Sony HCD-XGR80 User manual

HCD-XGR80
E Model
COMPACT Hi-Fi STEREO SYSTEM
— Continued on next page —
SPECIFICATIONS
•HCD-XGR80 is the Amplifier,
CD player, tape deck and tuner
section in LBT-XGR80.
Ver 1.1 2003.07
9-873-638-02
2003G02-1
© 2003.07
Model Name Using Similar Mechanism HCD-XGR60
CD CD Mechanism Type CDM37B-30BD60C
Section Base Unit Name BU-30BD60C
Optical Pick-up Name A-MAX.3
TAPE
Model Name Using Similar Mechanism HCD-XGR60
Section
SERVICE MANUAL
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
Amplifier section
The following measured at AC 120/220/240V, 50 Hz
DIN power output (rated) 125W x 2 + 125W x 2
watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
170 W x 2 + 170 W x 2
(6 ohms at 1 kHz, 10% THD)
Inputs
DJ MIX RETURN*:
(phono jacks) sensitivity 250 mV,
impedance 47 kilohms
GUITAR:
(phone jack) sensitivity 75 mV,
impedance 470 kilohms
PHONO IN:
(phono jacks) sensitivity 3 mV,
impedance 47 kilohms
MIX MIC:
(phone jack) sensitivity 1 mV,
impedance 10 kilohms
GAME INPUT:
(phono jacks) sensitivity 250 mV,
impedance 47 kilohms
MD (VIDEO) IN:
(phono jack) sensitivity 450 mV
(250 mV), impedance
47 kilohms
Outputs
DJ MIX SEND*:
(phono jacks) sensitivity 250 mV,
impedance 1 kilohms
PHONES:
(stereo phone jack) accepts headphones of
8 ohms or more
MD (VIDEO) OUT:
(phono jacks) voltage 250 mV
impedance 1 kilohms
FRONT SPEAKER: accepts impedance of 6 to
16 ohms (SUPER WOOFER)
accepts impedance of 6 to
16 ohms (TWEETER & WOOFER)
* Mexican model only

2
HCD-XGR80
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CAUTION
Use of controls or adjustments or performance of procedures
otherthan those specified hereinmayresultinhazardous radiation
exposure.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of soldering iron around 270˚C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINEWITH
MARK 0ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
CD player section
System Compact disc and digital
audio system
Laser Semiconductor laser
(λ=795 nm), Emission
duration: continuous
Frequency response 2 Hz – 20 kHz (±0.5 dB)
Signal-to-noise ratio More than 90 dB
Dynamic range More than 90 dB
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength: 660 nm
Output level –18 dBm
Tape player section
Recording system 4-track 2-channel stereo
Frequency response 40 – 13,000 Hz (±3 dB),
using Sony TYPE I cassette
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range 87.5 – 108.0 MHz
(50 kHz step)
Antenna FM lead antenna
Antenna terminals 75 ohms unbalanced
Intermediate frequency 10.7 MHz
AM tuner section
Tuning range
Pan- American models: 530 – 1,710 kHz
(with the interval set at 10 kHz)
531 – 1,710 kHz
(with the interval set at 9 kHz)
Other models: 531 – 1,602 kHz
(with the interval set at 9 kHz)
530 – 1,710 kHz
(with the interval set at 10 kHz)
Antenna AM loop antenna
Antenna terminals External antenna terminal
Intermediate frequency 450 kHz
General
Power requirements
Mexican model: 120 VAC, 60 Hz
Other models: 120 V, 220 V or 230 – 240 V
AC, 50/60 Hz
Adjustable with voltage selector
Power consumption 320 watts
Dimensions (w/h/d) Approx. 355 x 425 x 451 mm
Mass : Approx. 16.4 kg
Supplied accessories: AM loop antenna (1)
FM lead antenna (1)
Speaker cords (4)
Speaker pads (8)
Remote commander (1)
Batteries (2)
Design and specifications are subject to change without notice.

3
HCD-XGR80
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
• MODEL IDENTIFICATION
– Rear Panel –
MODEL
E model
E51 model
Mexican model
Argentina model
PARTS No.
4-237-748-6s
4-237-748-7s
4-237-748-8s
4-237-748-9s
•Abbreviation
E51 : Chilean and Peruvian model
PART No.

4
HCD-XGR80
TABLE OF CONTENTS
1. GENERAL ·········································································· 5
2. DISASSEMBY··································································· 7
3. TEST MODE···································································· 15
4. MECHANICAL ADJUSTMENTS ····························· 17
5. ELECTRICAL ADJUSTMENTS ······························· 17
6. DIAGRAMS
6-1. Circuit Board Location ······················································ 21
6-2. Block Diagram – CD Servo Section –······························· 22
Block Diagram – Tuner/Tape Deck Section – ··················· 23
Block Diagram – Main Section – ······································ 24
Block Diagram
– Display/Key Control/Power Supply Section –·········· 25
6-3. Printed Wiring Board – BD Section – ······························· 26
6-4. Schematic Diagram – BD Section – ·································· 27
6-5. Printed Wiring Board – Motor, LED Section – ················· 28
6-6. Schematic Diagram –Motor, LED Section – ····················· 28
6-7. Schematic Diagram – MIC/Guitar Section –····················· 29
6-8. Printed Wiring Board – MIC/Guitar Section – ·················· 29
6-9. Schematic Diagram – Main (1/3) Section – ······················ 30
6-10.Schematic Diagram – Main (2/3) Section – ······················ 31
6-11.Schematic Diagram – Main (3/3) Section – ······················ 32
6-12.Printed Wiring Board – Main Section – ····························· 33
6-13.Printed Wiring Board
– CD-L,CD-R,Headphone,Front Input,D-SW Section – ·· 34
6-14.Schematic Diagram
– CD-L,CD-R,Headphone,Front Input,D-SW Section – ·· 35
6-15.Printed Wiring Board – Panel VR Section – ······················ 36
6-16.Schematic Diagram – Panel VR Section – ························ 37
6-17.Printed Wiring Board – Panel FL,TC-A,TC-B Section – · 38
6-18.Schematic Diagram – Panel FL,TC-A,TC-B Section –····· 39
6-19.Printed Wiring Board – PA Section – ································ 40
6-20.Schematic Diagram – PA Section – ··································· 41
6-21. Printed Wiring Board – Sub Amp Section – ····················· 42
6-22.Schematic Diagram – Sub Amp Section –························· 43
6-23. Printed Wiring Board – Trans,Sub Trans Section – ·········· 44
6-24.Schematic Diagram – Trans,Sub Trans Section –·············· 44
6-25. IC Pin Function Description ············································· 46
6-26. IC Block Diagram ····························································· 51
7. EXPLODED VIEWS
7-1. Case,Back Panel Section ···················································54
7-2. Front Panel Section-1 ························································ 55
7-3. Front Panel Section-2 ························································ 56
7-4. Chassis Section ·································································· 57
7-5. CD Mechanism Deck Section
(CDM-30BD60C)······························································· 58
7-6. Base Unit Section (BU-30BD60C)····································59
8. ELECTRICAL PARTS LIST ······································· 60

5
HCD-XGR80
This section is extracted from
instruction manual.
SECTION 1
GENERAL
ALPHABETICALORDER
E – G
EDIT ea (15)
EFFECT 5(17)
ENTER 5(8, 15, 17, 19)
FM MODE 8(12)
FUNCTION qd (7, 9, 10, 14, 20,
22, 26)
GAME qf (22)
GAME INPUT AUDIO L/R wd
(25)
GAME INPUT VIDEO wd (25)
GAME MIXING qg (22)
GROOVE ek (16)
GUITAR DISTORTION wl (21)
GUITAR jack ed (21)
GUITAR LEVEL ef (21)
H – R
H SPEED DUB ql (14)
MIC LEVEL ef (20)
MIX GUITAR/KARAOKE wl (20,
21)
MIX MIC jack ed (20)
P FILE 5(17)
PHONES jack w;
PLAY MODE es (9, 10)
POWER SAVE/DEMO
(STANDBY) 3(23)
Power stream indicator 6
PUSH OPEN wj (9)
REPEAT es (10)
Mainunit
wfwgwhwjwle;
ea
es
ed
ef
eg
eh
ek
ej
wk
qf
qd
23
45 76890qa qs
qg
qh
qj
qk
ql
w;
wa
ws
wd
1
A – D
A EJECTZ/ZB EJECT wh (13)
AMS./> wa (9, 10)
CD SYNC ql (14, 15)
Direct equalizer qh ej (17)
GUITAR/ROCK/JAZZ/DANCE/
GAME
SALSA/REGGAE/TANGO/
SAMBA/MOVIE
DIRECTION eg (13, 14, 15, 20)
DISC SKIP es (9, 10)
DISC 1 to 5 e; (9)
DISPLAY 2
(23)

6
HCD-XGR80
Remote control
ALPHABETICALORDER
ql
qk
qj
qh
qg
qf
ws
wa
w;
5
6
7
9
8
q;
3
2
1
4
qd
qs
qa
S – X
SLEEP 0(18)
SPECTRUM ANALYZER 4(20)
SUPER WOOFER ek (16)
SUPER WOOFER MODE ek (16)
SURROUND ek (18)
TIMER SELECT qa (16, 19)
TUNER/BAND 9(11, 12)
TUNER ENTER wf (11)
TUNER MEMORY wf (11)
TUNING MODE 8(11, 12)
TUNING - /+ 9(11, 12)
VOLUME control 7(10)
X-GROOVE wg (16)
BUTTON DESCRIPTIONS
@/1 1
c/CLOCK SET qs
h/H qj eh
xqj eh
.m /M> qj eh
Xqk
zREC qk
HX ws
xws
m/Mws
R/r/T/t(cursor) wk
C – F
CD Nqg (9)
CLEAR 4(10)
CLOCK/TIMER SELECT ws (16,
19)
CLOCK/TIMER SET 1(8, 15,
19)
DISC SKIP w; (9, 10)
DISPLAY qa (23)
EFFECT 9(17)
ENTER 0(8, 15, 17, 19)
FILE SELECT +/- qd (17)
FUNCTION 3(7, 9, 10, 14, 20,
22, 26)
P – V
PRESET - /+ ql
SLEEP wa (18)
SURROUND 5(18)
TUNER/BAND qf (11, 12)
TUNING - /+ qk (11, 12)
VOL +/- 6(10)
BUTTON DESCRIPTIONS
@/1 2
nN 78
R/r/T/t(cursor)qs
xqh
Xqj
m/Mqk
./> ql
This section is extracted from
instruction manual.

7
HCD-XGR80
SECTION 2
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
2-1. CASE
•The equipment can be removed using the following procedure.
3
Five screws (BVTT 3
×
6)
4
Two screws (BVTP 3
×
8
)
2
Three screws (CASE3 TP2)
1
Three screws
(CASE3 TP2)
8
Case
6
7
5
5
6
Set Case Front panel section Tape mechanism deck
PANEL FL board, TC-A board, TC-B board
PANEL VR board
MIC/GUITAR board, HEADPHONE board
FRONT INPUT board
D-SW board, CD-L board, Lid (CD) assy, CD-R board
Back panel, DC fan, MAIN board
CD mechanism deck (CDM37B-30BD60C)
Base unit-1 (BU-30BD60C)
Disc table
Base unit-2 (BU-30BD60C) BD board

8
HCD-XGR80
2-2. FRONT PANEL SECTION
2-3.TAPE MECHANISM DECK
2
Flat type wire (CN431)
8
Lug
7
Screw (BVTP 3 X 8)
3
Connector (CN311)
4
Connector (CN903)
5
Connector (CN722)
1
Flat type wire
(CN371)
9
Screw (BVTP 3 X 8
)
qs
Screw (BVTP 3 X 8)
qd
Four screws (BVTP 3 X 8)
qg
Front panel section
qf
Claw
0
Lug
6
Connector (CN806)
qa
Connector (B deck)
1
Flat type wire (15 core)
2
Two screws
(BVTP 2.6 X 8)
3
Two screws
(BVTP 2.6 X 8)
5
Tape mechanism dec
k
Front panel
4

9
HCD-XGR80
2-4. PANEL FL BOARD,TC-A BOARD,TC-B BOARD
2-5. PANELVR BOARD
2
Lug
1
Screw (BVTP 2.6 X 8)
qa
Five screws (BVTP 2.6 X 8)
qs
Three screws
(BVTP 2.6 X 8)
qk
PANEL FL board
w;
TC-A board
qd
Eight screws
(BVTP 2.6 X 8)
qg
Four screws
(BVTP 2.6 X 8)
8
Connector (CN703)
6
Connector
(CN812)
7
Connector
(CN704)
ws
TC-B board
0
Two knobs (MIC)
ql
Two claws
4
Screw
(BVTP 2.6 X 8)
qf
Four screws
(BVTP 2.6 X 8)
5
Bracket (TA)
qh
Three claws
3
Bracket (TA)
qj
9
Flat type wire
(CN601)
wa
Two claws
Front panel
1
Screws
(BVTP 2.6 X 8)
2
Lug
4
Knob (VOLUME)
3
Bracket (TA)
7
6
Preess the two buttons (EJECT)
Front panel
qs
PANEL VR board
qa
Nine screws
(BVTP 2.6 X 8)
0
Eight screws
(BVTP 2.6 X 8)
5
Flat type wire
(CN701)
9
Lever (EJECT) ass
y
8
Two screws
(BVTP 2.6 X 8)

10
HCD-XGR80
2-6. MIC/GUITAR BOARD, HEADPHONE BOARD
1
Connector
(CN812)
2
Two screws
(BVTP 2.6 X 8)
4
MIC/GUITAR board
7
HEADPHONE board
5
Two screws
(BVTP 2.6 X 8)
3
MIC bracket
6
HEADPHONE bracke
t
Front panel
2-7. FRONT INPUT BOARD
2
Bumper (Panel)
Front panel
FRONT INPUT board
J804
4
FRONT INPUT board
1
Four screws
(BVTP 2.6 X 8
)
3
Front panel

11
HCD-XGR80
2-9. BACK PANEL, DC FAN, MAIN BOARD
2-8. D-SW BOARD, CD-L BOARD, LID (CD) ASSY, CD-R BOARD
5
Two screws
(BVTP 2.6 X 8)
7
Four screws
(BVTP 2.6 X 8)
qj
Four screws
(BVTP 2.6 X 8)
qk
CD-Rboard
4
Two screws
(BVTP 2.6 X 8)
qg
Two screws
(BVTP 2.6 X 8)
qf
Two screws
(BVTP 2.6 X 8)
2
D-SW board
1
Screw (BVTP 2.6 X8)
0
Spring (CD)
3
Connector
(CN704)
qd
Knob
(CD)
qa
Lid (CD) assy
9
Sub panel (CD-L) assy
8
CD-L board
6
ql
Sub panel
(CD-R) assy
qs
Connector (CN703)
qh
qs
DC FAN
(M901)
1
Flat type wire (CN441)
9
Back panel
2
Jumper plug
4
Eight screws
(BVTP 3 X 8)
7
Four screws
(BVTP 3 X 8)
6
Three screws
(BVTP 3 X 8)
qg
Two screws
(BVTP 3 X 8)
qh
Two connectors
(CN901, 902)
5
Two screws
(BVTP 3 X 8)
qa
Two screws
(BVTP 3 X 8)
3
Screw
(BVTP 3 X 8)
0
Connector (CN961)
MX model
qf
Connector (CN441)
qd
Flat type wire
(CN401)
qj
MAIN board
8

12
HCD-XGR80
2-10. CD MECHANISM DECK (CDM37B-30BD60C)
qa
CD mechanism deck
(CDM37B-30BD60)
6
Two screws (BVTP 3 X 8)
5
Two screws
(BVTP 3 X 8)
4
Three screws
(BVTP 3 X 8)
1
Flat type wire
(CN401)
2
Connector
(CN411)
3
Four screws (BVTP 3 X 8)
Wire holder
0
Five screws
(BVTP3
×
8)
7
7
8
9
Remove two cables fro
m
wire holder.

13
HCD-XGR80
2-11. BASE UNIT-1 (BU-30BD60C)
2-12. BASE UNIT-2 (BU-30BD60C)
3
Base unit
(BU-30BD60C)
1
BU fitting screw
2
Boss
1
Two floating screws (DIA.12)
6
Base unit (BU-30BD60C)
2
Two screws
(BVTP 2.6 X 8)
3
Two stoppers
(BU)
5
Two coil
springs
(insulator
)
4
Two coil springs
(insulator)
Holder (BU30) assy

14
HCD-XGR80
2-14. DISCTABLE
2-13. BD BOARD
Note: When the disc table is installed, adjust the positions of roller cam
and mark Bas shown in the figure, then set to the groove of disc
table.
1
Screw (BVTP 3
×
8)
2
Bracket (BU)
3
Step screw
4
Disc tabl
e
A
A
1
Remove the two solders.
4
Flat type wire (CN102)
BU-30BD60C
5
BD board
3
Rivet
2
Remove the two solders.

15
HCD-XGR80
SECTION 3
TEST MODE
[MC Cold Reset]
• The cold reset clears all data including preset data stored in the
RAM to initial conditions. Execute this mode when returning
the set to the customer.
Procedure:
1. Turn the power ON or set to the DEMO mode.
2. Press three buttons of c/CLOCK SET , TUNER ENTER ,
and \/1 simultaneously.
3. The set is reset, and displays “COLD RESET”, then becomes
DEMO mode.
[Change-over the AMTuning Interval]
•The AM tuning interval can be changed over 9 kHz or 10 kHz.
Procedure:
1. Press the \/1 button to turn the power ON.
2. Select the function “TUNER”, and press the TUNER/BAND
button to select the BAND “AM”.
3. Press the \/1 button to turn the power OFF.
4. Press the ENTER/NEXT and \/1 buttons simultaneously,
and the display on the fluorescent indicator tube changes to
“AM 9 K STEP”or “AM 10 K STEP”, and thus the tuning
interval is changed over.
[CD Ship Mode] (No memory clear)
•This mode moves the optical pick-up to the position durable to
vibration. Use this mode when returning the set to the customer
after repair.
Procedure:
1. Press the \/1 button to turn the power ON.
2. Press the EDIT and \/1 buttons simultaneously.
3. A message “LOCK”is displayed on the fluorescent indicator
tube, and the CD delivery mode is set.
[LED and Fluorescent Indicator Tube All Lit, Key Check
Mode]
Procedure:
1. Press three buttons of c/CLOCK SET , ENTER/NEXT ,
and DISC 2 simultaneously.
2. LEDs and fluorescent indicator tube are all turned on.
3. Press the DISC 1 button, the MODE and DESTINATION are
displayed fluorescent indicator tube.
4. Each time the DISC 1 button is pressed, the MC/GC category
version is displayed in the following order.
5. Press the DISC 2 button, and the key check mode is acti-vated.
6. In the key check mode, the fluorescent indicator tube displays
“K 0 J0 V0”. Each time a button is pressed, “K”value in-creases
to “K69”call the button is pressed.However, once a button is
pressed, it is no longer taken into account.
“J”value increases like 1, 2, 3 ... if turn the .AMS >
JOG dial clock-wise,or it decreases like 0, 9, 8 ... if turn the
. AMS >JOG dial counter-clockwise.
“V”value increases like 1, 2, 3 ... if turn the VOLUME dial
clockwise (“+”direction), or it decreases like 0, 9, 8 ... if turn
the VOLUME dial counterclockwise (“–” direction).
7. To release from this mode, press three buttons in the same
manner as step 1, or disconnect the power cord.
NR MC GC CD CDDM CDMA
CDM
B
BDABDBSTTATMTC
[Sled Servo Mode] (CD service mode)
•This mode can run the CD sled motor freely. Use this mode, for
instance, when cleaning the pick-up.
Procedure:
1. Select the function “CD”.
2. Press three buttons c/CLOCK SET , TUNER ENTER , and
DISC 5 simultaneously.
3. The Sled Servo mode is selected, if “CD”is blanking on the
fluorescent indicator tube.
4. With the CD in stop status, press M button in CD section to
move the pick-up to outside track, or m button to inside track.
5. To exit from this mode, press \/1 button turn to the power
OFF.
Note:
•Always move the pick-up to most inside track when exiting from
this mode. Otherwise, a disc will not be unloaded.
•Do not run the sled motor excessively, otherwise the gear can
be chipped.
[Change-over of FUNCTION Name]
•The FUNCTION name of external input terminal can be changed
over to VIDEO or MD.With the FUNCTION selected to “MD”,
about 5dB mute is applied to the input gain.
Procedure:
1. Press \/1 button to turn the power OFF.
2. Press \/1 button together with FUNCTION button for
several seconds, and the power is turned on, the display of
fluorescent indicator tube changes to “MD”or “VIDEO”
instantaneously, and thus the FUNCTION is changed over.
[Aging Mode]
This mode can be used for operation check of tape deck section.
Tape deck section work in parallel.
•If an error occurred:
The aging operation stops and display then status.
•If no error occurs:
The aging operation continues repeatedly.
Procedure:
1. Load the tapes into the decks A and B respectively.
2. Press the FUNCTION button to select the function “CD”.
3. Press the PLAY MODE button to set the “ALLDISCS”mode,
and press the REPEAT button to “REPEAT”off.
4. Press three buttons of c/CLOCK SET , TUNER ENTER ,
and DISC 4 simultaneously.
5. The aging mode is activated, if the indicator of disc tray num-
ber on the fluorescent indicator tube is blinking.
6. To release from the aging mode, press the \/1 button to turn
the power OFF and operate the cold reset. (Refer to the “MC
Cold Reset”)
1. Display at the Aging Mode
•Display operating state of tape deck section alternately.
•If an error occurred, stop display.

16
HCD-XGR80
FWD the tape A
“TAPE AAG-2”
Fast forward the tape A
“TAPE AAG-3”
RVS the tape A
“TAPE AAG-4”
Rewind the tape A
“TAPE A AG-5”
FWD the tape B
“TAPE B AG-2”
Rewind the tapeA
“TAPE AAG-1”
Fast forward the tape B
“TAPE B AG-3”
RVS the tape B
“TAPE B AG-4”
Rewind the tape B
“TAPE B AG-5”
Shut off
2 minutes
Shut off or 20 seconds
2 minutes
Shut off
2 minutes
Shut off or 20 seconds
2 minutes
Shut off
Aging mode sequence (Tape deck section):
2.Tape Deck Section
• The sequence during the aging mode is following as below.
• If an error occurred, stop display that step.
Note: “TAPE *AG- *” is display of each step.
3. CD Section
• The sequence during the aging mode is following as below.
• If an error occurred, stop display that step.
Aging mode sequence (CD section):
DISC 1
chucking
TOC Read
Track 1 Play
Tray Tun
Tray Turn
DISC 4
Chucking
2 seconds
Last Track Play
TOC Read
Track 1 Play
Last Track play
[VACS ON/OFF]
•The volume control by VACS is turned ON/OFF.
Procedure:
1.Press the \/1 button to turn the power ON.
2.Press the PLAY MODE and \/1 buttons simultaneously.
3.The reaction display appears when switcing ON/OFF.
2 seconds
2 seconds

17
HCD-XGR80
Torque Measurement
Mode Torque Meter Meter Reading
2.9~6.9 mN•m
FWD (30 to 70 g•cm)
(0.42 – 0.97 oz•inch)
FWD CQ-102C 0.19~0.59 mN•m
back tension (2 to 6 g•cm)
(0.03 – 0.08 oz•inch)
7.8~16.7 mN•m
FF/REW CQ-201B (80 to 170 g•cm)
(1.11 – 2.36 oz • inch)
SECTION 4
MECHANICAL ADJUSTMENTS
Precaution
1. Clean the following parts with a denatured alcohol-moistened
swab:record/playback heads pinch rollers
erase head rubber belts
capstan idlers
2. Demagnetize the record/playback head with a head demagne-
tizer.
3. Do not use a magnetized screwdriver for the adjustments.
4. After the adjustments, apply suitable locking compound to the
parts adjusted.
5. The adjustments should be performed with the rated power sup-
ply voltage unless otherwise noted.
SECTION 5
ELECTRICAL ADJUSTMENTS
DECK SECTION 0 dB = 0.775 V
Precaution
1. Demagnetize the record/playback head with a head demagne-
tizer.
2. Do not use a magnetized screwdriver for the adjustments.
3. After the adjustments, apply suitable locking compound to the
parts adjust.
4. The adjustments should be performed with the rated power
supply voltage unless otherwise noted.
5. The adjustments should be performed in the order given in
this service manual. (As a general rule, playback circuit
adjustment should be completed before performing recording
circuit adjustment.)
6. The adjustments should be performed for both L-CH and R-CH.
7. Switches and controls should be set as follows unless other-
wise specified.
8. Set to the DOLBY NR OFF.
9. Set to the test mode.
(1) Press the \/1 button to turn the power ON.
(2) Select the function “TAPE A or B”.
(3) Press the button of c/CLOCK SET , TUNER ENTER ,
and DISC 3 simultaneously, to set the tape deck test mode
and displays “TEST MODE” on the fluorescent indicator
tube.
(4) To release from the test mode, press the \/1 button.
• Test Tape
Tape Signal Used for
P-4-A100 10 kHz, – 10 dB Azimuth Adjustment
WS-48B 3 kHz, 0 dB Tape Speed Adjustment

18
HCD-XGR80
Record/Playback Head Azimuth Adjustment
DECK A DECK B
Note: Perform this adjustments for both decks
Procedure:
1. Mode: Playback (FWD)
set
MAIN board
MD (VIDEO) OUT jack (J701
)
L-CH, R-CH
+
level meter
test tape
P-4-A100
(10 kHz, – 10 dB)
Screw
position
L-CH
peak
within
1dB
Output
level
L-CH
peak R-CH
peak
within
1dB
Screw
position
R-CH
peak
3. Mode: Playback
set
test tape
P-4-A100
(10 kHz, –10 dB)
R-CH
oscilloscope
L-CH
R-CH
VH
waveform of oscilloscope
in phase 45
°
90
°
135
°
180
°
good wrong
MAIN board
MD (VIDEO) OUT jack (J701)
L-CH
4. Repeat step 1 to 3 in playback (REV) mode.
5. After the adjustments, apply suitable locking compound to the
pats adjusted.
Adjustment Location: Playback Head (Deck A).
Record/Playback/Erase Head (Deck B).
Tape Speed Adjustment DECK B
Mode: Playback
+
–
set
test tape
WS-48B
(3 kHz, 0 dB)
MAIN board
MD (VIDEO) OUT jack (J701)
L-CH, R-CH
frequency counter
1. Insert the WS-48B into the deck B.
2. Press the Hbutton on the deck B.
3. Press the H SPEED DUB button in playback mode.
Then at HIGH speed mode.
4. Adjust RV392 on the LEAF SW board do that frequency
counter reads 6,000 ± 180 Hz.
5. Press the H SPEED DUB button.
Then back to NORMAL speed mode.
6. Adjust RV391 on the LEAF SW board so that frequency
counter reads 3,000 ± 90 Hz.
Adjustment Location: MAIN board
Sample value of Wow and Flutter: 0.3% or less W.RMS (JIS)
(WS-48B)
forward reverse
2. Turn the adjustment screw and check output peaks. If the peaks
do not match for L-CH and R-CH, turn the adjustment screw
so that outputs match within 1dB of peak.

19
HCD-XGR80
REC Bias Adjustment DECK B
Procedure:
1. Mode: Record
FUNCTION: VIDEO
attenuator
set
MAIN board
MD(VIDEO) IN jack (J701)
L-CH, R-CH
1) 315 Hz
2) 10 kHz 50 mV (– 23.8 dB)
600
Ω
blank tap
e
CS-123
AF OSC
2. Mode: Playback
+
–
set
recorded
portion
MAIN board
CN301 pin
1
(L-CH)
pin
3
(R-CH)
level mete
r
3. Confirm playback the signal recorded in step 1 become speci-
fication values as follows.
If these values are out of specification values, adjust the RV321
(L-CH) and RV322 (R-CH) on the MAIN board to repeat
steps 1and 2.
Adjustment level:The playback output of 10kHz level difference
against 315 Hz reference should ±0.5 dB.
Adjustment Location: MAIN board
REC Level Adjustment DECK B
Procedure:
1. Mode: Record
FUNCTION: VIDEO
set
MAIN board
MD (VIDEO) IN jack (J701)
L-CH, R-CH
315 Hz, 50 mV (–23.8 dB) blank tape
CS-123
600
Ω
attenuator
AF OSC
2. Mode: Playback
+
–
set
recorded
portion
MAIN board
CN301 pin
1
(L-CH)
pin
3
(R-CH)
level meter
3. Confirm playback the signal recorded in step 1 become speci-
fication values as follows.
If these values are out of specification values, adjust the RV351
(L-CH) and RV301 (R-CH) on the MAIN board to repeat steps
1 and 2.
Specification values:
CN301 playback level: 47.2 to 53.0 mV (– 24.3 to – 23.3 dB)
Adjustment Location: MAIN board
– MAIN BOARD (Component Side) –
118
115
CN431
CN371
13
IN OUT
MD (VIDEO)
CN301
IC301
IC501
RV321
REC BIAS
(L-CH)
RV351
REC LEVEL
(L-CH)
RV301
REC LEVEL
(R-CH)
RV391
TAPE SPEED
(NORMAL)
RV392
TAPE SPEED
(HIGH)
RV322
REC BIAS
(R-CH)

20
HCD-XGR80
CD SECTION
Note :
1. CD Block is basically designed to operate without adjustment.
Therefore, check each item in order given.
2. Use LUV-P01 (4-999-032-01) unless otherwise indicated.
3. Use an oscilloscope with more than 10M impedance.
4. Clean the object lens by an applicator with neutral detergent
when the signal level is low than specified value with the
following checks.
S-Curve Check
BD board Oscilloscope
TP(FE)
TP(DVC)
Procedure :
1. Connect oscilloscope to TP (FE).
2. Connect between TP (FE) and TP (DVC ( 1.65 V) by lead
wire.
3. Press the \/1 button to turn the power ON.
4. Load a disc (LUV-P01) and actuate the focus search. (In conse-
quence of open and close the disc tray, actuate the focus search)
5. Confirm that the oscilloscope waveform (S-curve) is symmetri-
cal between A and B. And confirm peak to peak level within 2
±0.5 Vp-p.
symmetry
S-curve waveform
within 4
±
1Vp-p
A
B
6. After check, remove the lead wire connected in step 2.
Note : • Try to measure several times to make sure than the ratio
of A : B or B : Ais more than 10 : 7.
• Take sweep time as long as possible and light up the
brightness to obtain best waveform.
RF Level Check
TP(RFDC)
TP(RFAC)
BD board oscilloscope
Procedure :
1. Connect oscilloscope to TP2 (RFDC) and TP1 (RFAC).
2. Press the \/1 button to turn the power ON.
3. Load a disc (LUV-P01) and playback.
4. Confirm that oscilloscope waveform is clear and check RF
signal level is correct or not.
Note: Clear RF signal waveform means that the shape “◊”can be
clearly distinguished at the center of the waveform.
VOLT/DIV : 200mV
TIME/DIV : 500ns
level : 1.45
±
0.3Vp-p
E-F Balance (1Track jump) Check
TP(TE)
TP(DVC)
BD board oscilloscop
e
Procedure:
1. Connect oscilloscope to TP (TE) and TP (DVC) board.
2. Press the \/1 button to turn the power ON.
3. Load a disc (LUV-P01) and playback the number nine track.
4. Press the bB button. (Becomes the 1track jump mode.)
5. Confirm that the level B and A (DC voltage) on the oscillo-
scope waveform.
B=1.3
±
0.6Vp-p symmetry
A (DC voltage
)
center of
waveform
B
0V
Specified level: ×100=less than –22%
B
A
6. Adjust RV101 so that A (DC voltage) becomes 0.
Checking Location:
[BD BOARD]
DVC
RFAC
FE
SE
TE RFDC
RV101
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