Texas Instruments BQ25720 User manual

User’s Guide
BQ25720, BQ25723 Evaluation Module
ABSTRACT
The BQ25720EVM and BQ25723EVM evaluation modules (EVM) are SMBus or I2C-controlled NVDC-1 buck
boost charger. The input voltage range is from 3.5 V to 26 V, with a programmable output of 1–4 cells and a
charge output current range of 64 mA to 8.128 A. This EVM does not include the EV2400 interface device; the
EV2400 must be ordered separately to evaluate the BQ2572x EVM.
Table of Contents
1 Introduction.............................................................................................................................................................................2
1.1 EVM Features.................................................................................................................................................................... 2
1.2 General Description........................................................................................................................................................... 2
2 Test Summary......................................................................................................................................................................... 5
2.1 Definitions.......................................................................................................................................................................... 5
2.2 Equipment.......................................................................................................................................................................... 5
2.3 Equipment Setup................................................................................................................................................................6
2.4 Procedure...........................................................................................................................................................................9
3 Bill of Materials, Board Layout, and Schematics...............................................................................................................10
3.1 Bill of Materials.................................................................................................................................................................10
3.2 Board Assembly Layout................................................................................................................................................... 12
3.3 Schematic........................................................................................................................................................................ 18
List of Figures
Figure 2-2. Original Test Setup for BMS035 (BQ2572x EVM).....................................................................................................7
Figure 2-3. Main Window of the BQ2572x Evaluation Software..................................................................................................8
Figure 2-4. EN_OTG....................................................................................................................................................................9
Figure 3-1. Top Assembly.......................................................................................................................................................... 12
Figure 3-2. Bottom Assembly.................................................................................................................................................... 13
Figure 3-3. PCB Layer 1............................................................................................................................................................ 14
Figure 3-4. PCB Layer 2............................................................................................................................................................ 15
Figure 3-5. PCB Layer 3............................................................................................................................................................ 16
Figure 3-6. PCB Layer 4............................................................................................................................................................ 17
List of Tables
Table 1-1. I/O Description............................................................................................................................................................ 3
Table 1-2. Controls and Key Parameters Setting.........................................................................................................................3
Table 1-3. Recommended Operating Conditions.........................................................................................................................4
Table 3-1. BQ2572x EVM Bill of Materials.................................................................................................................................10
Trademarks
USB Type-C® is a registered trademark of USB Implementer's Forum, Inc..
Intel® is a registered trademark of Intel.
All trademarks are the property of their respective owners.
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1 Introduction
1.1 EVM Features
This EVM supports the following features:
• Evaluation module for the BQ2572x devices
• Supports 3.5- to 26-V input source
– 3.5- to 26-V, 0- to 6-A input operating range and 1–4 cell battery configuration
– Supports USB 2.0, USB 3.0, USB 3.1 (USB Type-C®) and USB_PD
– Supports USB OTG with 3- to 26-V adjustable output
– Supports Fast Role Swap (FRS) feature for USB_PD
• Narrow VDC (NVDC) power path management
– Battery supplements the system when the adapter is fully-loaded
• 800-kHz or 1.2-MHz switching frequency for low profile inductor
• SMBus (BQ25720) or I2C (BQ25723) port for optimal system performance and status reporting
• Power and current monitor for CPU throttling
• Safety
– Thermal shutdown
– Input and system overvoltage protection
– MOSFET overcurrent protection
• Supports Vmin Active Protection (VAP) mode for Intel® platform
• Charge status outputs for LED or host processor
• Maximum power tracking capability by input voltage regulation
• Test points for key signals available for testing purposes. Easy probe hook-up.
• Jumpers available. Easy-to-change connections.
1.2 General Description
The BQ2572x evaluation modules are complete charger modules for evaluating an SMBus or I2C-controlled
buck boost charger using the BQ2572x devices.
The BQ2572x EVM does not include the EV2400 interface board. To evaluate the BQ2572x EVM, order an
EV2400 interface board separately.
The BQ2572x is a synchronous NVDC-1 battery buck boost charge controller, offering a low component count,
high efficiency solution for space-constrained, multi-chemistry battery charging applications.
The NVDC-1 configuration allows the system to be regulated at the battery voltage, but does not drop below
the system minimum voltage. The system keeps operating even when the battery is completely discharged or
removed. When load power exceeds the input source rating, the battery supplement mode prevents the input
source from being overloaded.
The BQ2572x charges the battery from a wide range of input sources including a 5-V USB adapter to a
high-voltage USB PD source and traditional adapters.
During power up, the charger sets the converter to buck, boost, or buck-boost configuration based on the input
source and battery conditions. During the charging cycle, the charger automatically transits among buck, boost,
and buck-boost configuration without host control.
The BQ2572x monitors adapter current, battery current, and system power. The flexibly programmed PROCHOT
output goes directly to the CPU for throttle back, when needed.
For more details on register functions, see the BQ25720 SMBus 1- to 4-Cell Narrow VDC Buck-Boost Battery
Charge Controller With System Power Monitor and Processor Hot Monitor and BQ25723 I2C 1- to 4-Cell Narrow
VDC Buck-Boost Battery Charge Controller With System Power Monitor and Processor Hot Monitor data sheets.
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Table 1-1 lists the I/O descriptions.
Table 1-1. I/O Description
Jack Description
J1–VIN Input: positive terminal
J1–PGND Input: negative terminal (ground terminal)
J2-ILIM_HIZ External converter disable
J2-CHRG_OK CHRG_OK output
J2-ENZ_OTG External OTG disable pin
J2-CELL_control External battery removal control; logic high to pull the CELL pin down
J3–3V3 Onboard 3.3-V output
J3–SDA SMBUS or I2C SDA
J3-SCL SMBUS or I2C SCL
J3-GND Ground
J4-CMPOUT CMPOUT pin output
J4-GND Ground
J4-CMPIN External CMPIN pin input
J5-VBAT Connected to battery pack output
J5-PGND Ground
J6-VSYS Connected to system output
J6-PGND Ground
J7–SDA SMBUS or I2C SDA
J7-SCL SMBUS or I2C SCL
J7-GND Ground
Table 1-2 displays the controls and key parameters settings.
Table 1-2. Controls and Key Parameters Setting
Jumper Description Factory Setting
JP1 Bypass inrush control circuit
spa. JP1 on: bypasses input FETs Q6 and Q7 external selector
spa. JP1 off: CHRG_OK controls Q6 and Q7 external selector
Installed
JP2 Jumper on: Forward Mode
Jumper off: OTG Mode
Installed
JP3 CELL setting:
spa1S: JP3(1-2), measure CELL pin voltage 1.5 V
spa2S: JP3(3-4), measure CELL pin voltage 2.4 V
spa3S: JP3(5-6), measure CELL pin voltage 3.3 V
spa4S: JP3(7-8), measure CELL pin voltage 4.5 V
2S setting: JP3(3-4)
JP4 Jumper on: Bat removal Jumper off: Cell setting by JP3 Not installed
JP6 For input current setting:
spa Jumper on: ILIM_HIZ LOW.
spa Jumper off: Allow pre-bias ILIM_HIZ
Not installed
JP7 VBUS source selection
spa. JP7 (1-2): VBUS pin on VIN
spa. JP7 (2-3): VBUS pin on ACP
Installed: JP7(1-2)
JP8 Jumper on: Onboard LDO to drive the EVM 3V3
Jumper off: disconnect onboard LDO to drive the EVM 3V3
Installed
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Table 1-3 lists the recommended operating conditions.
Table 1-3. Recommended Operating Conditions
Symbol Description MIN TYP MAX Unit
Supply voltage, VIN Input voltage from AC adapter input 3.5 5, 9, 15, 20 26 V
Battery voltage, VBAT Voltage applied at VBAT terminal 0 19.2 V
Supply current, IAC Maximum input current from AC adapter
input
0 6.4 A
Output current, Iout Output current 0 8 A
Operating junction temperature
range, TJ
0 125 °C
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2 Test Summary
2.1 Definitions
This procedure details how to configure the BMS035 evaluation board. For the test procedure, the following
naming conventions are followed. Refer to the BMS035 schematic for details.
VXXX: External voltage supply name (VADP, VBT, VSBT)
LOADW: External load name (LOADR, LOADI)
V(TPyyy): Voltage at internal test point TPyyy. For example, V(TP12) means the voltage at TP12.
V(Jxx): Voltage at jack terminal Jxx.
V(TP(XXX)): Voltage at test point “XXX”. For example, V(ACDET) means the voltage at the test point which is
marked as “ACDET”.
V(XXX, YYY): Voltage across point XXX and YYY.
I(JXX(YYY)): Current going out from the YYY terminal of jack XX.
Jxx(BBB): Terminal or pin BBB of jack xx
Jxx ON : Internal jumper Jxx terminals are shorted
Jxx OFF: Internal jumper Jxx terminals are open
Jxx (-YY-) ON: Internal jumper Jxx adjacent terminals marked as “YY” are shorted
Measure: → A,B Check specified parameters A, B. If measured values are not within specified limits, the unit under test
has failed.
Observe → A,B Observe if A, B occurs. If they do not occur, the unit under test has failed.
Assembly drawings have locations for jumpers, test points, and individual components.
2.2 Equipment
The following list of equipment is required for fully testing the EVM:
1. Power Supplies
A power supply capable of supplying 26 V at 6 A is required. While this part can handle larger voltage and
current, it is not necessary for this procedure.
2. Load #1
A 20-V, 6-A system DC electronic load and setting as constant voltage load mode.
3. Load #2
A Kepco load: BOP36-6M, DC 0 to ±36 V, 0 to ±6 A (or higher), or equivalent.
4. Meters
Six Fluke 75 multimeters, (equivalent or better) or: Three equivalent voltage meters and three equivalent
current meters.
5. Computer
A computer with at least one USB port and a USB cable.
6. EV2400 Communication Kit
7. Software
Download and properly install bqStudio from https://www.ti.com/tool/BQSTUDIO.
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2.3 Equipment Setup
Use the following guidelines to set up the equipment:
1. Set power supply #1 for 10-V DC, 5-A current limit and then turn off the supply.
2. Connect the output of power supply #1 in series with a current meter to J1 (VIN and PGND).
3. Connect a voltage meter across J1 (VIN) and J1 (PGND).
4. Connect load #1 in series with a current meter to J6 (VSYS and PGND).
Connect a voltage meter across J6 (VSYS and PGND).
Set 1 A at the constant current mode. Turn off load #1.
5. Connect Load #2 in series with a current meter to J5 (VBAT and PGND).
Connect a voltage meter across J5 (VBAT and PGND).
Set 7 V at KEPCO load output. Turn off load #2.
Note
Add a 47-µF capacitor on the BAT pin when testing without a real battery.
6. Connect J3 to the EV2400. Connect J3 to the SMBus PORT 1 (BQ25720) or I2C PORT 2 (BQ25723) on the
EV2400. Figure 2-1 shows the connections.
The picture shows the SMBus version EVM connection. If using the BQ25723EVM, move the connector to the I2C port.
Figure 2-1. EV2400 Connections
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7. Install jumpers as indicated in Table 1-2.
After completing these steps, the test setup for BMS035 is as shown in Figure 2-2.
Figure 2-2. Original Test Setup for BMS035 (BQ2572x EVM)
8. Turn on the computer and power supply #1. Open the bqStudio software.
a. Select Charger and click the Next button.
b. For SMBus BQ25720, select “Charger_1_00_BQ25720.bqz” on the Select a Target Page. For I2C
BQ25723, select “Charger_1_00_BQ25723.bqz” on the Select a Target Page.
c. After selecting the target device, click the Read Register button and the interface in Figure 2-3 is
presented.
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Figure 2-3. Main Window of the BQ2572x Evaluation Software
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2.4 Procedure
2.4.1 Charge Function
Use the following for charge function settings:
1. Make sure the Equipment Setup steps are followed.
2. Set the Tgt Address to 12(9) for BQ25720 or D6(6B) for BQ25723.
3. Write “020E” to charge option 0 register 0x12H (BQ25720) or 0x00H (BQ25723).
Measure → V(J1(VIN)) = 10 V ±0.5 V
Measure → V(TP28(CHRG_OK)) = 3 V to 4.5 V
Measure → V(TP21(REGN)) = 6 V ±1 V
Measure → V(TP22(ILIM_HIZ)) = 2.2 V
4. Write “0800” to charge current 0x14H (BQ25720) or 0x02H (BQ25723).
Turn on load #1.
Measure → V(J6(SYS)) = 8.4 V ±0.5 V
5. Turn on LOAD #2 (VBAT Load).
Measure → V(J5(VBAT)) = 7 V ±0.5 V
Measure → I(J5(VBAT)) = 2 A ±0.5 V
2.4.2 OTG Function
Use the following for OTG function settings:
1. Connect a 7-V power supply to the VBAT load.
Remove the VIN power supply from J1. (The connection must be physically removed from the board).
2. Write “20D0” to the Charge Voltage Register.
3. Write “09C4” to the OTG voltage register.
4. Write “4000” to the OTG current registers.
5. Remove JP2 to enable the OTG function.
6. Select EN_OTG in Charge Option 3.
Measure → V(J1(VIN)) = 5 V ±1 V
Figure 2-4. EN_OTG
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3 Bill of Materials, Board Layout, and Schematics
This section contains the EVM BOM, board layout images and schematics.
3.1 Bill of Materials
Table 3-1 lists the BQ2572x EVM bill of materials.
Table 3-1. BQ2572x EVM Bill of Materials
Designator Qty Value Description Package Reference Part Number Manufacturer
!PCB1 1 Printed Circuit Board BMS035 Any
C3, C4, C23, C24, C44,
C45
6 10uF CAP, CERM, 10 uF, 35 V, ±10%, X5R, 0805 805 GRM21BR6YA106KE43L MuRata
C5, C6, C7, C8, C9,
C10, C21
7 10uF CAP, CERM, 10 uF, 25 V, ±10%, X5R, 0805 805 GRM21BR61E106KA73L MuRata
C12, C41 2 0.01uF CAP, CERM, 0.01 uF, 50 V, ±10%, X7R, 0603 603 GRM188R71H103KA01D MuRata
C15, C16 2 0.047uF CAP, CERM, 0.047 uF, 25 V, ±10%, X7R, 0603 603 GRM188R71E473KA01D MuRata
C17 1 1000pF CAP, CERM, 1000 pF, 50 V, ±5%, C0G/NP0, 0402 402 C1005NP01H102J050BA TDK
C18, C28, C29 3 1uF CAP, CERM, 1 µF, 35 V,±10%, X7R, AEC-Q200
Grade 1, 0603
603 CGA3E1X7R1V105K080AE TDK
C19, C20 2 150pF CAP, CERM, 150 pF, 50 V, ±5%, C0G/NP0, 0603 603 C0603C151J5GACTU Kemet
C22, C27, C38, C39 4 0.1uF CAP, CERM, 0.1 uF, 50 V, ±10%, X7R, 0603 603 C1608X7R1H104K080AA TDK
C25 1 0.47uF CAP, CERM, 0.47 uF, 50 V, ±10%, X7R, 0805 805 C2012X7R1H474K125AB TDK
C26, C55 2 10uF CAP, CERM, 10 uF, 25 V, ±10%, X7R, 1206 1206 GRM31CR71E106KA12L MuRata
C30 1 2.2uF CAP, CERM, 2.2 uF, 35 V, ±10%, X5R, 0603 603 GRM188R6YA225KA12D MuRata
C31 1 33pF CAP, CERM, 33 pF, 50 V, ±5%, C0G/NP0, 0402 402 GRM1555C1H330JA01D MuRata
C32 1 1200pF CAP, CERM, 1200 pF, 50 V, ±10%, X7R, 0402 402 GRM155R71H122KA01D MuRata
C33 1 3300pF CAP, CERM, 3300 pF, 50 V, ±10%, X7R, 0402 402 GRM155R71H332KA01D MuRata
C34 1 15pF CAP, CERM, 15 pF, 50 V, ±5%, C0G/NP0, 0402 402 GRM1555C1H150JA01D MuRata
C35, C36, C37 3 100pF CAP, CERM, 100 pF, 50 V, ±5%, C0G/NP0, 0603 603 C0603C101J5GAC Kemet
C46, C47 2 0.033uF CAP, CERM, 0.033 uF, 50 V, ±10%, X7R, 0603 603 GRM188R71H333KA61D MuRata
C48, C49, C53 3 33uF CAP, TA, 33 uF, 35 V, ±20%, 0.065 ohm, SMD 7343-31 T521D336M035ATE065 Kemet
D2, D3 2 30V Diode, Schottky, 30 V, 0.2 A, SOD-323 SOD-323 BAT54HT1G ON Semiconductor
D4 1 Green LED, Green, SMD 1.6x0.8x0.8mm LTST-C190GKT Lite-On
H1, H2, H3, H4 4 Bumpon, Hemisphere, 0.44 X 0.20, Clear Transparent Bumpon SJ-5303 (CLEAR) 3M
J1, J5, J6 3 Terminal Block, 5.08 mm, 2x1, Brass, TH 2x1 5.08 mm Terminal
Block
ED120/2DS On-Shore
Technology
J2 1 Terminal Block, 3.5mm Pitch, 4x1, TH 14x8.2x6.5mm ED555/4DS On-Shore
Technology
J3 1 Connector Header Through Hole, Right Angle 4
position 0.100" (2.54mm)
HDR4 22053041 Molex
J4 1 Terminal Block, 3.5mm Pitch, 3x1, TH 10.5x8.2x6.5mm ED555/3DS On-Shore
Technology
J7 1 Header (shrouded), 100mil, 5x2, High-Temperature,
Gold, TH
5x2 Shrouded header N2510-6002-RB 3M
JP1, JP2, JP4, JP6,
JP8
5 Header, 100mil, 2x1, Gold, TH Header, 2x1, 100mil 5-146261-1 TE Connectivity
JP3 1 Header, 100mil, 4x2, Gold, TH 4x2 Header TSW-104-07-G-D Samtec
JP7 1 Header, 100mil, 3x1, Tin, TH Header, 3 PIN, 100mil,
Tin
PEC03SAAN Sullins Connector
Solutions
L1 1 2.2µH Shielded Wirewound Inductor 13A 9mOhm Max
10x10x3mm
SMT_IND_11MM2_10
MM1
BMRHDY1010302R2MA1 Chilisin Electronics
LBL1 1 Thermal Transfer Printable Labels, 0.650" W x 0.200"
H - 10,000 per roll
PCB Label 0.650 x
0.200 inch
THT-14-423-10 Brady
Q1, Q2, Q3, Q4 4 30V MOSFET, N-CH, 30 V, 12 A, DNH0008A (VSONP-8) DNH0008A CSD17578Q3A Texas Instruments
Q5 1 MOSFET P-CH 30V 3X3 DFN DFN8 AONR21307 Alpha & Omega
Semiconductor
Q6, Q7 2 -30V MOSFET, P-CH, -30 V, -8.5 A, AEC-Q101, 8-
PowerVDFN
8-PowerVDFN DMP3035SFG-7 Diodes Inc.
Q9 1 50 V Transistor, NPN/PNP Pair, 50 V, 0.05 A, SC-74R SC-74R DCX124EK-7-F Diodes Inc.
Q10, Q11, Q12 3 60V MOSFET, N-CH, 60 V, 0.26 A, SOT-23 SOT-23 2N7002ET1G ON Semiconductor
R1, R2 2 0.01 RES, 0.01, 1%, 1 W, 1206 1206 WSLP1206R0100FEA Vishay-Dale
R3, R4 2 3.9 RES, 3.9, 5%, 0.25 W, AEC-Q200 Grade 0, 1206 1206 CRCW12063R90JNEA Vishay-Dale
R7, R24, R29 3 300k RES, 300 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW0603300KFKEA Vishay-Dale
R9, R28 2 100k RES, 100 k, 1%, 0.1 W, 0603 603 RC0603FR-07100KL Yageo
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Table 3-1. BQ2572x EVM Bill of Materials (continued)
Designator Qty Value Description Package Reference Part Number Manufacturer
R10, R38 2 10 RES, 10.0, 1%, 0.25 W, AEC-Q200 Grade 0, 1206 1206 ERJ-8ENF10R0V Panasonic
R11, R12 2 4.99 RES, 4.99, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW06034R99FKEA Vishay-Dale
R13 1 1 RES, 1.0, 5%, 0.125 W, AEC-Q200 Grade 0, 0805 805 CRCW08051R00JNEA Vishay-Dale
R14 1 20k RES, 20 k, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW060320K0JNEA Vishay-Dale
R15, R16, R18 3 10 RES, 10, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW060310R0JNEA Vishay-Dale
R17, R25, R32, R33,
R35, R39, R45
7 10.0k RES, 10.0 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW060310K0FKEA Vishay-Dale
R19 1 383k RES, 383 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW0603383KFKEA Vishay-Dale
R20 1 82k RES, 82 k, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW060382K0JNEA Vishay-Dale
R22 1 16.9k RES, 16.9 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 402 CRCW040216K9FKED Vishay-Dale
R23 1 10.0k RES, 10.0 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 402 CRCW040210K0FKED Vishay-Dale
R27 1 220k RES, 220 k, 1%, 0.1 W, 0603 603 RC0603FR-07220KL Yageo
R30 1 137k RES, 137 k, 1%, 0.1 W, 0603 603 RC0603FR-07137KL Yageo
R34 1 30.1k RES, 30.1 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW060330K1FKEA Vishay-Dale
R36 1 2.00k RES, 2.00 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW06032K00FKEA Vishay-Dale
R40 1 2.0Meg RES, 2.0 M, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW06032M00JNEA Vishay-Dale
R41 1 150k RES, 150 k, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW0603150KJNEA Vishay-Dale
R42 1 33k RES, 33 k, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW060333K0JNEA Vishay-Dale
SH-JP1, SH-JP2, SH-
JP3, SH-JP7, SH-JP8
5 1x2 Shunt, 100mil, Gold plated, Black Shunt SNT-100-BK-G Samtec
TP1, TP6, TP7, TP10,
TP11, TP13, TP14
7 White Test Point, Miniature, White, TH White Miniature
Testpoint
5002 Keystone
TP2, TP3, TP12, TP15,
TP16, TP17, TP18,
TP19, TP20, TP21,
TP22, TP23, TP24,
TP25, TP26, TP27,
TP28, TP29, TP30,
TP32, TP33, TP34,
TP35, TP36, TP37,
TP38
26 SMT Test Point, Miniature, SMT Testpoint_Keystone_M
iniature
5015 Keystone
TP4, TP5, TP9 3 Test Point, Multipurpose, Red, TH Red Multipurpose
Testpoint
5010 Keystone
TP8, TP31, TP39 3 Test Point, Multipurpose, Black, TH Black Multipurpose
Testpoint
5011 Keystone
U1 1 SMBus/I2C, 1-4 Cell Narrow VDC Buck-Boost Battery
Charge Controller With System Power Monitor and
Processor Hot Monitor
WQFN32 BQ25720RSN for BQ25720EVM;
BQ25723RSN for BQ25723EVM
Texas Instruments
U2 1 100 mA, Quasi Low-Dropout Linear Voltage Regulator,
3-pin SOT-23, Pb-Free
DBZ0003A LM3480IM3-3.3/NOPB Texas Instruments
Z1 1 26V Diode, TVS, Bi, 26 V, 42.1 Vc, 400 W, 9.5 A, SMA
(non-polarized)
SMA (non-polarized) SMAJ26CA Littelfuse
C1 0 15pF CAP, CERM, 15 pF, 50 V, ±5%, C0G/NP0, 0603 603 C0603C150J5GACTU Kemet
C2 0 47uF CAP, Aluminum Polymer, 47 uF, 25 V, ±20%, 0.03
ohm, F61 SMD
F61 25SVPF47M Panasonic
C11 0 0.01uF CAP, CERM, 0.01 uF, 50 V, ±10%, X7R, 0603 603 GRM188R71H103KA01D MuRata
C13, C14 0 330pF CAP, CERM, 330 pF, 50 V, ±10%, X7R, 0603 603 GRM188R71H331KA01D MuRata
C40, C51, C52 0 10uF CAP, CERM, 10 uF, 25 V, ±10%, X5R, 0805 805 GRM21BR61E106KA73L MuRata
C42, C43 0 10uF CAP, CERM, 10 uF, 35 V, ±10%, X5R, 0805 805 GRM21BR6YA106KE43L MuRata
C50, C54, C56 0 33uF CAP, TA, 33 uF, 35 V, ±20%, 0.065 ohm, SMD 7343-31 T521D336M035ATE065 Kemet
C57 0 0.068uF CAP, CERM, 0.068 uF, 50 V, ±10%, X7R, AEC-Q200
Grade 1, 0402
402 CGA2B3X7R1H683K050BB TDK
C58, C59 0 0.018uF CAP, CERM, 0.018 uF, 50 V, ±10%, X7R, 0603 603 GRM188R71H183KA01D MuRata
D1 0 20V Diode, Schottky, 20 V, 2 A, SMA SMA B220A-13-F Diodes Inc.
FID1, FID2, FID3, FID4,
FID5, FID6
0 Fiducial mark. There is nothing to buy or mount. N/A N/A N/A
R5, R6 0 56 RES, 56, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW060356R0JNEA Vishay-Dale
R8 0 0 RES, 0, 5%, 0.1 W, 0603 603 RC0603JR-070RL Yageo
R31 0 100 RES, 100, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW0603100RFKEA Vishay-Dale
R37 0 10.0k RES, 10.0 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW060310K0FKEA Vishay-Dale
R43, R46 0 0 RES, 0, 1%, 0.5 W, 0805 805 5106 Keystone
R44 0 100k RES, 100 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW0603100KFKEA Vishay-Dale
SH-JP4, SH-JP6 0 1x2 Shunt, 100mil, Gold plated, Black Shunt SNT-100-BK-G Samtec
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3.2 Board Assembly Layout
Figure 3-1 through Figure 3-6 illustrate the board assembly and layout images.
Figure 3-1. Top Assembly
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Figure 3-2. Bottom Assembly
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Figure 3-3. PCB Layer 1
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Figure 3-4. PCB Layer 2
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Figure 3-5. PCB Layer 3
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Figure 3-6. PCB Layer 4
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3.3 Schematic
Figure 3-7 shows the EVM schematic.
2.2µH
L1
0.047uF
C15
0.047uF
C16
4
7,8
1,2,3
5,6,
Q2
4
7,8
1,2,3
5,6,
Q1
0.01uF
50V
C12
0.01
R1
4.99
R11
4.99
R12
10uF
35V
C3
10uF
35V
C4
1µF
C18
3.9
R3
3.9
R4
4
7,8
1,2,3
5,6,
Q3
4
7,8 1,2,3
5,6,
Q4
0.1uF
C27
10uF
C7
1µF
C28
10
R15
10
R16
0.01
R2
1
2
J5
VSYS
PGND
PGND
VBAT
4
1
5-6-7-82
3Q5
AONR21307
10uF
C8
10uF
C9
10uF
C10
10uF
C6
10uF
C5
2.2uF
C30
REGN
REGN
1
µF
C29
383k
R19
10
R18
220k
R27
10.0k
R32
10.0k
R35
10.0k
R39
1
2
3
J4
Receptacle_3x1
3V3
300k
R7
GND
GND
GND
10.0k
R33
GND
100pF
C37 100pF
C36
30.1k
R34
VIN
PGND
10.0k
R25
3V3
VDDA
VDDA
100k
R28
GND
TP22
TP4 TP5
TP9
TP19
TP15
TP21
TP24
TP27
TP29
TP30
TP23
TP34
TP25
TP26
TP28
TP35
TP36
TP38
TP32
10.0k
R23
16.9k
R223300pFC33
GND
GND
1000pF
50V
C17
10uF
35V
C23
10uF
35V
C24
330pF
C13
56
DNP
R5
330pF
DNP
C14
56
DNP
R6
DNP
1
2
3
4
J2
Receptacle_4x1
1200pF
C32
137k
R30
1
2
JP4
1
2
JP2
300k
R24
1CELL 2 CELL 4 CELL3 CELL
BAT Removal
2.0M
R40
D1
DNP
TP11
TP14
TP7
TP6
TP10
TP13
47uF
C2
DNP
3V3
2.00k
R36
Green
1
2
D4
60V
1
23
Q11
GND
PGND
NT1
Net-Tie
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND PGND
PGNDPGND
ILIM_HIZ
ILIM_HIZ GND
CHG_OK
CHG_OK
PGND
CELL_control
60V
1
23
Q12
CELL_control BAT
PGND
D2 D3
10.0
R38
VBUS
VBUS
0.1uF
C38
0.1uF
C39
IN
2OUT 1
3
GND
U2
PM-REG-LM3480-SOT3
3V3
TP37
1 2
JP8
BAT
1
2
J6
1 2
JP1
100k
R9
20k
R14
60V
1
23
Q10
PGND
0.1uF
C22
CHG_OK
GND
26V
Z1
PGND
1.0
R13
VIN
43
2
Q9A
DCX124EK-7-F
1
6
5
Q9B
DCX124EK-7-F
10.0
R10
PGND
10.0k
R17
3V3
7,8
1,2,3
5,6,
Q7
4
7,8 1,2,3
5,6,
Q6
470nF
50V
C25
GND
1
2
3
4
J3
0022053041
10uF
C26
300k
R29
33pF
C31
15pF
C34
0
R8
DNP
15pF
50V
C1
100
DNP
R31
DNP
GND
TP1
TP33
TP2 TP3
150pF
C20
150pF
C19
3V3
1
2
JP6
GND
TP12
100pF
C35
PGND
TP17
TP16
TP18
TP20
1
2
3
JP7
TP31
0.01uF
C41
TP39TP8
VSYS
VBUS
10uF
35V
C44
10uF
35V
C45
PGND
10uF
35V
C42
DNP
10uF
35V
C43
DNP
PGND
0.01uF
C11
DNP 0.033uF
C47
0.033uF
C46
GND
33uF
35V
C48
1
2
J1
10uF
C21
10uF
C40
DNP
3.5V to 26V
Input Voltage Range
SYS Output Voltage
BAT Output Voltage
19.2V MAX
19.36V MAX
6.35A Max
8A MAX
33uF
C53
33uF
35V
C49
33uF
35V
C50
DNP
10uF
C51
DNP
10uF
C52
DNP
PGND
33uF
C54
DNP
VIN
10uF
C55
VDDA
7
COMP1
16 COMP2 17
SW1
32 SW2 23
HIDRV1
31 HIDRV2 24
BTST1
30 BTST2 25
LODRV1
29 LODRV2 26
BATDRV 21
PROCHOT
11
CELL_BATPRESZ 18
IADPT 8
IBAT 9
PSYS 10
REGN 28
SRN 19
SRP 20
Thermal_Pad 33
VBUS
1VSYS 22
PGND 27
ACN
2
ACP
3
ILIM_HIZ
6
CHRG_OK
4
SDA
12
SCL
13
CMPIN
14
CMPOUT
15
OTG/VAP
5
BQ25720RSN
U1
150k
R41
33k
R42
12 34 56 78
JP3
GND
1 2
3 4
5 6
7 8
9 10
J7
N2510-6002-RB
GND
SDA
SCL
SCL SDA
82k
R20
33uF
35V
C56
100k
DNP
R44
DNP
10.0k
R45
0
R43
DNP
0
R46
DNP
ILIM_HIZ
0.068uF
50V
C57
DNP
HIZ
8A MAX
18nF
50V
C59
DNP
18nF
50V
C58
DNP
GND GND
10.0k
R37
DNP
U1 is BQ25720 for BQ25720EVM, while BQ25723 for BQ25723EVM.
Figure 3-7. BQ2572x EVM Schematic
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STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
WARNING
Evaluation Kits are intended solely for use by technically qualified,
professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
components, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.

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2
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.