TABLE OF CONTENTS
1. UNPACKING ...........................................................................................1- 1
1.1 Procedures ......................................................................................1- 1
1.2 Checks.............................................................................................1- 1
2. MAJOR UNIT REPLACEMENT ..............................................................2- 1
2.1 Replacing the PS Unit .....................................................................2- 2
2.2 Replacing the CPU PC Board .........................................................2- 3
2.3 Replacing the Centronics I/F PC Board...........................................2- 4
2.4 Replacing the I/O PC Board ............................................................2- 5
2.5 Replacing the Stepping Motor .........................................................2- 6
2.6 Replacing the Ribbon Motors ..........................................................2- 7
2.7 Replacing the Solenoid (QP Model only).........................................2- 8
2.8 Replacing the Print Head................................................................2- 10
2.9 Replacing the Platen and Feed Roller............................................2- 11
2.10 Replacing the Paper Sensor...........................................................2- 13
2.11 Replacing the Ribbon Back Tension Block.....................................2- 14
2.12 Replacing the Pinch Roller Shaft Ass'y ..........................................2- 15
2.13 Correcting Skew Printing ................................................................2- 17
3. INSTALLATION PROCEDURE FOR THE OPTIONAL EQUIPMENT ....3- 1
3.1 PCMCIA PC Board (B-8700-PC-QM)..............................................3- 1
3.2 EXP I/O PC Board (B-8700-IO-QM) ................................................3- 4
3.3 Cutter Module (B-4205-QM) ............................................................3- 6
3.4 Ribbon Saving Module (B-4905-R-QM)...........................................3- 8
3.5 Strip Module (B-4905-H-QM)..........................................................3- 10
3.6 Fanfold Paper Guide Module (B-4905-FF-QM) ..............................3- 13
3.7 Cutter Module (B-8204-QM) ...........................................................3- 14
4. TROUBLESHOOTING.............................................................................4- 1
5. DIAG. TEST OPERATION.......................................................................5- 1
5.1 Outline of the Diag. Test Operation .................................................5- 1
5.2 Self Test Mode ................................................................................5- 3
5.3 Parameter Setting Mode.................................................................5- 14
5.4 Test Print Mode ..............................................................................5- 53
5.5 Sensor Setting Mode ......................................................................5- 60
5.6 RAM Clear Mode ............................................................................5- 65
5.7 IP Address Setting Mode................................................................5- 70
5.8 BASIC Setting Mode.......................................................................5- 72
EO18-33004
(Revision Date: Dec. 14, 2001)
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