Texas Instruments XWRL1432BOOST User manual

EVM User's Guide: XWRL1432BOOST
Low Power 77 GHz mm-Wave Sensor
Description
The xWRL1432BOOST from Texas Instruments is
an easy-to-use evaluation board for the xWRL1432
mmWave sensing device, with standalone operation
and direct connectivity to the DCA1000EVM for raw
ADC capture and signal processing development.
This EVM contains everything required to start
developing software for on-chip Hardware accelerator
and low power ARM® Cortex® - M4F controllers.
Get Started
1. Visit xWRL1432BOOST EVM product page.
Automotive - AWRL1432BOOST.
Industrial - IWRL1432BOOST.
2. Configure the SOP Switches (S1 and S4), for
functional mode(SOP4).
3. Visit TI Developer Zone for essential software like
SDK and Radar Toolbox.
Automotive - AWRL1432BOOST.
Industrial - IWRL1432BOOST.
4. Navigate to the Radar Toolbox.
5. The user’s guide is located here:
Radar Toolbox\Example Projects\Out of Box
Demo\xWRL1432 Out of Box Demo\.
6. Further explore the Radar Toolbox for more
information, applications, and resources.
Features
• High RF Performance RO4835LoPro PCB
substrate
• Wide field of view antenna, targeted for wall mount
applications
• XDS110 JTAG interface with USB connectivity for
code development and debugging
• Power optimized discrete DCDC power
management
• Serial port for onboard QSPI flash programming
• 60-pin, high-density (HD) connectors for raw
analog-to-digital converter (ADC) data
• Onboard CAN-FD transceiver
• Onboard LIN PHY transceiver for automotive
variant.
• USB powered standalone mode of operation
• EVM is designed as booster pack to connect with
other LaunchPad EVMs
• On board 16Mbit QSPI flash
XWRL1432BOOST EVM
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1 Evaluation Module Overview
1.1 Introduction
The xWRL1432 mmWave Sensor device is an integrated single chip mmWave sensor based on FMCW
radar technology. The device is capable of operation in the 76-GHz to 81-GHz band. The xWRL1432 is
designed for low power, self-monitored, ultra-accurate radar systems in the Automotive and Industrial space
of applications. The xWRL1432BOOST EVM enables access to point-cloud data and power over USB interface.
The xWRL1432BOOST supports direct connectivity to the DCA1000EVM development kit. This kit is supported
by mmWave tools, demos and software including mmWave software development kit (MMWAVE-L-SDK) and
TI's Code Composer Studio. Additional boards can be used to enable additional functionality. For example,
DCA1000EVM enables access to the raw ADC data capture of a sensor. On board XDS110 enables software
development through TI’s CCS. xWRL1432BOOST can interface with the MCU LaunchPad™ development kit
ecosystem.
1.2 Kit Contents
xWRL1432BOOST includes the following:
• xWRL1432BOOST Evaluation board
• Micro USB cable
• Quick Start Guide
1.3 Specification
40 m

INA228
TEMP SENS
TMP112A
40 m

INA228
QSPI flash
40 m

INA228 EEPROM
CAT24C08
XWRL6432
XWRL1432
Optional power jack
SOP0, SOP1
SPI
RESET
MISC
RX
TX
VOUT_PLL
VBGAP
XTAL
40 MHz
5V_IN
Max 5.5 V
I2C
USB TO UART
XDS110
On board
JTAG
RS232TX/RX
SOP
Switch
DCA1000
60 PIN CONNECTOR
Reset
button
CMOS to LVDS
converter
2X SN65LVDS31M (4
channel)
CAN FD interface
TCAN1042HGVDQ1
USB to
SPI/I2C
Header
FR4/Rogers
VPP
VOUT_14Synth
LVDS
VOUT_PA
3.3 V
1.8 V
1.2V
DCDC converter
TPS6285021HQD
RLRQ1
DCDC converter
TPS6285020MQ
DRLRQ1
DCDC converter
TPS628502QDRL
RQ1
LP/BP connector
6 ch CMOS I/Os
I2C
LIN PHY interface
TLIN1039DDFRQ1
Load switch
TPS2116DRLR
UART
PMIC_CLK_OUT, TDO
NRST
VDDA_10RF
INA228
RF supply
Digital supply
20 m

SPI
SPI
Header
Header
Figure 1-1. Functional Block Diagram
Figure 1-1 shows the functional block diagram. The EVM contains the essential components for the TI mm-
Wave radar system: DCDC, SFLASH, SOP configuration, Filter, TI mmWave Radar chip, a USB to UART
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converter, and a 60-pin Samtec connector for interfacing with the DCA1000. The board also hosts a booster
pack connector which can be connected to TI’s LaunchPad boards.
1.4 Device Information
The documents in Table 1-1 provide information regarding Texas Instruments integrated circuits used in the
assembly of the xWRL1432BOOST EVM. This user's guide is available from the TI web site under literature
number SWRU613. Any letter appended to the literature number corresponds to the document revision that is
current at the time of the writing of this document.
Table 1-1. Related Device Documentation
Devices Used on the EVM Data Sheet
TMP112-Q1 TMP112AQDRLRQ1
TS3A5018 TS3A5018RSVR
TCAN1042HGV-Q1 TCAN1042HGVDQ1
INA228A INA228AIDGST
TPD4E004D TPD4E004DRYR
SN65LVDS31MD SN65LVDS31MDREP
TS3A44159 TS3A44159PWR
TPS79601D TPS79601DRBR
TS3A27518E TS3A27518EPWR
TPS2116D TPS2116DRLR
SN74LVC1G11D SN74LVC1G11DSFR
TPS628502-Q1 TPS6285021HQDRLRQ1
TPS6285020-Q1 TPS6285020MQDRLRQ1
LM4040C25Q LM4040C25QDBZR
TLIN1039-Q1 TLIN1039DDFRQ1
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2 Hardware
CAUTION
Hot surface.
Contact can cause burns
Do not touch.
The XWRL1432BOOST includes three receivers and two transmitters with a wide field of view hosted on a High
RF Performance RO4835LoPRO PCB substrate.
Figure 2-1. XWRL1432BOOST (Top View)
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Figure 2-2. XWRL1432BOOST (Bottom View)
Figure 2-3. Salient Features of EVM (Top Side)
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Figure 2-4. Salient Features of EVM (Bottom Side)
2.1 XWRL1432BOOST Antenna
The XWRL1432BOOST includes three receivers and two transmitters FR4 based antennas on the PCB. Figure
2-5 shows the antenna configuration.
Figure 2-5. TX and Rx Antennas of the EVM
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Note
The XWRL1432BOOST has an antenna gain of approximately 5-6 dBi across different antenna pairs.
2.1.1 PCB Material
Material used for this PCB is Rogers RO4835LoPro of 4mil thickness with rolled copper for the Antenna and
transmission lines and 370HR is used for the rest of the layers.
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2.1.1.1 Transmitter and Receiver Virtual Array
Transmitter and receiver antennas positions in Figure 2-6 form a virtual array of six transmitter and receiver
pairs. This allows object detections finer azimuthal angular resolution (29°) and coarse elevation angular
resolution (58°). Receiver antennas are spaced at distance D (Lambda/2) and Transmitter antenna Tx1 and
Tx2 spaced at 2D (lambda) in azimuthal plane and D (Lambda/2) in elevation plane. Tx1 and Tx2 are placed at
D (lambda/2) in the elevation and 2D (Lambda) in azimuth plane.
Figure 2-6. Virtual Antenna Array
Figure 2-6 shows the antenna radiation pattern with regard to azimuth and Figure 2-7 shows the antenna
radiation pattern with regard to elevation for TX1 and TX2. Both figures show the radiation pattern for TX1
and TX2 and RX1, RX2 and RX3 together. All of the measurements were done with a Tx and Rx combination
together. Thus, for the -6dB beam width, the user must see a -12db (Tx (-6dB) + Rx(-6dB)) number from the
boresight.
Note
Wavelength (Lambda) is computed based on a frequency of 78.5 GHz. Antenna placements are
according to this frequency.
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Figure 2-7. xWRL1432BOOST EVM Azimuth Antenna Radiation Patterns
Measured azimuthal radiation pattern for all Tx to Rx pairs (Corner reflector placed at approximately 5 meters
with a 4- GHz bandwidth chirp starting at 76 GHz)
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Figure 2-8. xWRL1432BOOST EVM Elevation Antenna Radiation Patterns
Measured elevation radiation pattern for all TX to RX pairs (Corner reflector placed at approximately 5 meters
with a 4-GHz bandwidth chirp starting at 76 GHz)
Note
In accordance to the EN 62311 RF exposure test, a minimum separation distance of 20 centimeters
must be maintained between the user and the EVM during operation.
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2.2 EVM Mux Block Diagram
Figure 2-9 shows different muxing options for the digital signals. The device is pin limited to support different
features simultaneously; hence various internal IPs and signals are pin multiplexed. EVM provides de-muxing
options using various analog mux and sliding switch options. Figure 2-9 shows different muxing switch positions
to enable different muxing options to connect to different peripherals.
xWRLx432 RADAR IC
MUX U4
JTAG
XDS110
DCA1000 60-PIN HEADER
LP BP CONNECTOR
DCA_JTAG
XDS_JTAG
XDS_UARTA
CMOS_ADC_RAW
LVDS
DRIVER
DIFFERENTIAL
CAN PHY
LIN
PHY
LVDS signals
LIN_TX
LIN_RX
USER
DCA_LP_HOST_INTR
LED
USER
SWITCH
GPIO_0
DCA_LP_RS232
XDS_RS232
DC – DC
REG
MODE_SELECT
DCA_LP_SPI signals
I2C signals
A
I2C signals
A
TEMP
SENSOR
CURRENT
SENSOR
EEPROM
I2C signals
HOST_CLK_TP
RTC_CLKIN_TP
B
B
I2C
SPI
RS232
RS232
RS232
UARTA, CAN
LDVS, RTC_CLKIN_TP,
HOST_CLK_TP, LINRX
SPI, I2C, GPIO, HOST_INTR,
REG_MODE_SELECT
Test Points
nERROR
UARTA, CAN, nERROR_LED,
WATCH_DOG_TP
LED
WD_TP
HOST_INTR
S4.1 - OFF
S4.1 - ON
S1.4 - OFF
S1.4 - ON
S1.5 - ON
S1.5 - OFF
S1.3 - OFF
S1.3 - ON
S1.3 - OFF
MUX U15
MUX U12
MUX U24
S1.6 - OFF
S1.6 - OFF
S1.6 - OFF
S1.6 - ON
S1.6 - ON
Figure 2-9. Muxing Options for the EVM
2.3 Switch Settings
Figure 2-10 shows the part designators and positions of the switches (S1 and S4) on the XWRL1432BOOST.
Figure 2-10. S1 Switch for Various Mode Settings
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Figure 2-11. S4 Switch for Various Mode Settings
Figure 2-12 provides the different boot mode configurations to the device. Device supports application mode,
QSPI flashing mode (Device management mode), and debug modes. This mode (SOP) configuration shown
below in Figure 2-12 must be exercised first. After the SOP settings nRESET need to be issued to register the
SOP settings. Figure 2-12 also provides the switch position for different modes of operation supported by the
device and EVM.
Figure 2-12. SOP Switches
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2.4 LEDs
Table 2-1 contains the list of LEDs on the XWRL1432BOOST.
Table 2-1. List of LEDs
LED reference designators Description
D6 5 V Power indication
D5 Reset LED.
D9 NERROR LED
Note: There is switch settings are needed to enable this.
D7 User LED: Customer programmable.
Note: There is switch settings are needed to enable this.
D3 Power good indication
2.5 Connectors
Higher current support: When using the EVM with the external power adapter, the 5-V supply is provided by the
external power adapter. For most use cases, this external power supply option is not used and power is derived
from the USB interface.
Note
After the 5-V power supply is provided to the EVM, TI recommends pressing the NRST switch one
time to verify for a reliable boot-up state.
Note
All digital IO pins of the device (except NRESET) are not fail safe. Therefore, care needs to be taken
that the digital IO pins are not driven externally without the VIO supply being present to the device.
2.6 USB Connector
The USB connector provides a 5-V supply input to power the device; additionally the PC interface is brought out
on this connector:
• UART for flashing the onboard serial flash, downloading FW through Radar Studio, and getting application
data sent through the UART
Figure 2-13. USB Connector (J5)
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2.7 DCA1000 HD Connector
The 60-pin HD connector shown in Figure 2-14 provides the high-speed data and controls signals (SPI, UART,
I2C, NRST, NERROR, and SOPs) to the DCA1000.
Figure 2-14. DCA1000 HD Connector
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2.8 Booster Pack Connector for the LaunchPad Connectivity
J8/J9 are the booster pack connectors provided for the connectivity option with the other TI LaunchPad
ecosystem.
Figure 2-15. Booster Pack Connector
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2.9 CANFD Connector
The CAN connector provides access to the CAN_FD interfaces (CAN_L and CAN_H signals) from the onboard
CAND-FD transceivers. These signals can be directly wired to the CAN bus.
Figure 2-16. CANFD Connector
The J3 connector shown in Figure 2-16 provides the CAN_L and CAN_H signals from the onboard CAND-FD
transceivers (TCAN1042HGVDRQ1). These signals are wired to the CAN bus after muxing with the SPI signals;
one of the two paths must be selected. CAN signals are selected to PHY by changing the switch S1.5 to off
position.
Figure 2-17. Analog Mux for the CAN PHY Switch
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Figure 2-18. CAN FD PHY Used in the EVM
2.10 LIN PHY Connection
Figure 2-19 shows the LIN PHY (TLIN1039DDFRQ1) interface to the device. There are no switches for the LIN
PHY interface. LIN PHY can operate with different supply voltage than the mmWave sensor, hence external
VBAT option is provided for the LIN VDD supply, by default 5V_IN supply is provided. To enable external VBAT
supply, R32 resistor need to be mounted and R31 resistor need to be removed.
Figure 2-19. LIN header and PHY Interface
Figure 2-20. LIN PHY Interface
2.11 I2C Connections
The board features an EEPROM, current sensors, and temperature sensor for measuring on-board temperature.
These are connected to the I2C bus and can be isolated using the zero Ω provided on the hardware. External
I2C headers also provided for easy interface to I2C bus.
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2.11.1 EEPROM
The board features an EEPROM for storing the board specific IDs (for the identification of the EVM through the
XDS110 interface). Please refer to device schematics for the I2C addresses.
2.12 XDS110 Interface
J5 provides access to the onboard XDS110 (TM4C1294NCPDT) emulator. This connection provides the
following interfaces to the PC:
• JTAG for CCS connectivity
• Application/user UART (Configuration and data communication to PC)
When used in standalone mode of operation as shown in Figure 2-21, the power is supplied through a single
USB connector; the same USB connector J5 is also used for configuration and data transfer through the XDS110
USB to UART converter. When enumerated correctly, the 2 UART ports from the XDS110 are displayed on the
device manager as a virtual COM Port, similar to that shown in Figure 2-21.
Figure 2-21. Virtual COM Port
If the PC is unable to recognize the above COM ports, install the latest EMUpack.
Figure 2-22. EVM in Functional Mode Using Standalone Operation
EVM uses single UART port for both device configuration and processed data communication to PC.
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2.13 Flashing the Board
1. Verify that the drivers have been successfully installed and COM ports enumerated.
2. Configure the SOP to flashing mode.
3. Press the reset switch to verify that the board boots up in the right mode.
4. Run the visualizer and use the flashing tab and follow the instruction or use Uniflash tool.
5. Enter the application port number for the flashing interface.
6. Load image to serial flash. Please refer mmWave SDK for the flash binary for running out of box demos.
2.14 DCA1000EVM Mode
The setup for raw data capture using DCA1000EVM is shown in Figure 2-23.
Figure 2-23. DCA1000EVM Mode (Top View)
Figure 2-24. DCA1000EVM Mode (Side View)
Please refer to Figure 2-12 shown in the beginning of this document for the switch settings for the DCA1000 raw
ADC capture card.
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2.14.1 RDIF Interface for Raw ADC Capture
XWRL1432 doesn’t have LVDS I/Os, mainly to reduce the overall power consumption of the SOC. However,
DCA1000 board needs LVDS signals on the clock and data interface for raw ADC capture so CMOS to LVDS
converters are used on the board as shown below. Data capture interface uses RDIF (Radar Data interface) for
transferring the data between mmWave device and DCA1000 capture card. There is no change needed in the
DCA1000 capture card for this purpose, however a new low power mmWave studio need to be used for this
purpose. Low power mmWave studio interpret the RDIF interface and provides the raw ADC data visualization
platform for further signal processing.
Figure 2-25. DCA1000 CMOS TO LVDS Conversation for Data Lines
Figure 2-26. DCA1000 CMOS TO LVDS Conversation for Clock and Control Lines
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