Texas Instruments BOOSTXL-TMP107 User manual

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BOOSTXL-TMP107 User's Guide
User's Guide
SBOU174–June 2017
BOOSTXL-TMP107 User's Guide
The BOOSTXL-TMP107 BoosterPack™ (see Figure 1) is an easy-to-use plug-in module that adds high-
accuracy temperature sensors to your LaunchPad™ development kit. Two of the three temperature
sensors can be disconnected from the main board, and strung together in a chain using 3-conductor
wiring.
Figure 1. BOOSTXL-TMP107

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BOOSTXL-TMP107 User's Guide
Contents
1 Getting Started............................................................................................................... 3
1.1 Key Features ........................................................................................................ 3
1.2 What Is Included.................................................................................................... 3
2 Hardware...................................................................................................................... 3
2.1 Hardware Features ................................................................................................. 4
2.2 Power................................................................................................................. 6
2.3 Design Files ......................................................................................................... 6
2.4 Hardware Change Log............................................................................................. 6
3 Software Examples.......................................................................................................... 7
3.1 LibraryTestBench ................................................................................................... 7
3.2 OutOfBox_MSP-EXP430FR6989................................................................................. 8
3.3 OutOfBox_MSP-EXP430F5529LP.............................................................................. 10
4 Additional Resources ...................................................................................................... 11
4.1 TI LaunchPad™ Portal ........................................................................................... 11
4.2 Download CCS, IAR, or Energia ................................................................................ 11
4.3 MSP430Ware™ and TI Resource Explorer.................................................................... 11
4.4 TI E2E™ Community ............................................................................................. 11
5 Schematics.................................................................................................................. 12
List of Figures
1 BOOSTXL-TMP107 ......................................................................................................... 1
2 BOOSTXL-TMP107 Overview ............................................................................................. 3
3 BoosterPack™ Pinout....................................................................................................... 4
4 J3 Header..................................................................................................................... 5
5 Breakable PCB............................................................................................................... 5
6 Console Output From Compiled LibraryTestBench Demonstration................................................... 8
7 BOOSTXL-TMP107 and FR6989.......................................................................................... 9
8 Example Output from MSP Application UART ........................................................................ 10
9 Schematics.................................................................................................................. 12
List of Tables
1 Hardware Change Log...................................................................................................... 6
2 Software Examples.......................................................................................................... 7
3 IDE Minimum Requirements for MSP-EXP430F5529LP............................................................... 7
4 Source File and Folders .................................................................................................... 7
5 Source File and Folders .................................................................................................... 8
6 Source File and Folders................................................................................................... 10
Trademarks
BoosterPack, LaunchPad, MSP430Ware, E2E, Code Composer Studio are trademarks of Texas
Instruments.
All other trademarks are the property of their respective owners.

BOOSTXL-TMP107
TMP107
TMP107
Pin Header
SN74LVC1G07
Open-Drain Driver
Used in DRV mode
Select Comm Modes Temperature Sensor
First in Chain
Temperature Sensor
2nd and 3rd in Chain
x Driver
x Resistor
x Short
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BOOSTXL-TMP107 User's Guide
1 Getting Started
1.1 Key Features
• TI TMP107 temperature sensors (quantity 3)
– One temperature sensor on the main section of the PCB
– Two temperature sensors on perforated sections of the PCB
• Choice of three driver circuits for software evaluation
• Utilizes universal asynchronous receiver/transmitter (UART) of the host microcontroller
• TI SN74LVC1G07 open drain driver
• 40-pin BoosterPack standard for use with any LaunchPad kit
1.2 What Is Included
1.2.1 Kit Contents
• 1× BOOSTXL-TMP107
1.2.2 Software Examples
• TMP107 Library Test Bench
• OutOfBox_MSP-EXP430FR6989
• OutOfBox_MSP-EXP430F5529LP
2 Hardware
Figure 2 is an overview of the BOOSTXL-TMP107 hardware.
Figure 2. BOOSTXL-TMP107 Overview

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1
2
3
4
3v3
RXD
TXD
5
6
7
8
9
10
20
GND
19
18
17
16
15
14
13
12
11
40
39
39
37
36
35
34
33
ALERT 1
ALERT 2
32
31
21
22
5V*
GND*
23
24
25
26
27
28
29
30
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2.1 Hardware Features
2.1.1 BoosterPack™ Pinout
Figure 3 shows the pinout of the BoosterPack Module.
Figure 3. BoosterPack™ Pinout
The TMP107 BoosterPack adheres to the 40-pin LaunchPad and BoosterPack standard (see Figure 3). A
standard was created to aid compatibility between LaunchPad and BoosterPack tools across the TI
ecosystem.
The 40-pin standard is compatible with the 20-pin standard that is used by other LaunchPads like the
MSP-EXP430G2. This allows for the 20-pin LaunchPads to be used with 40-pin BoosterPAcks with some
limited functionality.
More information about compatibility is found at http://www.ti.com/launchpad.
2.1.2 TMP107 Temperature Sensor (U2–U4)
BOOSTXL-TMP107 features three TMP107 temperature sensors. The sensors are connected to one
another sequentially using a unique one-wire bus. Device U2 is the first in the communication chain, and
resides on the main section of the PCB. Device U3 and U4 follow U2, and reside on the breakable
sections of the PCB. Each device independently measures and reports temperature on the bus, which can
support up to 32 TMP107 devices.
2.1.3 Communication Modes Pin Header (J3)
The TMP107 one-wire communication interface is compatible with UART. However, it is necessary to
combine the transmit (TX) and receive (RX) lines of UART in order to create the bidirectional bus which
TMP107 uses. BOOSTXL-TMP107 offers three methods of creating this bidirectional bus.
1. The first method makes use of the open-drain driver SN74LVC1G07 U1 and the pullup resistor R1.
This is the method presented in the TMP107 data sheet, and it provides the most robust
communication regardless of UART host. To use this mode, connect the shunt across pins 1 and 2.
2. The second method uses 10-kΩseries resistor R2 to simultaneously act as a pullup (since the TX pin
idles high) and a current limiter. This method has lower cost and complexity than the first method. This
method works with all UART hosts, and works well with MSP430 in the BOOSTXL-TMP107 examples.
To use this mode, connect the shunt across pins 3 and 4.
3. The third method directly connects the TX line, and requires special programming of the UART Master
to avoid bus collision from the two drivers. This method uses no additional components, but only works
with microcontrollers which have been specially programmed. To use this mode, connect the shunt
across pins 5 and 6, and uncomment line 71 in hal.h which reads “#define TMP107_OneWireUART.”

BoosterPack
&
TMP107 #1
TMP107 #2 TMP107 #3
BoosterPack
&
TMP107 #1
TMP107 #2 TMP107 #3
Discard
Original Operation Remote Operation
0.1µF
C1
GND
C2
UCA0RXD
UCA0TXD
3.3k
R1
1 2
3 4
5 6
J3
10k
R2
V+
1
I/O1
3
I/O2
7
U2
TMP107BIDR
NC
1
2
3
4
5
U1
SN74LVC1G07DBVR
GND
+3.3V
+3.3V
TX Options:
Open-Drain Driver
Pull-Up Resistor/Current Limiter
Direct Connect
IO1_2
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Figure 4. J3 Header
2.1.4 Breakable PCB
The BOOSTXL-TMP107 PCB features perforations that allow sections to be separated. The second and
third TMP107 devices (U3 and U4) may be removed for remote temperature sensing. These modules only
require three-conductor cabling between them and the main BoosterPack module. The TMP107 features a
push-pull output capable of sourcing or sinking up to 1 mA. This push-pull output allows it to drive more
than 6 feet of ribbon cable between sensor nodes.
Figure 5. Breakable PCB

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2.2 Power
The board was designed to be powered by the attached LaunchPad, and requires only the 3.3-V power
rail.
2.3 Design Files
2.3.1 Hardware
Schematics are found in Section 5. All design files including schematics, layout, bill of materials (BOM,)
Gerber files, and documentation are available on the BOOSTXL-TMP107 download page.
2.3.2 Software
All design files including TI-TXT object-code firmware images, software example projects, and
documentation are available in the LaunchPad-specific software folders. To see which LaunchPads
feature BOOSTXL-TMP107 examples, check the BOOSTXL-TMP107 download page.
2.4 Hardware Change Log
Table 1 lists the hardware change log.
Table 1. Hardware Change Log
PCB Revision Description
Rev A Initial Release

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3 Software Examples
Table 2 lists the software examples.
Table 2. Software Examples
Demonstration Name LaunchPad™ Required Description More Details
LibraryTestBench N/A Evaluate TMP107 library on your development PC. Section 3.1
OutOfBox_MSP-EXP430FR6989 MSP-EXP430FR6989 Demonstrates reading TMP107 temperatures and
displaying them on LCD. Section 3.2
OutOfBox_MSP-EXP430F5529LP MSP-EXP430F5529LP Demonstrates reading TMP107 temperatures and printing
them to UART. Section 3.3
Table 3 displays the IDE minimum requirements for MSP-EXP430F5529LP.
Table 3. IDE Minimum Requirements for MSP-EXP430F5529LP
Code Composer Studio IDE IAR Embedded Workbench IDE
v6.1 or later 7.10 or later
3.1 LibraryTestBench
This section describes the functionality and structure of the LibraryTestBench demonstration included in
TMP107-Firmware-Library.
3.1.1 Source File Structure
Table 4 lists the source files and folders.
Table 4. Source File and Folders
Name Description
how-to-compile.txt A hint as to how the test bench can be used
tb_tmp107.c Test bench which demonstrates select library features
tmp107.c TMP107 library
tmp107.h TMP107 library header
3.1.2 Operation
This demonstration is intended to be compiled and run on your development PC. The tb_tmp107.c file
contains the main() program loop which contains calls to the TMP107 Library (tmp107.c.) Library functions
which would normally access the hardware, instead print to console the packets that are sent to the
hardware. This demonstration can be used to:
• Evaluate or test features of the TMP107 Library
• Generate command data to be sent by the bus master to the TMP107
• Convert temperature data to Celsius
• Encode and decode bus addresses

GlobalAddressInit:
0x55 Calibration Byte
0x95 Command Byte
0x0D Byte 1
DecodeTemperatureResult(0x1AB0): 26.687500
TMP107_Encode5bitAddress(0x01): 0x08
TMP107_Encode5bitAddress(0x03): 0x18
TMP107_Encode5bitAddress(0x1F): 0xF8
TMP107_Encode5bitAddress(0x08): 0x01
TMP107_Encode5bitAddress(0x0D): 0x01
TMP107_Encode5bitAddress(0x0B): 0x01
TMP107_Encode5bitAddress(0xF8): 0x1F
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Command data generated by the library is able to be hard-coded into your application. This demonstration
can also be used to check your understanding of the TMP107. The output of the demonstration is shown
in Figure 6.
Figure 6. Console Output From Compiled LibraryTestBench Demonstration
3.2 OutOfBox_MSP-EXP430FR6989
This section describes the functionality and structure of OutOfBox_MSP-EXP430FR6989 demonstration
that is included in TMP107-Firmware-Library.
3.2.1 Source File Structure
Table 5 lists the source files and folders.
Table 5. Source File and Folders
Name Description
driverlib Device drive library
.project CCS project files
hal_LCD.c LCD library
hal_LCD.h LCD library header
hal_tmp107.c Hardware abstraction layer for TMP107 library
hal_tmp107.h Hardware abstraction layer header for the TMP107 library
main.c Main source file of the demonstration
tmp107.c TMP107 library
tmp107.h TMP107 library header

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3.2.2 Operation
This demonstration uses the LCD on the MSP-EXP430F6989 LaunchPad to display temperature data. It
begins by querying the TMP107 bus for the last device in the bus. If the number of devices on the bus has
recently changed, or if new TMP107 devices are being used, hold the pushbutton S1 to initialize the bus
addresses instead. After either LastDevice query or AddressInit occurs, a global read operation is then
performed on the bus to retrieve temperature data from all TMP107 devices. This temperature data is
displayed sequentially on the LCD using the battery indicator bars to indicate (in binary) the current
device.
Figure 7. BOOSTXL-TMP107 and FR6989

temp 0: 24.000000
temp 1: 23.984375
temp 2: 24.234375
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3.3 OutOfBox_MSP-EXP430F5529LP
This section describes the functionality and structure of OutOfBox_MSP-EXP430F5529LP demonstration
that is included in TMP107-Firmware-Library.
3.3.1 Source File Structure
Table 6 lists the source files and folders.
Table 6. Source File and Folders
Name Description
driverlib Device drive library
.project CCS project files
hal.c Hardware abstraction layer for the TMP107 library
hal.h Hardware abstraction layer header for the TMP107 library
main.c Main source file of the demonstration
tmp107.c TMP107 library
tmp107.h TMP107 library header
3.3.2 Operation
This demonstration uses the MSP application UART to report temperature data to the PC. The MSP
application UART is a virtual COM port that is made available by the LaunchPad. Monitor this COM port
using a terminal application, such as PuTTy. See Figure 8 for an example of MSP application UART
output. The demonstration begins by querying the TMP107 bus for the last device in the bus. If the
number of devices on the bus has recently changed, or if new TMP107 devices are being used, hold the
pushbutton S1 to initialize the bus addresses instead. After either LastDevice query or AddressInit occurs,
a global read operation is then performed on the bus to retrieve temperature data from all TMP107
devices. This temperature data is then printed to the MSP application UART, and LED1 flashes to indicate
how many TMP107 devices were found.
Figure 8. Example Output from MSP Application UART