Sony MDR-IF630R User manual

MDR-IF630R
US Model
AEP Model
UK Model
E Model
Tourist Model
SERVICE MANUAL
HEADPHONES
Headphones MDR-IF630R
Transmitter TMR-IF630R
MDR-IF630R is the component model block one in the MDR-IF630RK.
COMPONENT MODEL NAME FOR MDR-IF630RK
SPECIFICATIONS
Built-in rechargeable batteries
Model name NH-AAC
Type Ni-MH
Voltage 1.2 V
Capacity 1000 mAh
Headphones
Type Closed, dynamic
Driver unit 30 mm dia. with neodymium
magnet
Frequency response
12 – 24,000 Hz
Power source DC 2.4 V: Built-in rechargeable
batteries
Mass Approx. 310 g (10.9 oz)
Design and specifications are subject to change without
notice.
Ver 1.0 2000. 12

— 2 —
SECTION 1
GENERAL
This section is extracted
from instruction manual.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Check the remaining power of the
headphone batteries
Pull up the suspender, and check that the
headphones’power indicator lights in red. You
can now use the headphones.
Charge the batteries or install new batteries, if the
power indicator light is weak or turned off and
the sound become distorted or has a lot of noise.
POWER
3Adjust the volume.
High
Low
Audio mode switch
Depress the audio mode switch (VOICE mode) to
emphasize the human voice. Press to release it
(NORMAL mode) for normal tone quality.
Audio mode switch
NORMAL VOICE

—3 —
SECTION 2
DISASSEMBLY
2-2. RX BASE BOARD
Note : Follow the disassembly procedure in the numerical order given.
•The equipment can be removed using the following procedure.
Driver (R side) RX BASE board
Driver (L side) RX CHR board
Set Lid (R), holder Hanger (R) RX SW board, Holder (R)
Lid (L), holder Hanger (L) Holder (L)
2-1. DRIVER (R SIDE)
Driver (R side)
Driver (R side)
From RX BASE board
2 Four screws
(+P2
× 6)
Solder the each lead wires
directly to the position as
shown while being
cautions of colors
Precaution for installation
1 Pad, ear
3 Plate (R) assy, front
4 Remove the two solderings
Natural
Red
from RX SW board (–) (natural)
Head band (rear) (natural)
Driver (natural)
Driver (red) Head band (front) (green)
Head band (front) (natural)
Head band (front) (natural)
Head band (front) (black)
Head band (rear) (red)
from RX SW board (+) (black)
RX BASE board
RX BASE board
3 Button, sound selection
4 Knob, volume
1 Two screws (+P2 × 6)
2 Remove the ten solderings
Solder the each lead wires directly to the position as
shown while being cautions of colors
Precaution for installation

—4 —
2-3. LID (R), HOLDER
2-4. HANGER (R)
2 Housing (R) assy
6 Claw
1
1
5
4
Lid (R), holder
3 Two screws (+P2 × 6)
2 Lid (R) hange
r
Hanger (R)
HANGER (R)
Groove
Groove
Groove
Groove
Groove
Groove
From head band (rear)
From RX SW board
From head band
(front)
1
Solder the each lead wires directly to the position as
shown while being cautions of colors
Precaution for installation

—5 —
2-5. RX SW BOARD, HOLDER (R)
2-6. DRIVER (L SIDE)
Holder (R)
Natural
RX SW board
8 Remove the two solderings
q; Cushion assy, head
9
1
Two screws (+P2 × 2.5)
2 Head band (front)
3 Head band (rear)
5 Chassis
4 Screw (+P2 × 5)
6 Two springs
7
Driver (L side)
Driver (L side)
From head band (rear)
Natural
Green
2 Four screws (P2 × 6)
1 Pad, ear
3 Plate (L) assy, front
4 Remove the two solderings
Solder the each lead wires
directly to the position as
shown while being
cautions of colors
Precaution for installation

—6 —
2-8. LID (L), HOLDER
2-7. RX CHR BOARD
1 Two screws (+P2 × 6)
7 Screw
(+P2 × 6)
5 Terminal (–), battery
6 RX CHR board
Terminal (–), battery
RX CHR board
3 Terminal (+), batter
y
Terminal (+), battery
2 Remobe the eight soderings
Two batteries, nickel hydrogen
Box assy, battery
4 Two terminals, charge
Two terminals, charge
Head band (front) (natural)
Head band (front) (black)
Head band (rear) (natural)
Head band (rear) (red)
Solder the each lead wires directly to the position as
shown while being cautions of colors
Precaution for installation
6 Claw
5
1
1
2 Housing (L) ssy
4 Lid (L), holder
3 Two screws
(+P2 × 6)

—7 —
2-9. HANGER (L)
2-10. HOLDER (L)
2 Lid (L), hanger
Hanger (L)
Hanger (L)
Groove
Groove
Groove
Groove
Groove
Groove
From head band (rear)
From head band (front)
1
Solder the each lead wires directly to the position as
shown while being cautions of colors
Precaution for installation
6
Holder (L)
7 Cushion assy, head
1 Two screws (+P2 × 2.5)
2 Head band (front)
3 Head band (rear)
5 Chassis
4 Screw (+P2 × 5)

—8 —
SECTION 3
ELECTRICAL ADJUSTMENTS
Notes:
1. The adjustments should be performed in the order given. (As a
generalrulethetransmittersection(TMR-IF630R)adjustments
shouldbe completed before performing the headphones section
(MDR-IF630R) adjustment.)
2. The adjustment and measurements should be performed for both
L-ch and R-ch unless otherwise indicated.
3. L-ch adjustment should be completed before performing R-ch
adjustment
4. Supply 9V dc to the transmitter section (TMR-IF630R) and 2.4 V
dcto theheadphonessection (MDR-IF630R)asthe powervoltage.
HEADPHONES SECTION 0 dBV=315 mVrms
Note:
1. On adjusting the headphones section (MDR-IF630R), use the
transmitter (TMR-IF630R) as a jig.
[ TUNING ADJUSTMENT ]
Preparation:
1. Feed a signal to jig (TMR-IF630R) and connect a power supply
to DC IN jack (J4).
2. Supply DC 2.4 V between VCC and GND on the RX BASE
board.
3. Set RV301 (VOL) on the RX BASE board to the maximum
positon.
4. Set SW301 on the RX BASE board to OFF (NORMAL).
Connection:
Adjustment Procedure:
1. Connect the distortion meter to L+/L–(L-ch) and R+/R–(R-ch).
2. Adjust with L204 (L-ch) and L104 (R-ch) on the RX BASE
board to minimize the reading on the distortion meter.
L-ch L204 minimum
R-ch L104 minimum
AUDIO IN B
jack (J1)
1kHz 315mV (
| 10dBV)
600 ¶
Trans-
mitter
jig
AT T
AF OSC
RX BASE board
L+/L–
R+/R–
+
+
–
100 µ F/16V
distortion mete
r
Adjustment Location :
–RX BASE BOARD (Conductor side)–
L204
Tuning adjustment
(L-ch)
R+
(R-ch)
R-
L+
(L-ch)
L-
(VCC)
(GND)
L104
Tuning adjustment
(R-ch)

MDR-IF630R
4-1. BLOCK DIAGRAM
—9 — — 10 —
SECTION 4
DIAGRAMS
(IR
SENSOR) D301,
D302
(IR
SENSOR) D303,
D304
D306
16
NI-MH
1.2Vx2
+B
Q301-Q303
RF AMP
Q304
BUFFER
(POWER) S10
SW301(1/2)
VOLSOUND MODE
RV301(1/2)
LPF MIXER
L203 2.3 MHz B.P.F L204 2.3MHz DET. COIL
MIXER
IN
16
OSCILLATOR
DEMODULATOR
LIMITER
1
2
MIXER
OUT AF
OUT
3LIMITER
IN
5QUAD COIL 8
9 6
2
7
1
35
8
3
SCAN
CONTROL 13
MUTE
14
AF AMP.
IC201
MIXER / LIMITER / DEMODULATOR
-
+
IC202
EXPANDER
IC203
VOICE ENHANCER IC204
POWER AMP
SP201
SPEAKER
(L-CH)
OUT
Q201
-1
VREF
IN
21 G.CELL
LPF MIXER
L103 2.8MHz B.P.F L104 2.8MHz DET. COIL
MIXER
IN
16
OSCILLATOR
DEMODULATOR
LIMITER
1
2
MIXER
OUT AF
OUT
3LIMITER
IN
5QUAD COIL 8
9 6
2
7
1
35
8
3
SCAN
CONTROL 13
MUTE
14
AF AMP.
IC101
MIXER / LIMITER / DEMODULATOR
-
+
IC301(2/2)
AMP.
IC102
EXPANDER
IC103
VOICE ENHANCER IC104
POWER AMP
SP101
SPEAKER
(R-CH)
OUT
Q101
-1
VREF
IN
67 G.CELL
Signal path.
: RF
: ANALOG
TO
TMR-IF630R
(BATTERY CHARGER)
f
ff
fff
SW301(2/2) RV301(2/2)
VOICE
NORMAL
+
–
+
–
IC301(1/2)
AMP.

MDR-IF630R
4-2. SCHEMATIC DIAGRAM
—11 — — 12 —
•See page 15 for IC Block Diagrams.
Note on Schematic Diagram:
•All capacitors are in µF unless otherwise noted.
pF: µµF 50 WV or less are not indicated except
for electrolytics and tantalums.
•All resistors are in Ωand 1/4W or less unless
otherwise specified.
•A: B+ Line.
•Power voltage is dc 2.4 V and fed with regu-
lated dc power supply from battery terminal.
•Voltages are taken with a VOM (Input imped-
ance 10 MΩ).
Voltage variations may be noted due to normal
production tolerances.
•Signal path.
F: ANALOG
J:RF
SOUND MODE
VOICE
NORMAL
1
2
636 mVp-p
434 nsec
2 IC201 3
1 IC101 3
600 mVp-p
358 nsec
VOLT/DIV : 200 mV
TIME/DIV : 200 ns
VOLT/DIV : 200 mV
TIME/DIV : 200 ns
•Waveforms