Sony MHC-DX90 User manual

SERVICE MANUAL
9-873-883-11 Sony Corporation
2001D0500-1 Home Audio Company
C2001.4 ShinagawaTec Service Manual Production Group
Ver 1.0 2001.04
MINI Hi-Fi COMPONENT SYSTEM
E Model
ACCESSORIES & PACKING MATERIALS
********************************
1-418-761-21 COMMANDER, STANDARD (RM-SR100B)
1-501-374-11 ANTENNA, LOOP (AM)
1-501-659-71 ANTENNA (FM)
1-769-317-11 CORD, SPEAKER (2.5m) (for SS-DX90)
4-210-254-01 CUSHION (FOOT) (for SS-DX90)
4-226-483-14 MANUAL, INSTRUCTION (ENGLISH)
4-226-483-24 MANUAL, INSTRUCTION (FRENCH) (E2)
4-226-483-34 MANUAL, INSTRUCTION (SPANISH)
4-228-952-01 COVER, BATTERY (for RM-SR100B)
•Abbreviation
E2 : 120 V AC Area in E model
PARTS LIST
Part No. Description Remark
MHC-DX90
SPECIFICATIONS
Power requirements 120 V, 220 V or 230 - 240 VAC, 50/60 Hz
Adjustable with voltage selector
Power consumption 300 watts
Dimensions (w/h/d) Approx. 280 ×360 ×425 mm
(11 ×14 3 /16 ×16 11 /16 in.)
Mass : Approx. 11 kg (24 lb. 5 oz)
Supplied accessories: AM loop antenna (1)
Remote commander (1)
Batteries (2)
FM lead antenna (1)
Front speaker pads (8)
Design and specifications are subject to change without notice.
• MHC-DX90 is composed of following models.
As for the service manual, it is issued for each component model, then, please refer to it.
COMPONENT MODEL NAME FOR MHC-DX90
MHC-DX90
COMPACT DISK DECK RECEIVER SYSTEM HCD-DX90
FRONT SPEAKER SS-DX90

2
MHC-DX90
REVISION HISTORY
Clicking the version allows you to jump to the revised page.
Also, clicking the version at the upper right on the revised page allows you to jump to the next revised
page.
Ver. Date Description of Revision
1.0 2001.04 New

SERVICE MANUAL
9-873-884-11 Sony Corporation
2001D0500-1 Audio Entertainment Group
C2001.4 General Engineering Dept.
Ver 1.0 2001.04
SPEAKER SYSTEM
E Model
SS-DX90
SPECIFICATIONS
Speaker system 2-way, 3-unit,
bass-reflex type
Speaker units
Woofer: 17 cm, cone type
Tweeter: 2.5 cm, horn type
Nominal impedance 4 ohms
Dimensions (w/h/d) Approx. 260 ×480 ×415 mm
(10 1/4 ×19 ×16 3/8in. )
front grill
Mass Approx. 9.5 kg net per
speaker (20 1b. 15 oz.)
Design and specifications are subject to change without notice.
• This set is the speaker system in
MHC-DX90.

2
SS-DX90
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
1 A-2004-809-A PANEL ASSY, FRONT
2 4-874-614-01 SCREW (4) (3.5X14), TAPPING
3 4-226-373-01 TAPPING (3.5X16)
4 4-228-365-01 HORN
5 4-942-029-01 PACKING
6 4-228-371-01 PACKING
7 A-2004-808-A CABINET ASSY, SPEAKER
8 1-761-365-11 MOUNTED PC BOARD
EXPLODED VIEWS AND PARTS LIST
NOTE:
• The mechanical parts with no reference number in
the exploded views are not supplied.
SP1
SP1
SP3
1
2
2
3
3
4
5
2
2
2
2
6
6
7
8
SP1 1-544-830-11 SPEAKER (16cm)
SP3 1-529-707-12 SPEAKER (HORN) (2.5cm)
**************************************************************
ACCESSORIES & PACKING MATERIALS
*******************************
1-558-848-11 CORD, SPEAKER (2.5m)

3
SS-DX90
MEMO

SS-DX90
REVISION HISTORY
Clicking the version allows you to jump to the revised page.
Also, clicking the version at the upper right on the revised page allows you to jump to the next revised
page.
Ver. Date Description of Revision
1.0 2001.04 New

SERVICE MANUAL
COMPACT DISC DECK RECEIVER
E Model
SPECIFICATIONS
HCD-DX90
Ver 1.0 2001.04
9-873-882-11 Sony Corporation
2001D0500-1 Home Audio Company
C2001.4 ShinagawaTec Service Manual Production Group
HCD-DX90 is the tuner, deck, CD and
amplifier section in MHC-DX90.
Model Name Using Similar Mechanism HCD-BX9/DX9
CD Mechanism Type CDM58-K2BD38
Base Unit Type BU-K2BD38
Optical Pick-up Type KSM-213DAP
Model Name Using Similar Mechanism NEW
Tape Transport Mechanism Type TCM-230AWP11
CD
SECTION
TAPE DECK
SECTION
Inputs
MD/VIDEO (AUDIO) IN: voltage 450 mV/250 mV,
(p ono jacks) impedance 47 kilo ms
MIC: sensitivity 1 mV,
(p one jack) impedance 10 kilo ms
Outputs
PHONES: accepts eadp ones of 8
(stereo mini jack) o ms or more
FRONT SPEAKER: accepts impedance of 4 to
16 o ms
CD player section
System Compact disc and digital
audio system
Laser Semiconductor laser
(λ=780nm)
Emission duration:
continuous
Laser output Max. 44.6
µ W*
*T is output is t e value
measured at a distance of
200 mm from t e
objective lens surface on
t e Optical Pick-up Block
wit 7 mm aperture.
Frequency response 2 Hz – 20 kHz (±0.5 dB)
Wavelengt 780 – 790 nm
Signal-to-noise ratio More t an 90 dB
Dynamic range More t an 90 dB
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelengt 660 nm
Output Level –18 dBm
Tape player section
Recording system 4-track 2-c annel stereo
Frequency response 40 – 13,000 Hz (±3 dB),
(DOLBY NR OFF) using Sony TYPE I
cassette
40 – 14,000 Hz (±3 dB),
using Sony TYPE II
cassette
Tuner section
FM stereo, FM/AM super eterodyne tuner
FM tuner section
Tuning range 87.5 – 108.0 MHz
Antenna FM lead antenna
Antenna terminals 75 o m unbalanced
Intermediate frequency 10.7 MHz
AM tuner section
Tuning range 531 – 1,602 kHz
(wit t e interval set at 9
kHz)
530 – 1,710 kHz
(wit t e interval set at 10
kHz)
Antenna AM loop antenna
Antenna terminals External antenna terminal
Intermediate frequency 450 kHz
Amplifier section
T e following measured at AC 120, 220, 240V
50/60 Hz
DIN power output (rated) 220 + 220 watts
(4 o ms at 1 kHz, DIN)
Continuous RMS power output (reference)
300 + 300 watts
(4 o ms at 1 kHz,
10% THD)
General
Power requirements 120 V, 220 V or 230 - 240
V AC, 50/60 Hz
Adjustable wit voltage
selector
Power consumption 300 watts
Dimensions (w/ /d) Approx. 280 x 360 x 425
mm (11 x 143/16 x 1611/16
in.)
Mass : Approx. 11 kg
(24 lb. 5 oz)
Supplied accessories: AM loop antenna (1)
Remote commander (1)
Batteries (2)
FM lead antenna (1)
Front speaker pads (8)
Design and specifications are subject to c ange
wit out notice.

2
HCD-DX90
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
otherthanthose specifiedherein mayresult inhazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
SAFETY-RELATED COMPONENTWARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINEWITH
MARK 0ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
TABLE OF CONTENTS
1. SERVICE NOTE ······························································· 3
2. GENERAL ·········································································· 4
3. DISASSEMBLY
3-1. Disassembly Flow ······························································ 6
3-2. Upper Case (Top) ······························································· 7
3-3. Loading Panel Assy ···························································· 7
3-4. Front Panel Section,
CD Mechanism Deck (CDM58-K2BD38)························· 8
3-5. Tape Mechanism Deck (TCM-230AWP11) ······················· 8
3-6. Panel Board ········································································ 9
3-7. Trans Board ········································································ 9
3-8. MAIN Board, AMP Board ··············································· 10
3-9. Leaf SW Board, Head (A) Board, Head (B) Board·········· 10
3-10. Base Unit (BU-K2BD38) ················································· 11
3-11. Driver Board, Motor Board, Sensor Board ······················ 11
4. TEST MODE···································································· 12
5. MECHANICAL ADJUSTMENTS ····························· 16
6. ELECTRICAL ADJUSTMENTS ······························· 16
7. DIAGRAMS
7-1. Circuit Boards Location ··················································· 21
7-2. Block Diagrams ································································ 22
7-3. Printed Wiring Board – BD Section – ······························ 24
7-4. Schematic Diagram – BD Section –································· 25
7-5. Printed Wiring Board – Main Section – ··························· 26
7-6. Schematic Diagram – Main (1/3) Section – ····················· 27
7-7. Schematic Diagram – Main (2/3) Section – ····················· 28
7-8. Schematic Diagram – Main (3/3) Section – ····················· 29
7-9. Printed Wiring Board – Power AMP Section – ················ 30
7-10. Schematic Diagram – PowerAMP Section –··················· 31
7-11. Printed Wiring Board – Panel Section –··························· 32
7-12. Schematic Diagram – Panel Section – ····························· 33
7-13. Printed Wiring Board – Leaf SW Section – ···················· 34
7-14. Schematic Diagram – Leaf SW Section – ························ 35
7-15. Printed Wiring Board – Driver Section – ························· 36
7-16. Schematic Diagram – Driver Section – ···························· 37
7-17. Printed Wiring Board – Trans Section – ··························· 38
7-18. Schematic Diagram – Trans Section – ····························· 39
7-19. IC Pin Function Description············································· 40
7-20. IC Block Diagrams ··························································· 42
8. EXPLODED VIEWS
8-1. Main Section····································································· 45
8-2. Panel Section ···································································· 46
8-3. Main Board Section·························································· 47
8-4. CD Mechanism Deck Section (CDM58-K2BD38)·········· 48
8-5. Base Unit Section (BU-K2BD38) ···································· 49
8-6. Tape Mechanism Deck Section-1 (TCM-230PWR11)····· 50
8-7. Tape Mechanism Deck Section-2 (TCM-230PWR11)····· 51
9. ELECTRICAL PARTS LIST······································· 52

3
HCD-DX90
SECTION 1
SERVICE NOTE
1 Cut the thirteen melted-connection points with a cutting plier.
2 panel board
Screw hole
Attach the panel board with
eleven screws (
+BVTP 2.6 × 8 )
after the board is removed once.
Do not tighten the screws excessively.
Note for installing the panel board
Hot melt

4
HCD-DX90 SECTION 2
GENERAL
1DISC SKIP EX-CHANGE button
2DISC 1 button and indicator
3DISC 2 button and indicator
4DISC 3 button and indicator
5ZOPEN/CLOSE button
6EDIT, TUNER MOMERY button
7PLAY MODE, STEREO/MONO button
8REPEAT, DOLBY NR button
9DIRECTION knob
q; SURROUND button
qa VOLUME knob
qs PHONES jack
qd ENTER button
qf REC PAUSE/START button and indicator
qg CD SYNC HI-DUB button
qh LOOP button
qj MIC jack
qk MIC LEVEL knob
ql V-GROOVE button and indicator
w; CURSOR button and indicator
wa GROOVE button
ws EQ EDIT button
wd SPECTRUM button
wf DISPLAY button
wg ?/1 button and indicator
wh TUNER/BAND button
wj MD (VIDEO) button
wk gG button
wl >+ button
e; Xbutton
ea –.button
es xbutton
ed TAPE A/B button
ef CD button
eg Function indicator
eh m/M knob
1234 5
6
7
8
qa
qs
qdqfqgqh
w;
ws
ed
ef wh
wj
eh
wk
wl
e;
ea
9
q;
wa
ql
wd
wf
wg
es
qk
qj
eg
LOCATION OF CONTROLS

5
HCD-DX90
7
1Press CLOCK/TIMER SET.
The hour indication flashes.
2Press .or >repeatedly to set
the hour.
3Press ENTER.
The minute indication flashes.
4Press .or >repeatedly to set
the minute.
5Press ENTER.
The clock starts working.
Tip
If you’ve made a mistake, start over from step 1.
To change the time
The previous explanation shows you how to set the
time while the power is off. To change the time
while the power is on, do the following:
1Press CLOCK/TIMER SET.
2Press .or >repeatedly to select
SET CLOCK.
3Press ENTER.
4Perform steps 2 through 5 above.
Note
The clock settings are canceled when you disconnect
the power cord or if a power failure occurs.
Step 2: Setting the
time
You must set the time before using the timer
functions.
The clock is on a 24-hour system for the
European model and a 12-hour system for
other models.
The 24-hour system model is used for
illustration purposes.
0)
=+
œP p
(P p
1
3,5
2,4
This section is extracted from
instruction manual.

HCD-DX90
6
•This set can be disassembled in the order shown below.
3-1. DISASSEMBLY FLOW
SECTION 3
DISASSEMBLY
3-2. UPPER CASE (TOP)
(page 7)
3-3. LOADING PANEL ASSY
(page 7)
3-4. FRONT PANEL SECTION,
CD MECHANISM DECK
(CDM58-K2BD38)
(page 8)
3-5. TAPE MECHANISM DECK
(TCM-230AWP11)
(page 8)
3-6. PANEL BOARD
(page 9) 3-7. TRANS BOARD
(page 9)
3-8. MAIN BOARD,
AMP BOARD
(page 10)
3-9. LEAF SW BOARD,
HEAD (A) BOARD,
HEAD (B) BOARD
(page 10)
3-10. BASE UNIT
(BU-K2BD38)
(page 11)
3-11. DRIVER BOARD,
MOTOR BOARD,
SENSOR BOARD
(page 11)
SET

HCD-DX90
7
side panel (R)
0 claw
4
qa
8
qs
upper case (top)
side panel (L)
5 two screws (case 3 TP2)
7 two screws
(+BVTP 3 × 10)
1 two screws (case 3 TP2)
9 two screws (+BVTP 3 × 10)
3 two screws
(+BVTP 3 × 10)
6 screw (case 3 TP2)
2 screw (case 3 TP2)
Note: Follow the disassembly procedure in the numerical order given.
3-2. UPPER CASE (TOP)
3-3. LOADING PANEL ASSY
2 pull-out the disc tray.
1 Turn the pulley to the direction of arrow.
pulley
4 loading panel assy
Front panel side
CD mechanism deck (CDM58)
3

HCD-DX90
8
3-4. FRONT PANEL SECTION, CD MECHANISM DECK (CDM58-K2BD38)
3-5. TAPE MECHANISM DECK (TCM-230AWP11)
7
qa
qs
CD mechanism deck (CDM58)
8 front panel section
3 connector (CN2)
9 connector (CN201)
0 connector (CN202)
2 connector (CN1)
Connector
(CN601)
1 flat type wire (CN304)
6 three screws (+BVTT 3 × 6)
5 screw (+BVTP 3 × 10)
4 screw (+BVTP 3 × 10)
6 tape mechanism deck
(TCM-230AWP11)
5 four screws (+BVTP 2.6 × 8)
1 screw (+BVTP 2.6 × 8)
2 bracket assy (heart cam R)
4 bracket assy (heart cam L)
3 screw (+BVTP 2.6 × 8)

HCD-DX90
9
3-6. PANEL BOARD
3-7. TRANS BOARD
qs Cut the thirteen melted-connection points with a cutting plier.
Note: When attching the panel board,
refer to "Service Note" on page 3.
qf panel board
qa CD Switch boar
d
1 vol knob
8
5
FR knob
4 bracket (FR)
qd five claws
0 three claws
9 two screws
(+BVTP 2.6
× 8)
3 two bosses & four pins
6 spring
2 two screws
(+BVTP 2.6
× 8)
7 knob(MIC)
8 two screws
(+BVTT 4 × 8)
2 five screws
(+BVTP 3 × 10)
1 two screws
(+BVTP 3 × 10)
4 back panel
7 two screws (+BVTT 4 × 8)
0 trans board
9 power transformer (T971)
5 connector (CN975)
6 connector (CN977)
3 connector (CN891)

HCD-DX90
10
3-8. MAIN BOARD, AMP BOARD
3-9. LEAF SW BOARD, HEAD (A) BOARD, HEAD (B) BOARD
5 three screws (+BVTP 3 × 8)
7 two screws (+BVTP 3 × 8)
8 heat sink
4 two screws (+BVTP 3 × 16)
1 two screws (+BVTP 3 × 8)
3 MAIN board
2 connector(CN502)
2 connector
(CN503)
6 POWER AMP board
7 screw (+PS 2.6 × 5)
5 screw (+PS 2.6 × 5)
4 leaf SW board
2
1
five claws
6 head (A) board
8 head (B) board
3 Remove the four solderings.

HCD-DX90
11
3-10. BASE UNIT (BU-K2BD38)
3-11. DRIVER BOARD, MOTOR BOARD, SENSOR BOARD
base unit
(BU-K2BD38)
7
2 two screws (+PTPWH 2.6), floatin
g
8 two insulators
9 two insulators
4 two screws (+PTPWH 2.6)
5 stopper (BU)
6 two springs (insulator), coil
1 flat type wire (CN101)
3 two springs (insulator), coil
4 three screws (+BVTP 2.6 × 8)
9 screw (+PTPWH 2.6 × 8)
q; tray
2 screw (+BVTP 2.6 × 8)
qa screw (+BVTP 2.6 × 8)
7 flat type wire (CN721)
6 MOTOR board
qs SENSOR board
8 connector(CN722)
3 DRIVER board
1 connector (CN701)
5 Remove the two solderings of motor.

12
HCD-DX90 SECTION 4
TEST MODE
[MC Cold Reset]
•The cold reset clears all data including preset data stored in the
RAM to initial conditions. Execute this mode when returning
the set to the customer.
Procedure:
1. Press three buttons x, ENTER , and ?/1simulta-neously.
2. The fluorescent indicator tube displays “COLD RESET”and
the set is reset.
[CD Ship Mode]
•This mode moves the pickup to the position durable to vibra-
tion. Use this mode when returning the set to the customer after
repair.
Procedure:
1. Press ?/1button to turn the set ON.
2. Press CD button and ?/1button simultaneously.
3. After the "STANDBY" display blinks six times, a message
“LOCK”is displayed on the fluorescent indicator tube, and the
CD ship mode is set.
[MC Hot Reset]
•This mode resets the set with the preset data kept stored in the
memory. The hot reset mode functions same as if the power
cord is plugged in and out.
Procedure:
1. Press three buttons x, ENTER, and DISC 1 simultaneously.
2. The fluorescent indicator tube becomes blank instantaneously,
and the set is reset.
[CD Service Mode]
•This mode can run the CD sled motor freely. Use this mode, for
instance, when cleaning the pickup.
Procedure:
1. Press ?/1button to turn the set ON.
2. Select the function “CD”.
3. Press three buttons x, ENTER , and ZOPEN/CLOSE si-
multaneously.
4. The CD service mode is selected.
5. With the CD in stop status, turn the shuttle knob clockwise to
move the pickup to outside track, or turn the shuttle knob
counter-clockwise to inside track.
6. To exit from this mode, perform as follows:
1) Move the pickup to the most inside track.
2) Press three buttons in the same manner as step 2.
Note: •Always move the pickup to most inside track when exiting from
this mode. Otherwise, a disc will not be unloaded.
•Do not run the sled motor excessively, otherwise the gear can be
chipped.
[VACS ON/OFF Mode]
•This mode is used to switch ON and OFF the VACS (Variable
Attenuation Control System).
Procedure:
Press the ENTER and SPECTRUM buttons simultaneously. The
message “VACS OFF”or “VACS ON”appears.
[Change-over of MW Tuner Step between 9 kHz and
10 kHz]
•A step of MW channels can be changed over between 9 kHz
and 10 kHz.
Procedure:
1. Press ?/1button to turn the set ON.
2. Select the function “TUNER”, and press TUNER/BAND
button to select the BAND “MW”.
3. Press ?/1button to turn the set OFF.
4. Press ENTER and ?/1buttons simultaneously, andthedisplay
of fluorescent indicator tube changes to “MW 9 k STEP”or
“MW 10 k STEP”, and thus the channel step is changed over.
[GCTest Mode]
•This mode is used to check the software version, FL tube, LED,
keyboard and VACS.
Procedure:
1. Pressthree buttons x, ENTER ,and DISC 2 simultaneously.
2. LEDs and fluorescent indicator tube are all turned on.
3. When you want to enter the software version display mode,
press DISC 1 . Themodelnumber and destinationaredisplayed.
4. Each time DISC 1 is pressed, the display changes starting
from MC version, GC version, VC version, CD version, CM
version, ST version, TC version, TA version, TM version and
BR version in this order, and returns to the model number and
destination display.
5. When DISC 3 is pressed while the version numbers are being
displayed except model number and destination, year, month
and day of the software creation appear. When DISC 3 is
pressedagain,the display returnstothe software version display.
When DISC 1 is pressed while year, month and day of the
software creation are being displayed, the year, month and day
of creation of the software versions are displayed in the same
order of version display.
6. Press DISC 2 button, and the key check mode is activated.
7. In the key check mode, the fluorescent indicator tube displays
“KEY0VOL0”. Each time a button is pressed, “KEY”value
increases. However, once a button is pressed, it is no longer
taken into account.
“VOL”value increases like 1, 2, 3 ... if rotating VOLUME
knob in “+”direction, or it decreases like 0, 9, 8 ... if rotating in
“–” direction.
8. Also when DISC 3 is pressed after lighting of all LEDs and FL
tubes, value of VACS appears.
9. To exit from this mode, press three buttons in the same manner
as step 1, or disconnect the power cord.

13
HCD-DX90
[MCTest Mode]
•This mode is used to check operations of the respective sections
of Amplifier, Tuner, CD and Tape.
Procedure:
1. Press the ?/1button to turn on the set.
2. Press the three buttons of x, ENTER and DISC 3
simultaneously.
3. A message “TEST MODE”appears on the FL display tube.
4 When v(CURSOR UP) button is pressed, GEQ increases to
its maximum and a message “GEQ ALL MA”appears.
5. When V(CURSOR DOWN) button ispressed, GEQdecreases
to its minimum and a message “GEQ ALL M1”appears.
6. When b(CURSOR LEFT) or B(CURSOR RIGHT) button
is pressed, GEQ is set to flat and a message “GEQ FLAT”
appears.
7. When the VOLUME control knob is turned clockwise even
slightly, the sound volume increases to its maximum and a
message “VOLUME MAX”appears for two seconds, then the
display returns to the original display.
8. When theVOLUME control knob is turned counter-clockwise
even slightly, the sound volume decreases to its minimum and
a message “VOLUME MIN”appears for two seconds, then
the display returns to the original display.
9. In the test mode, the default-preset channel is called even when
the TUNER is selected and an attempt is made to call the preset
channelthathas beenstoredinmemory, byoperatingthe Shuttle
knob. (It means that the memory is cleared.)
10. When CD is selected and the EDIT button is pressed, the disc
that is being chucked at this moment becomes the default
setting. It means that the default disc only is accessed when
any other discs are selected even though the display indication
changes accordingly. At the same time, the DISC SKIP EX-
CHANGE and ZOPEN/CLOSE cannot be accepted. (It
means that the tray motor and the turntable motor are disabled
of their operation.)
11. When a tape is inserted in Deck B and recording is started, the
input source function selects VIDEO automatically.
12. When xbutton is pressed to stop recording, the Tape (Deck)
B is selected and tape is rewound using the Shuttle knob, tape
is rewound, tape is stops at around the record-starting position
and playback of the recorded portion of the tape is started. If
PAUSE is inserted even once during recording, tape is rewound
to the position around the PAUSE position and is played back.
13. Whenthe CD SYNC HI-DUB Button is pressduringplayback
of Deck B, either normal speed or high speed can be selected
by this button.
14. Select the desired loop by pressing the PLAY MODE button.
Insert a test tapeAMS-110A or AMS-RO to Deck A.
15. Press the SPECTRUM button to enter the AMS test mode.
16. After a tape is rewound first, the FF AMS is checked, and the
mechanism is shut off after detecting the AMS signal twice.
17. Then the REWAMS is checked and the mechanism is shut off
after detecting the AMS signal twice.
18. When the check is complete, a message of either OK or NG
appears.
19. When you want to exit this mode, press the ?/1button twice.
The cold reset is enforced at the same time.

14
HCD-DX90
[Aging Mode]
This mode can be used for operation check of CD section and tape deck section.
•If an error occurred:
The aging operation stops and display status.
•If no error occurs:
The aging operation continues repeatedly.
1. Operating method ofAging Mode
Turn on the main power and select “CD”of the function.
1) Set a disc in DISC1 tray. Select ALL DISC CONTINUE, and REPEAT OFF.
2) Load the tapes recording use into the decks A and B respectively.
3) Press three buttons x, ENTER , and
DISC SKIP/EX-CHANGE simultaneously.
4) Aging operations of CD and tape are started at the same time.
5) To exit the aging mode, perform [MC Cold Reset].
3. Aging Mode in CD section
1) Display state
•No error occurs
Note:
[*][*][*][*] : Number of aging operations
Error display
E** s## $$ %%
12 3 4 5
•When the buttons x , ENTER and DISC 1 are pressed simultaneously, number of time of the mechanism error and the NO DISC error
can be checked.
Display: EMC**EDC** **: Number of times of error (Maximum three times)
EMC: Mechanism error
EDC: NO DISC error
•When aging operation is complete, be sure to perform the MC Cold Reset to reset the error history.
D: No disc error
01: FOCUS ERROR
02: GFS ERROR
03: SETUP ERROR
01: NO DISC judgment without chucking retry
02: NO DISC judgment after chucking retry
Status at the time of NO DISC judgment
(High order digits only)
1: STOP
2: SETUP
3: TOC READ
4: ACCESS
5: PLAY BACK
6: PAUSE
7: MANUAL SEARCH (PLAY)
8: MANUAL SEARCH (PAUSE)
AGING[*][*][*][*]
1**
2s
3##
4$$
5%%
M: Mechanism error
Don’t care
High order digits only
D: Stopped during closing due to problems other than mechanism.
E: Stopped during opening due to problems other than mechanism.
C: Stopped during chucking due to problems other than mechanism.
F: Stopped during EX-opening due to problems other than mechanism.
Emergency related errors (High order digits only)
1: Stopped during chuck-up
2: Stopped during chuck-down
3: Time out by EX-OPEN
5: Time out by EX-CLOSE
The error No. 00 indicates the newest error. As the error No. increases, it means the older error.
When you want to retrieve the error history, press the PLAY MODE button in the case of mechanism error.
Or press the REPEAT button in the case of NO DISC error.
Display