Sony ICD-SX68 Marketing User manual

SERVICE MANUAL
Published by Sony Techno Create Corporation
Sony Corporation
Audio Business Group
ICD-SX68/SX68DR9/SX78/
SX78DR9/SX88
SPECIFICATIONS
IC RECORDER
9-887-998-01
2008B04-1
© 2008.02
US Model
Canadian Model
ICD-SX68/SX68DR9
AEP Model
E Model
ICD-SX68/SX78/SX78DR9
Korea Model
ICD-SX68/SX78/SX88
Ver. 1.0 2008.02
Photo : ICD-SX68
Capacity (User available capacity)
ICD-SX68/SX68DR9: 512MB
(approx. 483MB=507,346,944Byte)
ICD-SX78/SX78DR9: 1GB
(approx. 975MB=1,022,590,976Byte)
ICD-SX88: 2GB
(approx. 1.93GB=2,081,521,664Byte)
A part of the memory capacity is used as a
management area.
Recording time
Frequency range
STHQ : 80 Hz - 20,000 Hz
ST : 80 Hz - 16,500 Hz
STLP : 80 Hz - 7,000 Hz
SP : 80 Hz - 6,000 Hz
LP : 80 Hz - 3,500 Hz
•
•
•
•
•
Bit rates and sampling frequencies for
Bit rate: 32 - 320 kbps, VBR
Sampling frequencies: 16/22.05/24/32/44.1/
48 kHz
Not all encoders are supported.
Speaker
Approx. 16 mm (21/32 in.) dia.
Power output
150 mW
Input/Output
Microphone jack (minijack, stereo)
input for plug in power, minimum input
level 0.6 mV, 3 kilohms or lower impedance
microphone
Headphone jack (minijack, stereo)
output for 8 - 300 ohms headphones
USB connector
Playback speed control
+200% to –75% (DPC)
Power requirements
Two NH-AAA rechargeable batteries: 2.4 V DC
Two LR03 (size AAA) alkaline batteries: 3.0 V DC
Operating temperature
5˚C - 35˚C (41˚F - 95˚F)
•
–
•
–
•
Maximum recording time
The maximum recording time of all the
folders is as follows.
ICD-SX68/SX68DR9
STHQ mode ST mode STLP mode
8 hr. 35 min. 22 hr. 50 min. 44 hr. 00 min.
SP mode LP mode
69 hr. 40 min. 185 hr. 55 min.
ICD-SX78/SX78DR9
STHQ mode ST mode STLP mode
17 hr. 25 min. 46 hr. 5 min. 88 hr. 45 min.
SP mode LP mode
140 hr. 35 min. 374 hr. 55 min.
ICD-SX88
STHQ mode ST mode STLP mode
35 hr. 30 min. 93 hr. 55 min. 180 hr. 45 min.
SP mode LP mode
286 hr. 10 min. 763 hr. 15 min.
(hr : hours/min. : minutes)
Dimensions (w/h/d) (not incl.
projecting parts and controls)(JEITA)*
30.8 × 119.3 × 14.9 mm (1 1/4 × 4 3/4 × 19/32
in.)
Mass (JEITA)*
74 g (2.7 oz) including two NH-AAA
rechargeable batteries
*Measured value by the standard of JEITA
(Japan Electronics and Information
Technology Industries Association)
Supplied accessories
change without notice.
Rechargeable batteries (2)
Stereo headphones (1) (Except AEP)
USB connecting cable (1)
Application Software, Digital Voice
Editor (CD-ROM) (1)
Application Software, Dragon Naturally
Speaking (CD-ROM)
(2) (SX68DR9: US/SX78DR9: E)
(3) (SX68DR9: Canadian)
(4) (SX78DR9: AEP)
Cradle (1) (SX68DE9/SX78DR9)
Stand (1) (AEP, E, Korea)
Carrying pouch (1)

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
2
1. GENERAL .................................................................. 3
2. DISASSEMBLY
2-1. Knob (HOLD), Speaker Assy (SP001)........................... 6
2-2. Chassis Assy, Case Assy................................................. 6
2-3. Battery Case Lid ............................................................. 7
2-4. Cover (Chassis), MAIN Board ....................................... 7
2-5. Chassis............................................................................ 8
2-6. SW Board, HPJACK Board............................................ 8
2-7. MIC-AAssy, MIC-B Assy.............................................. 9
2-8. Liquid Crystal Display Panel, AUDIO Board ................ 9
3. TEST MODE ............................................................ 10
4. DIAGRAMS
4-1. Block Diagram - MAIN1 Section -................................ 13
4-2. Block Diagram - MAIN2 Section -................................ 14
4-3. Printed Wiring Board - AUDIO Board (Side A) - ......... 15
4-4. Printed Wiring Board - AUDIO Board (Side B) - ......... 16
4-5. Schematic Diagram - AUDIO Board (1/2) -.................. 17
4-6. Schematic Diagram - AUDIO Board (2/2) -.................. 18
4-7. Printed Wiring Board - MAIN Board (Side A) - ........... 19
4-8. Printed Wiring Board - MAIN Board (Side B) - ........... 20
4-9. Schematic Diagram - MAIN Board (1/5) -.................... 21
4-10. Schematic Diagram - MAIN Board (2/5) -.................... 22
4-11. Schematic Diagram - MAIN Board (3/5) -.................... 23
4-12. Schematic Diagram - MAIN Board (4/5) -.................... 24
4-13. Schematic Diagram - MAIN Board (5/5) -.................... 25
4-14. Printed Wiring Boards - HPJACK Board, SW Board -. 26
4-15. Schematic Diagram - HPJACK Board, SW Board -...... 27
5. EXPLODED VIEWS
5-1. Overall Assy.................................................................... 38
5-2. Chassis Section............................................................... 39
6. ELECTRICAL PARTS LIST .............................. 40
TABLE OF CONTENTS
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
3
SECTION 1
GENERAL
9GB
*Connect stereo ear receiver or stereo
headphones supplied or not supplied to the
i(headphone) jack. If unwanted noise is
heard, wipe the headphones plug clean.
Rear
PSpeaker
QHOLD switch**
RV-UP (Digital Voice Up) switch (37, 57)
SDPC switch (38, 51)
TDIRECTNL (directional) switch (24)
Um(microphone) jack (31, 32)
V(USB) connector (13, 64)
WBattery compartment (13)
** Slide the HOLD switch in the direction of
the arrow to lock all the functions of all the
buttons. During stop,“POWER SAVING…”
will be displayed and the display will be
turned o to prevent battery power from
exhausting.
Index to Parts and
Controls
Refer to the pages indicated in
parentheses for details.
Front
1i(headphone) jack*(21, 23, 34, 35,
84)
2Built-in microphones (stereo/
directional) (21, 25, 26)
3Operation indicator (21, 25, 27, 29, 53)
4Display window (10, 11)
5DIVIDE/ (bookmark) button (31, 34,
39)
6(folder)/MENU button
7z(record/pause) button (21, 25, 26,
27, 30)
8x(stop) button (18, 22, 26, 28, 30, 34,
41, 43, 46, 47)
9>(cue/fast forward) button (35)
JNx (play/stop/enter) button
K.(review/fast backward) button
(35)
LVOL (volume) +/– button (23, 34)
M(repeat) A-B/ (priority) button
(34, 38, 46)
NERASE button (43)
OOpning for a handstrap (A handstrap
is not supplied.)
This section is extracted
from instruction manual.

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
4
5Remaining battery/Charging
indicator
When dry batteries are used, the
indicator shows the remaining
battery power.
While charging the rechargeable
batteries an animation appears.
6Selected message number/Total
number of messages in the folder
7Priority marks
Appear(s) when a message is set with
priority mark(s).
8Bookmark indicator
Appears when a bookmark is set for
a message.
9Alarm indicator
Appears when the alarm is set for a
message.
J
Displays the EFFECT setting in the
menu.
BA1 : The bass sound is reinforced.
BA2 : The bass sound is further
reinforced.
Display window
Display during playback and stop
1Operation mode indicator
Displays the following, depending on
the current operation mode
: playback
: stop
: review/fast backward,
cue/fast forward
: going backward/forward
continuously
2Folder indicator
3Elasped time/Remaining time
indication/Recording date and time
indication
4Folder name/Message name/Artist
name indication
KRecording mode indicator
Displays the recording mode set
using the menu when the IC recorder
is in the stop mode, and displays the
current recording mode when the IC
recorder is in the playback mode.
STHQ : Standard play stereo
recording mode with high quality
sound
ST : Standard play stereo recording
mode
STLP : Long play stereo recording
mode
SP : Standard play monaural
recording mode
LP : Long play monaural recording
mode
MP3 : MP3 mode (during playback
only)
LMicrophone sensitivity indicator
Displays the current microphone
sensitivity.
(high) : To record at a meeting or
in a quiet/spacious place.
(low) : To record for dictation or in
a noisy place.
MAN (manual) : To record with
microphone sensitivity set manually.
MRemaining recording time indication
Display during recording
NOperation mode indicator
Displays the following, depending
on the current operation of the IC
recorder.
: recording
: recording standby/recording
pause
: recording with the VOR
function
: recording pause with the
VOR function
ORecording level meter
PMicrophone sensitivity indicator
Displays the current microphone
sensitivity when recording with AGC
(Automatic Gain Control).
(high) : To record at a meeting or
in a quiet/spacious place.
(low) : To record for dictation or in
a noisy place.
Displays the recording level during
manual recording.
QElapsed recording time indication
RAlarm indicator
SRecording mode indicator
Displays the recording mode (STHQ,
ST, STLP, SP, and LP) set in the menu.
TLIM (limiter) indicator
Displays the LIMITER setting in the
menu.
When “REC LEVEL” is set to “AUTO-
AGC,”“---” is displayed.
URemaining recording time indication
VRemaining battery/Charging
indicator
WLCF (Low Cut Filter) indicator
Displays the LCF setting in the menu.
1Select “DATE & TIME” in the menu.
1
Press and hold /MENU.
The menu mode will be displayed in
the display window.
2Press .or >to select“DETAIL
MENU” and press Nx.
3Press .or >to select“DATE &
TIME” and press Nx.
2Press .or >to select “AUTO”
or “MANUAL” and press Nx.
When you selected “AUTO,” the clock is
automatically adjusted using the clock
in the computer connected to the IC
recorder and on which the supplied
Digital Voice Editor software is started.
When you select “MANUAL,”proceed
to the next steps.
Step 2: Setting the
Clock
x
./>
Nx
/MENU
You need to set the clock to use the
alarm function or record the date and
time.
Clock setting display appears when you
you insert batteries after the IC recorder
has been without batteries for a certain
period of time. In this case, proceed from
step 4.
3Press .or >to select
“08y1m1d” and press Nx.
4Press .or >to set the year,
month, day, hour, and minute in
sequence, and then press Nx.
“EXECUTING….” appears and the clock
is set.
5Press xto return to the normal
display.
Note
If you do not press Nx within one minute
of entering the clock setting data, the clock
setting mode is cancelled and the window
will return to the normal display.
P

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
5
SECTION 2
DISASSEMBLY
• This set can be disassembled in the order shown below.
2-2.CHASSIS ASSY,
CASE ASSY
(Page 6)
2-3.BATTERY CASE LID
(Page 7)
2-4.COVER (CHASSIS),
MAIN BOARD
(Page 7)
2-5.CHASSIS
(Page 8)
2-6.SW BOARD,
HPJACK BOARD
(Page 8)
2-7.MIC-AASSY,
MIC-B ASSY
(Page 9)
2-8.LIQUID CRYSTAL
DISPLAY PANEL,
AUDIO BOARD (Page 9)
2-1.KNOB (HOLD),
SPEAKER ASSY (SP001)
(Page 6)
SET

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
6
Note: Follow the disassembly procedure in the numerical order shown below.
2-1. KNOB (HOLD), SPEAKER ASSY (SP001)
2-2. CHASSIS ASSY, CASE ASSY
RE two screws (1.7 ×4.5)
RH speaker assy (SP001)
RB two claws
two
claws
claw
claw
RG claw
claw claw
knob (hold)
knob (hold)
RT base
R cover (jack)
knob (hold)
knob (hold)
screw (1.4 ×2.5)
L side
faces
case assy
chassis assy
left side
bracket (chassis)
spacer (ornamental belt)
chassis assy
battery case lid assy
screw (1.7 ×3.5)
When assembling the chassis assy,
adjust the switches in the direction
of the arrow.
When assembling the chassis assy to the case assy,
orient the case assy so that its L side
faces down, and insert the chassis
assy with its left side up.
switches
switch
case assy

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
7
2-3. BATTERY CASE LID
2-4. COVER (CHASSIS), MAIN BOARD
battery case lid,
base (battery), e.t.c.
chassis (battery case lid)
screw (1.7 ×3)
battery terminal
(+–) assy
base (battery)
hinge
(battery case lid) battery case lid
four claws
five claws
Remove the SW board
in the direction of the arrow.
cover (chassis)
Remove the
solderings.
battery terminal (+)
battery terminal (–)
MAIN board
Assembling the chassis assy
After the chassis assy has been assembled,
check that the wires of the microphone are properly
routed (without being pressed down).
board to board
connector

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
8
2-5. CHASSIS
2-6. SW BOARD, HPJACK BOARD
sheet (microphone jack)
screws
screw holes
harnesses
chassis
two claws
two claws
two claws and dowel.
Sheet (microphone jack) attachment
position is shown.
sheet
(microphone jack)
two cushions
two screws (B1.4 ×4) Route the harness as shown below.
When installing the HPJACK board,
push the board to the very end,
and then fix it with screws.
HPJACK board
Remove
the solderings.
wire (frat type)
(CN7002)
HPJACK board
SW board
sheet (LED) orange
black
blue
gray
Solder each lead according to the color
(black, orange, blue, gray) as shown in
the figure.
Sheet (LED) attachment position is shown.
sheet (LED)
sheet (LED)
LED
LED
SW board
SW board

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
9
2-7. MIC-A ASSY, MIC-B ASSY
2-8. LIQUID CRYSTAL DISPLAY PANEL, AUDIO BOARD
Remove the soldering.
wire (frat type)
(CN5002)
R AUDIO board
battery terminal
(detection) light guide plate
sheet (light guide plate S)
sheet
(light guide plate L)
liquid crystal
display panel
(LCD101)
holder (LCD)
two claws claw
Sheet (light guide plate L) attachment
position is shown.
When installing the liquid crystal display
panel to the holder (LCD), insert the liquid
crystal display panel to the holder (LCD)
from the side with claws.
Sheet
(light guide plate L)
AUDIO board 1mm
claw
liquid crystal
display panel
holder (LCD)
Remove the
solderings.
mic-A assy
(M101) mic-A assy
(M102) mic-B assy
(M103)
red
red black
black yellow
black
Solder each lead according to the color
(black, red, yellow) as shown in the figure.
mic-A assy
(M101) mic-A assy
(M102)
mic-B assy
(M103)

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
10
[Test Mode]
The following checks can be implemented using the Test Mode.
How to Enter the Test Mode
• Turn the power on. (by inserting batteries)
• Turn ON the [V-UP] switch while pressing the [DIVIDE/ ]
button and [VOL –] button at the same time.
How to Exit the Test Mode
Exit the test mode by turning OFF the power. (by removing the
batteries)
Initial Status of the Test Mode
When the machine enters the test mode, the LCD display appears
as shown below.
Select the desired item by using the [>]/[.] button, and
press the [Nx] button to set the selection.
1. Version test
• Version of the respective modules are verified.
• Press the [x] button to return to the test mode screen.
2. Key Chk + Format test
• Perform the key check by pressing the keys. The NAND for-
matting (deleting all events) and the default settings of the
menus (default language and LCD contrast remain unchanged)
are executed at the same time.
* [Nx]/[>]/[.]/[ /MENU]/[z]/[x]/[VOL +]/
[VOL –] /[ERASE]/[DIVIDE/ ]/[ A-B/ ]/
[DPC (ON/OFF)]/[V-UP (ON/OFF)]/
[DIRECTNT (ON/OFF)]/[.HOLD]
• Press the [x] button to return to the test mode screen.
SECTION 3
TEST MODE
+
Loop

















 


 




 
 



Version
KeyChk+Fmt
Loop
ExtMic Cal
SetMic Cal
Beep
Lcd Cont
RTC Int




Battery
BattAC2
BattAB4
BattCnt
Menu Init
Key Check
Log Output
App LogOut
Convert
VBUS
Sleep
START
Initial status of test mode
F/W version display
TEST MODE
END
TEST MODE
Turn off the power
(Remove the batteries)
ARM X.XX .XX /DSP X.X.XX
ICX-XXX
F/W version of
CPU(DSP block)
Boot:X
Oct XX 200X XX:XX:XX
F/W version of
CPU(ARM block)
F/W version of
Boot loader
liant
The checked key is display.
When all checks are
completed, the back-Light
turns on for 0.5 seconds
The NAND formatting
(deleting all events)
and the befault settings
of the menus are completed.
Total of 15 keys*are counted.

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
11
3. Loop test
Execute the DSP LOOP BACK.
• Press the [ /MENU] button to return to the test mode
screen.
4. ExtMic Cal
• The external microphone R and L channels level difference is
calibrated.
• Press the [Nx] button to start calibration.
• Press the [x] button to return to the test mode screen.
5. SetMic Cal
• The internal microphone R and L channels level difference is
calibrated.
• Press the [Nx] button to start calibration.
• Press the [x] button to return to the test mode screen.
6. Beep test
• Beep sound of 1.3 kHz is output.
• Press the [Nx] button to start outputting and press the [x]
button to stop.
• Press the [ /MENU] button to return to the test mode
screen.
7. LCD Cont test
• Adjust the LCD contrast.
Default value is 10.
• Adjust the LCD contrast using the [>]/[.] button.
• Press the [ /MENU] button to return to the test mode
screen.
8. RTC Interrupt test
• Perform the self test of the RTC.
• Press the [x] button to return to the test mode screen.
9. Battery test
•The detected A/D value of the battery remaining power is
checked.
•Press the [x] or [ /MENU] button to return to the test mode
screen.
10.Batt Cnt test
• The presentA/D value of the center of the battery remaining is
checked.
• When the battery is not connected, NG is display.
• Press the [x] or [ /MENU] button to return to the test mode
screen.
11. Batt AC2 test
• The present A/D value of the side of VBatAC x2 on the error
amplified circuit (IC1603 output) is checked.
• Press the [x] or [ /MENU] button to return to the test mode
screen.
12.Batt AB4 test
• The present A/D value of the side of VBatAB x4 on the error
amplified circuit (IC1603 output) is checked.
• Press the [x] or [ /MENU] button to return to the test mode
screen.
*: 11, 12 items, refer to following fig.
13.VBUS test
• The present value of the VBUS is checked.
If it is connected, OK is display.
• Press the [x] or [ /MENU] button to return to the test mode
screen.
14.Sleep test
• Sleep is tested.
Note: When <Sleep> is selected, the machine enter the sleep mode. To
exit the sleep mode, turn off the power, by removing the batteries
and reenter the test mode.
15.Menu lnit
• Press the [Nx] button to enter the menu initialization.
• Press the [x] button to return the test mode screen.
16.Key Chk test
• Key check only is executed when the key is pressed.
• Press the [x] button to return to the test mode screen.
17.Log Output test
• This is the log output to be used for engineering design.
Note: Not used.
• Press the [x] button to return to the test mode screen.
18.App Log Out test
• This is the app log out to be used for engineering design.
• Press the [x] button to return the test mode screen.
19.Convert test
• This is the conversion out to be used for engineering design.
• Press the [ /MENU] button to exit the test mode.
Test Key SWITCH Description
1Sound vol-
ume test [VOL +], [VOL –] The sound volume can be adjusted (Default value is 20.)
2Recording
level test [.], [>]
Press the [.HOLD] switch to ON
for MANUAL mode.
The recording level can be adjusted
(Default value is 30.)
Muting test [DIVIDE / ]Muting test can be set to “ON” or
“OFF”.
6Directivity [DIRECTNL] “ON” or “OFF” of the switch can be
set the directivity of the microphone.
3
Setting of
recording
AUTO/
MANUAL
[.HOLD] OFF: AUTO
ON: MANUAL
4Sensitivity
/ Limitter [V-UP]
AUTO ([.HOLD] SW:ON):
(OFF: Sensitivity H, ON: Sensitiv-
ity L)
MANUAL ([.HOLD] SW:ON):
(OFF: Limitter OFF, ON: Limitter
ON)
5
Selection
of the
external
micro-
phone
[DPC] Press the [.HOLD] switch to ON for MANUAL mode.
OFF: MIC IN, ON: AUDIO IN



70k
110k
ADIN1
(VCCVBAT)
ErrorAmp
ADIN7
(VBAT_ERR)
ADIN8
(VBAT_CNT)
B
C
A
VBatAB
VBatBC
VBatAC
IC1001
IC1603
Q1664
Q1663
x2SIDE
x4SIDE

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
12
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
• f: internal component.
• C: panel designation.
• A: B+ Line.
• Power voltage is dc 1.5V and fed with regulated dc power
supply from battery terminal.
• Voltages are dc with respect to ground under no-signal
(detuned) conditions.
no mark : REC
( ) : PLAY
*: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10
MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Signal path.
F: PB
L: REC
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X: Parts extracted from the component side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Parts face side:
(SIDE A)
Pattern face side:
(SIDE B)
Parts on the parts face side seen from
the pattern face are indicated.
Parts on the pattern face side seen from
the parts face are indicated.
• Lead layouts
SECTION 4
DIAGRAMS
surface
CSP (Chip Size Package)Lead layout of conventional IC

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
1313
4-1. BLOCK DIAGRAM - MAIN1 SECTION -
Signal path
: REC
: PB
27 9
CS
SDA
IC3404
REG
IC1001(1/2)
SYSTEM CONTROLLER
OUTP
OUTN
Q3304
MUTE
Q5001
LED DRIVE
D5005,5004,5002
Q3402
SWITCH
J3301
(SPEAKER)
13
14
11
2
3
IC3654
VOLUME CONTROL
WA
WB
SCLK
DIN
4CS
LA
10
LB
3
7
10
5
8
IC3203
SELECTOR
IN2
COM1
COM2
2NO1
D3607
D3606
IN1
9
4NC1
NO2
NC2
3
7
8
5
10
IC3655
SELECTOR
IN2
VDD_HP
COM1
COM2
4
NO1
IN1
9
2
NC1
NO2
NC2
SCK
IC3901
ADC, DAC, HEADPHONE AMP
AIN1L
30
31
MD/ADA
AS/ADR MC/SCR
LRCK
PCM0_LRCK
BCK
PCM0_BCK
DIN
DOUT
SCKI
HPCOM/MONO
HPOL/LOR
HPOR/LOR
17
16
V10
KS-1IPS
W8
OS-1IPS
W10
OZSC-1IPS
OMWP
AC22 AD22
AB22 AC21
KLC-OMP
NES-OMP
IS-OMP
OS-OMP
U18
OKLCFER
2ZSC-OIPS
SPI1_CLK
SPI1_MOSI
AGC_XCS
KLC_1IPS
ISOM_1IPS
SCX_CGA
IDT-D
KCT-D
V17
SMT_D
NWDP
NETUM
U19
AC6
AB2 W22
AA2
0ZSC-0IPS
KS-OIPS
OS-OIPS
Y3
80IPG
AA1
AC7
AC8
AC23 AD7
110IPG
010IPG
210IPG
SP001
+
-
FUNCTION
SWITCH
R
(MIC CENTER)
IC3403
POWERAMP
IC3904
MICAMP
IN+
OUT
V+
15
4
J3201
PLUG IN
POWER
S6014 S6015
HOLD
23
AIN3R
AIN3L
22
29
32
22W-0A-DLCB
91U-TSRX-DLCB
6CA-SC-DLCB
2BA-TEDX-JPH
1AA-ETUM-PS
2AA-RWP-PS
3Y-ETUM-PH
7CA-KLC-OIPS
8CA-ISOM-OIPS
PWM
ADA_XCS
1
2
PCM0_DADT
3
PCM0_ADDT
7
CPU_RFFCLK0
KCRL_0MCP
KCB_0MCP
MWP
SCX_ADA
TDAD_0MCP
TDDA_0MCP
0KLCFFR_UPC
4
515
2
IN
VDD2
UNREG35-DET
MAIN2
SECTION
(Page 14)
VDD1
VOUT
VIN
+3.3V CE
L
1
5
6
IC3202
AMP
AOUTPUT
B OUTPUT
3A+INPUT
A-INPUT
B+INPUT
B-INPUT 7
2
3
7
10
5
8
IC3024
SELECTOR
COM1
COM2
2NO1
IN1
IN2
9
4NC1
NO2
NC2
VDD_GP2
VDD_GP2
Q3660
SWITCH
Q3657
SWITCH
Q3659
SWITCH
TEDX_CIMTXE
1LES_CIM
2LES_CIM
RWPX_CIM
LES_ENILX_CIM
1DA_YEK
0DA_YEK
EKAW-YEK
B6
4NIDA
AD4
10IPG
AD3
20IPG
C6
3NIDA
IS_1MP
OS_1MP
Q6001
SWITCH
AD5 AA3 AD20 AC20
NES_1MP
AB20
KLC_1MP
AB21
0OIPG
9OIPG
CD
RES
LIQUID
CRYSTAL
DISPLAY
26 AIN1R
12
10
14 16
13
OFF
ON
V-UP
OFF
ON
S6016
AD2
30IPG
DPC
OFF
ON
S6013
AC5
40IPG
T26
OKC
U26
IKC
DIRECTNL
OFF
ON
X1401
11.2896MHz
AC26
NICSO
AB26
TUOCSO
X1601
32.768KHz
W3
510IPG
GRNK
D5004
REDK
W2
410IPG
A
S6001,S6002,S6004
S6005-6008
S6010,S6012,
S6509,S6511
(MIC)
(MIC)
M101
M102
M103
LCD101

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
1414
4-2. BLOCK DIAGRAM - MAIN2 SECTION -
Signal path
: REC
: PB
H4-8
G5-8
E5-7
F5-8
H22-25,F25
C25,G23-25
E25,J22-24
F24,D24,25
H2,3
G3,4
F4,E4
H18,19
D18,20
C20,E18
AB0_A25/DPQ
AB0_F24/DAK
A2,A8,B1
B2,B8,B9
C1,C2,C8
C9,D1,D2
D8,D9,E1
E9
H9-7,
H3-1,
G3,G2,
J8,7,
J3,2
U2-5,
V8,4,5
W4,5,
Y4,5,
AA4
R1,R8,N1,
N2,N3,N4,
N5N8,M4,
M5,M8,P1,
P2,P3P4,
P8,
GPI07 Q8501
SWITCH
J5
SDR_DATA30
G4
EXTRST
DQ0-7
DQ8-12
DQ13-15
F1R4 DQM1
E8 LDQM
SDR_DQM1
SDR_DQM0
SDR_DATA0-15
SDR_A0-11
P5
IC2602
SRAM
IC1001(2/2)
SYSTEM CONTOLLER
A4
NAND_WEZ
IC2701
FLASH
MEMORY
I/01-I/08
NAND_DA0-DA7
E1
E2
XIN
C2
VBUS
B1
DM C1
1
1
4
4
DP
XOUT
X8501
24MHz
C4
A6
A0-A11
DREQO_N
D4 DACK0-N
A5 CS_N
C5 WR0_N
RST_N
SDR_DATA31
C6
43
1
42
1
4
4
INT_N
B5 WR1_N
RD_N
AB0_A1 - A6
AB0_D00 - D15
AB0_A1-A6
AB0_D0 - D15
1
2
5
VBUS
D-
GND
ID
3D+
4
IC8503
USB CONTROLLER
CN8002
(USB)
VBUS
F8
SDR_WEZ
SDR_RASZ
SDR_CASZ
SDR_CKE0
SDR_CLK
SDR_BA0
T5
F7 U8
F3 CKE T1
F2 CLK AA5
EXM_RDZ
J19
AB0_WRZ
H16
E3
NAND_REZ
H13
NAND_DA15
E9
NAND_CLE
NAND_XWE
NAND_XRE
NAND_XWP
NAND_CLE
NAND_ALE
NAND_XCS0
NAND_XCS1
NAND_RXBO NAND_RBZO
D3
NAND_ALE
M9
NAND_CSZ0
NAND_CSZ1
C2
D2
NAND_RXB1 NAND_RBZ1
H8
19
XWP
18
XWE
17
ALE
16
CLE
10
XCE2
9
XCE1
8
XRE
7
R/B1
H26
PDAGHC
H17
E24
F23
AB3
A2
AB0_CSZ0
E11
TABWS_WSP
CS
G9
SDR_CSZ0
T3
BA1
G8
SDR_BA1
T4
G7 BA0 AB5
F9 R5
NAND_XWE
NAND_XRE
NAND_XWP
NAND_CLE
NAND_ALE
NAND_XCS0
NAND_XCS1
NAND_RXBO
6
R/B2
NAND_RXB1
29-32
41-44
B4,C4,D4
E4,L9,E6,
K9,E8
WE
RAS
CAS
H5
Q1665
SWITCH
Q1667
SWITCH
Q8004
SWITCH
IC8504
DETECT
Q8502
SWITCH
D1601
IC1802
DC/DC CONV.
VDD_DCCOUT33
VDD_UNREG
+3.1V IC8501
+3.1V REG
UNREG35-DET
MAIN1
SECTION
(Page 13)
VOUT SHDN
4
1
DRY BATTERY
SIZE "AAA"
(IEC DESIGNATION LR03)
2PCS. 3V
SWITCH
Q1608
Q1664
SW
SW
Q1663
IC8003
DETECT
Q1609
SWITCH
+1.5V
IC1603
AMP
INT+
OUT
IC8001
DETECT
VOUT VIN
IC8502
+1.5VREG
IC8002
RESET
SWITCH
Q1668
A17
SUBV
E15
SUBVWS_WSP
K26
GHC
D15
2SUB-WS_WSP
G22
3ZSC-0BA
2ZSC-0BA
F22
C8
7NIDA
SWITCH
Q1603
A
SWITCH
Q1601

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
1515
4-3. PRINTED WIRING BOARD - AUDIO BOARD (SIDE A) -
Ref. No. Location
• Semiconductor
Location
D5002 B-6
D5004 B-5
D5005 B-4
Q3657 B-2
• : Uses unleaded solder.
Q3657
2 1 3
BC3688 D5002
D5005
C6001
R3302
C1004
C3913
R6001
R6003
C3999
R3319
R6008
31
4
S
2
S6001
S6001
31
42
S6004
S6004
R6034
R3318
R6035
R6036
R6037
R6038
C6032
R3738
D5004
D5002,5004,5005
(LCD BACK LIGHT)
JL6110
+
AUDIO BOARD (SIDE A)
DIVIDE /
/ MENU
1-872-141-
12
(12)
23456781
A
B
C
D

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
1616
4-4. PRINTED WIRING BOARD - AUDIO BOARD (SIDE B) - • : Uses unleaded solder.
234567
8
1
A
B
C
D
IC3654
IC3655
IC3904
IC3901
IC3202
IC3203
IC3024
13
(13)
C
SW BOARD
(Page 26)
B
MAIN BOARD
CN1001
(Page 19)
AHPJACK
BOARD
(Page 26)
RED
R
M102
M103
M101
(MIC)
CENTER
MIC
BLACK
YELLOW
BLUE
ORANGE
BLACK
RED
BLACK
GRAY
BLACK
AUDIO BOARD (SIDE B)
L
(MIC)
( )
+P
+P
+P
+P
+P
A
+
A
+
113
*
1-872-141-
7033R
R6019
3306R
1023R
JL3201
F
FB3302
FB3303
JL3408
9043LJ
0143LJ
2233R
R3324
R3323
9863C
7093R
R3908
1033B
3023R
5023R
3963C
JL3205
7043LJ
93C
R3910
C3324
5233R
1
2
3
45
CSP
(Chip Size Package)
5
610
111
JL3203
JL3204
JL3206
1193R
Q3660
6063D
D3607
9093C
S
2 1 3
C3904
2093R
R3905
JL3202
80
R3913
4193R
Q3659
2863C
1963C
4005C
5005C
Q5001
C5011
R5013
R5023
R3714
R3909
C3907 S
S3 1 2
LCD101
LIQUID CRYSTAL DISPLAY
DIRECTNL
S6013
ON OFF
CSP
(Chip Size Package)
CSP
(Chip Size Package)
C3665
C3690
145
8
912
13
16 17
5
610
111
C3692
C3696
C3697
C3308
3
R3315
5073R
R3706
R3719
R3720
1373R
2123C
C3215
C3216
58
4
1
6133R
R3320
R3321
*
*
(Chip Size Package)
C3307
4033Q
033R
4033R
C3914
C3915
C3916 C3917
4133R
8
1
427
1
5
26
1
239
3
3
C1002
*
C5001 C5002
C5003
R5008
2105R
FB3201
3023BF
0123C
2023
R
R3207
0
10
6
206
CN5002
4105R
21
93R
C3683
6863
C
7863C 2023B
F
C1003
307
3R
C3217
C3218 R3204
123R
1123R
3D
R3215
3D
30
63D
4063D
0193C
CSP
(Chip Size Package)
7073R
2306R
C3211
90
23R
R3213
5063D
5
601
111
C3911 C6033
*
BT1602
LITHIUM
SECONDARY
BATTERY
3V
CSP
C1001
50
491
2
CN7001
1CN7002
J3201
8
Ref. No. Location
• Semiconductor
Location
D3601 B-4
D3602 B-4
D3603 C-4
D3604 C-4
D3605 C-3
D3606 D-7
D3607 D-7
IC3024 C-3
IC3202 C-5
IC3203 B-6
IC3654 C-5
IC3655 C-6
IC3901 C-4
IC3904 B-7
Q3304 D-5
Q3659 B-6
Q3660 D-7
Q5001 B-6

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
1717
4-5. SCHEMATIC DIAGRAM - AUDIO BOARD (1/2) -
AUDIO
BOARD
( 2 / 2 )
(Page 18)
101
AUDIO
BOARD
( 2 / 2 )
(Page 18)
102
IC3203
SELECTOR
IC3655
SELECTOR
IC3202
AMP
IC3654
VOLUME CONTROL
IC3024
SELECTOR
IC3904
MICAMP
L
R
18 19 20
2.9(0) 2.8(0)
2.8
0
2.8(0)
2.8(0)
0
2.8(0)
2.8(0)
2.9(0)
2.9(0)
2.8(0)
2.9(0)
2.9(0)
2(0)
02.9(0)
02.8(0)
2.9(0) 0
0
0
0
0
0
0
0
0
)0(9.2
0
0
0
0
0
2.9(0)
2.9
2.8(0)
0
0
0
000
0002.9(0)
2.9(0) 0
0
0
0
0
0
0
0
No mark : REC
( ) : PLAY
JL3201
JL3202
4.7k
R3201
JL3203
JL3204
4.7k
R3203
1M
R3207
C3210
0.1
EXTMIC_XDET_AA3
R3215 4.7k
VDD_HP
J3201 1
2
3
4
4.7k
R3205
JL3205
JL3206
VDD_ANA
AGND
FB3203
FB3202 FB3201
MICIN_L
MICIN_R
k74 6073R
0.1
C3665
NJM2732RB1(TE2)
IC3202
12
34
5678
47k
R3719
470
R3714
k74 5073R
k740273R
MIC_SEL1
MIC_SEL2
0.1
C3682
0.1
C3683
k224023R
22k
R3209
0.1
C3212
1k
R3210
1k
R3211
0.47
C3217
0.1
C3999
0.47
C3218
3LP01S-K-TL-E
Q3657
S
MIC_XPWR
0.1
C3211
MIC_XLINE_SEL
16-ET004SS1 1063D
12
16-ET004SS1 2063D
1
2
16-ET004SS1 3063D 12
16-ET004SS1 4063D 1
2
AGC_XCS_W10
0.22
C3215
0.22
C3216
0.47
C3686
0.47
C3687
6.3V
10
C3689
0.1
C3690 SPI1_MOSI_W8
SPI1_CLK_VI0
6.3V
4.7
C3691
4.7
C3692
6.3V
470
R3731
10
R3738
100p
C3696
100p
C3697
3LP01S-K-TL-E
Q3659
6.3V
100
C3688
1SS400TE-61
D3605
k1 7073R
k1 3073R
C3904
0.1
123
45
R3902
100k
R3905
10k
R3907
47k
R3908
47k
NJM2741F3(TE1)
IC3904
4.7k
R3909
1
C3907
0.47
C3908
3LP01S-K-TL-E
Q3660
220
R3910
1SS400TE-61
D3606
1SS400TE-61
D3607
1M
R3911
MAX5488ETE
IC3654 1234
5678
9101112
3141516171
MAX4762ETB
IC3655
12345
678901
11
MAX4762ETB
IC3203
12345
678901
11
MAX4762ETB
IC3024
12345
678901
11
100p
C3909
0.47
C3693
0
R3912
10k
R3913 10k
R3914
1
C3910
1
C3911
220k
R3202
AGC_XCS_W10
MIC_C
MIC_L
MIC_R
VDD_STMIC
VDD_MICAMP
EXTMIC_R-1
EXTMIC_L-1
EXTMIC_XDET-2
VCC
NO1
COM1
NC1
IN1
NO2
COM2
NC2
IN2
GND AOUTPUT
A-INPUT
A+INPUT
GND
B-INPUT
B OUTPUT
B+INPUT
V+
VCC
NO1
COM1
NC1
IN1
NO2
COM2
NC2
IN2
GND
VCC
NO1
COM1
NC1
IN1
NO2
COM2
NC2
IN2
GND
N.C.
GND
WA
HA
LA
N.C.
N.C.
N.C.
.C.N
BL
BW
BHDDV
KLCS
NID
SC
(0)
(1)
(0)
(1)
(1)
(0)
(1)
(0)
(1)
(0)
(1)
(0)
V+
OUT
IN-
GND
IN+
(CENTER)
SWITCH
SWITCH
SWITCH
*
*
*
*
CSP
(Chip Size Package)
CSP
(Chip Size Package)
CSP
(Chip Size Package)
CSP
(Chip Size Package)
AUDIO BOARD (1/2)
(MIC)
M101
M102
M103
(MIC)
(MIC)
*
*
S
S
R3213 4.7k

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
1818
4-6. SCHEMATIC DIAGRAM - AUDIO BOARD (2/2) - • See page 28 for IC Block Diagram.
SW
BOARD
(Page 27)
C
HPJACK
BOARD
(Page 27)
A
MAIN
BOARD
CN1001
(Page 21)
B
AUDIO
BOARD
( 1 / 2 )
(Page 17)
102
AUDIO
BOARD
( 1 / 2 )
(Page 17)
101
7
8
24
56
3
1SS
2.8
0
0
33
0
No mark : REC
IC3901
ADC, DAC, HEADPHONE AMP
18 19
M
DIRECTNL
MICIN_L
MICIN_R
VDD_HP
JL3408
4.7
R3303
FB3302
2.2
R3314
JL3409
JL3410
FB3303
4.7
R3304
0.22
C3307 0.22
C3308
470k
R3307
JL3407
2.2
R3315
FB3301
NTHD4508NT1G
MUTE
Q3304
0.1
C3913
470k
R3302
0.1
C1001
0.1
C1003
4V
100
C3914
4V
100
C3915
100k
R3319 10k
R3318
0
R3316
0.1
C3916
0.1
C3917
0.001
C1004
47
R3320
47R3321
PCM3794RHBR
CSP
(Chip Size Package)
IC3901
12345678
901112131415161
1718192021222324
526272829203132333
0R3322
C3324
0.1
1k
R3323 1k
R3324
1
C1002
220k
R3325
HP_R_TP
HP_L_TP
HP_XDET_TP
HP_AGND_TP
R2NIA
L3NIA
R3NIA
BCIM
CCV DNGA
MOCV
LOL/LOPH
AIN2L
AIN1R
AIN1L
MODE
MS/ADR
MD/ADA
MC/SCL
LRCK
HPOR/LOR
SPOLP
SPOLN
PGND
VPA
SPORP
SPORN
HPCOM/MONO
KCB
NID
TUOD
OIV
DDV
DNGD
IKCS
ITDH
MIC_SEL1
MIC_SEL2
MIC_XLINE_SEL
VDD_ANA
AGC_XCS_W10
EXTMIC_XDET_AA3
MIC_XPWR
SPI1_MOSI_W8
SPI1_CLK_VIO
FMGND
AGND
AGND
AGND
MIC_SEL1
MIC_SEL2
MIC_XLINE_SEL
VDD_HP
AGC_XCS_W10
EXTMIC_XDET_AA3
MIC_XPWR
CPU_REFCLKO
VDD_LOG
VDD_ANA
BATT_CNT_B8
PCM0_DADT_AC22
SPI1_MOSI_W8
PWM_0_AC23
PCM0_LRCK_AB22
ADA_XCS_AD7
PCM0_BCK_AC21
PCM0_ADDT_AD22
SPI1_CLK_V10
MONO_OUT
VDD_PUP_Y2
HP_MUTE_Y3
HP_XDET_AB2
TU_XCS_F23
FM_PWR
SPI1_MISO_AB8
CPU_CKI32
SPI0_MOSI_AC8
VDD_DDCOUT33
SPI0_CLK_AC7
BLCD_A0_W22
BLCD_CS_AC6
VDD_GP2
BLCD_LIGHT_V17
BLCD_XRST_U19
KEY_AD0_C6
OPLED_XGRN_W3
KEY_AD1_B6
OPLED_XRED_W2
KEY_WAKE-CN
KEY_XDICT_AC5
RTC_BKBAT_AD17
SGND
DGND
DGND
DGND
50P
CN7001
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
1k
R6003
10k
R6001
1k
R6008
C6001
0.1
470k
R6019
S6013
2MOC 1KM 3RB
4S1 5
S2 6S3
7S4
S6004
1
1A
2
2A
31B
42B
S6001
1
1A
2
2A
31B
42B
BT1602
LITHIUM
SECONDARY
BATTERY
3V
4.7k
R6032
0
R6033
R6035
10k
C6032
0.1
2200
R6034
470R6037 OPLED_XGRN
OPLED_XRED
VDD_GP2
SGND
KEY_AD0
DGND
KEY_AD1-3
KEY_WAKE
2.2kR6036
1kR6038
8P
CN7002
1
2
3
4
5
6
7
8
0.1
C6033
BKBAT+
BKBAT-
DIVIDE/BM MENU/FOLDER
R5012
100
100
R5013
1M
R5023 0.1
C5011
4.7
C5005
0.1
C5001
0.1
C5003
0.1
C5002
4.7
6.3V
6.3V
C5004
RTF025N03TL
LED DRIVER
Q5001
S
10M
R5008
13P
CN5002
1
2
3
4
5
6
7
8
9
10
11
12
13
100
R5014
SML-A12MT
D5005
SML-A12MT
D5002
D5002,5004.5005
(LCD BACK LIGHT)
SML-A12MT
D5004
CS
RES
CD
SCK
SDA
VDD
VSS
VBIAS
VLCD
VB0+
VB0-
VB1+
VB1-
JL6110
AUDIO BOARD (2/2)
*
*
LCD101
LIQUID
CRYSTAL
DISPLAY
IC B/D
DIVIDE MENU
(1/5)

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
1919
4-7. PRINTED WIRING BOARD - MAIN BOARD (SIDE A) - • : Uses unleaded solder.
23456781
A
B
C
D
14
(14)
1041X
1061
X
L1601
2061L
1072R
1058C 20
5
8C
C8503
C8504
5058C
1
23
1058
Q
6058C
C8509
C8511 C8512
C8513
C8514
49
50
2
1
CN1001
7058R 8058R
R8509
1
34
5
21
34
5
2
R8510
1
1
5
8R
R8512
R8513
R8514
R8515
C1404
C1405
C1408
11
4
1C
C1608
C1605
R6026
9061C
C1416
8141C
C1419
C1803
C1805
2161C
31
6
1C
4161C
C1421
6161C
2241C
C1617
4241C
C1425
C1426
R1401
C1429
0261C
R1404
R1406
7041R
C1430
9041R
C1432
C1627 C1434
8261C
7341C
C1438
0
3
61C
C1631
3361C
1
54
3
4361C
C1441
53
6
1C
C1637
1161R 9
3
61C
C1445
C1446
7441C
1461C
2061HT
C1643
R1815
R1816
2
561C
+P
2062C
3062C
3661C
4062C
C2605
C2606
Q1663
C2608
Q1664
Q1665
R1641
R1642
1
23
7
661
Q
R1645
51 CN8002
1072BF
5062R
R1666
R1667
Q8004
8
6
6
1R
9661R
0761R5761R
6761R
7761R
8761R
R1679
1058X
C3403
0
9
6
1R
3
4
12
3
4
12
Q3402
3961R
3
4
12
R1694
R1695
R1696
796
1
R
8961R
1108R
2108R
R8014
1
2
3
4
5
3
4
12
R8516
R1665
Q8502
71
5
8R
1-872-140-
1
13
34
46
6
13
4
6
S
S
S
S
MAIN BOARD (SIDE A)
CSP
(Chip Size Package)
CSP
(Chip Size Package)
CSP
(Chip Size Package)
*
*
*
IC8501 IC8503
IC8502
IC1001
IC1603
IC2602
IC8001 IC8002
3008CI
IC8504
B
AUDIO BOARD
CN7001
(Page 16)
IC3404
Ref. No. Location
• Semiconductor
Location
IC1001 C-3
IC1603 A-7
IC2602 C-2
IC3404 A-2
IC8001 A-3
IC8002 A-3
IC8003 C-7
IC8501 C-5
IC8502 B-5
IC8503 B-6
IC8504 C-5
Q1663 B-7
Q1664 B-7
Q1665 A-3
Q1667 D-6
Q3402 A-2
Q8004 C-6
Q8501 B-5
Q8502 C-5

ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
2020
4-8. PRINTED WIRING BOARD - MAIN BOARD (SIDE B) - • : Uses unleaded solder.
234567 8 1
A
B
C
D
R3419
L1802
C2701
C2702
JL6001
R2702
JL6003
R2704
JL6004 JL6007
JL6008
JL6009
25
48 1
24
R2903
R2904
JL6010
JL1401
JL1402
JL1403
JL1404
JL1405
JL1406
JL1407
JL1409
1
23
Q6001
JL1602
JL1603
JL1410
JL1604
JL1411
JL1614
JL1615
DPC
OFF ON OFF ON
DRY BATTERY
SIZE "AAA"
(IEC DESIGNATION
LR03)
2PCS, 3V
JL1616
JL1617
JL1618
JL1619
JL1620
JL1621
JL1622
JL1623
JL1624
JL1625
JL1626
JL1628
R6005
JL1629
C1401
R6006
C6031
JL1630
JL7201
JL7202
JL7203
JL7204
JL7205
Q1601
JL7206
R6017
Q1603
Q1608
B
+
C1801
Q1609
B
+C1802
B
+C1610
R6020
SP001
R6021
C1806
R6022
R6023
R6025
C1427
R1402
S6014
S6014
C1629
5
1
1
1
1
44
4
55
5
8
8
8
2
3
64
S6015
S6015
5
1
2
3
64
S6016
S6016
R1604
R1412
R1606
R1413
R1608
R1609
R1801
C1638
63
4
1
C1642
C1644
C1646
A
+
C1647
R1817
JL8001
1
23
Q1668
FB2702
C3402
C3407
C3410
C3411
C3412
C3413
R2851
SX68/SX68DR9/SX78/SX78DR9
17
14
12 9
5 8
16 13
D1601
5
1
2
3
64
V-UP HOLD
E
MAIN BOARD (SIDE B)
1-872-140-
14
(14)
E
S
IC3403
IC2701
IC1802
Ref. No. Location
• Semiconductor
Location
D1601 C-6
IC1802 C-6
IC2701 C-4
IC3403 B-3
Q1601 B-6
Q1603 B-6
Q1608 C-6
Q1609 B-6
Q1668 C-7
Q6001 B-2