Technics SX-PX662 User manual

ORDERNO. EMID0103013C0
A4
Digital Piano
SX-PX662
Colours
(K)...................Black
(M)...................Walnut
Areas
(P)U.S.A., Mexico
(PC)Canada
(EX)Norway, Sweden, Denmark, Finland, Spain, Portugal, Greece,
Poland, Czeco,SouthAfrica
(EG)Switzerland, France, Austria, Holland, Belgium, Italy
(EQ)Germany
(EB)theUnitedKingdom
(GW)Argentina
(GH)Hong Kong, Saudi Arabia, Kuwait
(GT)Taiwan
(GM)Malaysia, Singapore
(GU)Thailand, Panama, Philippines
(GW)Argentina
(GN)Australia, New Zealand
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SPECIFICATIONS
SPECIFICATIONS
KEYBOARD 88 KEYS
MAX. POLYPHONY 64 NOTES
SOUND 8SOUNDS:GRAND, UPRIGHT,
EPIANO1, EPIANO2, HARPSI,
VIBES, STRINGS, PIPEORGAN
PEDAL SOFT, SOSTENUTO, SUSTAIN
DIGITAL EFFECT O
BRILLIANCE MELLOW, BRIGHT(5STEPS)
DIGITAL REVERB O(ROOM, STAGE, HALL,
CONCERT)
TOUCHSENSITIVITY LIGHT, NORMAL, HEAVY
TRANSPOSE G-C-F#
METRONOME O(TIMESIGNATURE:OFF, 2/4,
3/4, 4/4, 5/4, 6/8)
TUNING 427.3Hz-440.0Hz-453.0Hz
SEQUENCER TRACK (1,2), STORAGE
CAPACITY:APPROX.
4500NOTES, RECORDING
MODE:REAL TIME
DISPLAY O
DEMO O
MIDI MULTI TIMBLE, LOCAL
CONTROL, OMNI ON,
PROGRAMCHANGE, PEDAL,
EFFECT, TRANSPOSE
MODESET PIANOTUNING, MINIMUM
RANGE
OTHERS POWERSWITCH, MAIN
VOLUME, MIDI TERMINALS(IN,
OUT), PEDAL IN, AUXIN(R/
MONO, L), LINEOUT(R/ MONO,
L), HEADPHONESx2, ACIN,
INITIAL KEY
OUTPUT 80W (40W×2)
SPEAKERS 14cm×2
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POWERREQUIREMENT 100W
110W (NORTHAMERICAAND
MEXICO)
AC120/ 220/ 230-240V50/ 60Hz
AC120V60Hz(NORTH
AMERICAAND MEXICO)
AC230-240V50/ 60Hz(EUROPE,
AUSTRALIA, ANDNEW
ZEALAND)
DIMENSIONES (W×H×D) 140.4cm×102.5cm×48.1cm
(55-9/32”×40-11/32”×18-15/16”)
NETWEIGHT 46kg (101.4lbs)
ACCESSORIES ACCORD, MUSICSTAND
1. Warning
Topreventtherisk offire, smoke, or electrical shock and toensuresafeoperation, please be
suretofollowthesafetyguidelines below.
1. Atplaces wherespecial caution isrequired, thenecessarysafety
precautionsareclearlylabeledorprinted, forexample, on the
cabinet, oron thepartconcerned. Please follow these safety
precautions, and alsothose listedintheOwner'sManual.
2. Parts whichhavea ;markinthecircuitdiagramorintheparts
list areessential forsafety. Whenreplacing these parts, besureto
use onlythespecifiedparts.
3. Use thespecifiedtypes forinternal wiring (double-insulated
wiring, etc.).
4. Whenreplacing parts on theACprimaryside(powertransformer,
electricswitch, electrical cord, noise-prevention condenser, etc.),
wind theleadwireand secureitbysoldering.
5. Donotlet thewiring comeintocontact withheat-emitting devices
(fuse resistor, radiatorplate, etc.).
6. Whenreplacing thewiring, make surethat itisnotincontact with
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theunfinishedorrough edgeofapart.
7. Whenreplacing thepowercord(exceptfortheplug-intype), tug it
fromvariousdirectionstoconfirm that itdoes notslipoutofplace.
8. Spacing
Ifsoldering was doneon theACprimarycircuit, confirm that the
interval betweenthesolderedterminalsorbetweentheterminal
and surrounding metallicparts isat least theminimumrequired
(betweentheprimarycircuitand thechassis:atleast 6.5mm;
betweenprimarycircuitterminals:at least 4.0mm;between
primarycircuitterminalsand secondarycircuitterminals:at least
6.5mm.).
2. SafetyPrecaution
2.1. SafetyPrecaution
1. Beforeservicing, unplug thepowercordtopreventanelectric
shock.
2. Whenreplacing parts, use onlythemanufacturer’srecommended
components forsafety.
3. Check thecondition ofthepowercord. Replace ifwearordamage
isevident.
4. Afterservicing, besuretorestoretheleaddress, insulation
barriers, insulation papers, shields, etc.
5. Beforereturning theservicedequipmenttothecustomer, besure
tomake thefollowing insulation resistance test topreventthe
customerfrombeing exposedtoashock hazard.
2.2. Insulation Resistance Test
1. Unplug thepowercordand shorttheprongsoftheplug witha
jumperwire.
2. Turnon thepowerswitch.
3. Measuretheresistance valuewithanohmmeterbetweenthe
jumperedACplug and eachexposedmetal cabinet part, suchas
screw heads, connectors, control shafts, handlebrackets, etc.
Measurements shouldrangefrom4MOhmtoinfinityfor
4

allexposedparts. (referto Fig. 1 )
Fig. 1
3. HowtoAssemblethe Piano
4. Sounds and Effects
5. Initial Setting
Thefollowing procedureresetsall programmablesettings, functionsand memories totheir
initialized(factory-preset) status.
Use thisprocedureifthebuttons, keys, etc. malfunction, or whenyou wishtoresetthememories
and functions.
1. Turnoff thePOWERbutton.
2. Whilepressing theINITIALkeyat thesametime, turnthePOWER
button on again.
Or, you canpress theINITIALkey whiletheMODE SETbutton ispressed.
6. KeyboardRanges and MIDI NoteNumber
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7. Connections
8. Symptomwhich Appertobe Signs of Trouble
9. PartsLocation
10. DisassemblyInstructions
10.1. Removing thetop coverand thekeyboardcover
[Fig. 2]
(Step2)
Remove thetop coverinthedirection ofarrows(referto [Fig. 2] ).
(Step3)
Remove thekeyboard coverinthedirection ofarrow(referto [Fig. 2] ).
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10.2. Removing thecontrol panel
-Follow the(Step1)-(Step3) ofitem10.1.
[Fig. 3]
(Step3)
Slidethecontrol panel forward and pull outinthedirection ofarrow(referto [Fig. 3] ).
10.3. Removing thekeyboardassembly
-Follow the(Step1)-(Step3) ofitem10.1.
-Follow the(Step1)-(Step3) ofitem10.2.
[Fig. 4]
10.4. Disassemblyand assemblyofkey(s)
-Follow the(Step1)-(Step3) ofitem10.1.
-Follow the(Step1)-(Step3) ofitem10.2.
-Follow the(Step1) ofitem10.3.
10.4.1. Disassembly(white keys)
(Step1)
Insertthethinsolidboard betweenwhitekey and black key, pushtheclaw(referto [Fig. 5] ).
(Step2)
Whilepressing slightlythefrontofthekey, pushtherearofthekey forward todisengagethekey
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clawfrom thechassis(referto [Fig. 5] ).
(Step3)
Lift thekey and remove it.
[Fig. 5]
10.4.2. Disassembly(black keys)
(Step1)
Whilepressing slightlythefrontofthekey, pushtherearofthekey forward todisengagethekey
clawfrom thechassis(referto [Fig. 6] )
(Step2)
Lift thekey and remove it.
[Fig. 6]
10.4.3. Assembly(bothwhite and black keys)
(Step1)
Insertthefrontpartofthekey intothechassis.
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(Step2)
Inserttheplatespring intothehammernotch(referto [Fig. 7] ).
(Step3)
Whileslowlylowering thekey intothechassis, inserttheplatespring intothenotchattherearof
thekey (referto [Fig. 7] ).
(Step4)
Carefullyinsertthekey intotheopening inthechassisand slidethekey towardsthereartolock
itinplace (referto [Fig. 7] ).
[Fig. 7]
10.5. Disassemblyofthepedal assembly
(Step1)
Remove thepedal assemblyfrom thepedal box.
(Step2)
Disassemblethepedal assembly(referto [Fig. 8] ).
[Fig. 8]
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10.6. Removing thespeakers
-Follow the(Step1)-(Step3) ofitem10.1.
10.6.1. Removing thespeakers
Remove 4screws (referto [Fig. 9] ).
[Fig. 9]
10.7. Removing theprintedcircuitboards
-Follow the(Step1)-(Step3) ofitem10.1.
-Pull outtheconnectorson theprintedcircuitboards.
10.7.1. Removing MAIN, FJASP and HP P.C.B.
-MAINP.C.B.
(Step1)
Remove theground wireholding screw (referto [Fig. 10] ).
(Step2)
Release theclowsofthe5P.C.B. holders(referto [Fig. 10] ).
-FJASP P.C.B.
(Step1)
Remove the4screws ×2and ×2(referto [Fig. 10] ).
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(Step2)
Release theclawsofthe3P.C.B. holders.
-HPP.C.B.
Followtheitem 10.3.
(Step1)
Remove theheadphonejack mounting nuts ×2(referto [Fig. 10] ).
(Step2)
Remove theground wireholding screw (referto [Fig. 10] ).
(Step2)
Remove theHP P.C.B. mounting screws ×2(referto [Fig. 10] ).
[Fig. 10]
10.7.2. Removing CPLand CPRP.C.B.
-Follow theitem10.2.
-CPLP.C.B.
(Step1)
Pull theMAINVOLUME knob (referto [Fig. 11] ).
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(Step2)
Remove theCPLP.C.B. mounting screws ×3, ×1, ×1and ×10 (referto [Fig. 11] ).
-CPRP.C.B.
(Step1)
Remove theCPRP.C.B. mounting screws ×1, ×1, ×3and ×10 (referto [Fig. 11] ).
[Fig. 11]
11. About the Self-DiagnosticFunction
Thismodel has someself-diagnosticcapabilities. Whensettotheself-diagnosticmode,
operation ofvariouscomponentscanbeverifiedbyfollowing theprocedures inthechartbelow.
No. PCB TESTMODE Procedure
1MAIN RAM(IC8, 9), ROM(IC6)
check 1. ConnecttheCHECKINGDEVICE toCN9on theMAIN
P.C.B.,
turn on theCHECKINGDEVICE switch.
2. Turn on thepowerswitch.
Whenthepowerswitchisturnedon, theLEDoftheCHECKINGDEVICE flashes 8
times.
first4flashes arefor theRAMcheck , and thelatter4flashes arefor theROM
check.
orderoftheLEDflashes correspond totherespective ICnumbersas shownbelow.
If
defective, thecorresponding flashtimeislonger.
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No. PCB TESTMODE Procedure
2CPL CPU(IC1)check 1. ConnecttheCHECKINGDEVICE toCN9on theMAIN
P.C.B.
Checking Device switchshouldbeoff).
2. Press and holdthetwoDkeys shownbelow, and
then
thepowerswitch.
Whenthepowerswitchisturnedon, theLEDoftheCHECKINGDEVICE flashes 4
times.
orderoftheLEDflashes correspondstotheCPU(IC) on therespective P.C.B.sas
shown
below. IfanICisdefective, thecorresponding flashtimeislonger.
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No. PCB TESTMODE Procedure
3MAIN Wave ROMcheck
MAIN: IC12 1. Press and holdthetwoE keys shownbelow, and
then
thepowerswitch.
2. SelecttheUPRIGHTsound.
3. Reduce theMAINVOLUME level lowenough.
Whensettotheself-diagnosticmode, theWave ROMoutputsasinewave. The
Wave
correspond tothekeyboard keys as showninthediagram totheright. Whenakey
is
thecorrespondingsinewave sound isproduced. Ifno sound isproduced, or ifthe
sound
distorted, theWave ROMcorresponding tothatkey isdefective. Thismethode
allows
diagnose alsotheoutputroutes (L/R) from theWave ROM.
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No. PCB TESTMODE Procedure
4CPL /
CPR Control Panel buttons LEDligting check Press and holdthetwoFkeys shownbelow, and then
turn
powerswitch.
Press thebuttonson thecontrol panel and confirm thatthecorresponding LEDs
light.
5 Control Panel LED
display check Press and holdthetwoGkeys shownbelow, and then
turn
powerswitch.
Thenumbersaredisplayedautomaticallyand repieatedlyon thedisplay.
Connection betweenserving CHECKINGDEVICE and MAINP.C.B.
12. MIDI Implementation Chart
13. Precautions beforeServicing
13.1. Precautionsformeasuring oftheoutputwaveforms
1. Thewaveform was measuredwitha“National Digital Storage
OscilloscopeVP-5730A”. Thereforethewaveformsofmusical tone
signalsshownmaydiffersomewhat duetothedifference inthe
timing oftriggering.
2. Since the1/10 test probeisused, theindicatedvoltagevalueon
thebottompartofeachwaveform illustration is1/10 oftheactual
value(e.g. 0.2V/cmshouldbe2.0V/cm).
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3. To measurethewaveforms, first set thisunittotheservice
diagnosticmode(referto“WAVE ROMtest”). TheWAVE ROM
outputwill thenbeoutputas asinewavetofacilitate theservicing
check.
13.2. Importantsafetynotice
-Components identifiedbya markhavespecial characteristics
impotantforsafety.
-Whenreplacing anyofthese components, use onlymanufacture’s
specifiedparts.
13.3. SymbolicMarks
Thesymbolicmarks for resistorsand capacitorswhichusedinthiscircuitsareclassifiedas
following Table-1 and Table-2 .
13.3.1. RESISTORS
-ResistorswithoutsymbolicmarkareFIXEDCARBONFILM
RESISTORS(ERD-type).
-All resistorsare1/4WATT, ±5%TOLERANCEunless otherwise
designatedinschematicdiagrams.
Table-1
SYMBOL SPECIFICATION
FixedCarbon Film Resistors
“FLAME-PROOF”(ERD—F—type)
FixedWireWound Resistors
“FLAME-PROOF”(ERF—type)
FixedMetal OxideFilm Resistors
“FLAME-PROOF”(ERG—type)
FixedMetal Film Resistors
“FLAME-PROOF”(ERX—type)
FixedMetal Film Resistors(Precision and
High Stability)
(ERO—type)
Fuse TypeFixedMetal OxideFilm Resistors
“FLAME-PROOF”(ERQ—type)
Fuse TypeFixedCarbon Film Resistors
“FLAME-PROOF”(ERD2FC—type)
13.3.2. CAPACITORS
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-CapacitorswithoutsymbolicmarkarePOLYESTERCAPACITORS.
(ECQM-type, ECQG-type, ±10%Tolerance)
-PolarizedcapacitorswithoutsymbolicmarkareAluminum
ElectrolyticCapapcitors. (ECEA-type, ±20%Tolerance)
Table-2
SYMBOL SPECIFICATION TYPE
Non-PolarizedElectrolytic
Capacitors ECEA_KN_type
Non-PolarizedElectrolytic(for
Networksystem) ECEA_Y_type
Tantalum SolidElectrolytic
Capacitors ECS_type
MetalizedPlasticFilm
Capacitors(TFSeries) ECQV_type
TemperatureCompensating
CeramicCapacitors ECC_type
High-DielecytricConstant
CeramicCapacitors ECK_type ECR_type
Axial LeadCeramicCapacitors ECB_type
MetalizedPolyesterFilm
Capacitorsfor Across theLine ECQ_EW_type
Aluminum Electrolytic
Capacitorsfor Smoothing
Circuit
ECES_type
MultilayerCeramicChip
Capacitors ECUV_type
14. Measuring Condition
Note
Whenmeasuring thewaveforms, set thispiano’sstate as Fig.2in
“10. DisassemblyInstructions”.
14.1. Measuring Condition ofMAINP.C.B.
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18

14.2. Measuring Condition ofFJASP P.C.B.
Note
Whenmeasuring thewaveforms, set thispiano’sstate as Fig.2in
“10. DisassemblyInstructions”.
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15. SchematicDiagram
16. Printed Circuit BoardDiagram
17. Block Diagram
18. Wiring Connection Diagram
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