Texas Instruments AFE3010EVM User manual

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AFE3010 Evaluation Module
User's Guide
SLYU038–June 2020
AFE3010 Evaluation Module
This user’s guide describes the characteristics, operation, and use of the AFE3010 evaluation module
(EVM). This EVM is designed to evaluate the performance of the AFE3010 as a ground-fault circuit
interrupter IC with self-tests. Throughout this document, the terms evaluation board, evaluation module,
and EVM are synonymous with the AFE3010EVM. This document also includes a schematic, reference
printed-circuit board (PCB) layouts, and a complete bill of materials (BOM).

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Contents
1 Overview...................................................................................................................... 3
1.1 EVM Kit Contents................................................................................................... 3
1.2 Related Documentation From Texas Instruments.............................................................. 3
2 Hardware ..................................................................................................................... 4
2.1 Features ............................................................................................................. 4
3 Operation ..................................................................................................................... 5
3.1 Quick Start Setup................................................................................................... 5
3.2 Measurements (Optional).......................................................................................... 9
4 EVM Components ........................................................................................................... 9
4.1 U1 - AFE3010....................................................................................................... 9
4.2 T1 ..................................................................................................................... 9
4.3 J1 and J2 ............................................................................................................ 9
4.4 J3 (SOL+), J4 (SOL-)............................................................................................... 9
4.5 D1..................................................................................................................... 9
4.6 R10, R11, R14, R15, C2, C16, and C1.......................................................................... 9
4.7 D2, SCR1, SCR2.................................................................................................. 10
4.8 R2, C5, R5, R4, C17, R8, C8, R12, and C18 ................................................................. 10
4.9 R3, C11............................................................................................................. 10
4.10 C6, C12, C13, and C14 .......................................................................................... 10
4.11 C4, C9, C7, C10, C15, Rin, and RFB .......................................................................... 10
4.12 RPH................................................................................................................. 10
4.13 R13, C3, and D6................................................................................................... 10
4.14 R9 ................................................................................................................... 10
4.15 R16, D3............................................................................................................. 10
4.16 R1, R1a, R1b, D5, and Q1....................................................................................... 10
4.17 JP1–JP13 .......................................................................................................... 11
4.18 S1–S25 ............................................................................................................. 11
4.19 TP1–TP25.......................................................................................................... 11
5 Schematic, PCB Layout, and Bill of Materials.......................................................................... 12
5.1 Schematics......................................................................................................... 12
5.2 PCB Layout ........................................................................................................ 14
5.3 Bill of Materials .................................................................................................... 16
List of Figures
1 Shunt (H9–H19) Connector Setup: Red Squares = Shunt Position, Green Circle = Open or no shunt ......... 6
2 AFE3010EVM and Hardware Setup ...................................................................................... 7
3 Simplified AFE3010EVM Schematic and Hardware for Quick Setup ................................................ 8
4 AFE3010EVM Schematic ................................................................................................. 13
5 AFE3010EVM Top Overlay............................................................................................... 14
6 AFE3010EVM Bottom Overlay ........................................................................................... 14
7 AFE3010EVM Top Layer.................................................................................................. 14
8 AFE3010EVM Bottom Layer.............................................................................................. 14
9 AFE3010EVM Top Solder ................................................................................................ 14
10 AFE3010EVM Bottom Solder ............................................................................................ 14
11 AFE3010EVM Drill Drawing............................................................................................... 15
List of Tables
1 AFE3010EVM Kit Contents................................................................................................. 3
2 Related Documentation..................................................................................................... 3
3 Bill of Materials ............................................................................................................. 16

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AFE3010 Evaluation Module
Trademarks
All trademarks are the property of their respective owners.
1 Overview
The AFE3010 device is a precision, low-power, ground-fault circuit interrupter (GFCI) controller used to
detect leakage currents or faults current in electrical circuits. It is a single IC solution that continuously
monitors its accompanying electrical circuitry for multiple fault conditions to verify it is working properly.
1.1 EVM Kit Contents
Table 1 summarizes the contents of the AFE3010EVM kit. Contact the Texas Instruments Product
Information Center nearest you if any component is missing. TI also recommends checking the AFE3010
device product folder at www.ti.com for any further information regarding this product.
Table 1. AFE3010EVM Kit Contents
Item Item Part Number Quantity
AFE3010EVM test board AFE3010EVM 1
Shunt, 100-mil, gold-plated, black SNT-100-BK-G 11
1.2 Related Documentation From Texas Instruments
This document provides information regarding Texas Instruments' integrated circuits used in the assembly
of the AFE3010EVM.
Table 2. Related Documentation
Document Description Literature Number
AFE3010 product data sheet SBFS042

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2 Hardware
The AFE3010EVM is intended to provide basic functional evaluation of the AFE3010 device. The fixture
layout is not intended to be a model for the target circuit, nor is it laid out for electromagnetic compatibility
(EMC) testing. The AFE3010EVM consists of one PCB with test points and sockets for external hardware
connections, as well as pads to solder down optional circuitry.
It is extremely important to implement high-voltage safety precautions when using the AFE3010EVM as
the board is designed to connect to a high-power AC source. The entire board is high-voltage and thus no
part of it is safe to touch when it is connected to a live source. The AFE3010EVM was not designed to
actually break or interrupt the source voltage if a fault current is detected.
• Never interact with the board or any of its electrical nodes when it is connected to a live source.
• Always keep the board in a high-voltage safety box when connected to a live voltage.
• Always use high-voltage differential probes when probing and measuring test points on the board.
2.1 Features
The AFE3010EVM PCB provides the following features:
• Ease of access to device pins with test points and sockets pins.
• Single sockets allows the user to experiment with different passive suited for their specific application.
• A generic, two-core current transformer with 1000-turn and 200-turn coils.
• High-power headers and components rated up to 40 A and 300 V.
See the device data sheet listed in Table 2 for comprehensive information about the AFE3010 and the
available gain options.

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3 Operation
3.1 Quick Start Setup
Follow these procedures to set up and ensure proper operation of the AFE3010EVM with its onboard
current transformer, T1.
Step 1. Gather equipment for safe high-voltage test setup.
Step 2. Ensure the EVM is completely de-energized and not connected to any source voltage.
Step 3. Make sure the header pins are configured and shorted according to Figure 1. Note that
correct EVM configuration is also reflected in Figure 3
Step 4. Insert a solenoid (not included) from HOT (line side) to the anode of D2 (D2_A). Use the J3
and J4 headers to screw in solenoid terminal to ensure secure connections. Refer to Figure 2
on how to make this connection.
• If a solenoid is not available, consider using a through-hole resistor of 10 kΩ. A lower
resistance more similar to the resistance of a solenoid could be used, but the power
rating needed will substantially increase. Ensure the power rating of the resistor is
sufficient to withstand a couple cycles of the source voltage.
Step 5. Collect two shielded wires (not included) each of approximately 12 inches in length. Refer to
these as W1 and W2. The gauge of W1 and W2 should be equal or smaller than 18 AWG.
Strip the ends of both wires.
Step 6. According to Figure 2 screw W1 and W2 into J1, feed through T1, and then screw into J2. It
is important that the wires start at J1 and go through the T1 hole by entering from the bottom
of the board.
Step 7. Collect more wires as needed to connect source and load to the J1 and J2 headers
respectively. Ensure source is off or disabled when making any connections to it.
Step 8. Place the board and all exposed metal connections into a high-voltage safety box.
Step 9. Close the box.
Step 10. Enable the source and line voltage and observe that the ALARM LED (D3) will blink once to
indicate a successful first self-test. The LED will remain off during standby operation and will
only blink if the device fails a self-test. This is the LED behavior when SEL = GND.
Step 11. If the LED begins blinking and there is no fault or leakage current, then the device is failing a
self-test due to an incorrect connection. Consider the following debug steps:
1. If the LED begins blinking immediately after power up, then this could be a failure with an
internal watchdog timer. Ensure all connections with PH and SCRTST pins are secure on
the board.
2. If the LED begins blinking around 5 seconds after power up, then this indicates a self-test
failure.
3. To eliminate one variable, change float the SEL pin. When SEL = GND, the device will
perform its internal SCR self-test. When SEL pin is floating, it will be pulled up and this
mode stops the AFE3010 from performing the SCR self-test.
4. If the device begins working (LED blinks once on power up and remains off), then there
could be a problem with the SCRTST pin. Contact TI support for more assistance.
5. If the LED still blinks after 5 seconds and SEL = floating, then this means the device is
failing its self-fault test.
6. Check connections with the FT pin: Q1, JP7, D5, and R1. Check that the W1 and W2
wires are set up correctly.
7. If device is still failing, then probe the OUT pin and the FT pin. See Section 3.2 for
instructions on making measurements. Check that the output voltage (OUT) of the
amplifier reacts to the enabling of the FT pin. The self-FT signal on OUT must be falling
and thus go below the 2.5-V amplifier offset.

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Figure 1. Shunt (H9–H19) Connector Setup: Red Squares = Shunt Position, Green Circle = Open or no
shunt

+
-
120 VAC
50-60 Hz
W1
W2
Safety
Box
RSOL = {10kO-
15kO}
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Figure 2. AFE3010EVM and Hardware Setup

200:1 1000:1
HOT
NEUTRAL
Solenoid
R13
Rin
RFB
R1
Q1
SCR1
ALARM
FT
VDD1
REF
FB
GND SCR
OUT
VDD2
SCR_TST
R10
C2
R11
SW_OPEN PH
PTT
R16
R3
AFE3010
NG_OUT
SEL
D2
R14 R15
C3
R2
C4
RPH
C7
C9
C15
C12
C6
C14
C5
HOT Load
NEUTRAL Load
D3
D1
C11
C13
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Figure 3. Simplified AFE3010EVM Schematic and Hardware for Quick Setup
3.1.1 Quick Start Setup - Testing the Trip Current
Follow these procedures to test at what fault current the AFE3010EVM trips to interrupt the fault current.
Note that the EVM was not mechanically constructed to break the circuit.
Step 1. Power off the source voltage.
Step 2. Connect a resistor array along with a rheostat or potentiometer to create an adjustable
leakage current from load HOT to Earth Ground or from load HOT to line NEUTRAL.
Step 3. Connect an ammeter in series with the fault resistors to measure fault current.
Step 4. Adjust total fault resistance so that fault current will approximately equal 3 mA RMS.
Step 5. Place the EVM and all exposed metal and components into a high-voltage safety box.
Step 6. Close the box.
Step 7. Turn on the source voltage and check for the device to enter its standby mode (the ALARM
blinks once on power up when SEL is grounded).
Step 8. Check the ammeter to make sure fault current is at 3 mA RMS.
Step 9. Gradually increase fault current until the system trips and note the trip current. It should be
from 4 mA RMS to 6 mA RMS.
• The user can determine if system trips by hearing the solenoid pop or measuring a pulse
on the SCR pin. See Section 3.2 for more information on making measurements). Note
that if a fault current is detected and no subsequent disconnection of the fault from the
EVM is made, then this will be detected by the AFE3010EVM as a self-test failure in
which case the ALARM LED will begin blinking.

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3.2 Measurements (Optional)
The AFE3010EVM allows the user to test the AFE3010 with different values for certain passive
components. Follow these procedures to probe and measure the EVM signals.
1. Power off the source voltage or EVM.
2. Make sure to use high-voltage rated differential probes whenever probing the AFE3010EVM.
3. Before making probe connections to the EVM, ensure it is not connected to a live source.
4. Connect the positive lead to the signal of consideration. The most likely places to probe are:
1. OUT - The internal output voltage of the amplifier.
2. SCR - The gate driver for the onboard SCR. This is enabled high when the device detects a
ground fault current.
3. FT - The fault test pin, which is enabled high periodically for the internal self-test of the
AFE3010 device.
4. VDD - The supply voltage for the AFE3010 device.
5. Connect the negative lead of the differential probe to any GND pin on the board. Note that the
ground of the board is not Earth ground. The ground of the board is floating and a high-voltage
node just as is every node on the AFE3010EVM that is never safe to have exposed.
4 EVM Components
This section summarizes the AFE3010EVM components.
4.1 U1 - AFE3010
GFCI controller IC with self test.
4.2 T1
Dual core, insulated, GFCI current transformer.
4.3 J1 and J2
High-power headers. J1 is where the line or source voltage should connect. J2 is where the load should
connect. Shielded wires (not included) are needed to connect the HOT input of J1 (Line HOT) to HOT of
J2 (Load HOT) and NEUTRAL of J1 (Line Neutral) to NEUTRAL of J2 (Load Neutral). These wires must
feed through T1.
4.4 J3 (SOL+), J4 (SOL-)
These headers provide secure connections from Line-HOT (J3) to the input of D1 or anode of D2 (J4). A
solenoid is needed to connect from HOT to D2 anode (D2_A). If a solenoid is not available, a resistor
could be used instead.
4.5 D1
Full-bridge rectifier to supply a fully-rectified voltage signal to be conditioned for the power supply of the
AFE3010 device.
4.6 R10, R11, R14, R15, C2, C16, and C1
These components serve to filter down the rectified source voltage from D1 for the internal 20-V regulator.
C2 also provides decoupling capacitance for VDD pin of the AFE3010 device. C1 and C16 are not
populated, but allow for the user to experiment with decoupling capacitors if needed.

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4.7 D2, SCR1, SCR2
D2 is high-voltage diode rectifier that allows for forward conduction current when SCR is turned on and
current flows from HOT through a solenoid, through D2, and then through SCR1. SCR2 is a redundant
SCR that can be driven by the ALARM pin when the AFE3010 is configured to do so.
4.8 R2, C5, R5, R4, C17, R8, C8, R12, and C18
These components allow the user to experiment with conditioning circuitry for the onboard SCR devices.
R8, C8, R12, C18 are not populated.
4.9 R3, C11
R3 has a specific value for the SCRTST pin to work properly and C11 serves are simple filtering capacitor
for the SCRTST pin.
4.10 C6, C12, C13, and C14
These capacitors serve to filter any noise that could be coupled to their respective pins.
4.11 C4, C9, C7, C10, C15, Rin, and RFB
All of these components serve to condition the 1000-turn coil current signal with the internal amplifier of
the AFE3010 device. The gain (and thus trip point) is determined by the ratio of RFB and Rin. C7 helps to
stabilize the coil current based upon the inductance of the coil so that the OUT voltage is approximately
180° out of phase with the line voltage. C9, C10, and C15 help to filter any noise injected or coupled into
the amplifier.
4.12 RPH
This is a 1-MΩresistor to help limit the current into the PH pin which is responsible for determining the
phase of the LINE.
4.13 R13, C3, and D6
These components serve the operation of our N-G detection capability. The NGOUT pin drives the C3
capacitor to generate a current into the 200-turn coil. The R13 resistor helps limit current going into the
NGOUT pin during inductive kickback, which protects the NGOUT pin from breaking due to an analog
voltage violation. D6 is not populated, but can be populated if more protection is needed for the NGOUT
pin.
4.14 R9
This is a pulldown resistor to pulldown the SEL pin to 2.5 V for the redundant SCR mode.
4.15 R16, D3
D3 is the LED driven by the ALARM pin when SEL is either grounded or floating. R16 provides additional
current limiting.
4.16 R1, R1a, R1b, D5, and Q1
These components constitute the self-fault test circuitry. Q1 is turned on by the FT pin periodically to test
that they system can detect fault currents. The fault current that is tested is determined by the source
voltage divided by R1. R1a and R1b are not populated, but can be populated if user wants to test with
lower power rated resistors in parallel.
D5 prevents any current flowing in the opposite direction, which can occur under certain bias conditions of
Q1.

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4.17 JP1–JP13
These 100-mil headers allow for easy access to pins, allow for quick ways to test the device in different
modes, and also allow the user to quickly test AFE3010 response to single-point failures. For example, the
JP7 header can be opened up to test what the AFE3010 device will do if it cannot successfully run its self-
fault test.
JP13 allows the user to see the difference in the N-G detection when the current-limiting resistor, R13, is
shorted. Although it is not recommended to short R13 when the T1 current transformer is being used.
4.18 S1–S25
These are single sockets located in critical positions on the board to allow the user to quickly insert and
test the EVM with different through-hole passive components. They can also serve as test points or ways
to short out components to test single-point failures.
For example, sockets S8, S9, S10, and S11 can be used to connect a completely different current
transformer to the board; however, the user will want to remove or de-solder T1 from the board to ensure
realistic system data.
4.19 TP1–TP25
These test points allow for the user to probe various pins and nodes on the EVM with secure hook
connections.

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5 Schematic, PCB Layout, and Bill of Materials
NOTE: Board layouts are not to scale. These figures are intended to show how the board is laid out; they are not intended to be used for
manufacturing AFE3010EVM PCBs.
5.1 Schematics
Figure 4 shows the schematics for the AFE3010EVM PCB.

Hot_Line
Hot_Load
Neutral_Load
1
2
D3
Alert
4
1
3
Q1
Neutral_Line
GND
GND
GND
GND
TP13
GND
TP14
GND
GND GND
TP2
NEUTRAL
TP1
HOT
TP6
1000T+
TP4
1000T-
TP3
200T-
18.0k
R10
18.0k
R11
TP8
VDD
GND
GND
GND
TP10
ALARM GND
TP16
D2_A
GND
TP18
PH
TP19
SCR
TP20
SCR_G
GND
50V
100pF
C11
GND
10pF
C10
TP12
NEUTRAL Load
TP21
HOT Load
~
3
+1
~4
-
2
D1
1 2
JP3
3
1
2,4
SCR1
1
2
3
JP5
GND
GND
1
2
JP4
TP22
NGOUT
1 2 3
JP2
1.0M
RPH
TP23
FT
3
2
1
JP1
1.50k
R5
35V
2.2uF
C16
100nF
50V
C1
GND
1000pF
C9
1000pF
C4
1000pF
C6
1000pF
C12
1000pF
C13
1000pF
C14
100nF
50V
C3
R3
51k
1
S1
Rin+
1
S2
FB
1
S3
FB
1
S4
OUT
1
2
J1
1
2
J3
SOL+
1
2
J4
SOL-
470nF
16V
C5
470nF
16V
C7
50V
180pF
C15
1
2
J2
1
2
JP7
M20-8770246
1 2
JP6
SCRTST
499k
R9
0
R8
1
2
3
JP8
1
S5
SCRTST
1
S6
SCR1A
1
S7
Q1_d
1
S10
200T-
1
S11
GND
1
S8
Rin+
1
S9
REF
1
S12
GND
1
2
JP10
1
2
3
4
5
6
T1
2010786CI
18.0k
R15
18.0k
R14
1
S13
NEUTRAL
1
S14
GND
1
S15
D1+
1
S16
D1_in
1 2
JP11
SCR
1
S17
ALARM
2.2nF
250V
C8
3
1
2,4
SCR2
1 2 3
JP12
GND
470nF
16V
C17
2.2nF
250V
C18
1
S18
SCR2A
560
R2
560
R4
1.1k
R16
0
R12
TP24
SCR_A
D5
10.5k
R1
20k
R1a
20k
R1b
1.50k
R17
GND
TP5
200T+
1
S19
GND
TP25
OUT
1
2
JP9
TP7
GND
GND
100
R13
1
S20
R13
1
S21
VDD
1
S22
GND
GND
1
S23
HOT Load
1
S24
D5A
ALARM
7
PH 10
SEL 11
FB 14
FT
8
SCR_TST
9
PTT 12
OUT 13
SCR
6
NG_OUT
5
GND 4
VDD2
3
VDD1
2
SW_OPEN
1
GND 16
REF 15
PAD 17
AFE3010AIRGT
U1
GND
D2
1
2
JP13
D6
B0530W-7-F
GND
50V
3.3uF
C2
1
S25
Open
75.0
Rin
36.0k
RFB
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Figure 4. AFE3010EVM Schematic

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5.2 PCB Layout
Figure 5 through Figure 11 illustrate the PCB layout for the AFE3010EVM.
Figure 5. AFE3010EVM Top Overlay Figure 6. AFE3010EVM Bottom Overlay
Figure 7. AFE3010EVM Top Layer Figure 8. AFE3010EVM Bottom Layer

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Figure 9. AFE3010EVM Top Solder Figure 10. AFE3010EVM Bottom Solder
Figure 11. AFE3010EVM Drill Drawing

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5.3 Bill of Materials
Table 3 provides the parts list for the AFE3010EVM.
Table 3. Bill of Materials
Designator QTY Value Description Package Reference Part Number Manufacturer
C2 1 3.3uF CAP, CERM, 3.3 uF, 50 V, ±10%, X7R, 1206_190 1206_190 C3216X7R1H335K160AC TDK
C3 1 0.1uF CAP, CERM, 0.1 uF, 50 V, ±10%, X7R, 0603 0603 06035C104KAT2A AVX
C4, C6, C9, C12, C13, C14 6 1000pF CAP, CERM, 1000 pF, 25 V, ±10%, C0G/NP0, 0603 0603 C0603C102K3GACTU Kemet
C5, C7, C17 3 0.47uF CAP, CERM, 0.47 uF, 16 V, ±10%, X7R, AEC-Q200 Grade 1,
0603 0603 GCM188R71C474KA55D MuRata
C11 1 100pF CAP, CERM, 100 pF, 50 V, ±5%, C0G/NP0, 0603 0603 C1608C0G1H101J080AE TDK
C15 1 180pF CAP, CERM, 180 pF, 50 V, ±5%, C0G/NP0, 0603 0603 06035A181JAT2A AVX
D1 1 600V Diode, Switching-Bridge, 600 V, 1 A, MICRODIP_4 MICRODIP_4 MDB6S Fairchild Semiconductor
D2 1 1000V Diode, Standard Recovery Rectifier, 1000 V, 1 A, SOD-123FL SOD-123FL SM4007PL-TP Micro Commercial
Components
D3 1 Red LED, Red, SMD 1.2x2mm LH R974-LP-1 OSRAM
D5 1 600V Diode, Ultrafast, 600 V, 1.5 A, SMA SMA BYG20J-E3/TR Vishay-Semiconductor
H1, H2, H3, H4 4 Machine Screw, Round, #4-40 x 1/4, Nylon, Philips panhead Screw NY PMS 440 0025 PH B&F Fastener Supply
H5, H6, H7, H8 4 Standoff, Hex, 0.5"L #4-40 Nylon Standoff 1902C Keystone
H9, H10, H11, H12, H13, H14,
H15, H16, H17, H18, H19 11 1x2 Shunt, 100mil, Gold plated, Black Shunt SNT-100-BK-G Samtec
J1, J2 2 HDR2 691256610002 Wurth
J3, J4 2 HDR2 OSTTA024163 On Shore Technology
JP1, JP2, JP8 3 Header, 2.54mm, 3x1, Gold, SMT Header, 2.54mm, 3x1, SMT M20-8770342 Harwin
JP3, JP4, JP9 3 Header, 100mil, 2x1, Gold, TH Sullins 100mil, 1x2, 230 mil
above insulator PBC02SAAN Sullins Connector Solutions
JP5, JP12 2 Header, 100mil, 3x1, Gold, TH PBC03SAAN PBC03SAAN Sullins Connector Solutions
JP6, JP7, JP10, JP11, JP13 5 Header, 2.54mm, 2x1, Tin, SMT Header, 2.54mm, 2x1, SMT M20-8770246 Harwin
Q1 1 400 V Transistor, NPN, 400 V, 8 A, DDPAK DDPAK STB13007DT4 STMicroelectronics
R1 1 10.5k RES, 10.5 k, 1%, 0.75 W, AEC-Q200 Grade 0, 2010 2010 CRCW201010K5FKEF Vishay-Dale
R2, R4 2 560 RES, 560, 5%, 0.1 W, 0603 0603 RC0603JR-07560RL Yageo
R3 1 51 kOhms ±5% 0.667W, 2/3W Chip Resistor 1206 (3216 Metric)
Automotive AEC-Q200, Pulse Withstanding Thick Film 1206 ERJ-P08J513V Panasonic Electronic Components
R9 1 499k RES, 499 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW0603499KFKEA Vishay-Dale
R10, R11, R14, R15 4 18.0k RES, 18.0 k, 1%, 0.5 W, 1206 1206 RC1206FR-0718KL Yageo America
R13 1 100 RES, 100, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW0603100RFKEA Vishay-Dale
R16 1 1.1k RES, 1.1 k, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW06031K10JNEA Vishay-Dale
RFB 1 36.0k RES, 36.0 k, 1%, 0.1 W, 0603 0603 RC0603FR-0736KL Yageo
Rin 1 75.0 RES, 75.0, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW060375R0FKEA Vishay-Dale
RPH 1 1.0Meg RES, 1.0 M, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW06031M00JNEA Vishay-Dale

www.ti.com Schematic, PCB Layout, and Bill of Materials
17
SLYU038–June 2020
Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated
AFE3010 Evaluation Module
Table 3. Bill of Materials (continued)
Designator QTY Value Description Package Reference Part Number Manufacturer
S1, S2, S3, S4, S5, S6, S7, S8,
S9, S10, S11, S12, S13, S14,
S15, S16, S17, S18, S19, S20,
S21, S22, S23, S24, S25
25 CONN PIN RCPT .018-.021 SOLDER PIN_RCPT 3-331272-8 TE Connectivity
SCR1, SCR2 2 SCR 400V 800mA Sensitive Gate, SOT-223 SOT-223 S4X8TS1 Littelfuse
T1 1 Transformer PTH_20MM65_16MM0 2010786CI GFCI
TP1, TP2, TP3, TP4, TP5, TP6,
TP7, TP8, TP10, TP12, TP13,
TP14, TP16, TP18, TP19, TP20,
TP21, TP22, TP23, TP24, TP25
21 Test Point, Compact, SMT Testpoint_Keystone_Compact 5016 Keystone
U1 1 Ground Fault Circuit Interrupter (GFCI) with Self Test, RGT0016C
(VQFN-16) RGT0016C AFE3010AIRGT Texas Instruments
C1 0 0.1uF CAP, CERM, 0.1 uF, 50 V, ±10%, X7R, 0603 0603 06035C104KAT2A AVX
C8, C18 0 2200pF CAP, CERM, 2200 pF, 250 V, ±10%, X7R, 0805 0805 GRM21AR72E222KW01D MuRata
C10 0 10pF CAP, CERM, 10 pF, 50 V, ±5%, C0G/NP0, AEC-Q200 Grade 1,
0603 0603 CGA3E2C0G1H100D080 AA TDK
C16 0 2.2uF CAP, TA, 2.2 uF, 35 V, ±10%, 3.8 ohm, SMD 3528-21 293D225X9035B2TE3 Vishay-Sprague
D6 0 30V Diode, Schottky, 30 V, 0.5 A, SOD-123 SOD-123 B0530W-7-F Diodes Inc.
FID1, FID2, FID3 0 Fiducial mark. There is nothing to buy or mount. N/A N/A N/A
R1a, R1b 0 20k RES, 20 k, 5%, 0.25 W, AEC-Q200 Grade 0, 1206 1206 CRCW120620K0JNEA Vishay-Dale
R5, R17 0 1.50k RES, 1.50 k, 1%, 0.1 W, 0603 0603 RC0603FR-071K5L Yageo
R8, R12 0 0 RES, 0, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 ERJ-3GEY0R00V Panasonic

STANDARD TERMS FOR EVALUATION MODULES
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electrical ratings of interface circuits such as input, output and
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NOTE:
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KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.

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2
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
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3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.

www.ti.com
3
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.