
7 Bill of Materials, Printed-Circuit Board Layout, and Schematics
This section contains the ADS8354EVM bill of materials (BOM), printed-circuit board (PCB) layout, and
schematics.
7.1 Bill of Materials
Table 7-1 lists the ADS8354EVM BOM.
Table 7-1. ADS8354EVM Bill of Materials
Manufacturer Part Number Quantity Reference
Designators
Manufacturer Description
DC196 1 PCB Printed Circuit Board
0603YC104JAT2A 15 C1, C3, C4, C5, C6,
C7, C8, C13, C15,
C16, C17, C28, C31,
C37, C39
KYOCERA AVX CAP, CERM, 0.1 uF, 16 V, +/- 5%, X7R, 0603
06033C105KAT2A 1 C2 KYOCERA AVX CAP, CERM, 1 uF, 25 V, +/- 10%, X7R, 0603
C0603C101J5GACTU 4 C9, C10, C11, C12 KEMET CAP, CERM, 100 pF, 50 V, +/- 5%, C0G/NP0, 0603
EMK107BB7225MA-T 2 C14, C18 Taiyo Yuden CAP, CERM, 2.2 uF, 16 V,+/- 10%, X7R, 0603
C1608X5R1E106M080AC 6 C19, C20, C40, C41,
C42, C44
TDK Corporation CAP, CERM, 10 uF, 25 V, +/- 20%, X5R, 0603
GRM1885C1H821JA01D 2 C21, C23 KEMET CAP, CERM, 820 pF, 50 V, +/- 5%, C0G/NP0, 0603
C0603C100F5GAC7867 4 C22, C24, C25, C26 KEMET CAP, CERM, 10 pF, 50 V, +/- 1%, C0G/NP0, 0603
GRM188R61C474KA93D 1 C27 KEMET CAP, CERM, 0.47 uF, 16 V, +/- 10%, X5R, 0603
CGA3E1X7R1E105K080AD 3 C29, C30, C38 TDK Corporation CAP, CERM, 1 µF, 25 V,+/- 10%, X7R, AEC-Q200 Grade 1, 0603
CL21A226KOQNNNE 1 C32 Samsung Electro-
Mechanics
CAP, CERM, 22 µF, 16 V,+/- 10%, X5R, 0805
CL21A475KOFNNNE 2 C33, C34 Samsung Electro-
Mechanics
CAP, CERM, 4.7 µF, 16 V,+/- 10%, X5R, 0805
CL21B106KOQNNNE 1 C35 Samsung Electro-
Mechanics
CAP, CERM, 10 uF, 16 V, +/- 10%, X7R, 0805
C3216X5R1E476M160AC 1 C36 TDK Corporation CAP, CERM, 47 uF, 25 V, +/- 20%, X5R, 1206_190
GRM1885C1H102FA01J 1 C43 Murata Electronics CAP, CERM, 1000 pF, 50 V, +/- 1%, C0G/NP0, 0603
1N4148WT 2 D1, D2 Yangzhou
Yangjie Electronic
Technology Co.,Ltd
Diode, Switching, 75 V, 0.3 A, SOD-523F
APT2012LZGCK 1 D3 Kingbright LED, Green, SMD
9774050360R 2 H1, H2 Würth Elektronik ROUND STANDOFF M3 STEEL 5MM
SJ-5303 (CLEAR) 4 H3, H4, H5, H6 3M Bumpon, Hemisphere, 0.44 X 0.20, Clear
RM3X4MM 2701 2 H10, H11 APM Hexseal Machine Screw Pan PHILLIPS M3
5-1814832-2 4 J1, J2, J3, J4 TE Connectivity
AMP Connectors
SMA Straight PCB Socket Die Cast, 50 Ohm, TH
TSW-106-07-G-D 1 J5 Samtec Inc. Header, 100mil, 6x2, Gold, TH
QTH-030-01-L-D-A 1 J6 Samtec Inc. Header(Shrouded), 19.7mil, 30x2, Gold, SMT
TSW-102-07-G-S 9 JP1, JP2, JP3, JP4,
JP5, JP6, JP7, JP8,
JP10
Samtec Inc. Header, 100mil, 2x1, Gold, TH
TSW-103-07-G-S 1 JP9 Samtec Inc. Header, 100mil, 3x1, Gold, TH
THT-14-423-10 1 LBL1 Brady Corporation Thermal Transfer Printable Labels, 0.650
RC0603FR-0720KL 4 R1, R2, R3, R4 YAGEO RES, 20.0 k, 1%, 0.1 W, 0603
RC0603FR-071K5L 8 R5, R6, R7, R8, R9,
R10, R11, R12
YAGEO RES, 1.50 k, 1%, 0.1 W, 0603
CRCW060315R0FKEA 4 R13, R14, R15, R16 Vishay Dale RES, 15.0, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
ERJ-3RQFR22V 2 R17, R18 Panasonic
Electronic
Components
RES, 0.22, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
RC0603FR-0713RL 4 R19, R20, R21, R22 YAGEO RES, 13.0, 1%, 0.1 W, 0603
ERJ-3GEY0R00V 2 R23, R41 Panasonic
Electronic
Components
RES, 0, 5%, 0.1 W, 0603
Bill of Materials, Printed-Circuit Board Layout, and Schematics www.ti.com
18 ADS8354EVM-PDK Evaluation Module SBAU407 – APRIL 2023
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