC-AA)
700mAh 2.4V
DRIVER AMP (R-CH)
IC52
DRIVER AMP (L-CH)
IC32
B+
(+3.0V)
INFRARED
SENSOR
D1-4
04
QUAD COIL
• Signal path
: RF
: ANALOG
L54,55
TUNING
(R)
B+
(+3.0V)
MDR-IF5000

MDR-IF5000
– 9 – – 10 –
Note:
•X: parts extracted from the component side.
•®:Through hole.
•: Pattern from the side which enables seeing.
•: Pattern of the rear side.
4-2. PRINTED WIRING BOARDS
DRY BATTERY
SIZE "AA"
(IEC DESIGNATION R6)
2PCS, 3V
OR
NICKEL CADMIUM
BATTERY
(NC-AA)
700mAh 2.4V
B+
GND
R-CH L-CH
-1
L TP11
TP9
-2
R
R-CH
L-CH
INFRARED
SENSOR
( )
1
A
B
C
D
E
F
G
2345678910111213
D1 C-13
D2 F-13
D3 C-10
D4 F-10
D10 D-2
D51 D-5
D52 D-5
IC31 D-3
IC32 F-3
IC51 D-4
IC52 F-4
Q1 B-3
Q2 B-4
Q3 B-4
Q4 B-5
• Semiconductor
Location
Ref.No. Location

– 11 –
4-3. SCHEMATIC DIAGRAM • Refer to page 13 for IC Block Diagrams.
– 12 –
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
•¢: internal component.
•C: panel designation.
•U: B+ Line.
•H: adjustment for repair.
• Power voltage is dc 3V and fed with regulated dc power
supply from battery terminal.
MDR-IF5000
• Total current is measured with POWER ON (no-sig-
nal) mode.
• Voltage is dc with respect to ground under no-signal
condition.
no mark : POWER ON
• Voltagesaretakenwith aVOM(Inputimpedance10MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Signal path.
J: RF
F: ANALOG

– 13 –
+
–
SQUELCH TRIGGER WITH
HYSTERESIS
MIXER
OSCILLATOR
CRYSTAL
OSC
MIXER
OUTPUT VCC
SCAN
CONTROL SQUELCH IN FILTER OUTPUT FILTER INPUT RECOVERD AUDIO
MIXER
INPUT GND MUTE
QUAD
COIL
LIMITER
INPUT DECOUPLING
FILTER
AMP
LIMITER
AMP
AF
AMP
DEMODULATOR
+
1 2 3 4 7 865
1516 14 13 12 11 10 9
+
8 7 6 5
4321
_
+
_
VO2
CD
CF 2 CF 1
V in
GND Vcc VO1
BIAS
CIRCUIT
• IC Block Diagrams
IC31, 51 SC111711DR2
IC32, 52 MC34119DTBEL

– 14 –
Ref. No. Part No. Description RemarkRef. No. Part No. Description Remark
SECTION 5
EXPLODED VIEW
NOTE:
• The mechanical parts with no reference
number in the exploded views are not supplied.
• Items marked “*” are not stocked since
they are seldom required for routine service.
Some delay should be anticipated
when ordering these items.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• Color Indication of Appearance Parts
Example :
KNOB, BALANCE (WHITE) ... (RED)
Parts Color Cabinet’s Color
N
N
1
2
3
333
3
3
3
3
5
6
7
7
8
8
9
10
11
12 13
14
14
14
14
27
28
16
15
17
18
19
20
21
22
22
23
24
25
26
26
4
not supplied
SP31 SP51
1 X-4951-063-1 BAND (F) ASSY, HEAD
2 X-4951-064-1 BAND (R) ASSY, HEAD
3 7-685-104-19 SCREW +P 2X6 TYPE2 NON-SLIT
4 X-4951-014-1 SUSPENDER ASSY
5 4-213-919-01 PLATE (L), FRONT
6 X-4950-548-1 FRAME (L) ASSY
7 4-213-911-01 PAD (OUTER), EAR
8 4-213-910-01 PAD (INNER), EAR
9 4-213-900-01 LID, BATTERY
10 4-961-876-01 TERMINAL (COMMONNESS), BATTERY
11 4-214-464-01 TERMINAL, (-) BATTERY
12 4-961-874-01 TERMINAL, (+) BATTERY
13 4-213-896-01 HANGER (L)
14 4-213-901-01 WINDOW, RAY CATCHER
*15 1-671-718-11 RX PD1 BOARD (L-CH)
*16 1-671-719-11 RX PD2 BOARD (L-CH)
17 X-4951-066-1 LID (L) ASSY, HANGER
18 4-213-918-01 SPRING, TENSION
*19 1-671-720-11 RX SW BOARD
*20 A-4542-557-A RX BOARD, COMPLETE
21 X-4950-549-1 FRAME (R) ASSY
22 4-213-916-01 SCREEN
23 4-213-920-01 PLATE (R), FRONT
24 4-213-897-01 HANGER (R)
25 4-213-899-01 LID (R), HANGER
26 4-215-827-01 STOPPER, BAND
*27 1-671-718-11 RX PD1 BOARD (R-CH)
*28 1-671-719-11 RX PD2 BOARD (R-CH)
SP31 X-4951-065-1 DRIVER ASSY (L-CH)
SP51 X-4951-065-1 DRIVER ASSY (R-CH)

– 15 –
SECTION 6
ELECTRICAL PARTS LIST
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
RX
NOTE:
• Due to standardization, replacements in
the parts list may be different from the
parts specified in the diagrams or the
components used on the set.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• RESISTORS
All resistors are in ohms.
METAL:Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F:nonflammable
• Items marked “*” are not stocked since
they are seldom required for routine service.
Some delay should be anticipated
when ordering these items.
• SEMICONDUCTORS
In each case, u : µ, for example:
uA.. : µA.. uPA.. : µPA..
uPB.. : µPB.. uPC.. : µPC.. uPD.. : µPD..
• CAPACITORS
uF : µF
• COILS
uH : µH
When indicating parts by reference
number, please include the board.
*A-4542-557-A RX BOARD, COMPLETE
*******************
< CAPACITOR >
C1 1-163-031-11 CERAMIC CHIP 0.01uF 50V
C2 1-163-243-11 CERAMIC CHIP 47PF 5% 50V
C3 1-163-031-11 CERAMIC CHIP 0.01uF 50V
C4 1-163-031-11 CERAMIC CHIP 0.01uF 50V
C5 1-163-031-11 CERAMIC CHIP 0.01uF 50V
C6 1-164-346-11 CERAMIC CHIP 1uF 16V
C7 1-126-246-11 ELECT CHIP 220uF 20% 4V
C8 1-164-346-11 CERAMIC CHIP 1uF 16V
C9 1-135-201-11 TANTALUM CHIP 10uF 20% 4V
C30 1-163-117-00 CERAMIC CHIP 100PF 5% 50V
C31 1-163-021-11 CERAMIC CHIP 0.01uF 10% 50V
C32 1-163-251-11 CERAMIC CHIP 100PF 5% 50V
C33 1-163-106-00 CERAMIC CHIP 36PF 5% 50V
C34 1-164-346-11 CERAMIC CHIP 1uF 16V
C37 1-163-031-11 CERAMIC CHIP 0.01uF 50V
C38 1-163-031-11 CERAMIC CHIP 0.01uF 50V
C39 1-163-031-11 CERAMIC CHIP 0.01uF 50V
C40 1-163-031-11 CERAMIC CHIP 0.01uF 50V
C42 1-117-720-11 CERAMIC CHIP 4.7uF 10V
C43 1-163-809-11 CERAMIC CHIP 0.047uF 10% 25V
C44 1-117-720-11 CERAMIC CHIP 4.7uF 10V
C45 1-135-201-11 TANTALUM CHIP 10uF 20% 4V
C46 1-163-033-11 CERAMIC CHIP 0.022uF 50V
C47 1-135-201-11 TANTALUM CHIP 10uF 20% 4V
C48 1-135-180-21 TANTALUM CHIP 3.3uF 20% 6.3V
C50 1-163-117-00 CERAMIC CHIP 100PF 5% 50V
C51 1-163-021-11 CERAMIC CHIP 0.01uF 10% 50V
C52 1-163-121-00 CERAMIC CHIP 150PF 5% 50V
C53 1-163-031-11 CERAMIC CHIP 0.01uF 50V
C54 1-163-031-11 CERAMIC CHIP 0.01uF 50V
C55 1-163-123-00 CERAMIC CHIP 180PF 5% 50V
C56 1-163-123-00 CERAMIC CHIP 180PF 5% 50V
C57 1-163-031-11 CERAMIC CHIP 0.01uF 50V
C58 1-163-031-11 CERAMIC CHIP 0.01uF 50V
C59 1-163-031-11 CERAMIC CHIP 0.01uF 50V
C60 1-163-031-11 CERAMIC CHIP 0.01uF 50V
C61 1-135-149-21 TANTALUM CHIP 2.2uF 20% 10V
C62 1-117-720-11 CERAMIC CHIP 4.7uF 10V
C63 1-163-809-11 CERAMIC CHIP 0.047uF 10% 25V
C64 1-117-720-11 CERAMIC CHIP 4.7uF 10V
C65 1-135-201-11 TANTALUM CHIP 10uF 20% 4V
C66 1-163-033-11 CERAMIC CHIP 0.022uF 50V
C67 1-135-201-11 TANTALUM CHIP 10uF 20% 4V
C68 1-135-180-21 TANTALUM CHIP 3.3uF 20% 6.3V
< DIODE >
D10 8-719-066-57 LED SA2512 (POWER)
D51 8-719-421-40 DIODE MA77
D52 8-719-421-40 DIODE MA77
< IC >
IC31 8-759-473-72 IC SC111711DR2
IC32 8-759-463-98 IC MC34119DR2
IC51 8-759-473-72 IC SC111711DR2
IC52 8-759-463-98 IC MC34119DR2
< COIL >
L1 1-412-956-21 INDUCTOR 27uH
L32 1-412-957-11 INDUCTOR 33uH
L33 1-239-762-11 FILTER, BAND PASS
L34 1-416-885-11 COIL, DETECTION (A)
L35 1-416-886-11 COIL, DETECTION (B)
L51 1-412-959-11 INDUCTOR 47uH
L52 1-412-957-11 INDUCTOR 33uH
L53 1-239-763-11 FILTER, BAND PASS
L54 1-416-887-11 COIL, DETECTION (A)
L55 1-416-888-11 COIL, DETECTION (B)
< TRANSISTOR >
Q1 8-729-220-93 FET 2SK209-G
Q2 8-729-024-13 TRANSISTOR 2SA1256E4
Q3 8-729-809-77 TRANSISTOR 2SC3142-J4
Q4 8-729-216-22 TRANSISTOR 2SA1162-G
< RESISTOR >
R1 1-216-057-00 METAL CHIP 2.2K 5% 1/10W
R2 1-216-049-11 RES,CHIP 1K 5% 1/10W
R3 1-216-097-00 RES,CHIP 100K 5% 1/10W
R4 1-216-093-00 RES,CHIP 68K 5% 1/10W
R5 1-216-049-11 RES,CHIP 1K 5% 1/10W
R6 1-216-057-00 METAL CHIP 2.2K 5% 1/10W
R7 1-216-037-00 METAL CHIP 330 5% 1/10W
R8 1-216-001-00 METAL CHIP 10 5% 1/10W
R34 1-216-063-00 RES,CHIP 3.9K 5% 1/10W
R35 1-216-063-00 RES,CHIP 3.9K 5% 1/10W

– 16 –
Sony Corporation
Personal A&V Products Company
9-924-998-11
MDR-IF5000
98L047015-1
Printed in Singapore C1998. 12
Published by Quality Engineering Dept.
(Shibaura)
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
R36 1-216-049-11 RES,CHIP 1K 5% 1/10W
R37 1-216-073-00 METAL CHIP 10K 5% 1/10W
R38 1-216-089-00 RES,CHIP 47K 5% 1/10W
R39 1-216-063-00 RES,CHIP 3.9K 5% 1/10W
R40 1-216-063-00 RES,CHIP 3.9K 5% 1/10W
R51 1-216-037-00 METAL CHIP 330 5% 1/10W
R52 1-216-097-00 RES,CHIP 100K 5% 1/10W
R53 1-216-111-00 METAL CHIP 390K 5% 1/10W
R54 1-216-061-00 METAL CHIP 3.3K 5% 1/10W
R55 1-216-063-00 RES,CHIP 3.9K 5% 1/10W
R56 1-216-049-11 RES,CHIP 1K 5% 1/10W
R57 1-216-073-00 METAL CHIP 10K 5% 1/10W
R58 1-216-089-00 RES,CHIP 47K 5% 1/10W
R59 1-216-063-00 RES,CHIP 3.9K 5% 1/10W
R60 1-216-069-00 METAL CHIP 6.8K 5% 1/10W
< VARIABLE RESISTOR >
RV10 1-223-516-11 RES, VAR, CARBON 50K (BALANCE)
RV11 1-223-517-11 RES, VAR, CARBON 50K/50K (VOL)
*************************************************************
*1-671-718-11 RX PD1 BOARD (L-CH)
*************
< PHOTO DIODE >
D1 8-719-058-49 PHOTO DIODE PP508
*************************************************************
*1-671-718-11 RX PD1 BOARD (R-CH)
*************
< PHOTO DIODE >
D3 8-719-058-49 PHOTO DIODE PP508
*************************************************************
*1-671-719-11 RX PD2 BOARD (L-CH)
*************
< PHOTO DIODE >
D2 8-719-058-49 PHOTO DIODE PP508
*************************************************************
*1-671-719-11 RX PD2 BOARD (R-CH)
*************
< PHOTO DIODE >
D4 8-719-058-49 PHOTO DIODE PP508
*************************************************************
*1-671-720-11 RX SW BOARD
************
< SWITCH >
S10 1-572-467-61 SWITCH, PUSH (1 KEY) (POWER)
*************************************************************
MISCELLANEOUS
***************
SP31 X-4951-065-1 DRIVER ASSY (L-CH)
SP51 X-4951-065-1 DRIVER ASSY (R-CH)
RX RX PD1 RX PD2 RX SW

– 1 –
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
SERVICE MANUAL
US Model
Canadian Model
AEP Model
UK Model
E Model
MDR-IF5000
MICROFILM
CORDLESS STEREO HEADPHONES
SPECIFICATIONS
Modulation System Frequency modulation
Carrier wave frequency Right channel 2.8 MHz
Left channel 2.3 MHz
Frequency response 12 – 24,000 Hz
Power requirements Rechargeable Ni-Cd
batteries (supplied) or
R6 (size AA) batteries
(dry-cell or
rechargeable, sold
separately)
Mass Approx. 280 g
(including the
supplied rechargeable
Ni-Cd batteries)
Design and specifications are subject to
change without notice.
•MDR-IF5000 is the component model block one in
MDR-DS5000.
COMPONENT MODEL NAME FOR MDR-DS5000
DIGITAL SURROUND PROCESSOR DP-IF5000
CORDLESS STEREO HEADPHONES MDR-IF5000
Ver 1.1 1999. 02

– 2 –
SECTION 1
GENERAL This section is extracted
from instruction manual.

– 3 –

– 4 –
SECTION 2
DISASSEMBLY
1 pad (outer), ear
2 pad (inner), ear
4 driver assy
7 plate, front
3 claws
5 P 2.6X6
6 claws
8 frame assy
9 hanger
plate, fron
t
hanger
frame assy
spread
spread
Set Frame assy
Frame assy
Hanger (L)
Hanger (R)
Band Assy, Head
Band Assy, HeadRX board
2 P 2.6X6
1 P 2.6X6
5 RX PD2
board (L-CH)
4 RX PD1 board (L-CH
)
3 hanger (L)
1 P 2.6X6
4 RX PD2
board
(R-CH)
3 RX PD1 board (R-CH)
2 hanger (R)
2-1. FRAME ASSY
2-2. HANGER (L) 2-3. HANGER (R)
• The equipment can be removed using the following procedure.
Note : Follow the disassembly procedure in the numerical order given.
• Remove the left and right ear
pads in the same manner.

– 5 –
5 band assy, head
3 stopper, PC board
2 RX SW board
1 wire
When installing,
take care to avoid extrusion
of wire from the hanger.
4 claws
1 P 2.6X6
2 RX board
2-4. RX BOARD
2-5. BAND ASSY, HEAD

– 6 –
SECTION 3
ELECTRICAL ADJUSTMENTS
Notes:
1. These adjustments are performed in the order that they are
discribed.
2. Adjustment and measurement are performed for each channel
unless otherwise specified.
3. Adjustment is made for right channel first and then the left
channel.
4. The power voltage at the headphones section is supplied with
1.2 V.
5. The processor section is used as jig to adjust the headphones
section (MDR-IF5000).
6. Adjustment is made with the RX SW board and RX PD1 and
RX PD2 boards (for both L-ch and R-ch) connected to the RX
board with wires (normal part).
0 dB=0.775 V
Tuning Adjustment
Preparation:
processor
(DP-IF5000) headphones (MDR-IF5000
)
1. Set the processor section (DP-IF5000) in test mode and operate
the set to generate a signal of 1 kHz and –10 dB. (Refer to
DP-IF5000 service manual page 7.)
2. Supply 1.2 V to between VCC and ground on the RX board.
3. Adjust RV11 (volume control) on the RX board to the minimum
level.
Adjustment Location:
TP9
TP11
L34
L35
TUNING
ADJUSTMENT
(L-ch)
TUNING
ADJUSTMENT
(R-ch)
L54
L55
– RX board (component side)
–
Setting:
+
–
distortion mete
r
RX board
TP11 (L-ch)
TP9 (R-ch)
1. Connect a distortion meter to TP11 (L-ch) and TP9 (R-ch) on
the RX board.
2. Adjust L34 and 35 for L-ch and L54 and 55 for R-ch on the
RX board so that the reading on the distortion meter is
minimized.

4-1. BLOCK DIAGRAM
– 7 – – 8 –
SECTION 4
DIAGRAMS
OSCILLATOR
OSCILLATOR
MIXER DEMODULATOR
MIXER
OUT LIMITER IN
2.3MHz BPF
L33
2.8MHz BPF
L53
LIMITER
AMP
AF
AMP
VCC
GND
AF
OUT -1
L
-2
R
MUTE
SQUELCH TRIGGER
WITH
HYSTERESIS
GND
MUTE
SQUELCH TRIGGER
WITH
HYSTERESIS
AUDIO (L) MIXER LIMITER
IC31
AUDIO (R) MIXER LIMITER
IC51
8
2
1
16
BPF
16
1
2
8
BPF
L34,35
TUNING
(L)
BUFFER
Q4
RF AMP
Q1-3 3 5 9
DEMODULATOR
LIMITER
IN
LIMITER
AMP AF
AMP
AF
OUT 9
14
15
14
4
VCC 4
15
QUAD COIL
OSC
OSC
MIXER
IN
MIXER
MIXER
OUT
MIXER
IN
OSC
OSC
3 5
B+
(+3.0V)
B+
(+1.7V)
B+
(+3.0V)
RV10
BALANCE
RV11
VOL
+
–
+
–
++
BIAS
CIRCUIT
VCC
FC2
FC1
VIN
4
3
2
6
8
5
VO1
VO2
SP31
L-CH
+
–
+
–
++
BIAS
CIRCUIT
VCC
FC2
FC1
VIN
4
3
2
6
8
5
VO1
VO2
SP51
R-CH
D10
POWER
B+
(+1.8V)
B+
(+1.7V)
S10
(POWER)
DRY BATTERY
SIZE "AA"
(IEC DESIGNATION R6)
2PCS, 3V
OR
NICKEL CADMIUM
BATTERY
(NC-AA)
700mAh 2.4V
DRIVER AMP (R-CH)
IC52
DRIVER AMP (L-CH)
IC32
B+
(+3.0V)
INFRARED
SENSOR
D1-4
04
QUAD COIL
• Signal path
: RF
: ANALOG
L54,55
TUNING
(R)
B+
(+3.0V)
MDR-IF5000