Texas Instruments LM3639A User manual

Using the LM3639A Evaluation Module
User's Guide
Literature Number: SNVU211
March 2013

GND
EN
VIO
GND
EN
VIO
User's Guide
SNVU211–March 2013
LM3639AYFQEVM User's Guide
1 Introduction
The Texas Instruments LM3639YFQAEVM evaluation module (EVM) helps designers evaluate the
operation and performance of the LM3639A Single Chip 40V Backlight + 1.5A Flash LED Driver. The low-
voltage, high-current flash LED driver is a synchronous boost which provides the power for a single flash
LED at up to 1.5A or dual LEDs at up to 750 mA each. The high-voltage backlight driver is a dual-output
asynchronous boost which powers dual LED strings at up to 40V and 30 mA per string.
The EVM contains one LM3639A Single Chip 40V Backlight + 1.5A Flash LED Driver (See Table 1).
Table 1. Device and Package Configurations
FLASH LED DRIVER IC PACKAGE
U1 LM3639AYFQT YFQ0020HGA
2 Setup
This section describes the jumpers and connectors on the EVM as well as how to properly connect, set up
and use the LM3639A EVM.
2.1 Input/Output Connector Description
Input / GND - These are the power input terminals for the driver. The terminal block provides a power
(VIN) and ground (GND) connection to allow the user to attach the EVM to a cable harness.
EN-This is the jumper used to enable the LED driver. The driver will be enabled when the EN pin is high
(VIO) and disabled when it is low (GND). The EN pin is connected to ground via a 300 kΩresistor internal
to the LM3639A
Figure 1. Enable Jumper Settings
VIO - This pin provides power for the I2C lines (Clock & Data) and for the EN pin. It is recommended that
this pin is connected to the VIN pin. If desired, it can be connected to the 3.3V line provided by the USB
interface connector. In this configuration, communication via the I2C interface may not be possible if the
supply voltage to the LED driver is below approximately 3V.
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GND
TX
PWM1
GND
TX
PWM1
GND
STROBE
PWM2
GND
STROBE
PWM2
www.ti.com Setup
Figure 2. VIO Jumper Settings
J3 - LEDB CON - is the jumper used to connect the on-board backlight LEDs to the LED output of the
driver.
J20 and J21 - D1B and D2B LEDs - are the jumper used to select the number of LEDs in each backlight
string.
J11 and J12 - D1F CON and D2F CON- are the jumpers used to connect the on-board flash LEDs to the
LED output of the driver.
J27 - STROBE - This pin provides an external method for initiating a flash event. The STROBE pin is
connected to ground via a 300 kΩresistor internal to the LM3639A. To externally drive this pin, either
connect a control signal directly to the STROBE pin of the connector or place a jumper between connector
pins STROBE and PWM0. Pin PWM2 can be configured as time-adjustable voltage pulse via the General
User Interface software provided.
Figure 3. STROBE Jumper Settings
J25-TX-This pin is used to initiate a TX-interrupt event. The TX pin is connected to ground via a 300 kΩ
resistor internal to the LM3639A. To externally drive this pin, either connect a control signal directly to the
TX pin of the connector or place a jumper between connector pins TX and PWM1. Pin PWM1 can be
configured as continuous voltage pulses via the General User Interface software provided.
Figure 4. TX Jumper Settings
J22 - PWM- This pin provides an external method for adjusting the backlight LED brightness. The PWM
pin is connected to ground via a 300 kΩresistor internal to the LM3639A. To externally drive this pin,
either connect a control signal directly to the PWM pin of the connector or place a jumper between
connector pins PWM and PWM0. Pin PWM0 can be configured to provide a continuous stream of voltage
pulses of adjustable frequency and duty cycle via the General User Interface software provided.
3
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GND
PWM
PWM0
GND
PWM
PWM0
Board Layout www.ti.com
Figure 5. PWM Jumper Settings
J29 - SDA / SCL - These connections allow the user to externally control the I2C lines. For independent
control of the I2C lines, do not connect the VIO jumper to either the 3.3V or the VIN pin.
2.2 Setup
The input voltage range for the flash driver is 2.7 volts to 5.5 volts. The on-board LEDs should be
connected for proper operation.
2.3 Operation
For proper operation of the LM3639A, the jumpers should be properly configured. The recommended
setting, using shorting blocks is:
VIO to VIN
EN to VIO
STROBE to PWM2 or external signal
PWM to PWM0 or external signal
TX to PWM1 or external signal
LEDs (J11, J12, J13, J20, J21) shorted
In this configuration, the device will power up when power is applied.
USB2ANY ribbon cable inserted into J19
3 Board Layout
Figure 6,Figure 9,Figure 7 and Figure 8 show the board layout for the LM3639A EVM. The EVM offers
resistors, capacitors and jumpers to Enable the device and to configure it as desired.
The LM3639A will dissipate power, especially during high current and long duration flash events. Power
will also be dissipated on the flash LEDs. The EVM layout is designed to minimize temperature rise during
operation. It is recommended that in order to prevent overheating, repeated flash events in very short time
intervals is avoided.
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www.ti.com Board Layout
Figure 6. Top Assembly Layer
Figure 7. Middle Layer 1 Routing
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Board Layout www.ti.com
Figure 8. Middle Layer 2 Routing
Figure 9. Bottom Assembly Layer (mirrored)
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SWB VOUTB
SWF
VOUTF
GND
GND
GND
D1F
A1
D2F
B1
EN
C1
D1B
D1
D2B
E1
OUTF1
A2
OUTF2
B2
TX
C2
SCL
D2
OVPB
E2
GNDF A4 GNDF B4
VIN C4
PWM D4
SWB E4
GNDB E3
SDA D3
STROBE C3
SWF2 B3
SW1F A3
U1
LM3639
GND
SWF
VOUTBVOUTF
SWB
VIN
TX
SCL
VINF
VINB
VIN
GND
1 2
J2
1 2
J7
GND
1 2
J13
D1B
D2B
D1B D2B
D1F
D2F
EN
PWM
SDA
STROBE
GND GND
1
2
J17
1
2
J18
1
2
J11
1
2
J12
D1F D2F
1 2
J5
SDASCL
3.3V GND
GND
VINF
VINB
0
R2
0
R1
1 2
J4
1 2
J10
1 2
J15
1
2
3
J22
PWM
1
2
3
J23
EN
1
2
3
J25
TX
4
1
2
3
J29
I2C
VIO
SCL
SDA
GND
PWM EN
TX 1
2
3
J27
STROBE
STROBE
VIO
PWM2
GND GND
GND
GND
1
2
3
J24
VIO
3.3V
VIO
VIN
1
2
J9
1
2
J8
VOUTF VOUTF
1
2
J3
1
2
J16
GND
GND
1
2
3
J26
L1B GND
1
2
3
J28
L2B
GND
J1
6091
J6
6092
J14
6091
1 2
3 4
5 6
7 8
9 10
J19
30310-6002HB
L2
—+
D24
D22
D20
D18
D16
D14
D12
D10
D8
D6
D4
D25
D23
D21
D19
D17
D15
D13
D11
D9
D7
D5
L1
1uH
PWM0 PWM1
PWM0
PWM1
PWM2
0.1
R3 0.1 R4
3.01
R5 3.01 R6
1.0k
R7 1.0k R8
VIO
SDA SCL
D2 D3
D1
NSR0240V2T1G
GND
1
2
3
J30
GND
1
2
3
J31
GND
GNDGND
12 34 56 78 910 1112 1314 1516
J20
12 34 56 78 910 1112 1314 1516
J21
TP1 10 uF
C1 10 uF C2
10 uF
C4 10 uF C5
1 uF
C6 1 uF C7
—)
C3
CBATT
LOGO
PCB
Texas Instruments
FID2
FID1 FID3
SV600873
A1
PCB Number:
PCB Rev:
SH-J1
SH-J3SH-J2
SH-J4 SH-J5 SH-J6
SH-J7
SH-J8
SH-J9 SH-J10
www.ti.com Schematic
4 Schematic
Figure 10. LM3639A EVM Schematic
Table 2. Bill of Materials
Item Desi Description Manufacturer Part Number Quantity
gnat
or
1 AA1 Printed Circuit Board TI 551600784-002 REVA 1
2 U1 IC, LM3639A Single Chip 40V Backlight + 1.5A TI LM3639AYFQT 1
Flash LED Driver
3 C1, CAP, CERM, 10uF, 6.3V, X5R 20%, 0402 Murata GRM155R60J106ME4 4
C2, 4D
C4,
C5
4 C3 CAP, CERM, 100uF, 6.3V, +/-20%, X5R, 1206 Murata GRM188R60J106ME4 1
7D
5 C6, CAP, CERM, 1F, 50V, X5R, 10%, 0603 TDK CGA4J3X7R1H105K 2
C7
6 D1 Diode, Schottky, 40V, 250A, SOD523 ON Semiconductor NSR0240V2T1G 1
7 D2, LED,White SMT Philips Lumileds LXCL-EYW4 2
D3
7
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Schematic www.ti.com
Table 2. Bill of Materials (continued)
Item Desi Description Manufacturer Part Number Quantity
gnat
or
8 D4, White LED, ROHM, 30mA, 0603 Rohm Semiconductor SML312WBCW1 22
D5,
D6,
D7,
D8,
D9,
D10,
D11,
D12,
D13,
D14,
D15,
D16,
D17,
D18,
D19,
D20,
D21,
D22,
D23,
D24,
D25
9 J1, Standard Banana Jack, Insulated, Red Keystone 6091 2
J14
10 J2, Header, TH, 100mil, 2x1, Gold plated, 230 mil Samtec, Inc. TSW-102-07-G-S 15
J3, above insulator
J4,
J5,
J7,
J8,
J9,
J10,
J11,
J12,
J13,
J15,
J16,
J17,
J18
11 J6 Standard Banana Jack, Insulated, Black Keystone 6092 1
12 J19 CONN HEADER 10POS DL STR GOLD 3M 30310-6002HB 1
13 J20, Header, TH, 100mil, 8x2, Gold plated, 230 mil Samtec, Inc. TSW-108-07-G-D 2
J21 above insulator
14 J22, Header, TH, 100mil, 3x1, Gold plated, 230 mil Samtec, Inc. TSW-103-07-G-S 9
J23, above insulator
J24,
J25,
J26,
J27,
J28,
J30,
J31
15 J29 Header, TH, 100mil, 4x1, Gold plated, 230 mil Samtec, Inc. TSW-104-07-G-S 1
above insulator
16 L1 Inductor, Metal Alloy, 1uH, 3.1A, 0.068ohm, SMT TOKO DFE201612C-H-1R0M 1
17 L2 Inductor, Ferrite, 10uH, 0.690A, 0.299ohm, SMT TDK Corporation VLF403212MT-220M 1
18 R1, RES, 0 ohm, 5%, 0.25W, 1206 Yageo America RC1206JR-070RL 2
R2
19 R3, RES, 0.1 ohm, 5%, 0.125W, 0805 Panasonic ERJ-6RSJR10V 2
R4
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www.ti.com USB2ANY Interface Board and I2C-Compatible Interface Program
Table 2. Bill of Materials (continued)
Item Desi Description Manufacturer Part Number Quantity
gnat
or
20 R5, RES, 3.01 ohm, 1%, 0.1W, 0603 Vishay-Dale CRCW06033R01FKEA 2
R6
21 R7, RES, 1.0k ohm, 5%, 0.1W, 0603 Vishay-Dale CRCW06031K00JNEA 2
R8
22 TP1 Test Point, TH, Compact, Red Keystone 5005 1
23 SH- Shunt, 100mil, Gold plated, Black 3M 969102-0000-DA 10
J1,
SH-
J2,
SH-
J3,
SH-
J4,
SH-
J5,
SH-
J6,
SH-
J7,
SH-
J8,
SH-
J9,
SH-
J10
5 USB2ANY Interface Board and I2C-Compatible Interface Program
Texas Instruments has created an I2C-compatible program and USB2ANY docking board that can help
exercise the part in a simple way. This document describes how to use the USB2ANY docking board and
interface software.
The LM3639A EVM has the means to connect the USB2ANY controller module which provides all the
control signals to operate the evaluation module. Power to the EVM must be provided externally. A USB
cable (provided) must be connected to the board from a PC.
The I2C-compatible interface program provides all of the control that the LM3639A part requires. For
proper operation, the USB docking board should be plugged into the PC before the interface program is
opened. Once connected, and the program is executed, a basic interface window will open.
5.1 EVM Setup
1. Plug in USB2ANY interface board into PC via USB cable and 10-pin Ribbon Cable into LM3639A
EVM.
2. Connect Power Supply to LM3639A EVM. Use the Red and Black Banana Jacks. Ensure current limit
is set to greater than 3A and that the voltage is set below 5.5V.
3. Unzip four GUI files (1 exe file, 3 DLLs) into a dedicated folder.
4. Run LM3639A_GUI_R1.0 application
9
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5.2 LM3639A GUI
Figure 11. LM3639A General User Interface
1. With the GUI running, press the READ button next to the Device ID Box
• If communication is working, a 0x11 should appear in the box.
• If nothing shows up in the box, press the default settings button
and press YES
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