TA Instruments DISCOVERY XENON FLASH User manual

DISCOVERY XENON FLASH
DXF 200+
Getting Started Guide
Revision BIssued August 2021

DXF Getting Started Guide Page 2
Notice
The material contained in this manual, and in the online help for the software used to support this instru-
ment, is believed adequate for the intended use of the instrument. If the instrument or procedures are used
for purposes other than those specified herein, confirmation of their suitability must be obtained from TA
Instruments. Otherwise, TA Instruments does not guarantee any results and assumes no obligation or
liability. TA Instruments also reserves the right to revise this document and to make changes without
notice.
TA Instruments may have patents, patent applications, trademarks, copyrights, or other intellectual prop-
erty covering subject matter in this document. Except as expressly provided in written license agreement
from TA Instruments, the furnishing of this document does not give you any license to these patents,
trademarks, copyrights, or other intellectual property.
TA Instruments Operating Software, as well as Module, Data Analysis, and Utility Software and their asso-
ciated manuals and online help, are proprietary and copyrighted by TA Instruments. Purchasers are granted
a license to use these software programs on the module and controller with which they were purchased.
These programs may not be duplicated by the purchaser without the prior written consent of TA Instru-
ments. Each licensed program shall remain the exclusive property of TA Instruments, and no rights or
licenses are granted to the purchaser other than as specified above.
TA Instruments can accept no liability for loss or damage, however caused, arising from the faulty or
incorrect use of its products.TA Instruments shall not be liable for any damages caused by interactions
between exogenous materials (e.g. chemicals) and parts of the instrument. This includes interactions of
gaseous, liquid or solid materials with parts of the instrument.
©2021 by
TA Instruments — Waters LLC
159 Lukens Drive
New Castle, DE 19720

DXF Getting Started Guide Page 3
Introduction
Important: TA Instruments Manual Supplement
Please click the TA Manual Supplement link to access the following important information supplemental
to this Getting Started Guide:
• TA Instruments Trademarks
• TA Instruments Patents
• Other Trademarks
• TA Instruments End-User License Agreement
• TA Instruments Offices

DXF Getting Started Guide Page 4
Notes, Cautions, and Warnings
This manual uses NOTES, CAUTIONS, and WARNINGS to emphasize important and critical
instructions. In the body of the manual these may be found in the shaded box on the outside of the page.
NOTE: A NOTE highlights important information about equipment or procedures.
CAUTION: A CAUTION emphasizes a procedure that may damage equipment or cause loss of data
if not followed correctly.
MISE EN GARDE: UNE MISE EN GARDE met l'accent sur une procédure susceptible d'endom-
mager l'équipement ou de causer la perte des données si elle n'est pas correctement suivie.
Please heed the warning labels and take the necessary precautions when dealing with those parts of the
instrument. The DXF Getting Started Guide contains cautions and warnings that must be
followed for your own safety.
Regulatory Compliance
Safety Standards
For Canada
CAN/CSA-C22.2 No. 61010-1 Safety requirements for electrical equipment for measurement, control, and
laboratory use, Part 1: General Requirements.
CAN/CSA-C22.2 No. 61010-2-010 Particular requirements for laboratory equipment for the heating of
materials.
For European Economic Area
(In accordance with Council Directive 2006/95/EC of 12 December 2006 on the harmonization of the laws
of Member States relating to electrical equipment designed for use within certain voltage limits.)
EN 61010-1:2012 Safety requirements for electrical equipment for measurement, control, and laboratory
use, Part 1: General Requirements + Amendments.
EN 61010-2-010:2003 Particular requirements for laboratory equipment for the heating of materials +
Amendments.
For United States
UL61010-1:2012 Electrical Equipment for Laboratory Use; Part 1: General Requirements.
A WARNING indicates a procedure that may be hazardous to the operator or to the environment
if not followed correctly.
Un AVERTISSEMENT indique une procédure qui peut être dangereuse pour l'opérateur ou
l'environnement si elle n'est pas correctement suivie.

DXF Getting Started Guide Page 5
Electromagnetic Compatibility Standards
For Australia and New Zealand
AS/NZS CISPR 11:2007 Industrial, Scientific and Medical (ISM) Equipment - Radio-frequency Distur-
bance Characteristics - Limits and Methods of Measurement.
For Canada
ICES-003 Issue 5, February 2004 Information Technology Equipment (ITE) - Interference-Causing Equip-
ment Standard - Limits and Methods of Measurements.
For the European Economic Area
(In accordance with Council Directive 2004/108/EC of 15 December 2004 on the approximation of the
laws of the Member States relating to electromagnetic compatibility.)
EN61326-1:2006 Electrical Equipment for Measurement, Control, and Laboratory Use - EMC Require-
ments - Part 1: General Requirements.
Emissions: Meets Class A Requirements per CISPR 11.
Immunity: Per Table 1 - Basic Immunity Test Requirements.
For the United States
Code of Federal Regulations (CFR) Title 47 - Telecommunication, Chapter I - Federal Communications
Commission (FCC), Part 15 - Radio Frequency Devices, Subpart B - Unintentional Radiators for a Class A
Digital Device (FCC regulation pertaining to radio frequency emissions).
NOTE: This equipment has been tested and found to comply with the limits for Class A digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interface when the equipment is operated in a commercial environment. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction
manual, may cause harmful interference to radio communications. Operation of this equipment in a residential
area is likely to cause harmful interference in which case the user will be required to correct the interference
at own expense.

DXF Getting Started Guide Page 6
Supplier’s Declaration of Conformity
47 CFR § 2.1077 Compliance Information
Unique Identifier: 858001.901
Responsible Party:
TA Instruments
159 Lukens Drive
New Castle, DE 19720
302-427-4000
www.tainstruments.com
FCC Compliance Statement:
This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Safety
Instrument Symbols
The following label is displayed on the instrument for your protection:
Please heed the warning labels and take the necessary precautions when dealing with these areas. This
Getting Started Guide contains cautions and warnings that must be followed for your own safety.
Symbol Explanation
This symbol indicates that a hand crush hazard is present. Take care when placing
the Environmental Module onto the Source Module.
Ce symbole indique qu'il existe un risque d'écrasement des mains. Faites attention
lorsque vous placez le module environnemental sur le module source.
This symbol indicates that you should read this Getting Started Guide for import-
ant safety information. This guide contains important warnings and cautions
related to the installation, operation, and safety of the system.
Ce symbole indique que vous devez lire entièrement ce guide de démarrage pour
obtenir d'importantes informations relatives à sécurité. Ce guide contient d'impor-
tants avertissements et mises en garde relatifs à l'installation, à l'utilisation et à la
sécurité du système.

DXF Getting Started Guide Page 7
Warnings
Electrical Safety
Liquid Nitrogen Safety
Liquid nitrogen is used to cool the furnace below ambient temperature on the EM-200+ Environmental
Module. Because of its low temperature (–196°C [–321°F)]), liquid nitrogen may burn the skin. When you
work with liquid nitrogen, use the following precautions:
NOTE: Please adhere to your company’s safety guidelines for handling liquid nitrogen.
WARNING: The operator of this instrument is advised that if the equipment is used in a manner
not specified in this manual, the protection provided by the equipment may be impaired.
AVERTISSEMENT: L'utilisateur de cet instrument est prévenu qu'en cas d'utilisation contraire
aux indications du manuel, la protection offerte par l'équipement peut être altérée.
WARNING: Always unplug the instrument before performing any maintenance.
AVERTISSEMENT: Débranchez toujours l'instrument avant de procéder à la maintenance.
DANGER: This pulse source operates from a high voltage power supply. Do not override the
safety interlocks as they prevent contact with potentially lethal voltages.
DANGER: Cette source d'impulsion fonctionne à partir d'une alimentation électrique haute ten-
sion. N'annulez pas les dispositifs de sécurité car ils empêchent tout contact avec les tensions
potentiellement mortelles.
WARNING: After transport or storage in humid conditions, this equiptment could fail to meet all
the safety requirements of the safety standards indicated. Refer to the furnace conditioning pro-
cedure on page 62 for the method used t o dry out the equipment before use.
AVERTISSEMENT: Après le transport ou le stockage dans des conditions humides, cet équipe-
ment pourrait ne pas répondre à toutes les exigences de sécurité des normes de sécurité
indiquées. Reportez-vous à la procédure de conditionnement de la fournaise à la page 44 pour
la méthode utilisée pour sécher l'équipement avant utilisation.
WARNING: Liquid nitrogen boils rapidly when exposed to room temperature. Be certain that
areas where liquid nitrogen is used are well ventilated to prevent displacement of oxygen in the
air.
AVERTISSEMENT: L'azote liquide bout rapidement lorsqu'il est exposé à la température ambi-
ante. Assurez-vous que les zones où l'azote liquide est utilisé sont bien aérées pour éviter le
déplacement de l'oxygène dans l'air.

DXF Getting Started Guide Page 8
1Wear goggles or a face shield, thermally insulated gloves large enough to be removed easily, and a
rubber apron. For extra protection, wear high-topped, sturdy shoes, and leave your pant legs outside the
tops.
2Transfer the liquid slowly to prevent thermal shock to the equipment. Use containers that have satisfactory
low-temperature properties. Ensure that closed containers have vents to relieve pressure.
Thermal Safety
If the power has not come back on after a power failure, do NOT open the furnace. The temperature con-
trollers will not be displaying a temperature so you will not know what the temperature is inside the fur-
nace.
The test is over once a power failure occurs. This is no recovery method to restart the test at that point, but
all data is saved up until the power failure occurs.
Do not press any buttons on the front panel after a power failure, just start a test normally. If the test was
running under vacuum, verify the vacuum.
Chemical Safety
WARNING: Cryogenic blow back possible if dewar is rapidly filled with liquid nitrogen. Fill par-
tially and allow for initial boil-off prior to filling completely.
AVERTISSEMENT: Possibilité de projections de gaz très froid si le Dewar est rapidement rempli
avec de l'azote liquide. Remplir partiellement et permettre une évaporation initiale avant de rem-
plir complètement.
DANGER: Source instrument surfaces can be hot enough to cause discomfort when in contact
with the skin during a sample run. If you are conducting a subambient test, cold could also
cause injury. After running any type of experiment, you must allow the DXF system to return to
near room temperature before you touch the inner furnace surfaces. Always use the available
software monitor to display temperature even after the termination of the test cycle.
DANGER: Les surfaces de l'instrument source peuvent être assez chaudes pour provoquer un
malaise au contact de la peau pendant l'analyse d'un échantillon. Si vous effectuez un essai à
basse température, le froid peut également provoquer des blessures. Après avoir effectué un
type d'expérience quelconque, vous devez laisser le système DXF revenir à la température
quasi ambiante avant de toucher les surfaces internes de la four. Utilisez toujours le moniteur
logiciel disponible pour afficher la température même après la fin du cycle d'essai.
WARNING: In the event of a power failure, do NOT open the furnace.
AVERTISSEMENT: En cas de coupure de courant, N'ouvrez PAS le four.
WARNING: Do not use hydrogen, oxygen, or any other explosive gas in the DXF system. Only
inert gas, such as nitrogen or argon, should be used.
AVERTISSEMENT: N'utilisez pas d'hydrogène, d'oxygène ou tout gaz explosif dans le système
DXF. Seuls les gaz inertes comme l'azote ou l'argon doivent être utilisés.

DXF Getting Started Guide Page 9
Lifting the Instrument
WARNING: Use two people to lift and/or carry the instrument. The instrument is too heavy for
one person to handle safely.
AVERTISSEMENT: Demandez à deux personnes de soulever et/ou de porter l'instrument.
L'instrument est trop lourd pour qu'une seule personne le manipule en toute sécurité.

DXF Getting Started Guide Page 10
Table of Contents
Introduction................................................................................................................................................. 3
Important: TA Instruments Manual Supplement ................................................................................... 3
Notes, Cautions, and Warnings .............................................................................................................. 4
Regulatory Compliance .......................................................................................................................... 4
Safety Standards .............................................................................................................................. 4
Electromagnetic Compatibility Standards ....................................................................................... 5
Supplier’s Declaration of Conformity .................................................................................................... 6
Safety ...................................................................................................................................................... 6
Instrument Symbols ......................................................................................................................... 6
Warnings .......................................................................................................................................... 7
Electrical Safety ............................................................................................................................... 7
Liquid Nitrogen Safety .................................................................................................................... 7
Thermal Safety ................................................................................................................................ 8
Chemical Safety ............................................................................................................................... 8
Lifting the Instrument ...................................................................................................................... 9
Table of Contents...................................................................................................................................... 10
Chapter 1: Introducing the Discovery Xenon Flash.............................................................................. 12
Overview ..................................................................................................................................................... 12
DXF System Components .......................................................................................................................... 13
Pulse Source Module ............................................................................................................................ 13
Environmental Modules and Detector Assembly ................................................................................ 16
Instrument Specifications ........................................................................................................................... 17
Chapter 2: Installing the DXF System.................................................................................................... 18
Unpacking/Repacking ................................................................................................................................. 18
Installing the System ................................................................................................................................... 18
Inspecting the System .......................................................................................................................... 18
Choosing a Location ............................................................................................................................ 19
In .................................................................................................................................................... 19
On .................................................................................................................................................. 19
Near ............................................................................................................................................... 19
Away from ..................................................................................................................................... 19
Moving the Instrument ......................................................................................................................... 20
Connecting the Environmental Module to the Pulse Source Module .................................................. 22
DXF Back Panel ............................................................................................................................ 23
Connecting the Environmental Module to the Pulse Source ......................................................... 26
Connecting the Detector Cable to the Detector Head Assembly ................................................... 27
Setting Up System Communication with the Controller (Computer) .................................................. 27
Connecting the Utilities ........................................................................................................................ 28
Connecting the Power .................................................................................................................... 28
Setting Up the Vacuum System ..................................................................................................... 28
Connecting Cryogenic Cooling and Purge Gas Lines ................................................................... 29
Installing the Tray ................................................................................................................................ 29
Calibrating the Tray Position ............................................................................................................... 31
Verifying the Tray Position Calibration ........................................................................................ 32
Installing the Pins ................................................................................................................................. 33

DXF Getting Started Guide Page 11
Calibrating Pin Height ................................................................................................................... 38
Chapter 3: Operating the DXF................................................................................................................ 42
Using the DXF ............................................................................................................................................ 42
Before You Begin ................................................................................................................................ 42
Startup and Shutdown Procedures .............................................................................................................. 43
Starting the DXF System ..................................................................................................................... 43
Shutting Down the DXF System .......................................................................................................... 43
Running a Discovery DXF Experiment ...................................................................................................... 44
Preparing the Sample ........................................................................................................................... 44
Sample Dimensions ....................................................................................................................... 44
Transparent or Translucent Materials ............................................................................................ 45
High Reflectance Samples ............................................................................................................. 45
Loading and Unloading the Sample ..................................................................................................... 47
Preparing the Instrument ...................................................................................................................... 49
Evacuating the System ................................................................................................................... 49
Starting an Experiment ............................................................................................................................... 51
Stopping an Experiment ............................................................................................................................. 54
Chapter 4: Maintaining the DXF/EM..................................................................................................... 55
General Cleaning Practices ......................................................................................................................... 55
Recommended Cleaning Supplies .............................................................................................................. 56
Cleaning Maintenance Schedule ................................................................................................................. 56
Maintenance Procedures ............................................................................................................................. 57
Cleaning the Light Pipe Assembly ....................................................................................................... 57
Cleaning the Detector Pins (DXF 200+ only) ...................................................................................... 58
Conditioning the Furnace ..................................................................................................................... 62
Replacement Parts ...................................................................................................................................... 64
Appendix A: Connection Diagram.......................................................................................................... 65

DXF Getting Started Guide Page 12
Chapter 1:
Introducing the Discovery Xenon Flash
Overview
Thermal diffusivity () is the thermophysical property defined as a ratio of the thermal conductivity and
the volumetric heat capacity. The thermal diffusivity in SI units is cm2/s. The most popular method used
for measuring thermal diffusivity is the flash method. It has the advantage of being fast while providing
values with excellent accuracy and reproducibility. The flash diffusivity method involves uniform irradia-
tion of a small, disc-shaped specimen over its front face with a very short pulse of energy. The time-tem-
perature history of the rear face is recorded through high-speed data acquisition from a solid-state optical
sensor with very fast thermal response, and thermal diffusivity is determined from the time-dependent ther-
mogram of the rear face. Thermal conductivity can be calculated as a product of the thermal diffusivity, the
specific heat, and the density of the material. A Discovery Xenon Flash (DXF) system automatically deter-
mines the thermal conductivity using the measured (or separately entered) specific heat capacity and ther-
mal diffusivity, with separately-entered density data.
The DXF system is comprised of a DXF Pulse Source, Environmental Module, IR Detector Assembly, and
associated software.The DXF with EM 200+ is shown below.
Figure 1 DXF Source Module with EM 200+ and Detector Assembly.
Contact Detector Assembly
Environmental Module
EM 200+
DXF

DXF Getting Started Guide Page 13
Your controller is a computer that performs the following functions:
• Provides an interface between you and the analysis instrument.
• Enables you to set up experiments and enter necessary information.
• Stores experimental data.
• Allows data analysis of results.
NOTE: For technical reference information, theory of operation, and other information associated with the
DXF system not found in this manual, see the online help associated with the instrument control software.
DXF System Components
A DXF system has three major components: the DXF Pulse Source module, the Environmental Module
with Detector Assembly, and the controller.
Pulse Source Module
The Discovery Xenon Flash (DXF) covers the most commonly needed cryogenic to 900°C temperatures
with a range of Environmental Modules, and employs a High Speed Xenon-Pulse Delivery Source
(HSXD). The reflective optic configuration effectively harnesses the power of a Xenon flash tube, and,
with the aid of proprietary wave guides, delivers it to the sample inside the Environmental Module. The
DXF produces a maximum pulse width of 650 s while uniformly concentrating sufficient power from the
flash source directly on the entire face of the sample. This optimized energy gathering scheme and the
broad light spectrum allows samples as large as 25 mm in diameter to be illuminated with sufficient
energy.
Figure 2 DXF Pulse Source Module.

DXF Getting Started Guide Page 14
Table 1: DXF Front Panel LED Indicators
Indicator Function
FURNACE INTERLOCK GREEN indicates that the EM is sitting correctly on top of
the DXF. RED indicates that EM is sitting incorrectly and
must be adjusted.
SAMPLE/DETECTOR INTERLOCK GREEN indicates that the Detector Head is closed and ready
for use, and that the detector is secured correctly to the EM.
RED indicates that the Detector Head is open or the detector
is not secured.
HIGH VOLTAGE MODULE GREEN indicates that the high voltage module is closed and
ready for use. RED indicates that the module is open.
XENON MODULE GREEN indicates that the xenon module is closed and ready
for use. RED indicates that the module is open.
SOURCE POWER ON indicates that the xenon control board is powered.
CHARGE/ARM ON / Blinking indicates that the lamp is charging.
FIRE ON indicates that the fire command was executed.
DUMP ON indicates that the laser system is in dump mode (not
charging and not firing).
FURNACE °C Indicates the current temperature of the furnace.
SAMPLE °C Indicates the current temperature of the sample.
OVER TEMP ON indicates one of the following:
• The EM has gone over its temperature limit
• One of the thermocouples is broken or not connected
As a result, the furnace is disabled and will not heat.
COOLANT ON indicates that the internal bypass is in place. Not in use.
POWER ON indicates the DXF system is powered.
FILTER 1 ON indicates Filter1 is in and ready for use.
SHUTTER ON indicates that the shutter is open and ready for use.
LOW GAIN ON indicates the detector amplifier has low gain values.
SYSTEM ENABLE switch ON indicates that the system is ready to execute all acquisi-
tion functions.
FURNACE ENABLE switch ON indicates that the furnace is available and ready to heat/
control the temperature parameters.

DXF Getting Started Guide Page 15
FURNACE DISABLE switch ON indicates one of the following:
• The furnace is unable to heat
• Heat to the furnace was stopped
• Any of the conditions for enabling the furnace were vio-
lated
SAMPLE MOTION switch Not in use.
Table 1: DXF Front Panel LED Indicators
Indicator Function

DXF Getting Started Guide Page 16
Environmental Modules and Detector Assembly
The Environmental Module includes a resistance-heated and liquid nitrogen cooled furnace, providing
temperature control of the sample operation in dry air or inert gas, or in vacuum. The EM also includes a
user-replaceable multi-sample tray holder (Autosampler), supporting a variety of sample sizes. and a con-
tact detection system.
Figure 3 EM and Contact Detector Assembly.
Contact Detector
Assembly
EM
Vacuum gauge
Anti siphon exit port

DXF Getting Started Guide Page 17
Instrument Specifications
The tables found below contain the technical specifications for the DXF and EM.
**Using ideal, well-defined, well-behaved 12.7 mm diameter samples of known properties
Table 2: DXF 200+ System Technical Specifications
Item/Area DXF 200+ Specifications
Dimensions Depth 66.04 cm (26 in)
Width 62.87 cm (24.75 in)
Height 57.79 cm (22.75 in)
Weight 83 kg (183 lbs)
Powera
a. This instrument is supplied with a power cord 2.4 m (7.75 ft) long, rated for 10A and 250V and a USA
NEMA 6-15P style plug. The TA Representative installing the instrument will provide the appropriate
power cable for the geographical location where the instrument is being installed. Connect the instrument,
computer, and monitor to wall outlets on the same circuit and make sure that the mains assigned do not
also supply power to noise generating equipment nearby, such as motors, welders, transformers, etc.
System supply voltage: 198–242 VAC (rated for 6A)
50/60 Hz.
Operating environmental
conditions
Temperature: 15 to 35°C
Relative humidity: 5 to 80% (non-condensing)
Installation Category II
Pollution Degree 2
Maximum altitude: 2000 m
The degree of protection for this instrument according to EN 60529 is IP20.
Pulse Source High speed Xenon module
Table 3: EM Technical Specifications
Item/Area EM 200+
Thermocouple Measurement Type E
Thermal Diffusivity Accuracy** ± 4%
Measurement Repeatability** ± 2%
Temperature Range -175 to 200°C
Atmosphere Air, inert gas, vacuum
Number of Specimens 4 to 12 (size dependent)
Sample Dimension 8 mm to 25.4 mm
Sample Shape Round disk, square plate (with tray)
Detector Assembly Thermoelectric Contact Detector
Vacuum 10mTorr with standard pump, 0.1mTorr with Turbo pump

DXF Getting Started Guide Page 18
Chapter 2:
Installing the DXF System
Unpacking/Repacking
You may wish to retain all of the shipping hardware, the plywood, and boxes from the instrument in the
event you wish to repack and ship your instrument.
Installing the System
Before shipment, the DXF is inspected both electrically and mechanically so that it is ready for operation
upon proper installation. Only limited instructions are given in this manual; consult the online documenta-
tion for additional information. Installation involves the following procedures:
• Inspecting the system for shipping damage and missing parts
• Choosing a location for instrument installation
• Connecting the Environmental Module to Pulse Source Module
• Setting up system communication with the controller (computer)
• Connecting the utilities
• Installing the tray
• Installing the pins
• Performing calibrations
It is strongly recommended that you have your DXF system installed by a TA Instruments Service Repre-
sentative; call for an installation appointment when you receive your instrument.
CAUTION: To avoid mistakes, read this entire chapter before you begin installation.
MISE EN GARDE: Pour éviter de commettre des erreurs, lisez tout le chapitre avant de commencer
l'installation.
Inspecting the System
When you receive your DXF system, look over the instrument and shipping container carefully for signs of
shipping damage, and check the parts received against the enclosed shipping list.
• If the instrument is damaged, notify the carrier and TA Instruments immediately.
• If the instrument is intact but parts are missing, contact TA Instruments.

DXF Getting Started Guide Page 19
Choosing a Location
Because of the sensitivity of DXF experiments, it is important to choose a location for the instrument using
the following guidelines. The DXF system should be:
In
• A temperature and humidity controlled area.
• A clean, vibration-free environment.
• An area with ample working and ventilation space.
On
• A stable, non-flammable work surface.
Near
• A power outlet for the specific voltage of the instrument.
• The controller.
• Compressed lab air and purge gas supplies with suitable regulators and filtering where needed.
• Cooling water/coolant (stable chiller/circulator preferred).
• Vacuum pump and vacuum connections.
Away from
• Dusty environments.
• Exposure to direct sunlight.
• Direct air drafts (fans, room air ducts).
• Poorly ventilated areas.
• Electrically noisy areas or areas prone to mechanical vibrations.
NOTE: Do not place equipment against walls or cabinets that might impede air flow. Leave at least 7.5 cm
(3 in) clearance between the back of the instrument and any objects.
CAUTION: Drying out the instrument may be needed if it has been exposed to humid conditions.
Refer to the furnace conditioning procedure on page 62 for the method used to dry out the equip-
ment before use. It is important to be certain that the instrument ground is adequately connected to
the facilities ground for safe operation.
MISE EN GARDE: Le séchage de l'instrument peut être nécessaire s'il a été exposé à des conditions
humides. Reportez-vous à la procédure de conditionnement de la fournaise à la page 62 pour la
méthode utilisée pour sécher l'équipement avant utilisation. Il est important de s'assurer que la

DXF Getting Started Guide Page 20
masse de l'instrument est correctement connectée à la masse de l'installation pour un fonctionne-
ment sûr.
Moving the Instrument
Lifting the instrument should always be done with two people. With each person standing on either side of
the EM, place hands on the outside bottom corners of the EM and lift upwards, keeping the module in an
upright position. Use the same procedure to move the DXF.
WARNING: For safety, position the equipment in a manner that allows access to the power cord
for emergency disconnection.
AVERTISSEMENT: Par mesure de sécurité, placez l'équipement de sorte qu'il permette d'accéder
facilement au cordon d'alimentation en cas de débranchement d'urgence.
WARNING: Protect power and communication cable paths. Do not create tripping hazards by
laying the cables across access ways.
AVERTISSEMENT: Protégez les chemins de câble électriques et de câbles de télécommunica-
tion. Ne créez pas de risques de déclenchement en posant des câbles sur les voies d'accès.
WARNING: Use two people to lift and/or carry the instrument. The instrument is too heavy for
one person to handle safely.
AVERTISSEMENT: Demandez à deux personnes de soulever et/ou de porter l'instrument.
L'instrument est trop lourd pour qu'une seule personne le manipule en toute sécurité.
WARNING: Hand crush hazard is present. Do not place hands between the
Environmental Module and the DXF.
AVERTISSEMENT: Un risque d'écrasement des mains est présent. Ne placez
pas les mains entre le module environnemental et le DXF.
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