Sony KLV-MR32M2 User manual

SERVICE MANUAL
SPECIFICATIONS
MR2 CHASSIS
KLV-MR32M2
LCD Colour TV
China Model
LDM-3210
Power requirements
Power consumption (W)
Stereo/Bilingual system
Channel coverage
B/G
I
D/K
M
8 VHF/UHF (antenna)
Audio output (Speaker)
Display unit LDM-3210 220 V AC, 50/60 Hz
220 V AC, 50/60 Hz
Media receiver unit MBT-MR2
Indicated on the rear of media receiver unit
Television system B/G, I, D/K, M
NICAM Stereo/Bilingual B/G, I, D/K, M
Color system PAL, PAL 60, SECAM, NTSC4.43, NTSC3.58
VHF : E2 to E12 / UHF : E21 to E69 / CATV : S01 to S03, S1 to S41
UHF : B21 to B68 / CATV : S01 to S03, S1 to S41
VHF : C1 to C12, R1 to R12 / UHF : C13 to C57, R21 to R60/
CATV : S01 to S03, S1 to S41, Z1 to Z39
VHF : A2 to A13 / UHF : A14 to A79/
CATV : A-8 to A-2, A to W+4, W+6 to W+84
75-ohm external terminal
10 W + 10 W (4Ω)
MBT-MR2

KLV-MR32M2 (CH) 2
Desi
g
n and specifications are sub
j
ect to chan
g
e without notice.
WOOFER OUT (VAR)
i(Headphones)
Display resolution
Screen size
Dimensions (w/h/d, mm)
Mass (kg)
Output: 1 Phono jack
Output: 1 Stereo minijack
1280 pixels × 768 pixels
32 inches
Display unit LDM-3210:
Media receiver unit MBT-MR2: 430 × 79 × 343 mm
1052 × 569 (635) × 97 (229) mm (with stand)
Display unit LDM-3210: 23 (30) kg (with stand)
Media receiver unit MBT-MR2: 4.7 kg
Number of terminal
VIDEO (Video)
AUDIO (Audio)
S VIDEO
(S Video)
COMPONENT
VIDEO IN
(Component Video)
COMPONENT
VIDEO IN
(G/B/R/HD/VD
Video)
5PC– CENTER SP IN
(Center Speaker)
Input: 4 Output: 1 Phono jacks; 1 Vp-p, 75 ohms
Input: 6 Output: 1 Phono jacks; 500 mVrms
Input: 4 Y: 1 Vp-p, 75 ohms,
unbalanced, sync negative
C: 0.286 Vp-p, 75 ohms
Input: 2 Phono jacks
Y: 1 Vp-p, 75 ohms, sync negative
PB/CB: 0.7 Vp-p, 75 ohms
PR/CR: 0.7 Vp-p, 75 ohms
Audio: 500 mVrms
Input: 1 Phono jacks
G: 0.7 Vp-p, 75 ohms
B: 0.7 Vp-p, 75 ohms
R: 0.7 Vp-p, 75 ohms
HD: 0.7 Vp-p, 75 ohms
VD: 0.7 Vp-p, 75 ohms
Input:1 120 W max., 8 ohms

KLV-MR32M2 (CH) 3
SAFETY CHECK-OUT
After correcting the original service problem, perform the
following safety checks before releasing the set to the customer:
1. Check the area of your repair for unsoldered or poorly-sol-
dered connections. Check the entire board surface for solder
splashes and bridges.
2. Check the interboard wiring to ensure that no wires are
“pinched” or contact high-wattage resistors.
3. Check that all control knobs, shields, covers, ground straps,
and mounting hardware have been replaced. Be absolutely cer-
tain that you have replaced all the insulators.
4. Look for unauthorized replacement parts, particularly transis-
tors, that were installed during a previous repair. Point them
out to the customer and recommend their replacement.
5. Look for parts which, though functioning, show obvious signs
of deterioration. Point them out to the customer and recom-
mend their replacement.
6. Check the line cords for cracks and abrasion. Recommend the
replacement of any such line cord to the customer.
7. Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC Leakage.
Check leakage as described right.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indica-
tion is 0.75 V, so analog meters must have an accurate low-
voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex-
amples of a passive VOMs that are suitable. Nearly all battery
operated digital multimeters that have a 2 V AC range are suit-
able. (See Fig. A)
Fig. A. Using an AC voltmeter to check AC leakage.
1.5 k Ω 0.15 µF
AC
Voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
WARNING!!
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY SHADING AND MARK !
ON THE SCHEMATIC DIAGRAMS, EXPLODED VIEWS
AND IN THE PARTS LIST ARE CRITICAL FOR SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY. CIRCUIT ADJUSTMENTS THAT ARE
CRITICAL FOR SAFE OPERATION ARE IDENTIFIED IN
THIS MANUAL. FOLLOW THESE PROCEDURES WHEN-
EVER CRITICAL COMPONENTS ARE REPLACED OR
IMPROPER OPERATION IS SUSPECTED.
AVERTISSEMENT!!
ATTENTION AUX COMPOSANTS RELATIFS À LA
SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE TRAME ET
UNE MARQUE ! SONT CRITIQUES POUR LA
SÉCURITÉ. NE LES REMPLACER QUE PAR UNE
PIÈCE PORTANT LE NUMÉRO SPECIFIÉ. LES
RÉGLAGES DE CIRCUIT DONT L’IMPORTANCE EST
CRITIQUE POUR LA SÉCURITÉ DU
FONCTIONNEMENT SONT IDENTIFIÉS DANS LE
PRÉSENT MANUEL. SUIVRE CES PROCÉDURES
LORS DE CHAQUE REMPLACEMENT DE
COMPOSANTS CRITIQUES, OU LORSQU’UN MAUVAIS
FONCTIONNEMENT EST SUSPECTÉ.

KLV-MR32M2 (CH) 4
SELF DIAGNOSIS FUNCTION
1. Outline of Self-Diagnosis Function
•This device includes a self-diagnosis function.
•In case of abnormalities, the POWER/STANDBY indicator sutomatically blinks.
•It is possible to predict the sbnormality location by the number of blinks.
•The instruction manual describes blinking of the POWER/STANDBY indicator.
•If the symptom is not reproduced sometime in case of a malfunction, there is recording of whether a malfunction was generated or
not.
Operate the remote command to confirm the matter on the screen and to predict the location of the abnormality.
2. Diagnosis Iteams and Prediction of Malfunction Location
•When a malfunction occure the POWER/STANDBY indicators only blinks for one of the following diagnosis items.
•In case of two or more malfunctions, the item which first occurred blinks.
If the malfunctions occurred simultaneously, the item whith the lower blink count blinks first.
<Maifunction location by the number of blinks>
Number of times
symptom
POWER/STANDBY
Indicators blinks
4 times (RED) Fan Error
6 times (RED) Low-B Error
9 times (RED) Panel Module Error (Display Unit Error)

KLV-MR32M2 (CH) 5
TABLE OF CONTENTS
SAFETY CHECK-OUT ....................................... 3
SELF DIAGNOSIS FUNCTION .......................... 4
1. DISASSEMBLY ............................................ 1-1
1-1. DISPLAY UNIT (LDM-3210) .......................... 1-1
1-1-1. STAND AND REAR COVER REMOVAL . 1-1
1-1-2. DES BOARD REMOVAL ............................ 1-1
1-1-3. SHIELD CASES AND MAIN ARMS
REMOVAL .................................................... 1-2
1-1-4. K BOARD REMOVAL ................................. 1-2
1-1-5. G1 BOARD REMOVAL ............................... 1-3
1-1-6. R1 AND R2 BOARDS REMOVAL ............. 1-3
1-1-7. LCD PANEL REMOVAL ............................. 1-4
1-2. MEDIA RECEIVER UNIT (MBT-MR2) ......... 1-5
1-2-1. PANEL AND COVERS REMOVAL ........... 1-5
1-2-2. SPM BOARD REMOVAL ............................ 1-6
1-2-3. H1, H2 AND H3 BOARDS REMOVAL ...... 1-6
1-2-4. HM BOARD REMOVAL ............................. 1-7
1-2-5. J1 AND J2 BOARDS REMOVAL ............... 1-7
1-2-6. BD, M AND MS2 BOARDS
REMOVAL .................................................... 1-8
1-2-7. A BOARD REMOVAL ................................. 1-9
1-2-8. G BOARD REMOVAL ................................. 1-9
2. ADJUSTMENT .............................................. 2-1
2-1. SERVICE MODE ............................................... 2-1
2-1-1. METHOD OF SETTING THE
SERVICE MODE.. ........................................ 2-1
2-1-2. ADJUSTMENT ITEMS AND
KEY OPERATION. ....................................... 2-1
2-1-3. METHOD OF ENDING
SERVICE MODE .......................................... 2-1
2-1-4. SERVICE MODE LIST ................................. 2-2
3. DIAGRAMS ................................................... 3-1
3-1. BLOCK DIAGRAMS ........................................ 3-1
3-1-1. DISPLAY UNIT (LDM-3210) ...................... 3-1
(1) DES, R1 and R2 Boards ............................... 3-1
(2) K Board .......................................................... 3-2
(3) G1 Board ........................................................ 3-3
3-1-2. MEDIA RECEIVER UNIT (MBT-MR2) ..... 3-4
(1) A (1/2) and H1 (2/1) Boards .......................... 3-4
(2) A (2/2), H1 (2/2), H2, H3 and
SPM Boards ................................................... 3-5
(3) J1 Board ......................................................... 3-6
(4) HM and MS2 Boards ..................................... 3-7
(5) BD Board ....................................................... 3-8
(6) J2 and M (1/2) Boards ................................... 3-9
(7) M (2/2) Board ............................................... 3-10
(8) G Board .......................................................... 3-11
3-2. FRAME DIAGRAM .......................................... 3-12
3-3. CIRCUIT BOARDS LOCATION ..................... 3-13
3-3-1. DISPLAY UNIT (LDM-3210) ...................... 3-13
3-3-2. MEDIA RECEIVER UNIT (MBT-MR2) ..... 3-13
3-4. SCHEMATIC DIAGRAMS AND PRINTED
WIRING BOARDS ............................................ 3-13
3-4-1. DISPLAY UNIT (LDM-3210) ...................... 3-14
(1) Schematic Diagram of DES Board ................ 3-14
(2) Schematic Diagram of G1 Board .................. 3-23
(3) Schematic Diagram of K Board .................... 3-25
(4) Schematic Diagram of R1 Board ................... 3-27
(5) Schematic Diagram of R2 Board ................... 3-27
3-4-2. MEDIA RECEIVER UNIT (MBT-MR2) ...... 3-28
(1) Schematic Diagram of A Board .................... 3-28
(2) Schematic Diagram of BD Board .................. 3-34
(3) Schematic Diagram of G Board .................... 3-40
(4) Schematic Diagram of H1 Board .................. 3-42
(5) Schematic Diagram of H2 and H3 Boards .... 3-43
(6) Schematic Diagram of HM Board ................. 3-44
(7) Schematic Diagram of J1 Board .................... 3-45
(8) Schematic Diagram of J2 and SPM Boards .. 3-47
(9) Schematic Diagram of M Board .................... 3-48
(10) Schematic Diagram of MS2 Board................ 3-52
3-5. SEMICONDUCTORS ....................................... 3-57
4. EXPLODED VIEWS ...................................... 4-1
4-1. DISPLAY UNIT-1 (LDM-3210) ....................... 4-2
4-1-1. DISPLAY UNIT-1 ......................................... 4-2
4-1-2. DISPLAY UNIT-2 ......................................... 4-3
4-1-3. DISPLAY UNIT-3 ......................................... 4-4
4-1-4. DISPLAY UNIT-4 ......................................... 4-5
4-2. MEDIA RECEIVER UNIT (MBT-MR2) ......... 4-6
4-2-1. MEDIA RECEIVER UNIT-1 ........................ 4-6
4-2-2. MEDIA RECEIVER UNIT-2 ........................ 4-7
4-2-3. MEDIA RECEIVER UNIT-3 ........................ 4-8
4-2-4. MEDIA RECEIVER UNIT-4 ........................ 4-9
4-3. PACKING MATERIALS FOR DISPLAY UNIT
(LDM-3210) ...................................................... 4-10
4-4. PACKING MATERIALS FOR MEDIA
RECEIVER UNIT (MBT-MR2) ........................ 4-11
5. ELECTRICAL PARTS LIST ........................ 5-1

KLV-MR32M2 (CH) 1-1
1-1. DISPLAY UNIT (LDM-3210)
1-1-1. STAND AMD REAR COVER REMOVAL
SECTION 1
DISASSEMBLY
1-1-2. DES BOARD REMOVAL
1Four screws
(+PSW 5X16)
3Five screws
(+PSV 4X10)
2Stand assy
4Rear cover
1Twenty fouur screws
(+BVTT 3X6)
5Five screws
(+BVTT 3X6)
3Two screws
(M2.6S HEAD EG)
4Two screws (HEX)
2Shieid case,S32 (center)
6DES board

KLV-MR32M2 (CH) 1-2
1-1-3. SHIELD CASES AND MAIN ARMS REMOVAL
1-1-4. K BOARD REMOVAL
1Three screws
(+BVTT 3X6)
2Shield case,32 (R)
8Shield case,32 (L)
5Main arm,S32 (R)
qa Main arm,S32 (L)
3Two screws
(+BVTT 4X10)
3Two screws
(+BVTT 4X10)
4Three screws
(+PSW 5X10)
0Three screws
(+PSW 5X10)
9Two screws
(+BVTT 4X10)
9Two screws
(+BVTT 4X10)
7Three screws
(+BVTT 2.6X4)
6Four screws
(+BVTT 3X6)
1Five screws
(+BVTT 3X6)
2K board

KLV-MR32M2 (CH) 1-3
1-1-5. G1 BOARD REMOVAL
1-1-6. R1 AND R2 BOARDS REMOVAL
1Eight screws
(+BVTT 3X6)
2G1 board
1Two screws
(+BVTP 3X12)
4Two screws
(+BVTP 3X12)
3R1 board
6R2 board
2PWB-R bracket
2PWB-R bracket
5PWB-R bracket
5PWB-R bracket

KLV-MR32M2 (CH) 1-4
1-1-7. LCD RANEL REMOVAL
3Eight screws
(+BVTP 4X10)
5Eight screws
(+BVTP 4X10)
1Three screws
(+BVTT 3X6)
2S32,chassis
4Panel support,S32 upper 7LCD panel
6Panel support,S32 lower

KLV-MR32M2 (CH) 1-5
1-2. MEDIA RECEIVER UNIT (MBT-MR2)
1-2-1. PANEL AND COVERS REMOVAL
1Four screws
(M3,SW)
3Two screws
(M3,SW)
3Three screws
(M3,SW)
5Two screws
(HEX)
2Top cover
8Rear panel assy
9Fan block (L) assy
0Front panel assy
4Eight screws
(+BVTP 3x12)
7Screw
(+PSW 4x8)
6Two screws
(GRIP,M2.6 S HEAD)

KLV-MR32M2 (CH) 1-6
1-2-2. SPM BOARD REMOVAL
1-2-3. H1, H2 AND H3 BOARDS REMOVAL
Rear panel
5Two screws
(M3,SW)
1Two screws
(+BVTP 3x12)
3Screw
(+PSW 3x5)
6AC Inlet
2SPM board
4RF spliter
Front panel assy
1Five screws
(+BVTP 3x12)
3Three screws
(+BVTP 3x12)
5Three screws
(+BVTP 3x12)
2H1 board
4H3 board
6H2 board

KLV-MR32M2 (CH) 1-7
1-2-4. HM BOARD REMOVAL
1-2-5. J1 AND J2 BOARDS REMOVAL
Front panel assy
1Two screws
(+BVTP 3x12)
3Screw
(+BVTP 3x12)
4HM board
2HMP bracket
1Screw
(+PSW 3x8)
3Two screws
(M3x6,P,SW(+))
5Two rivet,nylon
2D block assy
6J2 board
4J1 board

KLV-MR32M2 (CH) 1-8
1-2-6. BD, M AND MS2 BOARDS REMOVAL
4Four screws
(M3x6,P,SW(+))
6Two screws
(M3x6,P,SW(+))
9Two screws
(M3x6,P,SW(+))
qj Four screws
(M3x6,P,SW(+))
qk M board
qf Two screws
(HEX)
qa Two screws
(M3x6,P,SW(+))
0Holder,DIC PWB (MSB)
qs Holder,DIC PWB (MSA)
7Four screws
(M3x6,P,SW(+))
8MS2 board
qd BD board
5Case (UP),D block shield
1Connector assy 2P
2LVDS connector assy
3Lead wire connector (LVDS)
qg Two screws
(GRIP,M2.6 S HEAD)
qh Case(REAR),D block shield

KLV-MR32M2 (CH) 1-9E
1-2-7. A BOARD REMOVAL
1-2-8. G BOARD REMOVAL
1Four screws
(+PSW 3x8)
3Two pin cable
2A board
1Seven screws
(+PSW 3x8)
2G board

KLV-MR32M2 (CH) 2-1
SECTION 2
ADJUSTMENTS
2-1. SERVICE MODE
•By using remote commander (RM-1028), all circuit
adjustment can be made.
2-1-1. METHOD OF SETTING THE SERVICE
MODE.
1. Standby mode. (power off)
2. On the remote command button. (Press each button within a
second)
DISPLAY →10KEY<5> →VOL<+> →POWER
2-1-2. ADJUSTMENT ITEMS AND KEY
OPERATION.
ITEM KEY OPERATION
Change the Category 2(UP), 5(down)
Change the Item 1(UP), 4(down)
Change the Value 3(UP), 6(down)
Read Data from NVM 7→-
Write Data to NVM MUTE →-
Test Reset NVM Data 8→-
2-1-3. METHOD OF ENDING SERVICE MODE
•When ending service mode, turn the power switch OFF on the
remote commander or the main unit.

KLV-MR32M2 (CH) 2-2
2-1-4. SERVICE MODE LIST
CATEGORY DATA
No Name
OSD 0 OSV 20
1 FW1 7
2 FW2 20
ITEM
CATEGORY DATA
No Name
MSP 0 WST 21
1 WBT 236
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
WLL
WAC
WDL
NDL
SDL
AGC
REL
CRM
ACO
FP
FPM
FH2
FH2M
FH3
FH3M
WGP
NIP
ERR
VOL
5
ITEM
No Name
ITEM
1
48
32
16
1
40
0
DATA
48
40
62
0
0
0
0
1
2
2
1
1
27
54
27
54
27
54
28
127
80
48
0
1
2
3
4
5
6
8
9
10
11
TEXT TXH
TXV
THD
TVD
HPL
VPL
FPL
TBR
NOP
TCH
DRC
CATEGORY
No Name
ITEM DATA
2
7
TEXT FMD
CATEGORY

KLV-MR32M2 (CH) 2-3
CATEGORY DATA
No Name
POWR 0 DLY1 12
1 DLY2
2 DLY3
ITEM
CATEGORY DATA
No Name
OPM 0 APC
2 AFM
3
4
5
6
7
8
10
11
12
13
14
DBL
SSO
SCH
SCA
LBB
23P
TUT1
TUT2
TUT3
TUTW
3NR
1
5
5
5
5
ITEM
1
1
1
1
1
1
1
1
0
0
CATEGORY DATA
No Name
OPM 15 SIG
16 NSIG
ITEM
0
0
0
0
No Name
ITEM
ITEM
DATA
2
Zoom50
15
1
No
9
TSY
Name
VLIM
WDZM50
15
WDZM60
15
CATEGORY
CATEGORY
Zoom60
SD
DATA
OPM
OPM
15
ITEM
Zoom50
15
No
9
Name
VLIM
WDZM50
15
WDZM60
15
CATEGORY
Zoom60
HD
DATA
OPM 15
RF Video
No Name
ITEM DATA
*
0
PFED PFED
CATEGORY
No Name
ITEM DATA
00
GUID GUID
CATEGORY
*:Decimal

KLV-MR32M2 (CH) 2-4E
ITEM
Data
10
No
5
Name Data
10
Data
10
CATEGORY
Data
DATA
PIC 10
0
6000
0
010
No Name
ITEM DATA
*
0
SRV COM
CATEGORY
*:Decimal
CATEGORY
No Name
Dynamic Standard Hi-Fine Personal Dynamic Standard Hi-Fine Personal Dynamic Standard Hi-Fine Personal
PIC 0 PIC 100 80 60 50
1 COL 52 56 50 50 60 60
2 BRI 47 50 50 50 47
3 HUE 50 50 50 50 50
4 SHP 60 60 60 50 70 70 70
ITEM DATA
N50
100 80 60
50
50 50
50 50
N61 S32
50
50
50
50
50
50
50
50
50
50
65 63
47
50
50 50 50
100 80 60
50
50 50
50 50
BLLV
CTMP
Dynamic Standard Hi-Fine Personal
ITEM
Data
50
No
0
Name Data
50
Data
50
CATEGORY
Data
DATA
SOU 50
50
50 50 50
1
BAS
TRE
Dynamic Standard Hi-Fine Personal
ITEM
Data
No
7
Name Data Data
CATEGORY
Data
DATA
PIC PIOF
Dynamic Standard Hi-Fine Personal
CATEGORY DATA
No Name
OPB 0 OP0 60
75
60
32
1 OP1
3 OP3
ITEM
4OP4
CATEGORY DATA
No Name
OPB 2 OP2
ITEM
1

KLV-MR32M2 (CH) 3-1
3-1. BLOCK DIAGRAMS
3-1-1. DISPLAY UNIT (LDM-3210)
(1) DES, R1 and R2 Boards
SECTION 3
DIAGRAMS
17
18
9
10
1
2
24
23
DATA0-
DATA0+
DATA1-
DATA1+
DATA2-
DATA2+
CLOCK-
CLOCK+
D3115,3116
LIMITTER
R0-
R0+
R1-
R1+
R2-
R2+
RC-
RC+
6
7
1
14
DDC SCL
DDC SDA
HOTPLUG DET
+5V POWER
7
2
IC3104
6
3
87
86
84
83
81
80
90
89
RX0-
RX0+
RX1-
RX1+
RX2-
RX2+
RXC-
RXC+
QE
QE
QE
0DLK
DE
VSYNC
IC3109
TMDS RECEIVER
93
92
DDC SCL
DDC SDA
Q3122
5V_4
3.3V
D3118
IC3111(1/2)
6
5
I/O EX
23
22
20
SDA
SCL
19
Q3108 EEPROM
WC
SDA
SCL
11
15
14
1
4
2
5
12
5
6
13
3
SERIAL BUS SW
DECODER 6
3.3V_2
Q3113
SDA
SCL
PROM SCL
PROM SDA
9
10
18
1
16
17
4
SCDT
95
96
8
B5
B13
B7
B11
B6
B8
B9
A7
A8
A10
A11
A13
A3
A1
A6
A4
POWER ON
STBY
CABLE DAT
RESET
MODE
RXD
TXD
JIG
SIRCS+
SIRCS-
SPDIF+
SPDIF-
UART_I+
UART_I-
UART_O+
UART_O-
CN3101
TXD-
TXD+
6
5
7
8
8
6
5
LINE DRIVE/RECEIVER
D/A CONVERTER
9
8
11
12
1
2
3
4
5
6
8
3.3V_4
RV
GY
BU
CLKO
DE1
VS1
HSCS1
30-37
20-27
10-17
R0I-R7I
G0I-R7I
B0I-R7I
HSCS1
44
46
47
48
RAO
GAO
BAO
VSO
HSO
DEO
SDATA
CPU LVDS TRANSMITTER
IC3801
CORBU-LVDS
(R2-R9)
(G2-G9)
CORBU-LVDS
CORBU-LVDS
(B2-B9)
TC5
TC4
TC6
CLKIN
28
27
30
31
32
426
399
427
52
VSO
HSO
DEO
CLKO
18
17
15
14
12
11
9
8
6
5
TD+
TD-
TCLK+
TCLK-
TC+
TC-
TB+
TB-
TA+
TA-
CN3801
48
47
46
45
42
41
40
39
38
37
TA-
TA+
TB-
TB+
TC-
TC+
TCLK-
TCLK+
TD-
TD+
CAS
CS,RAS
WE,CKE
BA0,1
CK,CK
DM
DQS
DQ0-DQ31
A0-A11
A0-A11
DQ00-31
DQS
DM0-3
CK9,CKN
BA0,1
WEN,CKE
CSN,RASN
CASN
AUR32-42,54
AUR0-31
AUR53
AUR55-58
AUR51-52
AUR44,45
AUR49,50
AUR46,47
AUR48
2
18
A
DQ
DQS
BUS SW
22
SDA
SCL
WP
EEPROM
5
6
48
46
49
47
42
8
3
3.3V_4
SDA
SCL
21
20
13
14
Q3120
Q3121
3.3V
6
4
1
13
10
2
12
9
3
2
5
6
5V_4
5
3
11
8
1
7
6
5
2
1
IC3308(2/2)
IC3111(2/2)
Q3101
1
2
6
5
3
2
2
3
26
25
33
57
83
82
84
13
IC3301
SCL
SDA
39
38
FLASH MEMORY
IC3403
MCUA 1-12
AS,RD,WRO
WR1,CS1,CLK
BUS SW
MCUD 0-15
47
48
47
48
IC3602
DDR SDRAM
TO
PDP
UNIT
Q3110
DES
HSYNC
DCKI
DE1
VS1
7
IC3110 BUFFER
IC3101
3
7
2
2
2
4
32
12
8
8
88
8
8
12
16
DISPLAY UNIT
(WHITE CABLE)
TO
IC3306
I/O17
SCL
SDA
I/O16
I/O10
I/O11
I/O15
INT
I/O13
I/O14
I/O00
SP_PROT
G_PROT
LED_R2
LED_G1
LED_G2
AU_RES
LED_W
LED_B
LED_G2
AU_MUTE
SCL
SDA
AO4
AO3
AO2
AO1
AO12
AO11
I/O 04
I/O 05
AO5
AO6
AO8
Q3303
TO
(BLACK CABLE)
DISPLAY UNIT
RXD+
RXD-
SPDIF+
SPDIF-
SIRCS+
SIRCS-
IC3103 IC3102
IC3108 IC3107
IC3404
30
20
29
28
80
76
21
SDA2_I
SDA2_O
SCL2_I
SCL2_O
NVM_WP
TEST SW
SO0
SI0
SCL1
SDA1
WAKE UP
SO1
SI1
SW_1
RESET
CABLE DET
7
IC3308(1/2)
A1-A20
BUS_SW
D0-D15
PLLBP
SW_2 CLS
INTVS2
INTVS1
RY/DY
INV_FAIL
LED_ON
POWER ON
AC SW
PANEL ON
THERMO G
INTVS0
PANEL MCU
IC3401
20
MCUA 1-20
41
67
68
16
17
18
40
20
MCUA 1-20
16
MCUD 0-15
3
RD,CSO,WRO
15
A0-A19
D0-D15/A-1
CE,WE,OE
RY/BY
THERMO_G
3
7LCD12ON
POWER_ON
CPUA1-12
CPUD0-15
12
CPUA1-12
CPUCLK
3
CPUCS_X
CPUWR1_X
CPUAS_X
CPURD_X
3
CPUWRO_X
CPUD0-15
16
PLLBP
CL_X
INTVS1
INTVS2
INTVS0
IC3501
2.5V REG
IC3302
2.5V
3.3V_2
IC3203
3.3V REG
5V REG
5V
IC3204
Q3304
5V_4 5V REG
IC3304
STBY
5V
Q3306
5
3
1
BL BRT
BL ON
INV FAIL
CN3802
10
9
8
7
6
3
1
AU_RES
AU_MUTE
SP_PROT
SCL
SDA
SPDIF
3.3V
CN3301
12
11
10
9
8
7
5
4
CN701
STBY5V
SIRCS
MUTE
TIMER2
TIMER1
POWER
STBY
SAVING(NC)
1
2
4
5
6
7
8
9
9
8
7
5
1,2
16.5V
THERMO G
POWER_ON
STBY6V
24V
CN3201
Q3305
INV_FAIL
BL_ON
BL_BRT
SDA
SCL
STBY5V
2
1
LOGO
STBY5V
CN751
1
2
CN3302
LED_B
LED_G2
LED_R1
LED_G1
LED_R2
LED_W
TO
D
K BOARD
CN5001
CN6302
G1 BOARD
C
TO
Q751
Q754
LED
DRIVE LOGO
Q754
Q751
STBY5V
IC701
SIRCS STBY5V
(CPU,LVDS TRANSMITTER,TMDS RECEIVER)
DRIVE
LED
Q706
Q701
D701
POWER
TIMER
D7013
MUTE
D705
R2
R1
7
IC3307
7
3
3
CL_X
INTVS1
INTVS2,0
PLLBP
IC3406
IC3405
5V
Q3123
3.3V_4
CN3102
3.3V_2
Q3105
3
2
IC3201
1
5V_4 5I/O 01
24V
AC DET
SCDT
TMDS_ON
6
BL_BRT
D3108-D3111
OVER VOLTAGE PROTECTOR
2
1
RESET
IC3402
3.3V_4
RESET
Q3123
XTB
XTO
29
30
X3701
24MHz
XO
XI 53
54
X3401
16.5MHz
RES
D3404
56
BL_ON
12
D3302
26-30 5V
5V
3.3V
SP_PR0T
IC3603
DDRAM
TERM.
SUPPLY
16
14 2.5V
3.3V
16.5V
24V
FL3201
LCD12ON
POWER_ON
THERMO G
Q3106,3107
D3213
3.3V_4
IC3304
3.3V REG
Q3307
IC3302
3.3V REG
1.8V
3.3V
4
3
1
SCL B
SDA B
3.3V
CN3307
3.3V
SDA
SCL
TO
A
K BOARD
CN5201
PDWN

KLV-MR32M2 (CH) 3-2
Q5001
+3.3V
CN3301
DES BOARD
TO
D
K(AUDIO PROCESSOR)
1
9
8
10
7
6
3
+3.3V
MUTE
SP_PROT
RES
SCL2
SDA2
SPDIF
CN5001
27
MCCKO2
23
33
44
TRANSCEIVER
RX1 SDTO
LRCKSDA
24
DIGITAL AUDIO
IC5001
SCL
PDN
BICK
INT1
34
31
26
37 28
1
17
PWM_AM_R
MCLK_IN
SCLK
IC5002
AUDIO PROCESSOR
34
LRCLK PWM_AM_L
PWM_AP_L
SDIN
19
18
35
PWM_AP_R
29
VALID_L
23
MUTE
RESET
7
10
9
8
6
4
5
2
1
3
IC5004
Q5003 OVER OUTPUT
PROTECT
SHOTDOWN
RESET
PWDN
PWM-BM
PWM-BP
OUTPUTA
OUTPUTAPWM-AP
14
15
13
1
16
5
27
26
AUDIO OUTPUT
IC5003
PWM-AM
22
23
OUTPUTB
OUTPUTB
Q5004-5007
4
3
2
1
R+
R-
L-
L+
CN5002
L
R
1-2AUDIO VCC
CN5003 F5001 ACTIVE
FILTER VCC REG
Q5008,5009 Q5002 17
32
PVDDB2
PVDDA2
18
LDROUTB
LDROUTA
31
Q5012
REG
D5003
D5009
28
PVDDA1
PVDDB1
21
PVDDB1
20
PVDDA1
29
4
3
1
SCL B
SDA B
3.3V
CN5201
A
TO
DES BOARD
CN3307
2
SCL
SDA
VCC
8
1
SENSOR
TEMPERATURE
DIGITAL
IC5201
AUDIO AUDIO AUDIO L
AUDIO R
AUDIO R
AUDIO L
CN6301
G1 BOARD
TO
B
2
(2) K Board