Texas Instruments TPA6166A2 User manual

User's Guide
SLOU381–March 2014
TPA6166A2 Multimedia Headset Interface
This user’s guide describes the characteristics, operation, and use of the TPA6166A2EVM evaluation
module (EVM). This document includes schematic diagrams, a printed circuit board (PCB) layout, and a
bill of materials.
Contents
1 Introduction ................................................................................................................... 2
2 Description.................................................................................................................... 2
3 Applications................................................................................................................... 2
4 Features....................................................................................................................... 2
5 Electrical Performance Specification...................................................................................... 2
6 Schematic..................................................................................................................... 3
7 Operation ..................................................................................................................... 5
7.1 Summary of Operation Instructions .............................................................................. 5
7.2 Install and Run the Graphical User Interface ................................................................... 5
7.3 EVM Connections and Power Up................................................................................. 6
7.4 Input and Output Connections .................................................................................... 7
7.5 Plug In a Supported Accessory................................................................................... 8
7.6 PurePath Console GUI Evaluation ............................................................................... 8
8 Device Evaluation Options.................................................................................................. 8
8.1 Current Measurement Connections .............................................................................. 8
9 EVM Assembly Drawings and PCB Layout .............................................................................. 9
10 List of Materials............................................................................................................. 12
11 Related Documentation from Texas Instruments ...................................................................... 14
List of Figures
1 TPA6166A2EVM Schematic ............................................................................................... 3
2 TPA6166A2EVM Schematic ............................................................................................... 4
3 PurePath Console ........................................................................................................... 5
4 Established I2C Connection (Shown with Green Indicator Light)...................................................... 6
5 TPA6166A2 Panel Details.................................................................................................. 8
6 TPA6166A2EVM Silk Screen Top Layer ................................................................................. 9
7 TPA6166A2EVM X-Ray Silk Screen Layer .............................................................................. 9
8 TPA6166A2EVM Top Copper ............................................................................................ 10
9 TPA6166A2EVM Copper Layer 2........................................................................................ 10
10 TPA6166A2EVM Copper Layer 3........................................................................................ 11
11 TPA6166A2EVM Bottom Copper ........................................................................................ 11
List of Tables
1 Supply Specifications........................................................................................................ 2
2 TPA6166A2 Jumper Settings .............................................................................................. 6
3 TPA6166A2EVM List of Materials........................................................................................ 12
DirectPath, PurePath are trademarks of Texas Instruments.
Microsoft, Windows are registered trademarks of Microsoft Corporation.
1
SLOU381–March 2014 TPA6166A2 Multimedia Headset Interface
Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

Introduction www.ti.com
1 Introduction
The TPA6166A2 evaluation module (TPA6166A2EVM) is a complete multimedia headset interface with
headphone amplifier, and microphone pre-amp and bias, as well as advanced headset detection circuitry.
All components and the evaluation module are Pb-free.
2 Description
The TPA6166A2EVM consists of a TPA6166A2 device and all necessary components to evaluate it. The
EVM connects to a PC through a USB interface. It is controlled by easy-to-use, intuitive, graphical user
interface (GUI)-based software.
3 Applications
This EVM is used in the following applications:
• Smart phones and wireless handsets
• Portable tablets
4 Features
The following features are available through this EVM:
• Ultra low power, high performance DirectPath™ Class-G headphone amplifier
• Fully differential Mic pre-amp with variable gain
• Choice of two Mic Bias voltages: 2 V and 2.6 V
• Advanced accessory insertion, removal, and type detection
5 Electrical Performance Specification
Table 1 lists the required power supply specifications.
Table 1. Supply Specifications
Supply voltage range, VDD 1.7 V – 1.9 V
Microphone Supply voltage, 2.4 V – 3.6 V
MICVDD
2TPA6166A2 Multimedia Headset Interface SLOU381–March 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated

SCL
IRQ2
SDA1
SCL1
SDA
IRQ
33pF/50V
C12
33pF/50V
C13
33pF/50V
C14
33pF/50V
C15
33pF/50V
C16
33pF/50V
C17
33pF/50V
C18
33pF/50V
C19
0.47uF/16V
C1
0.47uF/16V
C2
100k
R5
JP1
1
2
3IRQ
0.0
R10
RING1
TIP
JACK-SENSE
RING2
SLEEVE
1.0k
R1
1.0k
R2
J1
5
3
1
4
2
Shield
RIGHT
LEFT
3
2
1
SDA
3
2
1
SCL
2.7k
R4
2.7k
R3
4700pF/50V
C3
1.0uF/10V
C6
1.0uF/10V
C8
1.0uF/10V
C9
0.0
R8
2.2uF/10V
C5
2
3
HPINL
Shield
1
2
3
HPINR
Shield
1
0.0
R7
GND
GND
GNDGND
GND
GND
GND
GND
GND
GND
GND
GND GND
GND GND
GND GND
GND GND
GND
GND GND
+1.8V
+1.8V
+1.8V
+3.0V
GND
GND
GND
10pF/50V
C23
10pF/50V
C21
10pF/50V
C4
10pF/50V
C11
10pF/50V
C24
GND
10pF/50V
C22
GND
10pF/50V
C10
GND
10pF/50V
C20
+1.8V
1.0ufd/10V
C7
3
2
MICOUT
Shield
1
GND
0.0
R6
120ohms/1.2A
FB1
12
120ohms/1.2A
FB2
12
120ohms/1.2A
FB3
12
120ohms/1.2A
FB4
12
M3x5
M3x12
GND
U1
TPA6166A2YFF
A1C3 D3 E2B2C1
A3 C4
A2 B4
E5
D1
D2
E1
D4
B1
B3
C2
B5
C5
A5
E4
A4E3D5
R9
0.0
M3x12 M3x12 M3x12
GND GND GND
M3x5 M3x5 M3x5
DNP
DNP
DNP
DNP
DNP
DNPDNP
DNP
DNP
SCREWSSTANDOFFS
TO U3
HEADPHONE
INPUTS
TO U2
MIC OUTPUT
MOUNTING HARDWARE
www.ti.com Schematic
6 Schematic
Figure 1 and Figure 2 illustrate the EVM schematics.
Figure 1. TPA6166A2EVM Schematic
3
SLOU381–March 2014 TPA6166A2 Multimedia Headset Interface
Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

DP
DM
5VIN
PUR
3VIN
SDA2
SCL2
IRQ2
USB-IRQ
SDA1
SCL1
1.8VIN
18pF/50V
C45
18pF/50V
C46
1000pF/50V
C48
3.09k
R22
4.99k
R20
4.99k
R21
JP5 2
1
4.99k
R15
2.00k
R23
100k
R16
S1
27.4
R13
27.4
R14
15k
R11
1.50k
R12
5.0V
GND
3.0V
1.8V
GND
GND GND
GND
GND
GND
GND
GND
GND GND GND GND
GND
GND
GND
GND
GND
JP4
1
2
3
GND
GND
JP2
1
2
3
3
2
1
JP3
GND
GND
GND
GND
GND
GND
GND
330
R17
330
R18
GND
GND
JP6
1
2
GND
GND
6.0MHz
12
Y1
GND
U5
TAS1020BPFB
47 46
3
48
1
2
45 44 43
5
6
7
9
10
11
12
4142
33
16
28
4
8
21
40 39 38 37
36
35
34
32
23 24
25
26
27
29
30
31
13 14 15 17 18 19 20 22
64K
U4
1
2
3
4 5
6
7
8
3.3V/400mA
VR3
TPS73633MDBVREP
5
43
2
1
3.0V/400mA
VR1
1
2
3 4
5
TPS73630MDBVREP
1.8V/400mA
VR2
TPS73618MDBVREP
5
43
2
1
U3
SN74AVC1T45DBV
6
5
43
2
1
A
GND DIR
VCCA VCCB
B
U2
PCA9306DCT
1
2
3
4
5
6
7
8
GND
GND
GND
220k
R19
0.1uF/16V
C26
10.0uF/10V
C25
10.0uF/10V
C27
+
10.0uF/10V
C30
10.0uF/10V
C34
0.1uF/16V
C35
0.1uF/16V
C31
10.0uF/10V
C32
+
10.0uF/10V
C36
+
1.0uF/25V
C33
1.0uF/25V
C37
1.0uF/25V
C28
100pF/50V
C47
0.1uF/16V
C38
0.1uF/16V
C49
0.1uF/16V
C50
0.1uF/16V
C51
0.1uF/16V
C52
0.1uF/16V
C53
0.1uF/16V
C54
0.1uF/16V
C43
0.1uF/16V
C44
0.1uF/16V
C41
0.1uF/16V
C42
47pF/50V
C39
47pF/50V
C40
10uF/6.3V
C29
40V,1A
Q1
B
E
C
GND GND GND
GND GND
GND GND
GND
GND
GND
GND
+5V-USB
+5V-USB
+3.3V
+3.3V
+3.0V
+1.8V
+5V
+5V
+5V
+3.3V
+3.3V
+3.3V
+3.3V
+3.3V
+5V
+3.3V
+3.3V
+3.3V
+1.8V-PS
+1.8V-PS
+1.8V-PS
1
2
3
4
5
USB
Data+
GND
ID_NC
5v
Data-
600 Ohms/2A
FB6
12
600 Ohms/2A
FB5
12
+3.3V
POWER
SUPPLY
INPUTS
FROM
U1
USB
USB
RESET
USB-IRQ
Schematic www.ti.com
Figure 2. TPA6166A2EVM Schematic
4TPA6166A2 Multimedia Headset Interface SLOU381–March 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated

www.ti.com Operation
7 Operation
This section describes how to operate the TPA6166A2EVM.
7.1 Summary of Operation Instructions
Follow the procedures below to quickly set up the TPA6166A2EVM and begin evaluation (upon
connecting to the USB):
1. Install the GUI. Use a PC running Microsoft®Windows®XP or higher. See Section 7.2 for details.
2. Connect the EVM to the PC and power up the EVM. Use a micro-USB cable. See Section 7.3 for
details.
3. Run the GUI.
4. Connect inputs and outputs. See Section 7.4 for details.
5. Plug in a supported accessory. See Section 7.5 for details.
6. Use the GUI to control the evaluation. See Section 7.6 for details.
7.2 Install and Run the Graphical User Interface
Download the PurePath™ Console from www.ti.com. Once the PurePath Console is installed, select the
TPA6166A2 plugin to start the GUI. The front panel of the GUI looks like Figure 3. Refer to Section 7.6 for
a detailed description of the GUI. Connect the EVM before running the GUI.
Figure 3. PurePath Console
5
SLOU381–March 2014 TPA6166A2 Multimedia Headset Interface
Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

Operation www.ti.com
7.3 EVM Connections and Power Up
The EVM is configured to power up from the USB by default. If the EVM is not in this mode, ensure that
jumpers are inserted between the middle pin and the USB pin of the following jumpers: JP2, JP3 and JP4.
Then, using a micro-USB cable, connect the EVM to a PC running Windows XP or higher.
The EVM powers itself from the USB (5.0 V) and generates 3.0-V and 1.8-V supplies for the TPA6166A2
using on-board voltage regulators as well as a 3.3 V for the TAS1020B chip which is used to convert USB
to I2C and vice versa.
Alternatively, to power the TPA6166A2 using external power supplies, use the jumper settings in Table 2.
It is not possible to power the TAS1020B chip from an external 3.3-V supply.
Table 2. TPA6166A2 Jumper Settings
Jumper Connect Middle Pin To Function
JP4 5.0-V pin of jumper Use external 5.0-V supply instead of USB power
JP2 3.0-V pin of jumper Use external 3.0-V supply instead of 3.0 V from on-board regulator
JP3 1.8-V pin of jumper Use external 1.8-V supply instead of 1.8 V from on-board regulator
Once the USB cable is connected to the PC, the I2C status indicator in the bottom half of the GUI should
turn green as shown in Figure 4.
Figure 4. Established I2C Connection (Shown with Green Indicator Light)
6TPA6166A2 Multimedia Headset Interface SLOU381–March 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated

www.ti.com Operation
7.4 Input and Output Connections
7.4.1 Headphone Input
For headphone amplifier evaluation, connect the left and right signal sources to HPINL (black) and HPINR
(red) RCA input connectors on the EVM.
7.4.2 Microphone Output
For microphone pre-amp and mic-bias evaluation, connect the microphone output available on the
MICOUT (black) RCA connector to the measurement equipment or external amplifier system.
7.4.3 I2C Connection
By default, pins SDA and SCL of the TPA6166A2 are driven by the on-board TAS1020B which is
controlled by the GUI running on the PC through the USB. If the EVM is not in this default mode, insert
jumpers between the middle-pin and USB pin of the following jumpers: SDA, SCL.
To use an external I2C master instead of the on-board TAS1020B, remove the jumpers between the
middle-pin and USB pin of jumpers SDA and SCL and connect the external I2C signals between the
middle-pin and GND of jumpers SDA and SCL. Ensure that SDA and SCL are not swapped. Ensure that
the I2C master does not have pull up resistors or that the I2C master’s pull-up resistors pull up SDA and
SCL to 1.8 V. Voltages greater than 1.8 V may cause device damage.
7.4.4 IRQ Connection
By default, the IRQ pin of the TPA6166A2 is connected to the on-board TAS1020B which is controlled by
the GUI running on the PC through the USB. If the EVM is not in this default mode, insert a jumper
between the middle-pin and the USB pin of the IRQ jumper.
To stop the IRQ signal from going to the on-board TAS1020B and to process it using an external device,
remove the jumper between the middle-pin and the USB pin of jumper IRQ, and connect the middle-pin
and GND of jumper IRQ to the external device. Ensure that IRQ does not have pull-up resistors or that the
I2C master’s pull-up resistors pull up IRQ to 1.8 V. Voltages greater than 1.8 V may cause device damage.
7
SLOU381–March 2014 TPA6166A2 Multimedia Headset Interface
Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

Device Evaluation Options www.ti.com
7.5 Plug In a Supported Accessory
Connect a supported accessory to the 3.5-mm jack J1. For a list of supported accessories, refer to the
TPA6166A2 data sheet (SLAS997) under Accessory detection. As soon as the accessory is inserted, the
GUI should indicate the type of accessory inserted.
7.6 PurePath Console GUI Evaluation
Use the PurePath Console GUI to control the device during evaluation. This section gives a short
description of the main features of the GUI.
The GUI window consists of the following tabs: EVM,Block Diagram,TPA6166A2,Direct I2C Read/Write,
Registers, and Scripting.
Figure 5. TPA6166A2 Panel Details
8 Device Evaluation Options
8.1 Current Measurement Connections
One or both of the jumpers JP2 and JP3 can be removed and current meters can be installed to measure
TPA6166A2 current consumption
8TPA6166A2 Multimedia Headset Interface SLOU381–March 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated

www.ti.com EVM Assembly Drawings and PCB Layout
9 EVM Assembly Drawings and PCB Layout
Figure 6 through Figure 11 illustrate the TPA6166A2EVM assembly drawings and PCB layout.
Figure 6. TPA6166A2EVM Silk Screen Top Layer
Figure 7. TPA6166A2EVM X-Ray Silk Screen Layer
9
SLOU381–March 2014 TPA6166A2 Multimedia Headset Interface
Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

EVM Assembly Drawings and PCB Layout www.ti.com
Figure 8. TPA6166A2EVM Top Copper
Figure 9. TPA6166A2EVM Copper Layer 2
10 TPA6166A2 Multimedia Headset Interface SLOU381–March 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated

www.ti.com EVM Assembly Drawings and PCB Layout
Figure 10. TPA6166A2EVM Copper Layer 3
Figure 11. TPA6166A2EVM Bottom Copper
11
SLOU381–March 2014 TPA6166A2 Multimedia Headset Interface
Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

List of Materials www.ti.com
10 List of Materials
Table 3 lists the BOM for the TPA6166A2EVM.
Table 3. TPA6166A2EVM List of Materials
Item MFG Part Number MFG Qty Ref Designators Description
1 TPA6166A2YFF TEXAS INSTRUMENTS 1 U1 3.5mm JACK DETECT AND HEADSET INTERFACE IC WCSP25-YFF ROHS
2 PCA9306DCTR TEXAS INSTRUMENTS 1 U2 DUAL BIDIR I2C BUS AND SMBUS VOLT LEVEL TRANS SSOP8-DCT ROHS
3 SN74AVC1T45DBVR TEXAS INSTRUMENTS 1 U3 1BIT DUAL SUPPLY XCVR W/CONFIG VOLTAGE SOT23-DBV6 ROHS
4 24LC64-I/SN MICROCHIP 1 U4 64K I2C SERIAL EEPROM SOP8-D ROHS
5 TAS1020BPFB TEXAS INSTRUMENTS 1 U5 USB STREAMING CONTROLLER TQFP48-PFB ROHS
6 TPS73630MDBVREP TEXAS INSTRUMENTS 1 VR1 VOLT REG 3.0V 400MA LDO CAP FREE NMOS SOT23-DBV5 ROHS
7 TPS73618MDBVREP TEXAS INSTRUMENTS 1 VR2 VOLT REG 1.8V 400MA LDO CAP FREE NMOS SOT23-DBV5 ROHS
8 TPS73633MDBVREP TEXAS INSTRUMENTS 1 VR3 VOLT REG 3.3V 400MA LDO CAP FREE NMOS SOT23-DBV5 ROHS
9 MMBT2222A-7-F DIODES INC. 1 Q1 TRANSISTOR NPN GENERAL PURPOSE 40V 1A SOT23 DBV3 ROHS
10 FQ1045A-6.000 FOX 1 Y1 CRYSTAL SMT 6.0MHz 30ppm FQ1045A ROHS
11 0603YD474KAT2A AVX 2 C1, C2 CAP SMD0603 CERM 0.47UFD 16V 10% X5R ROHS
12 GRM188R71H472KA01D MURATA 1 C3 CAP SMD0603 CERM 4700PFD 50V 10% X7R ROHS
13 GRM0335C1H100JA01D MURATA 0 C4, C10, C11, C20, C21, C22, C23, C24 CAP SMD0201 CERM 10pF 50V NPO 5% ROHS
14 C1005X5R1A225K TDK CORP 1 C5 CAP SMD0402 CERM 2.2UFD 10V 10% X5R ROHS
15 C1005X5R1A105K TDK CORP 4 C6, C7, C8, C9 CAP SMD0402 CERM 1.0UFD 10V 10% X5R ROHS
16 GRM1555C1H330JA01D MURATA 8 C12, C13, C14, C15, C16, C17, C18, C19 CAP SMD0402 CERM 33PFD 5% 50V COG ROHS
17 LMK107BJ106MALTD TAIYO YUDEN 3 C25, C30, C34 CAP SMD0603 CERM 10.0UFD 10V 20% X5R ROHS
18 GRM188R71C104KA01D MURATA 14 C26, C31, C35, C38, C41, C42, C43, C44, C49, C50, C51, CAP SMD0603 CERM 0.1UFD 16V 10% X7R ROHS
C52, C53, C54
19 AVE106M16A12T-F CORNELL DUBILIER 3 C27, C32, C36 CAP ALUM-ELECT SMD-AVE TYPE A 10UFD 16V 20% ROHS
20 TMK107BJ105KA-T TAIYO YUDEN 3 C28, C33, C37 CAP SMD0603 CERM 1.0UFD 25V 10% X5R ROHS
21 GRM188R60J106ME47D MURATA 1 C29 CAP SMD0603 CERM 10UFD 6.3V 20% X5R ROHS
22 GRM1885C1H470JA01D MURATA 2 C39, C40 CAP SMD0603 CERM 47PFD 50V 5% COG ROHS
23 C1608C0G1H180J TDK CORP. 2 C45, C46 CAP SMD0603 CERM 18PFD 50V 5% COG ROHS
24 GRM1885C1H101JA01D MURATA 1 C47 CAP SMD0603 CERM 100PFD 50V 5% COG ROHS
25 C1608C0G1H102J TDK CORP. 1 C48 CAP SMD0603 CERM 1000PFD 50V 5% COG ROHS
26 ERJ-2GEJ102X PANASONIC 2 R1, R2 RESISTOR SMD0402 1.0K OHMS 5% THICK FILM 1/16W ROHS
27 CRCW04022K70JNED VISHAY 2 R3, R4 RESISTOR SMD0402 2.7K OHMS 5% THICK FILM 1/16W ROHS
28 ERJ-2GEJ104 PANASONIC 1 R5 RESISTOR SMD0402 THICK FILM 100K OHMS 1/16W 5% ROHS
29 RMCF0402ZT0R00 STACKPOLE ELECTRONICS 3 R6, R8, R10 ZERO OHM JUMPER SMT 0402 0 OHM 1/16W,5% ROHS
30 ERJ-3GEY0R00V PANASONIC 1 R7 RESISTOR SMD0603 0.0 OHM 5% THICK FILM 1/10W ROHS
31 RMCF0402ZT0R00 STACKPOLE ELECTRONICS 0 R9 ZERO OHM JUMPER SMT 0402 0 OHM 1/16W,5% ROHS
32 ERJ-3GEYJ153V PANASONIC 1 R11 RESISTOR SMD0603 15K OHM 5% THICK FILM 1/10W ROHS
33 ERJ-3EKF1501V PANASONIC 1 R12 RESISTOR SMD0603 1.50K OHM 1% THICK FILM 1/10W ROHS
34 CRCW060327R4FKEA VISHAY 2 R13, R14 RESISTOR SMD0603 27.4 OHM 1/10W 1% ROHS
35 ERJ-3EKF4991V PANASONIC 3 R15, R20, R21 RESISTOR SMD0603 4.99K OHM 1% THICK FILM 1/10W ROHS
36 RMCF0603JT100K STACKPOLE ELECTRONICS 1 R16 RESISTOR SMD0603 100K OHMS 5% 1/10W ROHS
12 TPA6166A2 Multimedia Headset Interface SLOU381–March 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated

www.ti.com List of Materials
Table 3. TPA6166A2EVM List of Materials (continued)
Item MFG Part Number MFG Qty Ref Designators Description
37 ERJ-3GEYJ331V PANASONIC 2 R17, R18 RESISTOR SMD0603 330 OHMS 5% 1/10W ROHS
38 ERJ-3EKF2203V PANASONIC 1 R19 RESISTOR SMD0603 220K 1% THICK FILM 1/10W ROHS
39 ERJ-3EKF3091V PANASONIC 1 R22 RESISTOR SMD0603 3.09K OHM 1% THICK FILM 1/10W ROHS
40 RMCF0603FT2K00 STACKPOLE ELECTRONICS 1 R23 RESISTOR SMD0603 2.00K OHMS 1% 1/10W ROHS
41 MPZ1005S121C TDK 4 FB1, FB2, FB3, FB4 FERRITE BEAD, 120 Ohms 1.2A 100MHz SM0402 ROHS
42 MPZ2012S601A TDK 2 FB5, FB6 FERRITE BEAD SMD0805 600 Ohms 2A ROHS
43 SJ-43515TS-SMT CUI STACK 1 J1 JACK AUDIO-STEREO MINI(3.5MM 3-COND SMT-RA ROHS
44 PBC02SAAN SULLINS 3 JP1, JP5, JP6 HEADER THRU MALE 2 PIN 100LS 120 TAIL GOLD ROHS
45 PBC03SAAN SULLINS 6 IRQ, JP2, JP3, JP4, SCL, SDA HEADER THRU MALE 3 PIN 100LS 120 TAIL GOLD ROHS
46 PBC01SAAN SULLINS 5 TIP, RING1, RING2, SLEEVE, JACK-SENSE HEADER THRU MALE 1 PIN GOLD ROHS
47 PJRAN1X1U01X SWITCHCRAFT 2 HPINL, MICOUT JACK, RCA 3-PIN PCB-RA BLACK ROHS
48 PJRAN1X1U03X SWITCHCRAFT 1 HPINR JACK, RCA 3-PIN PCB-RA RED ROHS
49 ZX62WD1-B-5PC HIROSE 1 USB JACK USB FEMALE TYPEB MICRO SMT-RA 5PIN ROHS
50 5001 KEYSTONE ELECTRONICS 3 GNDx3 PC TESTPOINT, BLACK, ROHS
51 TL1015AF160QG E-SWITCH 1 S1 SWITCH, MOM, 160G SMT 4X3MM ROHS
52 3760-2 POMONA 3 1.8V, 3.0V, 5.0V BINDING POST, RED 60V/15A TIN ROHS
53 3760-0 POMONA 1 GND BINDING POST, BLACK 60V/15A TIN ROHS
54 24434 KEYSTONE ELECTRONICS 4 STANDOFFS Standoff, Hex, 12mm, M3, Aluminum
56 MPMS 003 0005 PH BUILDING FASTENER 4 STANDOFF SCREWS MACHINE SCREW PAN PHILLIPS M3
57 969102-0000-DA 3M 6 IRQ, JP2, JP3, JP4, SCL, SDA SHUNT BLACK AU FLASH 0.100LS OPEN TOP ROHS
TOTAL 125
Special Notes to this Bill of Materials
SN1 These assemblies are ESD sensitive, observe ESD precautions.
SN2 These assemblies must be clean and free from flux and all contaminants. Use of no-clean flux is not acceptable.
SN3 These assemblies must comply with workmanship standards IPC-A-610 Class 2.
SN4 Ref designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG's components.
13
SLOU381–March 2014 TPA6166A2 Multimedia Headset Interface
Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated

Related Documentation from Texas Instruments www.ti.com
11 Related Documentation from Texas Instruments
Refer to the following related documentation for more information about the TPA6166A2:
TPA6166A2 data sheet, SLAS997.
14 TPA6166A2 Multimedia Headset Interface SLOU381–March 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated

ADDITIONAL TERMS AND CONDITIONS, WARNINGS, RESTRICTIONS, AND DISCLAIMERS FOR
EVALUATION MODULES
Texas Instruments Incorporated (TI) markets, sells, and loans all evaluation boards, kits, and/or modules (EVMs) pursuant to, and user
expressly acknowledges, represents, and agrees, and takes sole responsibility and risk with respect to, the following:
1. User agrees and acknowledges that EVMs are intended to be handled and used for feasibility evaluation only in laboratory and/or
development environments. Notwithstanding the foregoing, in certain instances, TI makes certain EVMs available to users that do not
handle and use EVMs solely for feasibility evaluation only in laboratory and/or development environments, but may use EVMs in a
hobbyist environment. All EVMs made available to hobbyist users are FCC certified, as applicable. Hobbyist users acknowledge, agree,
and shall comply with all applicable terms, conditions, warnings, and restrictions in this document and are subject to the disclaimer and
indemnity provisions included in this document.
2. Unless otherwise indicated, EVMs are not finished products and not intended for consumer use. EVMs are intended solely for use by
technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical
mechanical components, systems, and subsystems.
3. User agrees that EVMs shall not be used as, or incorporated into, all or any part of a finished product.
4. User agrees and acknowledges that certain EVMs may not be designed or manufactured by TI.
5. User must read the user's guide and all other documentation accompanying EVMs, including without limitation any warning or
restriction notices, prior to handling and/or using EVMs. Such notices contain important safety information related to, for example,
temperatures and voltages. For additional information on TI's environmental and/or safety programs, please visit www.ti.com/esh or
contact TI.
6. User assumes all responsibility, obligation, and any corresponding liability for proper and safe handling and use of EVMs.
7. Should any EVM not meet the specifications indicated in the user’s guide or other documentation accompanying such EVM, the EVM
may be returned to TI within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE
EXCLUSIVE WARRANTY MADE BY TI TO USER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR
STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. TI SHALL
NOT BE LIABLE TO USER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES RELATED TO THE
HANDLING OR USE OF ANY EVM.
8. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which EVMs might be or are used. TI currently deals with a variety of customers, and therefore TI’s arrangement with
the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services with respect to the handling or use of EVMs.
9. User assumes sole responsibility to determine whether EVMs may be subject to any applicable federal, state, or local laws and
regulatory requirements (including but not limited to U.S. Food and Drug Administration regulations, if applicable) related to its handling
and use of EVMs and, if applicable, compliance in all respects with such laws and regulations.
10. User has sole responsibility to ensure the safety of any activities to be conducted by it and its employees, affiliates, contractors or
designees, with respect to handling and using EVMs. Further, user is responsible to ensure that any interfaces (electronic and/or
mechanical) between EVMs and any human body are designed with suitable isolation and means to safely limit accessible leakage
currents to minimize the risk of electrical shock hazard.
11. User shall employ reasonable safeguards to ensure that user’s use of EVMs will not result in any property damage, injury or death,
even if EVMs should fail to perform as described or expected.
12. User shall be solely responsible for proper disposal and recycling of EVMs consistent with all applicable federal, state, and local
requirements.
Certain Instructions. User shall operate EVMs within TI’s recommended specifications and environmental considerations per the user’s
guide, accompanying documentation, and any other applicable requirements. Exceeding the specified ratings (including but not limited to
input and output voltage, current, power, and environmental ranges) for EVMs may cause property damage, personal injury or death. If
there are questions concerning these ratings, user should contact a TI field representative prior to connecting interface electronics including
input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate
operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the applicable EVM user's guide prior
to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During
normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output are maintained
at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass
transistors, and current sense resistors which can be identified using EVMs’ schematics located in the applicable EVM user's guide. When
placing measurement probes near EVMs during normal operation, please be aware that EVMs may become very warm. As with all
electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in
development environments should use EVMs.
Agreement to Defend, Indemnify and Hold Harmless. User agrees to defend, indemnify, and hold TI, its directors, officers, employees,
agents, representatives, affiliates, licensors and their representatives harmless from and against any and all claims, damages, losses,
expenses, costs and liabilities (collectively, "Claims") arising out of, or in connection with, any handling and/or use of EVMs. User’s
indemnity shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if EVMs fail to perform as
described or expected.
Safety-Critical or Life-Critical Applications. If user intends to use EVMs in evaluations of safety critical applications (such as life support),
and a failure of a TI product considered for purchase by user for use in user’s product would reasonably be expected to cause severe
personal injury or death such as devices which are classified as FDA Class III or similar classification, then user must specifically notify TI
of such intent and enter into a separate Assurance and Indemnity Agreement.

RADIO FREQUENCY REGULATORY COMPLIANCE INFORMATION FOR EVALUATION MODULES
Texas Instruments Incorporated (TI) evaluation boards, kits, and/or modules (EVMs) and/or accompanying hardware that is marketed, sold,
or loaned to users may or may not be subject to radio frequency regulations in specific countries.
General Statement for EVMs Not Including a Radio
For EVMs not including a radio and not subject to the U.S. Federal Communications Commission (FCC) or Industry Canada (IC)
regulations, TI intends EVMs to be used only for engineering development, demonstration, or evaluation purposes. EVMs are not finished
products typically fit for general consumer use. EVMs may nonetheless generate, use, or radiate radio frequency energy, but have not been
tested for compliance with the limits of computing devices pursuant to part 15 of FCC or the ICES-003 rules. Operation of such EVMs may
cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may
be required to correct this interference.
General Statement for EVMs including a radio
User Power/Frequency Use Obligations: For EVMs including a radio, the radio included in such EVMs is intended for development and/or
professional use only in legally allocated frequency and power limits. Any use of radio frequencies and/or power availability in such EVMs
and their development application(s) must comply with local laws governing radio spectrum allocation and power limits for such EVMs. It is
the user’s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations.
Any exceptions to this are strictly prohibited and unauthorized by TI unless user has obtained appropriate experimental and/or development
licenses from local regulatory authorities, which is the sole responsibility of the user, including its acceptable authorization.
U.S. Federal Communications Commission Compliance
For EVMs Annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant
Caution
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause
harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications could void the user's authority to operate the equipment.
FCC Interference Statement for Class A EVM devices
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at its own expense.
FCC Interference Statement for Class B EVM devices
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and
on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Industry Canada Compliance (English)
For EVMs Annotated as IC – INDUSTRY CANADA Compliant:
This Class A or B digital apparatus complies with Canadian ICES-003.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the
equipment.
Concerning EVMs Including Radio Transmitters
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this
device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired
operation of the device.
Concerning EVMs Including Detachable Antennas
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain
approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should
be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum
permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain
greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Canada Industry Canada Compliance (French)
Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada
Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de
l'utilisateur pour actionner l'équipement.
Concernant les EVMs avec appareils radio
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain
maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à
l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente
(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel
d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans
cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
spacer
Important Notice for Users of EVMs Considered “Radio Frequency Products” in Japan
EVMs entering Japan are NOT certified by TI as conforming to Technical Regulations of Radio Law of Japan.
If user uses EVMs in Japan, user is required by Radio Law of Japan to follow the instructions below with respect to EVMs:
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and
Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of
Japan,
2. Use EVMs only after user obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or
3. Use of EVMs only after user obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect
to EVMs. Also, do not transfer EVMs, unless user gives the same notice above to the transferee. Please note that if user does not
follow the instructions above, user will be subject to penalties of Radio Law of Japan.
http://www.tij.co.jp
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 本開発キットは技術基準適合証明を受けておりません。 本製品の
ご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
日本テキサス・インスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
http://www.tij.co.jp Texas Instruments Japan Limited
(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated

Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Texas Instruments:
TPA6166A2YFFEVM