Texas Instruments bq20z70EVM-001 User manual

User's Guide
SLUU242B–May 2006–Revised October 2013
bq20z70EVM-001 SBS 1.1 Impedance Track™Technology
Enabled Battery Management Solution Evaluation Module
This EVM is a complete evaluation system for the bq20z70/bq29330/bq29412 battery management
system. The EVM includes one bq20z70/bq29330/bq29412 circuit module, a current sense resistor, two
thermistors, and Windows®-based PC software. The circuit module includes one bq20z70 IC, one
bq29330 IC, one bq29412 IC, and all other onboard components necessary to monitor and predict
capacity, perform cell balancing, monitor critical parameters, protect the cells from overcharge, over
discharge, short circuit, and overcurrent in 2-, 3- or 4-series cell Li-ion or Li-polymer battery packs. The
circuit module connects directly across the cells in a battery. An EV2300 board for gas gauge interface is
required to interface this EVM with the PC and can be purchased separately. With the EV2300 interface
board and software, the user can read the bq20z70 data registers, program the chipset for different pack
configurations, log cycling data for further evaluation, and evaluate the overall functionality of the
bq20z70/bq29330/bq29412 solution under different charge and discharge conditions.
Contents
1 Features ...................................................................................................................... 2
2 bq20z70/bq29330-Based Circuit Module ................................................................................ 2
3 bq20z70/bq29330 Circuit Module Schematic ........................................................................... 3
4 Circuit Module Physical Layouts and Bill of Materials .................................................................. 3
5 EVM Hardware and Software Setup ..................................................................................... 9
6 Troubleshooting Unexpected Dialog Boxes ............................................................................. 9
7 Hardware Connection ...................................................................................................... 9
8 Operation ................................................................................................................... 11
9 Calibration Screen ......................................................................................................... 14
10 Pro (Advanced) Screen ................................................................................................... 16
11 Related Documentation from Texas Instruments ..................................................................... 17
List of Figures
1 bq20z70EVM-001 Layout (Silk Screen).................................................................................. 4
2 Top Assembly ............................................................................................................... 4
3 Top Layer .................................................................................................................... 4
4 Bottom Layer ................................................................................................................ 5
5 Bottom Assembly ........................................................................................................... 5
6 Schematic.................................................................................................................... 8
7 bq20z70/bq29330 Circuit Module Connection to Cells and System Load/Charger............................... 10
8 SBS Data Screen.......................................................................................................... 12
9 Data Flash Screen, 1st Level Safety Class............................................................................ 13
10 Calibration Screen......................................................................................................... 15
11 Pro (Advanced) Screen................................................................................................... 16
List of Tables
1 Ordering Information........................................................................................................ 2
2 Bill of Materials.............................................................................................................. 6
Impedance Track is a trademark of Texas Instruments.
Windows is a registered trademark of Microsoft Corporation.
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3 Performance Specification Summary..................................................................................... 9
4 Circuit Module to EV2300 Connections ................................................................................ 10
1 Features
• Complete evaluation system for the bq20z70 SBS 1.1-compliant advanced gas gauge with Impedance
Track Technology, bq29330 analog front end (AFE) and protection IC, and bq29412 independent
overvoltage protection IC
• Populated circuit module for quick setup
• PC software and interface board for easy evaluation
• Software that allows data logging for system analysis
1.1 Kit Contents
• bq20z70/bq29330/bq29412 circuit module
• Software CD with the evaluation software
• Set of support documentation
1.2 Ordering Information
Table 1. Ordering Information
EVM PART NUMBER CHEMISTRY CONFIGURATION CAPACITY
bq20z70EVM-001 Li-ion 2, 3, or 4 cell Any
2 bq20z70/bq29330-Based Circuit Module
The bq20z70/bq29330/bq29412-based circuit module is a complete and compact example solution of a
bq20z70 and bq29330 circuit for battery management and protection of Li-ion or Li-polymer packs. The
circuit module incorporates a bq20z70 battery monitor IC, bq29330 AFE and protection IC, bq29412
independent overvoltage protection IC, and all other components necessary to accurately predict the
capacity of 2-, 3-, or 4-series cells.
2.1 Circuit Module Connections
Contacts on the circuit module provide the following connections:
• Direct connection to the cells: 1N (BAT–), 1P, 2P, 3P, 4P (BAT+)
• To the serial communications port (SMBC, SMBD, VSS)
• The system load and charger connect across PACK+ and PACK–
• To the system present pin (SYS PRES)
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2.2 Pin Descriptions
PIN NAME DESCRIPTION
1N –ve connection of first (bottom) cell
1P +ve connection of first (bottom) cell
2P +ve connection of second cell
3P +ve connection of third cell
4P +ve connection of fourth (top) cell
SMBC Serial communication port clock
SMBD Serial communication data port
VSS Pack negative terminal
PACK– Pack negative terminal
SYS PRES System present pin (if low, system is present)
PACK+ Pack positive terminal
3 bq20z70/bq29330 Circuit Module Schematic
This section contains information for modifying and choosing a precharge mode for
bq20z70/bq29330/bq29412 implementation.
3.1 Schematic
The schematic follows the bill of materials in this user's guide.
3.2 Choosing Particular Precharge Mode
The chipset supports both a charger that has a precharge mode and one that does not. The EVM by
default supports a charger that does not have a precharge mode. This is configured by grounding the
PMS pin with a resistor. R12 and Q2 are used as the precharge current path in order to sustain sufficient
Pack+ voltage when the battery voltage is too low to power up the bq29330 IC.
If the charger has a precharge function, R12 and FET Q2 are not used. The PMS pin must be pulled high
to disable ZVCHG output. The charge FET Q1 is used as the precharge FET, and the charger must
control the precharge current and voltage.
Note: The configuration at PMS pin is a hardware level control. Once the bq20z70 is up and running, the
firmware may change the precharge settings. Please refer to bq20z70 datasheet for further information.
3.3 Testing Fuse-Blowing Circuit
To prevent the loss of board functionality during the fuse-blowing test, the actual chemical fuse is not
provided in the circuit. FET Q4 drives TP3 low if a fuse-blow condition occurs; so monitoring TP3 can be
used to test this condition.
4 Circuit Module Physical Layouts and Bill of Materials
This section contains the board layout, bill of materials, and assembly drawings for the bq20z70/ bq29330/
bq29412 circuit module.
NOTE: For the battery pack designer: D3 is not recommended, and should be shorted out if the
DSG FET does not have built-in zener diode protection.
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4.1 Board Layout
This section shows the dimensions, PCB layers, and assembly drawing for the bq20z70/bq29330 module.
Figure 1. bq20z70EVM-001 Layout (Silk Screen)
Figure 2. Top Assembly
Figure 3. Top Layer
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www.ti.com Circuit Module Physical Layouts and Bill of Materials
Figure 4. Bottom Layer
Figure 5. Bottom Assembly
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4.2 Bill of Materials
Table 2. Bill of Materials
Count Ref Des Value Description Size Part No. MFR
20 C1–C11, C14,
C16–C20, 0.1 μF Capacitor, ceramic, 0.1 μF, 50 V, X7R, 20% 0603 STD Any
C22–C24
1 C12 0.22 μF Capacitor, ceramic, 0.22 μF, 25 V, X7R, 20% 0603 STD Any
3 C13, C15, C27 1.0 μF Capacitor, ceramic, 1.0 μF, 25 V, X7R, 20% 0805 STD Any
2 C21, C26 0.47 μF Capacitor, ceramic, 0.47 μF, 16 V, X7R, 20% 0603 STD Any
1 C25 2.2 μF Capacitor, ceramic, 2.2 μF, 10 V, X7R, 20% 0805 STD Any
4 D1, D3, D4, D6 BAS16 Diode, Switching, 150-mA, 75-V, 350 mW SOT23 BAS16 Vishay-Liteon
2 D2, D5 AZ23C5V6 Diode, dual, zener, 5.6V, 300mW SOT23 AZ23C5V6 Vishay-Telefunken
1 J1 22-05-3041 Header, friction lock assembly, 4-pin right angle 0.400 x 0.500 22-05-3041 Molex
2 Q1, Q3 FDS6690A MOSFET, N-ch, Logic Level, Power Trench, 30 SO8 FDS6690A Fairchild
V, 11 A, 12.5 mΩ
1 Q2 Si4435DY MOSFET, P-ch, 30 V, 8 A, 20 mΩSO8 Si4435DY Siliconix
1 Q4 NDS331N MOSFET, N-ch, 20 V, 1.3 A, 0.16 ΩSOT23 NDS331N Fairchild
1 Q5 BSS138 MOSFET, N-ch, 50 V, 0.22 A, 6 ΩSOT23 BSS138 Fairchild
12 R1–R5, 100 Resistor, chip, 100 Ω, 1/16 W, 5% 0603 STD STD
R21–R24, R31,
R32, R36
2 R11, R19 3M Resistor, chip, 3 MΩ, 1/16 W, 5% 0603 STD STD
1 R12 301 Resistor, chip, 301 Ω, 1 W, 1% 2512 WSL-2512-301 Vishay
3 R13, R15, R18 5.1K Resistor, chip, 5.1 kΩ, 1/16 W, 5% 0603 STD STD
3 R14, R25, R30 1M Resistor, chip, 1 MΩ, 1/16 W, 5% 0603 STD STD
1 R16 100K Resistor, chip, 100 kΩ, 1/16 W, 5% 0603 STD STD
1 R17 0.010 Resistor, chip, 0.010 Ω, 1 W, 1% 2512 WSL-2512-010 Vishay
75ppm
1 R20 10K Resistor, chip, 10 kΩ, 1/16 W, 5% 0603 STD STD
2 R26, R34 8.45K Resistor, chip, 8.45 kΩ, 1/16 W, 1% 0603 STD STD
2 R27, R33 61.9K Resistor, chip, 61.9 kΩ, 1/16 W, 1% 0603 STD STD
3 R28, R29, R35 220K Resistor, chip, 220 kΩ, 1/16 W, 5% 0603 STD STD
6 R6–R10, R37 1K Resistor, Chip 1 kΩ, 1/16W, 5% 0603 STD STD
2 RT1, RT2 10K Thermistor, 10 kΩ0.095 x 0.150 NTC103AT Sematec
2 TB1, TB3 ED1515 Terminal block, 3 pin, 6 A, 3,5 mm 0.41 x 0.25 ED1515 OST
1 TB2 ED1514 Terminal block, 2 pin, 6 A, 3,5 mm 0.27 x 0.25 ED1514 OST
1 TP1 GND Test point, White, Thru Hole Color Keyed 0.100 × 0.100 in 5002 Keystone
1 TP2 VCC Test point, White, Thru Hole Color Keyed 0.100 × 0.100 in 5002 Keystone
1 TP3 ~FUSE Test point, White, Thru Hole Color Keyed 0.100 × 0.100 in 5002 Keystone
1 U1 IC, voltage protection for 2, 3, or 4 cell Li-Ion, MSOP-08 BA29412DT3R TI
2nd protection, 4.45 OVP ±25 mV (DCT3)
1 U2 IC, 2, 3, or 4 cell series protection control AFE TSSOP-30 bq29330DBT TI
1 U3 IC, SBS 1.1-Compliant GG Enabled with TSSOP-20 bq20z70PW TI
Impedance Track™ technology, use with the
bq29330
Connector
2 J5 mate Connector, Female, 0.100 centers Molex 22-01-3407
8 N/A Terminals, crimp, tin Molex 08-50-0114
N/A Wire, insulated 24 AWG. red, 18 inches (±3 inches) (USB_5V) Alpha 1854-3
N/A Wire, insulated 24 AWG. white, 18 inches (±3 inches) (SCL) Alpha 1854-1
N/A Wire, insulated 24 AWG. black, 18 inches (±3 inches) (GND) Alpha 1854-2
N/A Wire, insulated 24 AWG. brown, 18 inches (±3 inches) (SDA) Alpha 1854-7
1 N/A Heatsink, 1 inch Any Any
Notes:
1. These assemblies are ESD sensitive; observe ESD precautions.
2. This assembly must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
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Table 2. Bill of Materials (continued)
Count Ref Des Value Description Size Part No. MFR
3. This assembly must comply with workmanship standards IPC-A-610 Class 2.
4. Reference designators marked with an asterisk (**) cannot be substituted. All other components can be substituted with equivalent MFG's
components.
5. Make one SMBus connector wire assembly for each assembly produced, from J5 mate, 4-24 AWG wires, and crimp terminals. Wire colors
for pin numbers are listed below. The wire assembly shall have a J5 mate on each end.
• Red – Pin 4 (Signal USB_5V)
• Brown – Pin 3 (Signal Data)
• White – Pin 2 (Signal Clock)
• Black – Pin 1 (GND)
6. RT1/RT2 should be assembled horizontally laying flat against the board edge with the sensing tip out.
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Note: For the battery pack designer:D3 is not recommended,
and should be shorted out if the DSG FET does not
have built-in zener diode protection.
Circuit Module Physical Layouts and Bill of Materials www.ti.com
Figure 6. Schematic
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www.ti.com EVM Hardware and Software Setup
4.3 bq20z70/bq29330/bq29412 Circuit Module Performance Specification Summary
This section summarizes the performance specifications of the bq20z70/ bq29330/bq29412 circuit module.
Table 3. Performance Specification Summary
Specification Min Typ Max Units
Input voltage Pack+ to Pack- 6 15 25 V
Charge and discharge current 0 2 7 A
5 EVM Hardware and Software Setup
This section describes how to install the bq20z70EVM-001 PC software, and how to connect the different
components of the EVM.
5.1 System Requirements
The bq20z70EVSW requires Windows 2000 or Windows XP. Drivers for Windows 98SE are provided, but
Microsoft no longer supports Windows 98; and there may be issues in Windows 98 with USB driver
support. The EV2300 USB drivers have been tested for Windows 98SE, but no assurance is made for
problem-free operation with specific system configurations.
5.2 Software Installation
Find the latest software version in the bq20z70 tool folder on power.ti.com. Use the following steps to
install the bq20z70EVSW software:
1. Copy the files from the CD into the temporary directory you selected, in the folder "bq20z70 EV SW
Install", double-click on bqEVSWSetup00.09.32.exe and follow the installer instructions to complete the
bq20z70 EVSW installation.
2. If the EV2300 was not previously installed, after bq20z70 EVSW installation, a TI USB DRIVER
INSTALLER will pop up. Click "Yes" for the agreement message and follow its instructions.
3. Plug the EV2300 into a USB port.
4. The Win98 Driver can be found in the archive Win98EV2300Drivers-DocUpdateDec1703.zip under the
"EV2300 Drivers" folder.
If files were downloaded from the Web:
1. Open the archive containing the installation package, and copy its contents in a temporary directory.
2. Follow the preceding steps 1 - 4.
6 Troubleshooting Unexpected Dialog Boxes
Ensure that the files were extracted from the zip file using the Preserve Folder names option.
Ensure that all the files were extracted from the zip file.
The user that is downloading the files must be logged in as the administrator.
The driver is not signed, so the administrator must allow installation of unsigned drivers in the operating
system policy.
7 Hardware Connection
The bq20z70EVM-001 comprises three hardware components: the bq20z70/bq29330/bq29412 circuit
module, the EV2300 PC interface board (purchased separately), and the PC.
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7.1 Connecting the bq20z70/bq29330/bq29412 Circuit Module to a Battery Pack
Figure 7 shows how to connect the bq20z70/bq29330/bq29412 circuit module to the cells and system
load/charger.
The cells should be connected in the following order:
1. 4-Cell Pack: 1N (BAT-), 1P, and 2P (see Section 2.1 for definitions).
2. 3-Cell Pack: 1N (BAT-), 1P, 2P, and then connect 4P and 3P together.
3. 2-Cell Pack: 1N (BAT-), 1P, and then connect 4P, 3P, and 2P together
To start charge or discharge test, connect SYS PRES pin to PACK- pin to set SYS PRES state. To test
sleep mode, disconnect the SYS PRES pin.
Figure 7. bq20z70/bq29330 Circuit Module Connection to Cells and System Load/Charger
7.2 PC Interface Connection
The following steps configure the hardware for interface to the PC:
1. Connect the bq20z70/bq29330-based smart battery to the EV2300 using wire leads as shown in
Table 4.
Table 4. Circuit Module to EV2300 Connections
bq20z70/bq29330-Based Battery EV2300
SMBD SMBD
SMBC SMBC
VSS GND
2. Connect the PC USB cable to the EV2300 and the PC USB port.
The bq20z70EVM-001 is now set up for operation.
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8 Operation
This section details the operation of the bq20z70 EVSW software. Note: the EV2300 driver does not
support Windows Sleep or Hibernate. In case there is a problem communicating with the EV2300 or the
EVM, first unplug the USB cable then plug it back in. If the problem persists, check whether the EVM is in
Shutdown mode. The bq20z70 can be waken up by momentarily applying a voltage higher than 5.5V (but
less than 25V) at Pack+ pin of the EVM.
8.1 Starting the Program
With the EV2300 and the bq20z70 EVM connected to the computer, run bq20z70 EVSW from the Start |
Programs | Texas Instruments | bq20z70 EVSW menu sequence. The SBS Data screen appears. Data
begins to appear once the <Refresh> (single time scan) button is clicked, or when the <Keep Scanning>
check box is checked. To disable the scan feature, deselect <Keep Scanning>.
The continuous scanning period can be set via the |Options| and |Set Scan Interval| menu selections. The
range for this interval is 0 ms to 65535 ms. Only items that are selected for scanning are scanned within
this period.
The bq20z70 EVSW provides a logging function which logs the values that were last scanned by EVSW.
To enable this function, select the Start Logging button; this causes the Keep Scanning button to be
selected. When logging is Stopped, the keep scanning button is still selected and has to be manually
unchecked.
The logging interval are specified under the |Options| menu with the maximum value of 65535
milliseconds. The Log interval cannot be smaller than the scan interval because this results in the same
value being logged at least twice.
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Figure 8. SBS Data Screen
This screen shows the SBS data set along with additional ManufacturersAccess() command information
such as individual cell measurements. Additional Flag and Static data can be viewed by selecting the
appropriate tab at the bottom of the SBS screen.
Data such as SBS.ManufacturerName( ) is static and does not change. This data is viewed separately
using the Static Data tab available at the bottom of the screen.
Dragging the splitter bar (line that separates the Flags/Static data from SBS values) changes the height of
the Flags/Static Data display. Selecting |View| then |Auto Arrange| returns the splitter bar to its original
location.
8.2 Setting Programmable bq20z70 and bq29330 Options
The bq20z70 data flash comes configured per the default settings detailed in the bq20z70 data sheet
(SLUS686). Ensure that the settings are correctly changed to match the pack and application for the
bq20z70/bq29330 solution being evaluated.
IMPORTANT: The correct setting of these options is essential to get the best performance.
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The settings can be configured using the Data Flash screen.
Figure 9. Data Flash Screen, 1st Level Safety Class
To read all the data from the bq20z70 data flash, click on menu option | Data Flash | Read All |.
To write to a data flash location, click on the desired location, enter the data, and press <Enter>, which
writes the entire tab of flash data, or select menu option |Data Flash|Write All|. The data flash must be
read before any writes are performed to avoid any incorrect data being written to the device.
The | File | Special Export | menu options allows the data flash to be exported, but it configures the
exported data flash to a learned state ready for mass production use.
The data flash configuration can be saved to a file by selecting | File | Export |, and entering a file name. A
data flash file can also be retrieved in this way, imported, and written to the bq20z70 using the | Write All |
button.
The configuration information of the bq29330 and module calibration data is also held in the bq20z70 data
flash.
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The bq20z70 allows for an automatic data flash export function, similar to the SBS Data logging function.
This feature, when selected via | Options | Auto Export |, exports Data Flash to a sequential series of files
named as FilenameNNNNN.gg where N = a decimal number from 0 to 9.
The AutoExport interval is set under the | Options menu | with a minimum value of 15 seconds. The
AutoExport filename is also set under the | Options menu |.
When there is a check next to | AutoExport |, the AutoExport is in progress. The same menu selection is
used to turn on/off AutoExport.
If the data flash screen is blank, then the bq20z70 that is being used may not be supported by the
bqEVSW version that is being used. An upgrade may be required.
9 Calibration Screen
9.1 How to Calibrate
Before the bq20z70 is calibrated:
• Connect a load to Pack- and Pack+ that draws approximately 2 A and measures discharge current to
use the FETs.
• Connect a current source to Batt- and Pack- to calibrate without using the FETs.
• Measure the pack voltage from Batt+ to Batt- (Total of Cell voltages).
• Measure the temperature of the pack.
• These steps may or may not be required, depending on the type of calibration being performed.
9.2 To Calibrate the bq20z70
Select the types of calibration to be performed.
Enter the measured values for the types selected (Except for CC Offset Calibration).
If Voltage Calibration is selected, then enter the number of cells on the pack.
If Temperature Calibration is selected, then select the sensor that is to be calibrated.
If the load is connected between Pack+ and Pack-, then select the Use FETs check box.
Press the Calibrate Part button.
9.3 Board Offset Calibration
This performs the offset calibration for the current offset of the board.
Remove load/external voltage.
Press the Software Board Offset Calibration button.
9.4 Pack Voltage Calibration
This calibrates the voltage at the AFE Pack pin.
Make sure Voltage Calibration has been performed for the pack. If Voltage Calibration is not performed,
then Pack Voltage Calibration calibrates incorrectly.
Remove load/external voltage applied between Pack+ and Pack-.
Press the Pack Voltage button to calibrate.
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Figure 10. Calibration Screen
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10 Pro (Advanced) Screen
10.1 SMB Communication
The set of read/write operations over SMBus are not specific to any gas gauge. These are provided as
general-purpose communication tools.
10.2 Hex/Decimal Converter
These two boxes convert between hexadecimal (hex) and decimal as soon as values are typed into the
boxes. Invalid values may cause erroneous results.
When scaling converted hex values to a higher number of bytes, follow these rules:
• When unsigned is selected, the left pad contains zeroes.
• When signed is selected, the left pad contains zeroes for a positive number, or the left pad contains F
for negative numbers.
10.3 Programming
Allows for device reprogramming from unencrypted and encrypted files.
Figure 11. Pro (Advanced) Screen
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www.ti.com Related Documentation from Texas Instruments
11 Related Documentation from Texas Instruments
To obtain a copy of any of the following TI document, call the Texas Instruments Literature Response
Center at [phone] or the Product Information Center (PIC) at [phone]. When ordering,
identify this document by its title and literature number. Updated documents can also be obtained through
the TI Web site at www.ti.com.
Documents: Literature Number:
bq20z70 Data Sheet SLUS686
bq20z70 Technical Reference SLUU250
bq29330 Data Sheet SLUS673
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