Tektronix P6230 User manual

Tektronix, Inc.
P.O. Box 500
Beaverton, Oregon 97077
070-4211-00
Product Group 60
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COII.MTTED 10 EXCELLENCE
PLEASE CHECK FOR CHANGE
INFORMATION AT THE REAR
OF THIS MANUAL.
INSTRUCTION MANUAL
Rrst Printing APR 1983
Revised SEP 1986

Copyright ® 1983 Tektronix, Inc. All rights reserved.
Contents of this publication may not be reproduced in any
form without the written permission of Tektronix, Inc.
Products of Tektronix, Inc. and its subsidiaries are covered
by U.S. and foreign patents and/or pending patents.
TEKTRONIX, TEK, SCOPE.MOBILE, and i! are
registered trademarks of Tektronix, Inc. TELEQUIPMENT
is a registered trademark of Tektronix U.K. Limited.
Printed in U.S.A. Specification and price change privileges
are reserved.
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TABLE OF CONTENTS
Page
LIST OF IllUSTRATIONS .................................................. ..iii
LIST OF TABLES ...................................................................... ..iv
OPERATORS SAFETY SUMMARY ................................... v
SERVICING SAFETY SUMMARY ...................................... vii
SECTION 1 SPECIFICATION
DESCRIPTION ....................................................... 1-1
ACCESSORIES ...................................................... 1-1
PERFORMANCE CONDITIONS ..................... 1-2
SECTION 2 OPERATING INSTRUCTIONS
INTRODUCTION ................................................... 2-1
OPERATING CONSIDERATIONS ................. 2-1
Probe Handling ................................................ 2-1
Probe Grounding ............................................ 2-1
Input Dynamic Range ................................... 2-2
CONTROLS AND CONNECTORS ................ 2-2
PROBE ACCESSORIES .............. " .................... 2-4
OPERATION ........................................................... 2-7
Page
SECTION 3 PERFORMANCE CHECK
PURPOSE ................................................................ 3-1
TEST EQUIPMENT REQUIRED ..................... 3-1
LIMITS AND TOLERANCES ............................ 3-1
PREPARATION ...................................................... 3-1
PROCEDURE STEPS .......................................... 3-3
DC Offset Check ............................................. 3-3
Bandwidth/Rise Time
High-Frequency Aberrations Check
...... 3-5
IWARNING ,
The following servicing instructions are for use
by qualified personnel only. To avoid personal
injury, do not perform any servicing other than
that contained in operating instructions unless
you are qualified
to do so.
SECTION 4 ADJUSTMENT PROCEDURE
PURPOSE ................................................................ 4-1
TEST EQUIPMENT REQUIRED ................... ..4-1
P6230

TABLE OF CONTENTS (cont)
Page
ADJUSTMENT SEQUENCE ........................... ..4-1
ADJUSTMENT LOCATIONS ......................... ..4-1
PREPARATION ...................................................... 4-2
PROCEDURE STEPS
........................................ ..4-4
Check/Adjust Offset Null
.......................... ..4-4
Check/Adjust Attenuation Accuracy
and Mid-Frequency Response
................. 4-4
SECTION 5 THEORY OF OPERATION
GENERAL CIRCUIT DESCRIPTION ............ 5-1
DETAILED CIRCUIT DESCRIPTION ............ 5-1
SECTION 6 MAINTENANCE
INTRODUCTION ................................................... 6-1
STATIC-SENSITIVE COMPONENTS .......... 6-1
PREVENTIVE MAINTENANCE ....................... 6-3
Cleaning .............................................................. 6-3
Visual Inspection ............................................ 6-4
Semiconductor Checks ............................... 6-4
TROUBLESHOOTING ........................................ 6-5
Schematic Diagram and Circuit
Board Illustration
............................................ 6-9
Page
Color Codes and Markings ........................ 6-9
Semiconductor Lead Configuration ....... 6-9
Troubleshooting Techniques .................... 6-9
CORRECTIVE MAINTENANCE ...................... 6-13
Maintenance Precautions ........................... 6-13
Obtaining Replacement Parts .................. 6-13
Soldering Techniques .................................. 6-14
PROBE DISASSEMBLY .................................... 6-16
Probe Tip Replacement ............................... 6-16
Control Box Disassembly ........................... 6-16
Cable Assembly Replacement ................. 6-1 8
Input Power Connector ReplacemenL6-18
INT-EXT Switch Replacement.. ................ 6-18
READJUSTMENT AFTER REPAIR ............... 6-20
INSTRUMENT REPACKING ............................ 6-20
SECTION 7 REPLACEABLE PARTS
DIAGRAMS
REPLACEABLE ELECTRICAL PARTS
REPLACEABLE MECHANICAL PARTS
OPTIONAL ACCESSORIES
ii
P6230
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Figure
1-1
2-1
2-2
2-3
2-4
2-5
3-1
4-1
5-1
LIST OF ILLUSTRATIONS
Page
P6230 Probe ............................................................ viii
Typical input impedance versus
frequency
................................................................... 1-6
Controls and connectors ................................... 2-3
Installation of probe accessories
................ .2-5
Simplified functional diagram ......................... 2-7
Typical
ECl output circuit... ............................ .2-8
Typical loading effects
on ECL.. .................... 2-8
High frequency check setup
........................... 3-6
P6230 adjustment locations ......................... ..4-5
Functional block diagram
.................................. 5-2
Figure
6-1
6-2
6-3
6-4
6-5
7-1
7-2
7-3
7-4
7-5
P6230
Page
Lead configuration of IC .................................... 6-9
Color code for resistors
and capacitors ........................................................ 6-10
Disassembly of control box .............................. 6-17
Input power connector pins ............................. 6-18
I NT -EXT switch removal .................................... 6-19
Schematic diagram for the P6230
P6230 circuit board
Exploded view
Accessories
Optional accessories
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LIST OF TABLES
Table Page
1-1 Electrical Characteristics .................................. 1-2
1-2 Environmental Characteristics ....................... 1-5
1-3 Physical Characteristics
.................................... 1-5
2-1 Typical Performance Effects
of Grounding Configurations ........................... 2-6
3-1 Test Equipment Required
................................. 3-2
4-1 Test Equipment Required ............................... ..4-2
6-1
6-2
6-3
Relative Susceptibility To Static
Discharge Damage ................................................ 6-2
Troubleshooting Equipment ............................ 6-5
Fault Indication and Probable Cause ......... 6-6
P6230

OPERATORS SAFETY SUMMARY
The general safety information in this part of the summary is for both operating and servicing personnel. Specific
warnings
and cautions will be found throughout the manual where they apply, but may not appear in this sum-
mary.
Terms In This Manual
CAUTION statements identify conditions or practices
that could result
in damage to the equipment or other
property.
WARNING statements identify conditions or practices
that could result
in personal injury or loss of life.
Do Not Operate In Explosive Atmospheres
To avoid explosion, do not operate this product in any
explosive atmosphere unless it has been specifically
certified for such operation.
Do Not Remove Covers
To avoid personal injury, do not remove the product
covers.
Do not operate the product without the covers
properly installed.
P6230
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SERVICE SAFETY SUMMARY
FOR QUALIFIED SERVICE PERSONNEL ONL Y
Refer also to the preceding Operators Safety Summary.
Do Not Service Alone
Use Care When Servicing With Power On
Do not perform internal service or adjustment of this pro-
duct unless another person capable of rendering first aid
and resuscitation is present.
To avoid personal injury. do not touch exposed con-
nections and components while power is on.
REV MAR 1986
P6230
vii
$ M.%Q.. MiA

The P6230 Probe.
viii