Sony HCD-ZUX9 User manual

SERVICE MANUAL
MINI Hi-Fi COMPONENT SYSTEM
SPECIFICATIONS
Ver. 1.1 2007.11
9-887-765-02
2007K04-1
© 2007.11
Sony Corporation
Audio Business Group
Published by SonyTechno Create Corporation
• HCD-ZUX9 is the tuner, deck, CD
and amplifier section in FST-ZUX9,
LBT-ZUX9.
Amplifier section
The following are measured at
US model:
AC 120 V, 60 Hz
Other models:
AC 120, 220, 240 V, 50/60 Hz
Front/Surround speaker
Power Output (rated):
160 W + 160W (at 6 Ω, 1 kHz,
1% THD)
RMS output power (reference):
250 W + 250W (per channel at 6 Ω,
1 kHz, 10% THD)
Inputs
VIDEO (AUDIO IN) L/R :
Voltage 250 mV, impedance
47 kilohms
AUDIO (AUDIO IN) L/R:
Voltage 450 mV, impedance
47 kilohms
MIC:Sensitivity 1 mV, impedance
10 kilohms
(USB) port:
Type A
Outputs
PHONES:
accepts headphones of 8 ohms or more
Disc player section
System
Compact disc and digital audio system
LaserSemiconductor laser
(λ= 770 – 810 nm)
Emission duration: continuous
Laser Output
Max. 44.6 µW*
*This output is the value measured at
a distance of 200 mm from the
objective lens surface on the Optical
Pick-up Block with 7 mm aperture.
Frequency response
2 Hz – 20 kHz
Wave length
770 – 810 nm
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 88 dB – Continued on next page –
HCD-ZUX9
Model Name Using Similar Mechanism HCD-GTX88
CD Mechanism Type CDM74KF-K6BD91UR-WOD
CD Section Base Unit Name BU-K6BD91UR-WOD
Optical Pick-up Name KSM-213DCP
Tape Section Model Name Using Similar Mechanism HCD-GTX88
US Model
E Model
Australian Model
AUDIO POWER SPECIFICATION
(US model only)
POWER OUTPUT AND TOTAL
HARMONIC DISTORTION:
With 6-ohm loads, both channels driven,
from 120 Hz – 10 kHz; rates 160 watts per
channel minimum RMS power, with no
more than 10 % total harmonic distortion
from 250 milliwatts to rated output.

2
HCD-ZUX9
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
Tape deck section
Recording system
4-track 2-channel stereo
Frequency response
50 – 13,000 Hz (±3 dB),
using Sony TYPE I tape
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
US model:
87.5 – 108.0 MHz (100 kHz step)
Other models:
87.5 – 108.0 MHz (50 kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
US and AUS models:
530 – 1,710 kHz (with the interval set
at 10 kHz)
531 – 1,710 kHz (with the interval set
at 9 kHz)
Other models:
531 – 1,602 kHz (with the interval set
at 9 kHz)
530 – 1,610 kHz (with the interval set
at 10 kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
USB section
Supported bit rate
MP3 (MPEG 1 Audio Layer 3):
32 – 320 kbps, VBR
Sampling frequencies
MP3 (MPEG 1 Audio Layer 3):
32/44.1/48 kHz
Transfer speed
Full-Speed
Supported USB device
Mass Storage Class
Maximum current
500 mA
General
Power requirements
US model: 120 V AC, 60 Hz
AUS model: 230 – 240 VAC,
50/60 Hz
Other models: 120 V, 220 V or
230 – 240 V AC, 50/60 Hz, adjustable
with voltage selector
Power consumption
420 W
Dimensions (Approx.)
491 ×297.5 ×460 mm (w/h/d)
Mass (Approx.)
20 kg
Supplied accessories:
Remote Commander (2)
R6 (size AA) batteries (4)
AM loop antenna (1)
FM lead antenna (1)
Front speaker pads (8)
Surround speaker pads (8)
Speaker cords (4)
Design and specifications are subject to
change without notice.
Ver. 1.1
•Abbreviation
AUS:Australian model

3
HCD-ZUX9
1.5 k Ω 0.15 µ FAC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270 ˚C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
otherthan thosespecified hereinmay resultin hazardousradiation
exposure.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40 ˚C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
This appliance is
claassified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
Ver. 1.1
SAFETY CHECK-OUT (US MODEL)
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts forAC leakage. Check leakage as
described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operatedAC voltmeter. The“limit” indication
is 0.75V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2VAC range are suitable. (See
Fig. A)
Fig. A. Using an AC voltmeter to check AC leakage.

4
HCD-ZUX9
MODEL IDENTIFICATION
– BACK PANEL –
Model Part No.
E2 3-095-364-0s
E51 3-095-364-1s
E13 3-095-364-2s
AUS 3-095-364-5s
US 3-095-364-6s
•Abbreviation
E2 : 120 V AC area in E model
E13 : 220-230 V AC area in E model
E51 : Chilean and Peruvian model
AUS:Australian model
PART No.
PLAYABLE DISC
Format of discs Logo
•AUDIO CD
•CD-R/-RW in AUDIO
CD format
•CD-R/-RW in DATA CD
format, containing MP3
audio tracks1) that
conforms to ISO 96602)
Level 1/Level 2, Joliet
(in expansion format), or
Multi Session3)
1) MP3 (MPEG 1 Audio Layer 3) is a standard format defined
by ISO/MPEG which compresses audio data. MP3 audio
tracks must be in MPEG 1 Audio Layer 3 format.
2) A logical format of files and folders on CD-ROMs, defined
by ISO (International Organization for Standardization).
3) This is a recording method that enables adding of data using
the Track-At-Once method. Conventional discs begin at a
disc control area called the Lead-in and end at an area called
Lead-out. A Multi Session disc is a disc having multiple
sessions, with each segment from Lead-in to Lead-out
regarded as a single session.
Ver. 1.1

5
HCD-ZUX9
1. SERVICING NOTES
Loading Panel .................................................................. 6
2. GENERAL
Guide to Parts and Controls............................................. 7
3. DISASSEMBLY
3-1. Side R Panel, Side L Panel .............................................. 16
3-2. Top Case Section ............................................................. 16
3-3. Back Panel Section .......................................................... 17
3-4. Loading Panel .................................................................. 17
3-5. Front Panel Section ......................................................... 18
3-6. Tape Mechanism Deck .................................................... 18
3-7. Holder (TC-L), Holder (TC-R) ....................................... 19
3-8. Power AMP Section ........................................................ 19
3-9. Main Board...................................................................... 20
3-10. FL Board, Power LED Board .......................................... 20
3-11. Illumination Board,VOL Board...................................... 21
3-12. MIC Board, Base R LED Board...................................... 21
3-13. HP-Video Board, USB Connector Board,
Base L LED Board .......................................................... 22
3-14. Center Key Board, Beat Creator Board,
X-Round Board ............................................................... 22
3-15. USB Board ...................................................................... 23
3-16. CD Mechanism ................................................................ 23
3-17. Driver Board, SW Board ................................................. 24
3-18. BD91 Board..................................................................... 24
3-19. Optical Pick-Up ............................................................... 25
3-20. Sensor Board ................................................................... 25
3-21. Motor (TB) Board ........................................................... 26
3-22. Motor (LD) Board ........................................................... 26
4. TEST MODE.............................................................. 27
5. MECHANICAL ADJUSTMENTS ....................... 31
6. ELECTRICAL ADJUSTMENTS ......................... 31
7. DIAGRAMS
7-1. Block Diagram – RF/Servo Section – ............................. 35
7-2. Block Diagram – Tape/Tuner Section – .......................... 36
7-3. Block Diagram – Main Section – .................................... 37
7-4. Block Diagram – Effector Section – ............................... 38
7-5. Block Diagram – USB Section –..................................... 39
TABLE OF CONTENTS
7-6. Block Diagram – AMP Section – .................................... 40
7-7. Block Diagram – Display/Power Section – ..................... 41
7-8. Printed Wiring Board – BD91 Section – ......................... 43
7-9. Schematic Diagram – BD91 Section –............................ 44
7-10. Printed Wiring Boards – Driver Section –....................... 45
7-11. Schematic Diagram – Driver Section – ........................... 46
7-12. Printed Wiring Board – Main Section – .......................... 47
7-13. Schematic Diagram – Main Section (1/4) – .................... 48
7-14. Schematic Diagram – Main Section (2/4) – .................... 49
7-15. Schematic Diagram – Main Section (3/4) – .................... 50
7-16. Schematic Diagram – Main Section (4/4) – .................... 51
7-17. Printed Wiring Boards
– HP-Video/MIC/USB Connector Section –................... 52
7-18. Schematic Diagram
– HP-Video/MIC/USB Connector Section –................... 53
7-19. Printed Wiring Board – USB Section –........................... 54
7-20. Schematic Diagram – USB Section –.............................. 55
7-21. Printed Wiring Board – Effector Section –...................... 56
7-22. Schematic Diagram – Effector Section – ........................ 57
7-23. Printed Wiring Board – PowerAMP Section – ............... 58
7-24. Schematic Diagram – Power AMP Section – .................. 59
7-25. Printed Wiring Board – FL Section – .............................. 60
7-26. Schematic Diagram – FL Section –................................. 61
7-27. Printed Wiring Boards – Key Section (1/2) –.................. 62
7-28. Printed Wiring Boards – Key Section (2/2) –.................. 63
7-29. Schematic Diagram – Key Section – ............................... 64
7-30. Printed Wiring Boards – LED Section (1/2) – ................ 65
7-31. Printed Wiring Boards – LED Section (2/2) – ................ 66
7-32. Schematic Diagram – LED Section –.............................. 67
7-33. Printed Wiring Boards – Power Section – ....................... 68
7-34. Schematic Diagram – Power Section – ........................... 69
8. EXPLODED VIEWS
8-1. Main Section.................................................................... 87
8-2. Front Panel Section (1).................................................... 88
8-3. Front Panel Section (2).................................................... 89
8-4. Front Panel Section (3).................................................... 90
8-5. Top Case Section ............................................................. 91
8-6. Back Panel Section .......................................................... 92
8-7. Chassis Section................................................................ 93
8-8. CD Mechanism Section (1) ............................................. 94
8-9. CD Mechanism Section (2) ............................................. 95
9. ELECTRICAL PARTS LIST................................ 96

6
HCD-ZUX9 SECTION 1
SERVICING NOTES
LOADING PANEL
gear (shaft)
1 Turn the gear (shaft) in the direction of the arrow.
3 loading panel
2

7
HCD-ZUX9
SECTION 2
GENERAL This section is extracted from
instruction manual.
6
GB
Guide to parts and controls
This manual mainly explains operations using the buttons on the unit, but the same
operations can also be performed using the buttons on the remote having the same or
similar names.
Unit
–Front view
–Top view
12 34 657
wh
wf
ws
wg
ql
qk qh
wa
wd
w; qg
qf
qdqs
qaq;
98
qj
wj
wl
ef
wk
ed es
ea
e;

8
HCD-ZUX9
7
GB
1"/1 (on/standby) (pages 15, 16,
17, 24, 30, 42, 47, 53)
Press to turn the system on or off.
BFunction buttons:
CD(pages 16,18, 20,23,30, 32,
43)
TUNER/BAND (pages 29, 43)
TAPE A/B (pages 31, 43)
Press to select a function.
CMASTER VOLUME (pages 18,
25, 42, 47)
Turn to adjust the volume.
DOPERATION DIAL (pages 18,
26, 34, 38, 42)
Turn to select a track or folder.
Turn to select a setting.
EDisplay (pages 10, 42, 44, 54)
FIR Receptor (page 48)
GFunction buttons:
AUDIO (pages 36, 43, 46)
VIDEO (pages 36, 43, 46)
(pages 24, 25, 36, 43)
Press to select a function.
HDISPLAY (pages 43, 44)
Press to change the information on
the display.
IGROOVE (page 34)
Press to reinforce the bass.
JFLAT (page 34)
SAMBA (page 34)
REGGAE (page 34)
HIP HOP (page 34)
TECHNO (page 34)
Press to select a preset effect.
KSPEAKERS (page 40)
Press to select the speaker system.
LFRONT BEAM (Right) (page 43)
MCHORUS (pages 36, 48, 53)
AQUA (pages 36, 48, 53)
Press to select an effector mode.
NPower illuminator (page 42)
OMIC (jack) (pages 40, 47, 57)
Connect an optional microphone.
MIC LEVEL (pages 33, 40, 47)
Turn to adjust the microphone
volume.
PBOTTOM BEAM (Right)
(page 43)
QDisc tray (pages 16, 18, 49)
RBOTTOM BEAM (Left) (page 43)
S(USB) port (pages 23, 24,
25, 51, 57)
Connect an optional USB device
(Digital music player or USB storage
media).
REC/ERASE (indicator)
(pages 24, 26)
Lightsupwhen recording from adisc
onto the connected optional USB
device (Digital music player or USB
storage media).
Lights up when erasing MP3 audio
tracks from the connected optional
USB device (Digital music player or
USB storage media).
USB
Continued
l

9
HCD-ZUX9
8
GB
TPHONES (jack) (pages 37, 40,
47, 57)
Connect the headphones.
UFLANGER (pages 35, 48, 53)
DELAY (pages 35, 48, 53)
Press to select an effector mode.
VFRONT BEAM (Left) (page 43)
WEQ BAND/MEMORY (page 34)
Press to select a frequency band
when adjusting the graphic
equalizer.
XROCK (page 34)
POP (page 34)
JAZZ (page 34)
DANCE (page 34)
Press to select a preset effect.
USER EQ (page 34)
Press to select a user equalizer
setting.
YAMP MENU (page 42)
Press to change the spectrum
analyser display, adjust the
brightness of the display and built-in
beam or change the power
illuminator pattern.
ZBEAM MODE (page 43)
Press to change the lighting effect of
a beam.
wj B PUSH Z OPEN/CLOSE
(Deck B) (page 31)
Press to insert or eject a tape.
Deck B (pages 32, 42, 53)
wk A ZPUSH OPEN/CLOSE
(Deck A) (page 31)
Press to insert or eject a tape.
Deck A (pages 31, 53)
wl ENTER (pages 17, 18, 21, 24,
26, 29, 35, 42, 43, 53)
Press to enter the selection.
ERASE (page 24)
Press to erase MP3 audio tracks or
folders on the connected optional
USB device (Digital music player or
USB storage media).
RETURN (pages 18, 26)
Press to return to the parent folder.
e; X-ROUND ON/OFF (pages 36,
37)
Presstoturnonoroffthe X-ROUND
function.
X-ROUND MODE (pages 36, 37)
Press to select an X-ROUND mode.
MAX/JUMP MODE (page 37)
Press to select the way of creating
“MAX” and “JUMP” effect.
X-ROUND JOG (page 37)
Turn to change the sound movement
or the speed of the sound movement.
JUMP PAD (page 37)
Press to switch the sound position to
the opposite direction instantly.
MAX PAD (page 37)
Press to enhance the sound.
ez DISC SKIP/EX-CHANGE
(pages 16, 18, 19, 21)
Press to select the next disc.
Press to exchange other discs during
playback.
ZOPEN/CLOSE (pages 16, 18,
49)
Press to load or eject a disc.
DISC 1 ~ 3 (pages 19, 21)
Press to select a disc.
Press to switch to the CD function
from the other functions.

10
HCD-ZUX9
9
GB
es CD- SYNC/REC 1 (page 23)
Press to record from a disc onto the
connected optional USB device
(Digital music player or USB storage
media).
Press to record a track from a disc
onto the connected optional USB
device (Digital music player or USB
storage media).
TAPE REC PAUSE/STAR T
(page 32)
Press to record onto a tape.
CD-TAPE SYNC (page 32)
Press to record a disc onto a tape.
ed NX (play/pause) (pages 18,20,
23, 25, 31, 49, 52)
Press to start or pause playback.
x(stop) (pages 18, 24, 26, 29,
31, 33, 49, 53)
Press to stop playback or recording.
./> (go forward/go
backward) (pages 17, 18, 21, 24,
26, 32, 41, 53)
Press to select a track.
TUNING +/– (pages 29, 30)
Press to tune in a radio station.
+/– (pages 18, 21, 24, 26, 32)
Press to select a folder.
m/M (rewind/fast forward)
(pages 18, 26, 31)
Press to find a point in a track or tape.
ef BEAT ON/OFF (page 38)
Press to turn on or off the rhythms of
the beat.
BEAT LEVEL (page 38)
Press to adjust the beat level.
BEAT SPEED (page 39)
Press to change the beat speed.
BEAT PATTE RN (pages 39)
Press to select the rhythms of the
beat.
BPM CONTROL (page 39)
Press to input the tempo of the audio
source.
PAD A/PAD B (page 38)
Press to add percussion sound.
USB
Continued
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