Telguard Bespoke User manual

Access to your home by the tone of your phone™
Door & Hardware
Federation
Raising Standards
®
MULTI LAYER INSTALL GUIDE

Contents.
3. Overview
4. Multi Layer Connections
5. I/O Board Connections
6. Pass Thru & I/O Expansion Board Connections
7. / 8. / 9. / 10. / 11. SMS Programming

Overview.
The new Telguard GSM Multi Layer board combines the Hy-Can PCB and the RGB keypad into one PCB allowing
for ultimate Low Profile. The PCB connects via a supplied ribbon cable back to the I/O PCB (Input/Output) that is
housed inside the back box, this is where you will find all the usual Telguard connections. The Multi Layer board
features a built in GSM module where the SIM and antenna both connect.
There is also an option to house the I/O board outside the back box - this is an I/O extension which means that you
can keep the install as safe as possible by having the relays separate from the unit, the back box then has a ‘Pass
Thru’ PCB housed inside.

CONNECTIONS
HY-CAN Multi Board

I/O Board
• Switching voltage max
60V AC or DC.
• Max switching current
2 Amp.
• Switching current max
200mA.
• Max switching voltage
60V AC or DC.
Power Relay
Opto Relay
(Changeover)
(Normally Open)

Pass Thru Board
I/O Expansion
Board