Sony Hbd-dz330 User manual

SERVICE MANUAL

Sony Corporation

Audio&Video Business Group

Published by Sony Techno Create Corporation

SPECIFICATIONS

DVD RECEIVER

9-889-805-01

2010C04-1

AEP Model

HBD-DZ330/DZ730

UK Model

HBD-DZ330

Russian Model

HBD-DZ710

Ver. 1.0 2010.03

• HBD-DZ330/DZ710/DZ730 are the ampliﬁer, DVD/CD and

tuner section in DAV-DZ330/DZ710/DZ730.

Model Name Using Similar Mechanism HBD-DZ170/DZ171/

DZ175/DZ310/DZ510/

DZ610/DZ810

Mechanism Type CDM85MB-DVBU102

Optical Pick-up Name KHM-313CAA

This system incorporates with Dolby* Digital and Dolby Pro Logic (II)

adaptive matrix surround decoder and the DTS** Digital Surround System.

* Manufactured under license from Dolby Laboratories.

Dolby, Pro Logic, and the double-D symbol are trademarks of Dolby

Laboratories.

** Manufactured under license under U.S. Patent #’s:

5,451,942; 5,956,674; 5,974,380; 5,978,762; 6,487,535 & other U.S. and

worldwide patents issued & pending. DTS and DTS Digital Surround

are registered trademarks and the DTS logos and Symbol are trademarks

Ampliﬁer Section

(DAV-DZ330/DAV-DZ730)

POWER OUTPUT (rated):

Front L + Front R 108 W + 108 W (at 3 ohms,

1 kHz, 1% THD)

POWER OUTPUT (reference):

Front L/Front R/Center/

Surround L/Surround R:

167 watts (per channel at 3

ohms, 1 kHz)

Subwoofer: 165 watts (at 3

ohms, 80 Hz)

Inputs (Analog)

TV (AUDIO IN) Sensitivity: 450/250 mV

AUDIO IN Sensitivity: 250/125 mV

Inputs (Digital)

TV (Audio Return Channel/OPTICAL IN)

Input Stream: Dolby

Digital 5.1ch/DTS 5.1ch/

Linear PCM 2ch

(Sampling Frequency: less

than 48 kHz)

Ampliﬁer Section

(DAV-DZ710)

POWER OUTPUT (rated):

Front L + Front R 108 W + 108 W (at 3 ohms,

1 kHz, 1% THD)

POWER OUTPUT (reference)

Front L/Front R/Center/

Surround L/Surround R:

167 watts (per channel at 3

ohms, 1 kHz)

Subwoofer: 165 watts (at 3

ohms, 80 Hz)

Inputs (Analog)

TV (AUDIO IN) Sensitivity: 450/250 mV

MIC1 Sensitivity: 1 mV

MIC2 Sensitivity: 1 mV

Inputs (Digital)

TV (Audio Return Channel/OPTICAL IN)

Input Stream: Dolby

Digital 5.1ch/DTS 5.1ch/

Linear PCM 2ch

(Sampling Frequency: less

than 48 kHz)

Super Audio CD/DVD System

Laser Diode Properties Emission Duration:

Continuous

Laser Output: Less than

44.6 μW

* This output is the value measurement at a distance

of 200 mm from the objective lens surface on the

Optical Pick-up Block with 7 mm aperture.

Signal format system PAL/NTSC

USB Section

(USB) port:

Maximum current: 500 mA

Tuner Section

System PLL quartz-locked digital

synthesizer

Tuning range

North American models: 87.5 MHz - 108.0 MHz

(100 kHz step)

Other models: 87.5 MHz - 108.0 MHz (50

kHz step)

Antenna (aerial) FM wire antenna (aerial)

Antenna (aerial) terminals 75 ohms, unbalanced

Intermediate frequency 10.7 MHz

– Continued on next page –

HBD-DZ330/DZ710/DZ730

SAFETY-RELATED COMPONENT WARNING!

COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE

WITH MARK 0ON THE SCHEMATIC DIAGRAMS AND IN

THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.

REPLACE THESE COMPONENTS WITH SONY PARTS

WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS

MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

Video Section

(DAV-DZ330/DAV-DZ730)

Outputs VIDEO: 1 Vp-p 75 ohms

R/G/B: 0.7 Vp-p 75 ohms

HDMI OUT: Type A (19

pin)

Video Section

(DAV-DZ710)

Outputs VIDEO: 1 Vp-p 75 ohms

COMPONENT:

Y: 1 Vp-p 75 ohms

PB/CB, PR/CR: 0.7 Vp-p

75 ohms

HDMI OUT: Type A (19

pin)

General

Power requirements 220 V - 240 V AC,

50/60 Hz

Power consumption

DAV-DZ330 On: 170 W

Standby: 0.25 W*

DAV-DZ710/DAV-DZ730 On: 175 W

Standby: 0.25 W*

* Valid when the system is in the following status:

– “DEMO” is set to “OFF.”

– [CONTROL FOR HDMI] is set to [OFF].

– “S-AIR STBY” is set to “STBY OFF.” (DAV-DZ710/

DAV-DZ730)

Dimensions (approx.) 430 mm ×66 mm ×385

mm (w/h/d) incl.

projecting parts

Mass (approx.) 4.4 kg

Supported ﬁle format

MP3 (MPEG 1 Audio Layer-3)

File Extension: mp3

Bitrate: 32 kbps - 320 kbps

Sampling frequencies: 32/44.1/48 kHz

WMA (USB device only)

File Extension: wma

Bitrate: 48 kbps - 192 kbps

Sampling frequencies: 44.1 kHz

AAC (USB device only)

File Extension: m4a

Bitrate: 48 kbps - 320 kbps

Sampling frequencies: 44.1 kHz

DivX (except for United Kingdom models)

File Extension: avi/divx

Video codec: DivX video

Bitrate: 10.08 Mbps (MAX)

Frame rate: 30 fps

Resolution: 720 ×576

Audio codec: MP3

MPEG4

File format: MP4 File Format

File Extension: mp4/m4v

Video codec: MPEG4 Simple Proﬁle

(AVC is not compatible.)

Bitrate: 4 Mbps

Frame rate: 30 fps

Resolution: 720 ×576

Audio codec: AAC-LC (HE-AAC is not

compatible.)

DRM: Not compatible

Design and speciﬁcations are subject to change without notice.

SPECIAL COMPONENT NOTICE

The components identiﬁed by mark 9contain conﬁdential infor-

mation.

Strictly follow the instructions whenever the components are re-

paired and/or replaced.

HBD-DZ330/DZ710/DZ730

UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the lead-

free mark (LF) indicating the solder contains no lead.

(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40 °C higher

than ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be

applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to

about 350 °C.

Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to ﬂow)

than ordinary solder so use caution not to let solder bridges

occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may

also be added to ordinary solder.

NOTES ON CHIP COMPONENT REPLACEMENT

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

FLEXIBLE CIRCUIT BOARD REPAIRING

• Keep the temperature of soldering iron around 270 °C during

repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

Laser component in this product is capable of emitting radiation

exceeding the limit for Class 1.

This appliance is classiﬁed as

a CLASS 1 LASER product.

This marking is located on the

rear or bottom exterior.

CAUTION

Use of controls or adjustments or performance of procedures

other than those speciﬁed herein may result in hazardous radia-

tion exposure.

HBD-DZ330/DZ710/DZ730

Model Part No.

DZ330 4-159-511-0[]

DZ730 4-159-513-9[]

DZ710 4-159-514-0[]

MODEL IDENTIFICATION

– Back Panel –

Parts No.

(When letters/numbers appear in the

display)

When the self-diagnosis function is activated to

prevent the system from malfunctioning, a 5-

character service number (e.g., C 13 50) with a

combination of a letter and 4 digits appears on

the TV screen orfront panel display. In this case,

check the following table.

When the version number

appears on the TV screen

When you turn on the system, the version

number [VER.X.XX] (X is a number) may

appear on the TV screen. Although this is not a

malfunction and for Sony service use only,

normal system operation will not be possible.

Turn off the system, and then turn on the system

again to operate.

Self-diagnosis Function

First 3

characters of

the service

number

Cause and/or corrective action

C 13 The disc is dirty.

,Clean the disc with a soft cloth.

E XX

(XX is a

number)

To prevent a malfunction, the

system has performed the self-

diagnosis function.

,Contact your nearest Sony

dealer or local authorized Sony

service facility and give the 5-

character service number.

Example: E 61 10

C:13:50

VER.X.XX

HBD-DZ330/DZ710/DZ730

TABLE OF CONTENTS

1. SERVICING NOTES ............................................. 6

2. DISASSEMBLY

2-1. Case ................................................................................ 9

2-2. Loading Panel................................................................. 10

2-3. Front Panel Section......................................................... 10

2-4. FL Board, ENCODER Board, JACK Board,

USB Board...................................................................... 11

2-5. KEY-SW Board, P-SW Board ........................................ 12

2-6. Back Panel Section ......................................................... 13

2-7. MAIN Board................................................................... 14

2-8. IO Board ......................................................................... 15

2-9. POWER Board................................................................ 15

2-10. DVD Mechanism Deck Section...................................... 16

2-11. Tray................................................................................. 16

2-12. Belt.................................................................................. 17

2-13. MS-203 Board................................................................. 17

2-14. Base Unit......................................................................... 18

2-15. Optical Pick-up............................................................... 18

3. TEST MODE ............................................................ 19

4. ELECTRICAL ADJUSTMENTS ........................ 23

5. DIAGRAMS

5-1. Block Diagram –RF Section–......................................... 25

5-2. Block Diagram –VIDEO Section– ................................. 26

5-3. Block Diagram –AUDIO Section–................................. 27

5-4. Block Diagram –AMP Section– ..................................... 28

5-5. Block Diagram –POWER Section–................................ 29

5-6. Printed Wiring Board –MAIN Section (1/2)–................. 31

5-7. Printed Wiring Board –MAIN Section (2/2)–................. 32

5-8. Schematic Diagram –MAIN Section (1/9)– ................... 33

5-9. Schematic Diagram –MAIN Section (2/9)– ................... 34

5-10. Schematic Diagram –MAIN Section (3/9)– ................... 35

5-11. Schematic Diagram –MAIN Section (4/9)– ................... 36

5-12. Schematic Diagram –MAIN Section (5/9)– ................... 37

5-13. Schematic Diagram –MAIN Section (6/9)– ................... 38

5-14. Schematic Diagram –MAIN Section (7/9)– ................... 39

5-15. Schematic Diagram –MAIN Section (8/9)– ................... 40

5-16. Schematic Diagram –MAIN Section (9/9)– ................... 41

5-17. Printed Wiring Board –IO Section–................................ 42

5-18. Schematic Diagram –IO Section–................................... 43

5-19. Printed Wiring Boards

–JACK, KEY-SW, P-SW Section–................................. 44

5-20. Schematic Diagram –JACK Section–............................. 45

5-21. Schematic Diagram –KEY-SW, P-SW Section–............. 46

5-22. Printed Wiring Boards

–SPEAKER, USB, MS-203 Section–............................. 47

5-23. Schematic Diagram –SPEAKER, USB Section–........... 48

5-24. Printed Wiring Boards –FL, ENCODER Section–......... 49

5-25. Schematic Diagram –FL Section– .................................. 50

5-26. Schematic Diagram –ENCODER Section–.................... 51

5-27. Printed Wiring Board –S-AIR CON Section–................ 52

5-28. Schematic Diagram –S-AIR CON Section–................... 53

5-29. Printed Wiring Board –POWER Section–...................... 54

5-30. Schematic Diagram –POWER Section–......................... 55

6. EXPLODED VIEWS

6-1. Overall Section ............................................................... 69

6-2. Front Panel Section......................................................... 70

6-3. Front Boards Section ...................................................... 71

6-4. Back Panel Section ......................................................... 72

6-5. Chassis Section............................................................... 73

6-6. DVD Mechanism Deck Section

(CDM85MB-DVBU102)................................................ 74

7. ELECTRICAL PARTS LIST .............................. 75

HBD-DZ330/DZ710/DZ730

tray

Insert a screwdriver from between the front panel and

the chassis and slide the rod in the direction of the arrow.

SECTION 1

SERVICING NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP

BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electro-

static break-down because of the potential difference generated by

the charged electrostatic load, etc. on clothing and the human body.

During repair, pay attention to electrostatic break-down and also

use the procedure in the printed matter which is included in the

repair parts.

The ﬂexible board is easily damaged and should be handled with

care.

How to open the disc table when power switch turns off

Insert a tapering driver into the aperture of the unit bottom, and

slide it in the direction of the arrow.

Precaution when installing a new OP unit/

Precaution before unsoldering the static electricity

prevention solder bridge

When installing a new OP unit, be sure to connect the ﬂexible

printed circuit board ﬁrst of all before removing the static electric-

ity prevention solder bridge by unsoldering.

Remove the static electricity prevention solder bridge by unsolder-

ing after the ﬂexible printed circuit board has already been con-

nected.

(Do not remove nor unsolder the solder bridge as long as the OP

unit is kept standalone.)

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused

on the disc reﬂective surface by the objective lens in the optical

pickup block. Therefore, when checking the laser diode emission,

observe from more than 30 cm away from the objective lens.

On cleaning discs, disc/lens cleaners

• Do not use cleaning discs or disc/lens cleaners (including wet

or spray types). These may cause the apparatus to malfunction.

IMPORTANT NOTICE

Caution: This system is capable of holding a still video image or on-

screen display image on your television screen indeﬁnitely. If you leave

the still video image or on-screen display image displayed on your TV

for an extended period of time you risk permanent damage to your tele-

vision screen.

Projection televisions are especially susceptible to this.

DISC TRAY LOCK

The disc tray lock function for the antitheft of an demonstration

disc in the store is equipped.

Setting Procedure :

1. Press the [?/1] button to turn the set on.

2. Press the [FUNCTION] button to set DVD/CD function.

3. Insert a disc.

4. Press the [x] button and the [Z] button simultaneously for ﬁve

seconds.

5. The message “LOCKED” is displayed and the tray is locked.

Releasing Procedure :

1. Press the [x] button and the [Z] button simultaneously for ﬁve

seconds again.

2. The message “UNLOCKED” is displayed and the tray is un-

locked.

Note: When “LOCKED” is displayed, the tray lock is not released by

turning power on/off with the [?/1] button.

LASER DIODE AND FOCUS SEARCH

1. Open the case and turn POWER on with no disc inserted.

2. Conﬁrm that the following operation is performed while ob-

serving the objecting lens from the clearance of DVD mecha-

nism deck.

1) Conﬁrm that laser beam is spread.

2) Up and down motion of the objective lens. (2 times)

HBD-DZ330/DZ710/DZ730

Discharge the charged electricity in capacitors to prevent electric shock as follows

When disassembling the machine, be sure to discharge the charged electricity in the following capacitors.

Use a resistor of 800 ohms, 2 Watts for discharging the following capacitors.

POWER board

C903: 390V

C932, C933, C934, CN904: 30V

Point of capacitor discharge for C932, C933, C934:

Connect to the red and black wire of CN904.

Point of capacitor discharge for C903:

Connect to the foot of C903.

800:/2W

Arranging the USB wire

MAIN board

The USB wire should be located on the front side

from these capacitors.

Thread the USB wire through the capacitors.

Dress the USB wire in this area

properly along the board.

Have the USB wire spread on the inside

of the claws of the chassis.

USB wire

Tie up with LP501.

HBD-DZ330/DZ710/DZ730

SECTION 2

DISASSEMBLY

• This set can be disassembled in the order shown below.

2-1. CASE

(Page 9)

2-4. FL BOARD,

ENCODER BOARD,

JACK BOARD,

USB BOARD

(Page 11)

SET

2-2. LOADING PANEL

(Page 10)

2-7. MAIN BOARD

(Page 14)

2-3. FRONT PANEL SECTION

(Page 10)

2-5. KEY-SW BOARD,

P-SW BOARD

(Page 12)

2-6. BACK PANEL SECTION

(Page 13)

2-9. POWER BOARD

(Page 15)

2-8. IO BOARD

(Page 15)

2-10. DVD MECHANISM DECK SECTION

(Page 16)

2-11. TRAY

(Page 16)

2-13. MS-203 BOARD

(Page 17) 2-15. OPTICAL PICK-UP

(Page 18)

2-12. BELT

(Page 17) 2-14. BASE UNIT

(Page 18)

HBD-DZ330/DZ710/DZ730

Note: Follow the disassembly procedure in the numerical order given.

2-1. CASE

8case

6Raise one side of the case.

1two screws

(+BV3 (3-CR))

2two screws

(+BV3 (3-CR))

3four screws

(+BV3 (3-CR))

4screw

(+BV3 (3-CR))

HBD-DZ330/DZ710/DZ730

2-2. LOADING PANEL

2-3. FRONT PANEL SECTION

3loading panel

tray

Insert a screwdriver from between the front panel

and the chassis and slide the rod in the direction

of the arrow.

1two screws

(+BV3 (3-CR))

5four screws

(+BV3 (3-CR))

6four claws

9three claws

7claw

8claw

2two ground plate (front)

3knob vol (DSZ)

4nut

qa CN5202 (4P)

qs front panel section

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