Sony MDR-RF415R User manual

MDR-RF415R
AEP Model SERVICE MANUAL
HEADPHONES
Sony Corporation
Audio Entertainment Group
General Engineering Dept.
9-873-075-11
2001B1600-1
© 2001.2
SPECIFICATIONS
Ver 1.0 2001. 02
Headphones MDR-RF415R
Transmitter TMR-RF415R
MDR-RF415R is the component model block one in the MDR-RF415RK.
COMPONENT MODEL NAME FOR MDR-RF415RK
Power source DC 2.4 V: Built-in rechargeable battery
Mass Approx. 240 g (8.5 oz.) incl.
built-in rechargeable battery
Built-in Ni-Cd rechargeable battery
Model name NC-AA
Voltage 1.2 V
Capacity 700 mAh
Design and specifications are subject to change without notice.

2
MDR-RF415R SECTION 1
GENERAL This section is extracted
from instruction manual.
5 Turn up the volume to a moderate level
with the VOL control, then tune the
headphones in to the frequency of the
transmitter with the TUNING control
until you can hear the audio signal
loud and clear.
TUNING
control
VOL control
Auto power on/off function
When you remove the headphones from your
head, the power turns off automatically. Do not
allow the self adjusting band to be pulled up,
otherwise the headphones will be switched on.
The power turns on.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.

3
MDR-RF415R
SECTION 2
DISASSEMBLY
2-1. RX-BASE BOARD
Note : Follow the disassembly procedure in the numerical order given.
3 Remove the
nine solderings.
8 Remove the two solderings.
RX-BASE board
Solder the each lead wires directly to the position as shown
while being cautions of colors.
Precaution for installtion
Precaution for installtion
6 RX-BASE board
9 Switch, push (1 key)
Cover (R), hanger
No.203
No.203 (black)
No.202 (red)
No.201 (green)
No.201
No.204
No.205
No.204
No.202
4 Screw (P 2 × 8)
1 Five screws (P 2 × 6)
2 Set the push
switch (1 key).
Suspender
1 Slide the suspender in the
direction of the arrow.
Claw
Claw
2
5
7

4
MDR-RF415R
No.201
Cover (L), hanger
Cover (L), hanger
No.203
No.201, No.203
No.201, No.203
Groove
Set the lead wires
No.204
No.205
No.202
No.202
No.201
No.203
Set the each lead wires as illustrated below.
Cover (R), hanger
A
B
Cover (R), hanger
Groove
Groove
Groove
Groove
To the driver (030F032//K).
To the RX-BASE board
Groove
To the driver (030F032//K).
B
A

5
MDR-RF415R
SECTION 3
ELECTRICAL ADJUSTMENTS
Notes:
1. Use transmitter with check and adjustment already completed.
2. On adjusting the headphones section, use the transmitter as a
jig.Headphones:MDR-RF415R
Transmitter:TMR-RF415R
Procedure:
1. Connect an oscillator with attenuator and terminator (600 Ω)
to the transmitter AUDIO IN-A connector (J402).
2. Connect anACadapter to the transmitter DC IN 9V jack (J404).
3. Connect lead wires to IC301 pin 4, pin 6, pin 7 and GND on
the RX-BASE board.
4. Connect a resistor 33k Ωbetween IC301 pin 4 and pin 7.
5. Connect lead wires to the speakers’terminals (L+,L-,R+,R-)
on the RX-BASE board.
3-1. Free run frequency check and adjustment
1. Set the transmitterAUDIO IN-A connector (J402) to no signal.
Note: In this case, operation time is about 4 or 5 minutes.
2. Check the transmitter power indicator (red) lights.
3. Set the transmitter CHANNEL switch to 1.
4. Set the headphones tuning (RV303) to center position.
5. Connect a frequency counter to IC301 pin 4 and GND on the
RX-BASE board.
6. Adjust the value of the frequency counter to specification by
RV301 on the RX-BASE board.
Specified Values: 76kHz ±50Hz.
3-2. Receive frequency check and adjustment
1. Set the transmitter CHANNEL switch to 2.
2. Set the transmitter NOISE FILTER switch to OFF.
3. Input a signal of 1kHz, 316mVrms to transmitter
AUDIO IN-A-L connector only.
4. Keep distance transmitter and headphones to 5 meters over.
5. Set the headphones volume (RV302) to minimum.
6. Set the headphones tuning (RV303) to center position.
7.
Connect an oscilloscope CH1 and CH2 to IC301 pin 6 and pin 4.
8. Check the waveform of the oscilloscope to CH1 isdemodulated
1kHz signal and CH2 is GND.
9. If CH1 and CH2 are not satisfied step 8, adjust the coil (L301)
on the RX-BASE board to satisfied step 8.
10. Set the transmitter CHANNEL switch to 1 or 3.
11. Adjust the headphones tuning (RV303) to receive radio
frequency.
12. Check same step 8.
3-3. Carrier modulation check
1. Set the transmitter CHANNEL switch to 2.
2. Set the transmitter NOISE FILTER switch to OFF.
3. Input a signal of 1kHz, 316mVrms to transmitter
AUDIO IN-A-L connector only.
4. Adjust the headphones tuning (RV303) to receive radio
freqency.
5. Set the headphones volume (RV302) to minimum.
6. Connect an oscilloscope CH1 and CH2 to IC301 pin 6 and pin 4.
7. Check the waveform of the oscilloscope to CH1 isdemodulated
1kHz signal and CH2 is GND.
8. Connect an AC volt meter to IC301 pin 6 and GND.
9. Check the value of theAC volt meter to 26mVrms ±2mV
3-4. Separation check
1. Set the transmitter CHANNEL switch to 2.
2. Set the transmitter NOISE FILTER switch to OFF.
3. Input a signal of 1kHz, 316mVrms to transmitter
AUDIO IN-A-L connector only.
4. Adjust the headphones tuning (RV303) to receive radio
freqency.
5. Connect an oscilloscope to CH1 is demodulated 1kHz signal
and CH2 is GND.
6. Check the waveform of the oscilloscope to CH1 isdemodulated
1kHz signal and CH2 is GND.
7. Connect anAC volt meter with LPF to speakers terminal (L+,L-).
8. Adjust the value of the AC volt meter to specification by
headphones volume (RV302).
Specified Value: 155mVrms
9. Connect anAC volt meter with LPF to speakers terminal (R+,R-).
10. Measure the value of theAC volt meter.
11. Check the difference of the L and R to more than 20dB.
12. Input a signal of 1kHz, 316mVrms to transmitter
AUDIO IN-A-R connector only.
13. Connect an AC volt meter to speakers terminal (R+,R-).
14. Adjust the value of the AC volt meter to specification by
headphones volume (RV302).
Specified Value: 155mVrms
15. Connect an AC volt meter to speakers terminal (L+,L-).
16. Measure the value of theAC volt meter.
17. Check the difference of the L and R to more than 20dB.
Adjustment Location : (See page 6)

6
MDR-RF415R
Adjustment Location :
[RX-BASE BOARD]
(Conductor side)
RV303
R323
C334
JC324
power
IC301 7
IC301 4
IC301 6
GND
L–
L+
R–
R+

77
MDR-RF415R
4-1. BLOCK DIAGRAM
SECTION 4
DIAGRAMS
• IC BLOCK DIAGRAM
IC302 LA4533M
POWER
SWITCH MUTE
CIRCIUT
BIAS
1
2
3
4
56
7
8
9
10 MT/SW
OUT1
POWER GND
OUT2
VCC
P/SW
IN1
PRE GND
IN2
REF
AMP2
AMP1
L301
RECEIVE
FREQ.
RV303
TUNE
D301
+V +V
FRONT END
FE UNIT 18 1316 FM IF/
DISCRI DECODE AMP
STEREO
IND
CF301
10.7MHz
26
CF302
10.7MHz
6 2 9
5R-CH
R-CH
RV302
VOLw
SPEAKER
L-CH
SPEAKER
R-CH
AUDIO AMP
IC302
22
20
FM FE
L302
+V
27
AUTO
BLEND
MUTE MONO/ST
SW
1/2
COUNTER
PD1
PD1
VCO
21
REG
RV301
FREE RUN
FREQ.
IF AMP/DECODE
IC301
D304
S1
ON/OFF SW
+
-
B+
Ni-Cd
1.2 x 2
power
R-ch is omitted.
• Signal path.
F: FM

88
MDR-RF415R
4-2. SCHEMATIC DIAGRAM
FREE RUN
FREQ.
5
2.2
0.01
HVU363ATRU
TUNE
VOLw
TLSU124
TO
TMR-RF415R
C345
0.01
B
IC B/D
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or
less are not indicated except for electrolytics and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise specified.
•A: B+ Line.
•H: adjustment for repair.
• Power voltage is dc 2.4 V and fed with regulated dc power supply
from battery terminal.
• Voltages are dc with respect to ground under no-signal conditions.
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production toler-
ances.
• Signal path.
F:FM

99
MDR-RF415R
4-3. PRINTED WIRING BOARD
Ref. No. Location
D301 B-1
D304 B-2
D310 C-2
IC301 A-2
IC302 C-2
• Semiconductor
Location
S1
ON/OFF
SWITCH
SPEAKER
(L-ch)
SPEAKER
(R-ch)
RECHARGEABLE
Ni-cd
NC-AA(HJ)
2pcs,2.4V
RV303
R323
RV303
C334
JC324
TUNE
TO TMR-RF415R (BATTERY CHARGER)
VOLw
power
IC302
IC301
Note on Printed Wiring Board:
•X: parts extracted from the component side.
•a: Through hole.
•: Pattern from the side which enables seeing.
Caution:
Pattern face side: Parts on the pattern face side seen from
(SideB) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.

1010
MDR-RF415R SECTION 5
EXPLODED VIEWS
NOTE:
• -XX, -X mean standardized parts, so they may
have some differences from the original one.
• Items marked “*” are not stocked since they
are seldom required for routine service. Some
delayshould be anticipatedwhenordering these
items.
• Themechanical parts withnoreference number
in the exploded views are not supplied.
• Hardware (# mark) list and accessories and
packing materials are given in the last of this
parts list.
1
2
3
4
5
810
9
11
12
21
13
23
3
4
5
9
1415
6
#3
#2
#3
#1
#1
#1
#1
#1
#1
#2
S1
#2
#3
#2
18
16
19
17
8
20
23
a
a
b
b
7
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
1 3-046-672-01 SUSPENDER
2 3-046-671-11 BAND, HEAD
3 3-046-692-01 PAT, EAR
4 1-542-400-11 DRIVER (030F032//K)
5 3-046-685-01 PLATE (L), FRONT
6 3-046-675-31 HANGER (R)
7 3-846-312-01 SPACER
8 4-992-281-01 HOLDER, BALL SHAFT
9 4-981-975-01 SPRING, TENSION
*10 A-4542-692-A RX-BASE BOARD, COMPLETE
11 3-046-677-11 COVER (R), HANGER
12 3-049-799-01 LIGHT, MDR GUIDE
13 3-046-679-31 CAP (R), ORNAMENTAL
14 3-046-674-11 HANGER (L)
15 3-048-267-01 TERMINAL (MIDWAY), BATTERY
16 3-048-265-01 TERMINAL (+), BATTERY
17 3-048-266-01 TERMINAL (-), BATTERY
18 1-756-112-11 BATTERY, NICKEL CADMIUM
19 3-046-676-11 COVER (L), HANGER
20 3-046-678-31 CAP (L), ORNAMENTAL
21 3-046-682-01 TERMINAL, CHARGE
23 3-048-264-01 SHEET, ORNAMENTAL CAP ADHESIVE
S1 1-771-249-11 SWITCH, PUSH (1 KEY) (ON/OFF)
#1 7-685-104-19 SCREW +P 2X6 TYPE2 NON-SLIT
#2 7-685-105-19 SCREW +P 2X8 TYPE2 NON-SLIT
#3 3-223-909-01 SCREW (B2)
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
SECTION 6
ELECTRICAL PARTS LIST
NOTE:
•Due to standardization, replacements in the
parts list may be different from the parts
specifiedin the diagramsorthe components
used on the set.
•-XX, -X mean standardized parts, so they
may have some difference from the original
one.
•Items marked “*”are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.
•CAPACITORS:
uF: µF
•RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable
•COILS
uH: µH
•SEMICONDUCTORS
In each case, u: µ, for example:
uA...: µA... , uPA... , µPA... ,
uPB... , µPB... , uPC... , µPC... ,
uPD..., µPD...
When indicating parts by reference number,
please include the board name.
*A-4542-692-A RX-BASE MOUNTED BOARD, COMPLETE
*********************************
3-046-682-01 TERMINAL, CHARGE
< CAPACITOR >
C301 1-164-346-11 CERAMIC CHIP 1uF 16V
C302 1-164-005-11 CERAMIC CHIP 0.47uF 25V
C303 1-124-259-11 ELECT 4.7uF 20.00% 16V
C304 1-163-037-11 CERAMIC CHIP 0.022uF 10% 25V
C305 1-163-037-11 CERAMIC CHIP 0.022uF 10% 25V
C306 1-124-234-00 ELECT 22uF 20% 16V
C307 1-163-059-00 CERAMIC CHIP 0.01uF 10.00% 50V
C308 1-124-234-00 ELECT 22uF 20% 16V
C309 1-124-257-00 ELECT 2.2uF 20% 50V
C310 1-104-942-11 ELECT 1uF 20.00% 50V
C311 1-124-233-11 ELECT 10uF 20.00% 16V
C312 1-126-162-11 ELECT 3.3uF 20% 50V
C313 1-163-021-11 CERAMIC CHIP 0.01uF 10.00% 50V
C314 1-164-441-11 CERAMIC CHIP 68PF 5.00% 50V
C315 1-163-235-11 CERAMIC CHIP 22PF 5.00% 50V
C316 1-124-233-11 ELECT 10uF 20.00% 16V
C317 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C319 1-163-021-11 CERAMIC CHIP 0.01uF 10.00% 50V
C320 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C324 1-124-635-00 ELECT 220uF 20.00% 6.3V
C325 1-124-635-00 ELECT 220uF 20.00% 6.3V
C326 1-124-635-00 ELECT 220uF 20.00% 6.3V
C327 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C328 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C329 1-163-021-11 CERAMIC CHIP 0.01uF 10.00% 50V
C330 1-124-242-00 ELECT 33uF 20% 25V
C331 1-163-021-11 CERAMIC CHIP 0.01uF 10.00% 50V
C332 1-163-245-11 CERAMIC CHIP 56PF 5.00% 50V
C333 1-163-222-11 CERAMIC CHIP 5PF 0.25PF 50V
C334 1-164-346-11 CERAMIC CHIP 1uF 16V
C336 1-163-245-11 CERAMIC CHIP 56PF 5.00% 50V
C345 1-163-021-11 CERAMIC CHIP 0.01uF 10.00% 50V
C350 1-164-346-11 CERAMIC CHIP 1uF 16V
C351 1-164-346-11 CERAMIC CHIP 1uF 16V
C352 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C355 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C357 1-163-021-11 CERAMIC CHIP 0.01uF 10.00% 50V
C361 1-163-251-11 CERAMIC CHIP 100PF 5.00% 50V
C362 1-163-251-11 CERAMIC CHIP 100PF 5.00% 50V
C363 1-163-021-11 CERAMIC CHIP 0.01uF 10.00% 50V
C364 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C365 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C366 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
< FILTER >
CF301 1-577-588-11 FILTER, CERAMIC
CF302 1-577-572-11 FILTER, CERAMIC
< DIODE >
D301 8-719-083-90 DIODE HVU363ATRU
D304 8-719-077-16 DIODE TLSU124 (TPJ52) (power)
D310 8-719-975-40 DIODE RB411D
< IC >
IC301 8-752-072-12 IC CXA1538N-T4
IC302 8-759-802-75 IC LA4533MTP-1
< JUMPER >
JC301 1-216-295-11 SHORT 0
JC303 1-216-295-11 SHORT 0
JC305 1-216-295-11 SHORT 0
JC309 1-216-295-11 SHORT 0
JC311 1-216-295-11 SHORT 0
JC324 1-216-295-11 SHORT 0
< COIL >
L301 1-422-317-31 COIL, AIR-CORE
L302 1-412-933-11 INDUCTOR 0.33uH
L304 1-414-234-11 FERRITE 0uH
L305 1-414-234-11 FERRITE 0uH
L306 1-414-234-11 FERRITE 0uH
L307 1-414-234-11 FERRITE 0uH
L308 1-414-234-11 FERRITE 0uH
L309 1-414-234-11 FERRITE 0uH
RX-BASE