Texas Instruments bq25606 User manual

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bq25606 PWR772 Evaluation Module
User's Guide
SLUUBL3–June 2017
bq25606 PWR772 Evaluation Module
This user's guide provides detailed testing instructions for the bq25606 evaluation module (EVM). Also
included are descriptions of the necessary equipment, equipment setup, test procedures, the printed-
circuit board layouts, schematics, and the bill of materials (BOM).
Throughout this user's guide, the abbreviations EVM,bq25606EVM,PWR772, and the term evaluation
module are synonymous with the bq25606 evaluation module, unless otherwise noted.
Contents
1 Introduction ................................................................................................................... 2
1.1 EVM Features....................................................................................................... 2
1.2 I/O Descriptions..................................................................................................... 2
2 Test Summary................................................................................................................ 3
2.1 Equipment ........................................................................................................... 3
2.2 Equipment Setup.................................................................................................... 3
2.3 Test Procedure...................................................................................................... 5
3 PCB Layout Guideline....................................................................................................... 6
4 Board Layout, Schematic, and Bill of Materials.......................................................................... 7
4.1 Board Layout ........................................................................................................ 7
4.2 Schematic............................................................................................................ 9
4.3 Bill of Materials .................................................................................................... 10
List of Figures
1 Original Test Setup for bq25606 EVM.................................................................................... 4
2 bq25606EVM Top Overlay ................................................................................................. 7
3 bq25606EVM Top Solder Mask............................................................................................ 7
4 bq25606EVM Top Layer ................................................................................................... 7
5 bq25606EVM Signal Layer 1 .............................................................................................. 7
6 bq25606EVM Signal Layer 2 .............................................................................................. 7
7 bq25606EVM Bottom Layer ............................................................................................... 7
8 bq25606EVM Bottom Solder Mask........................................................................................ 8
9 bq25606EVM Bottom Overlay ............................................................................................. 8
10 Schematic for bq25606EVM-772 .......................................................................................... 9
List of Tables
1 Device Data Sheets ......................................................................................................... 2
2 EVM Connections............................................................................................................ 2
3 EVM Jumper Connections and Shunt Installation....................................................................... 2
4 Recommended Operating Conditions..................................................................................... 3
5 bq25606EVM-772 Bill of Materials....................................................................................... 10
Trademarks
All trademarks are the property of their respective owners.

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1 Introduction
1.1 EVM Features
For detailed features and operation, refer to Table 1 for a list of devices and their data sheets.
Table 1. Device Data Sheets
Device Data Sheet EVM Label Variant
bq25606 SLUSCK6 BQ25606EVM-772 004
The bq25606 evaluation module (EVM) is a standalone charger module without I2C control.
1.2 I/O Descriptions
Table 2 lists the jumper connections available on this EVM.
Table 2. EVM Connections
Jack Description
J1-VAC Input positive terminal
J1-GND Ground Input: negative terminal (ground terminal)
J2-PMID PMID pin connection
J2-GND Ground
J3 Output mini-USB port
J4-SYS Connected to system
J4-GND Ground
J5-BATSNS_ICHG BATSNS or ICHG pin connection
J5-BAT Connected to battery pack positive node
J5-GND Ground
J6 I2C 4-pin connector
J7 USB-TO-GPIO connector (Not populated)
Table 3 lists the EVM jumper connections.
Table 3. EVM Jumper Connections and Shunt Installation
Jack Description bq25606 Setting
JP1 PSEL pin selection Not installed
JP2 CE pin setting: pull low to enable the charge Installed
JP3 OTG pin setting: pull high to enable OTG mode Short OTG to GND
JP4 STAT, PG, CE, INT, and OTG pins pullup source (SYS or
BAT) Short to SYS
JP5 TS pin to GND Not installed
JP6 TS resistor divider pullup source (REGN) connection Installed
JP7 Internal 10 kΩto GND to TS pin Installed
JP8 BATSNS selection Not installed
JP9 QON and VSET pin setting Not installed
JP10 STAT pin setting Installed
JP11 Add SYS cap Not installed
JP12 SDA and PG pin setting Installed
JP13 D+ and PSEL to J3 Not Installed
JP14 D– and PG to J3 Not Installed
JP15 D– and PG pin setting Not installed
JP16 Add VBUS cap Not installed

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Table 3. EVM Jumper Connections and Shunt Installation (continued)
Jack Description bq25606 Setting
JP17 Add PMID cap Not installed
JP18 Add AT cap Not installed
S1 QON control Default open
S2 Switch to short indicator LEDs Default open
Table 4 lists the recommended operating conditions for this EVM.
Table 4. Recommended Operating Conditions
Symbol Description MIN TYP MAX Unit
Supply voltage, VVBUS Input voltage from AC adapter 3.9 5.0 13.5 V
Battery voltage, VBAT Voltage applied at VBAT terminal 0 4.208 4.4 V
IBAT Fast charging current 0 3.0 A
Discharging current through internal MOSFET 6.0 A
Supply current, IIN Maximum input current from AC adapter input 0 3.0 A
2 Test Summary
2.1 Equipment
This section includes a list of supplies required for testing this EVM.
1. Power Supplies: Power supply #1 (PS#1): a power supply capable of supplying 5 V at 3 A is required.
While this part can handle larger voltage and current, it is not necessary for this procedure.
2. Load #1: (4-quadrant supply, constant voltage < 4.5 V) A 0–20 V, 0–5 A, > 30-W system, DC
electronic load and setting as constant voltage load mode
or:
Kepco load: BOP 20–5M, DC 0 to ±20 V, 0 to ±5 A (or higher)
3. Load #2: Use with Boost Mode
VAC to GND load, 10 Ω, 5 W or greater.
4. Meters: Six Fluke 75 multimeters, (equivalent or better)
or:
Four equivalent voltage meters and two equivalent current meters. The current meters must be
capable of measuring 5-A+ current
2.2 Equipment Setup
Use the following list to set up the equipment:
1. Set PS#1 for 5-V DC, 3-A current limit and then turn off the supply.
2. Connect the output of PS#1 in series with a current meter (multimeter) to J1 (VAC and GND). It is
recommended to connect one voltage meter across TP24 and TP27 to measure the input current
sensing resistor voltage. The sensing resistor is 10 mΩ.
3. Connect one voltage meter across TP21 (VAC) and TP18 (GND), connect another voltage meter
across TP1 (VBUS) and TP18 (GND).
4. Turn on Load #1, set to constant voltage mode and output to 2.5 V. Turn off (disable) load. Connect
load to J5 (BAT and GND).
5. Connect one voltage meter across TP9 (BAT) and TP17 (GND) to measure the battery voltage and
another voltage meter across TP28 and TP29 to measure the battery current sensing resistor voltage.
The sensing resistor is 10 mΩ. An alternate method is to use the optional current meter in series to
measure the battery current.
6. Install shunts as shown in Table 3.

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Figure 1. Original Test Setup for bq25606 EVM

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2.3 Test Procedure
2.3.1 Charger Mode Verification
1. Enable Load #1 from Section 2.2, step 4. Measure the voltage across J4 and J5 as follows:
•Measure →V(TP8(SYS), TP17(GND)) = 3.65 V (Typical)
•Measure →V(TP9(BAT), TP17(GND)) = 2.5 V (Typical)
•Measure →IBAT ( = pre-charge current)
2. Change Load #1 to 3.7 V
•Measure →V(TP8(SYS), TP17(GND)) = 3.8 V (Typical)
•Measure →V(TP9(BAT), TP17(GND)) = 3.7 V (Typical)
•Measure →IBAT ( = fast charge current)
3. Adjust R10 to change charging current
Adjust R11 to change input current limit
4. Turn off and disconnect Load #1
5. Turn off and disconnect PS#1
2.3.2 Boost Mode Verification
1. Do not install JP3
2. If the constant voltage load connected from BAT to GND is not a four-quadrant supply (sources
current), remove the load and use the power source disconnected in step 1, set to 3.7 V and 2-A
current limit and connect between BAT and GND
3. Apply 10 Ω(5 W or greater) across J1 VAC(+) to GND(–)
4. Verify VVBUS to GND since VBUS is the actual boost mode output voltage
Measure →VVBUS = 5.15 V (Typical)
5. Turn off and disconnect power supply
6. Remove 10-Ωresistor at VAC
2.3.3 Helpful Tips
1. The leads and cables to the various power supplies, batteries, and loads have resistance. The current
meters also have series resistance. The charger dynamically reduces charge current depending on the
voltage sensed at its VBUS pin (using the VINDPM feature), BAT pin (as part of normal termination),
and TS pin (through its battery temperature monitoring feature via battery thermistor). Therefore,
voltmeters must be used to measure the voltage as close to the IC pins as possible instead of relying
on the digital readouts of the power supply. If a battery thermistor is not available, make sure shunts
JP6 and JP7 are in place.
2. When using a source meter that can source and sink current as your battery simulator, TI highly
recommends adding a large (1000+ μF) capacitor at the EVM BAT and GND connectors in order to
prevent oscillations at the BAT pin due to mismatched impedances of the charger output and source
meter input within their respective regulation loop bandwidths. Configuring the source meter for 4-wire
sensing eliminates the need for a separate voltmeter to measure the voltage at the BAT pin.
When using 4-wire sensing, always ensure that the sensing leads are connected in order to prevent
accidental overvoltage by the power leads.
3. For precise measurements of charge current and battery regulation near termination, the current meter
in series with the battery or battery simulator should not be set to auto-range and may need be
removed entirely. An alternate method for measuring charge current is to either use an oscilloscope
with Hall effect current probe or place a 1% or better, thermally capable (for example, 0.010 Ωin 1210
or larger footprint) resistor in series between the BAT pin and battery and measure the voltage across
that resistor. The bq25606EVM has the sensing resistors onboard.

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3 PCB Layout Guideline
Minimize the switching node rise and fall times for minimum switching loss. Proper layout of the
components minimizing high-frequency current path loop is important to prevent electrical and magnetic
field radiation and high-frequency resonant problems. This PCB layout priority list must be followed in the
order presented for proper layout:
1. Place the input capacitor as close as possible to the PMID pin and GND pin connections and use the
shortest copper trace connection or GND plane.
2. Place the inductor input terminal as close to the SW pin as possible. Minimize the copper area of this
trace to lower electrical and magnetic field radiation but make the trace wide enough to carry the
charging current. Do not use multiple layers in parallel for this connection. Minimize parasitic
capacitance from this area to any other trace or plane.
3. Put an output capacitor near to the inductor and the IC. Tie ground connections to the IC ground with a
short copper trace connection or GND plane.
4. Route analog ground separately from the power ground. Connect analog ground and connect power
ground separately. Connect analog ground and power ground together using a power pad as the
single ground connection point or use a 0-Ωresistor to tie analog ground to power ground.
5. Use a single ground connection to tie the charger power ground to the charger analog ground just
beneath the IC. Use ground copper pour but avoid power pins to reduce inductive and capacitive noise
coupling.
6. Place decoupling capacitors next to the IC pins and make the trace connection as short as possible.
7. It is critical that the exposed power pad on the backside of the IC package be soldered to the PCB
ground. Ensure that there are sufficient thermal vias directly under the IC connecting to the ground
plane on the other layers.
8. The via size and number should be enough for a given current path.
See the EVM design for the recommended component placement with trace and via locations. For the
QFN information, refer to Quad Flatpack No-Lead Logic Packages (SCBA017) and QFN/SON PCB
Attachment (SLUA271).

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4 Board Layout, Schematic, and Bill of Materials
4.1 Board Layout
Figure 2 through Figure 9 illustrate the EVM PCB layout images.
Figure 2. bq25606EVM Top Overlay Figure 3. bq25606EVM Top Solder Mask
Figure 4. bq25606EVM Top Layer Figure 5. bq25606EVM Signal Layer 1

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Figure 6. bq25606EVM Signal Layer 2 Figure 7. bq25606EVM Bottom Layer
Figure 8. bq25606EVM Bottom Solder Mask Figure 9. bq25606EVM Bottom Overlay

1 2
3 4
5 6
7 8
9 10
J7
DNP
0
R21
DNP
200
R19
DNP
200
R20
DNP SDA_/PG
SCL_OTG
PGND
VBUS 1
D- 2
D+ 3
ID 4
GND 5
6 7 8
11 10
9
J3
VAC
PGND
PGND
4
1
2
3
J6
PGND
SCL_OTG
SDA_/PG
/CE
D+_PSEL
PGND
VAC
GND
PMID
GND
Vbus: 3.9V to 14V
1000pF
C2
DNP
2.21kR4
10.0k
R5DNP
JP3
/CE
AGND
AGND
TP2TP1
1µF
C1
TP3 TP4 TP7
13V
D1
DNP
2.21k
R17
30.1k
R23
10
R26
DNP
0.1µF
C11
DNP
System
GND
GND
PGND
Battery
PGND
PULL-UP
TS
GND
10µF
C9
10µF
C10
10µF
C19
DNP
20V
D3
DNP
ICHG: 0 ~ 2.5A
40V
D2
DNP
0.047µF
C7
0
R25
1
2
3
J5
TP6
BATSNS_ICHG
PGND
1µH
L1
DNP
4.7k
R15
DNP
AGND
S1
DNP
STAT_/IMON
REGN
CSD17571Q2
3
5,6,8 4,7
1,2,
Q1
0
R2
PGND
JP16
DNP
JP17
DNP
PGND
PGND
1µF
C18
DNP
SCL_OTG
SDA_/PG
VBUS PMID
VAC
ACDRV
VAC
SDA_/PG
D+_PSEL
D-_/PG
10k ohm
R10
PGND
/CE
10K
TS
20V
D6
DNP
J2
1
2
3
JP1
AGND
10.0k
R6
REGN
D+_PSEL
JP2
/CE
AGND
PMID
10µF
C3
DNP
10µF
C17
DNP
10µF
C4
1000pF
C5
DNP
4.7µF
C6
AGND
PMID
/QON_VSET
/QON_VSET
JP5
10.0k
R24
5.23k
R22
JP6
REGN
JP7
REGN
110pF
C8
DNP
INT_ILIM
AGND
1
2 3 4 5
SW1
DNP
PGND
1
2
3
JP4
PULL-UP
JP18
DNP
JP11
DNP
1000pF
C12
DNP
10µF
C13
4.7µF
C20
DNP
4.7µF
C14
DNP
NT1
Net-Tie
0
R16
DNP
Green
D4
REGN
RTOP TS
PSEL
GND
REGN
/CE
GND
GND
OTG
TP9
TP8
SYS
BAT
BAT
SYS
TP5
REGN BATSNS_ICHG INT_ILIMSCL_OTG
TP10 TP11
TS
TS
TP12 TP13
D-_/PGACDRV
TP14 TP15
/QON_VSETD+_PSEL
TP16
/CE
TP17 TP18 TP19 TP20
AGND
PGND
BAT
SYS
PULLUP
AGND
10k ohm
R11
PULL-UP
1
2 3 4 5
SW3
DNP
1
2 3 4 5
SW4
DNP
1
2 3 4 5
SW2
DNP
BAT
SYS
SW
PMID
JP13
SCL_OTG
1
2
3
JP9
AGND
/QON_VSET
1µF
C15
0.1µF
C16
AGND
0
R1
DNP
STAT_/IMON
STAT_/IMON
BATSNS_ICHG
BTST
JP10
2.21k
R7
Green
D5
JP12
SDA_/PG
TP21
VAC
0
R27
D-_/PG
10.0k
R29
PGND
D-_/PG
VBUS
AGND
JP14
JP15
DNP
10.0k
R13
DNP PULL-UP
1 2
4 3
S2
10.0k
R14
TP22 TP23
0.01
R31
158
R12
1.00k
R3
221
R8
2.80k
R9
1
2
3
JP8
DNP BATSNS_ICHG
BAT
BATCON
0.01
R30
40V
D7
TP24
0.01
R18
TP27
TP25 TP26
TP28
TP29
J1
J4
1µH
L2
ACDRV
2
BAT 13
BAT 14
ICHG 10
BTST 21
PAD 25
PGND 17
PGND 18
PMID
23
D+
3
REGN 22
OTG
6
PG
7
STAT 5
SW 19
SW 20
SYS 15
SYS 16
TS 11
VBUS
24
VAC
1
CE
9ILIM 8
D-
4
VSET 12
U1
bq25606RGER
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4.2 Schematic
Figure 10 illustrates the schematic for the bq25606 EVM.
Figure 10. Schematic for bq25606EVM-772

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4.3 Bill of Materials
Table 5 lists the bq25606EVM-772 BOM.
Table 5. bq25606EVM-772 Bill of Materials
Designator Qty Value Description Package Reference Part Number Manufacturer Alternate Part
Number Alternate Manufacturer
!PCB 1 Printed Circuit Board PWR772 Any
C1 1 1uF CAP, CERM, 1 µF, 35 V, +/- 10%, X5R, 0603 0603 GMK107BJ105KA-T Taiyo Yuden
C4 1 10uF CAP, CERM, 10 µF, 25 V, +/- 10%, X7S, 0805 0805 GRM21BC71E106KE11L Murata
C6 1 4.7uF CAP, CERM, 4.7 µF, 16 V, +/- 10%, X5R, 0603 0603 GRM188R61C475KAAJ Murata
C7 1 0.047u
FCAP, CERM, 0.047 µF, 25 V, +/- 10%, X7R, 0402 0402 GRM155R71E473KA88D Murata
C9, C10, C13 3 10uF CAP, CERM, 10 µF, 10 V, +/- 10%, X7R, 0805 0805 GRM21BR71A106KE51L Murata
C15 1 1uF CAP, CERM, 1 µF, 25 V, +/- 10%, X7R, 0805 0805 GRM219R71E105KA88D Murata
C16 1 0.1uF CAP, CERM, 0.1 µF, 25 V, +/- 10%, X7R, 0402 0402 GRM155R71E104KE14D Murata
D4, D5 2 Green LED, Green, SMD 1.6x0.8x0.8mm LTST-C190GKT Lite-On
D7 1 40V Diode, Schottky, 40 V, 0.38 A, SOD-523 SOD-523 ZLLS350TA Diodes Inc.
J1, J2, J4 3 Conn Term Block, 2POS, 3.81mm, TH 2POS Terminal Block 1727010 Phoenix Contact
J3 1 Connector, Receptacle, Micro-USB Type B, R/A, Bottom Mount
SMT 7.5x2.45x5mm 0473460001 Molex
J5 1 Terminal Block Receptacle, 3x1, 3.81mm, R/A, TH Term Block, 3 pos 1727023 Phoenix Contact
J6 1 Header (friction lock), 100mil, 4x1, R/A, TH 4x1 R/A Header 22-05-3041 Molex
JP1, JP4, JP9 3 Header, 100mil, 3x1, Tin, TH Header, 3 PIN, 100mil, Tin PEC03SAAN Sullins Connector
Solutions
JP2, JP3, JP5, JP6, JP7,
JP10, JP12, JP13, JP14 9 Header, 100mil, 2x1, Tin, TH Header, 2 PIN, 100mil, Tin PEC02SAAN Sullins Connector Solutions
L2 1 1uH Inductor, 1 µH, 3.2 A, 0.028 ohm, SMD 2.5x2mm MPIM252010F1R0M-LF Microgate
LBL1 1 Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000
per roll PCB Label 0.650"H x 0.200"W THT-14-423-10 Brady
Q1 1 30V MOSFET, N-CH, 30 V, 22 A, DQK0006C (WSON-6) DQK0006C CSD17571Q2 Texas Instruments None
R2, R25, R27 3 0 RES, 0, 5%, 0.063 W, 0402 0402 CRCW04020000Z0ED Vishay-Dale
R3 1 1.00k RES, 1.00 k, 1%, 0.063 W, 0402 0402 CRCW04021K00FKED Vishay-Dale
R4, R7, R17 3 2.21k RES, 2.21 k, 1%, 0.063 W, 0402 0402 CRCW04022K21FKED Vishay-Dale
R6, R14, R24, R29 4 10.0k RES, 10.0 k, 1%, 0.063 W, 0402 0402 CRCW040210K0FKED Vishay-Dale
R8 1 221 RES, 221, 1%, 0.063 W, 0402 0402 CRCW0402221RFKED Vishay-Dale
R9 1 2.80k RES, 2.80 k, 1%, 0.063 W, 0402 0402 CRCW04022K80FKED Vishay-Dale
R10, R11 2 10k
ohm Trimmer, 10k ohm, 0.25W, TH 4.5x8x6.7mm 3266W-1-103LF Bourns
R12 1 158 RES, 158, 1%, 0.063 W, 0402 0402 CRCW0402158RFKED Vishay-Dale
R18, R30, R31 3 0.01 RES, 0.01, 1%, 1 W, 2010 2010 WSL2010R0100FEA18 Vishay-Dale
R22 1 5.23k RES, 5.23 k, 1%, 0.063 W, 0402 0402 CRCW04025K23FKED Vishay-Dale
R23 1 30.1k RES, 30.1 k, 1%, 0.063 W, 0402 0402 CRCW040230K1FKED Vishay-Dale
S2 1 Switch, SPST, 2 Pos, 25mA, 24VDC, SMD 3.71x5.8mm 218-2LPST CTS Electrocomponents

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Table 5. bq25606EVM-772 Bill of Materials (continued)
Designator Qty Value Description Package Reference Part Number Manufacturer Alternate Part
Number Alternate Manufacturer
SH-JP2, SH-JP3, SH-
JP4, SH-JP6, SH-JP7,
SH-JP10, SH-JP12, SH-
JP13, SH-JP14
9 1x2 Shunt, 100mil, Gold plated, Black Shunt 969102-0000-DA 3M SNT-100-BK-G Samtec
TP1, TP2 2 Test Point, Miniature, Red, TH Red Miniature Testpoint 5000 Keystone
TP3, TP4, TP6, TP7,
TP10, TP11, TP12, TP13,
TP14, TP15, TP16, TP21,
TP24, TP25, TP26, TP27,
TP28, TP29
18 Test Point, Miniature, White, TH White Miniature Testpoint 5002 Keystone
TP5, TP8 2 Test Point, Miniature, Orange, TH Orange Miniature Testpoint 5003 Keystone
TP9 1 Test Point, Miniature, Yellow, TH Yellow Miniature Testpoint 5004 Keystone
TP17, TP18, TP19, TP20,
TP22, TP23 6 Test Point, Compact, SMT Testpoint_Keystone_Compact 5016 Keystone
U1 1 BQ25606RGER, RGE0024H (VQFN-24) RGE0024H bq25606RGER Texas Instruments bq25606RGET Texas Instruments
C2, C5, C12 0 1000pF CAP, CERM, 1000 pF, 50 V, +/- 5%, C0G/NP0, 0402 0402 GRM1555C1H102JA01D Murata
C3, C17 0 10uF CAP, CERM, 10 µF, 25 V, +/- 10%, X5R, 0805 0805 GRM21BR61E106KA73L Murata
C8 0 110pF CAP, CERM, 110 pF, 25 V, +/- 5%, C0G/NP0, 0402 0402 GRM1555C1E111JA01D Murata
C11 0 0.1uF CAP, CERM, 0.1 µF, 25 V, +/- 20%, X7R, 0402 0402 C1005X7R1E104M050BB TDK
C14, C20 0 4.7uF CAP, CERM, 4.7 µF, 16 V, +/- 10%, X5R, 0603 0603 GRM188R61C475KAAJ Murata
C18 0 1uF CAP, CERM, 1 µF, 35 V, +/- 10%, X5R, 0603 0603 GMK107BJ105KA-T Taiyo Yuden
C19 0 10uF CAP, CERM, 10 µF, 10 V, +/- 10%, X7R, 0805 0805 GRM21BR71A106KE51L Murata
D1 0 13V Diode, TVS, Uni, 13 V, W, SOD-123W SOD-123W PTVS13VS1UR,115 NXP Semiconductor
D2 0 40V Diode, Schottky, 40 V, 0.38 A, SOD-523 SOD-523 ZLLS350TA Diodes Inc.
D3, D6 0 20V Diode, Schottky, 20 V, 1 A, 152AD 152AD NSR10F20NXT5G ON Semiconductor
FID1, FID2, FID3, FID4,
FID5, FID6 0 Fiducial mark. There is nothing to buy or mount. N/A N/A N/A
H1, H2, H3, H4 0 Machine Screw, Round, #4-40 x 1/4, Nylon, Philips panhead Screw NY PMS 440 0025 PH BampersandF Fastener
Supply - -
H5, H6, H7, H8 0 Standoff, Hex, 0.5"L #4-40 Nylon Standoff 1902C Keystone - -
J7 0 Header (shrouded), 100mil, 5x2, High-Temperature, Gold, TH 5x2 Shrouded header N2510-6002-RB 3M
JP8 0 Header, 100mil, 3x1, Tin, TH Header, 3 PIN, 100mil, Tin PEC03SAAN Sullins Connector
Solutions
JP11, JP15, JP16, JP17,
JP18 0 Header, 100mil, 2x1, Tin, TH Header, 2 PIN, 100mil, Tin PEC02SAAN Sullins Connector Solutions
L1 0 1uH Inductor, Wirewound, 1 µH, 4 A, 0.041 ohm, SMD 4.06x4.06mm 74437321010 Wurth Elektronik
R1 0 0 RES, 0, 5%, 0.1 W, 0603 0603 CRCW06030000Z0EA Vishay-Dale
R5, R13 0 10.0k RES, 10.0 k, 1%, 0.063 W, 0402 0402 CRCW040210K0FKED Vishay-Dale
R15 0 4.7k RES, 4.7 k, 5%, 0.063 W, 0402 0402 CRCW04024K70JNED Vishay-Dale
R16, R21 0 0 RES, 0, 5%, 0.063 W, 0402 0402 CRCW04020000Z0ED Vishay-Dale
R19, R20 0 200 RES, 200, 1%, 0.063 W, 0402 0402 CRCW0402200RFKED Vishay-Dale
R26 0 10 RES, 10, 5%, 0.063 W, 0402 0402 CRCW040210R0JNED Vishay-Dale
S1 0 Switch, Normally open, 2.3N force, 200k operations, SMD KSR KSR221GLFS CampersandK
Components

Board Layout, Schematic, and Bill of Materials www.ti.com
12 SLUUBL3–June 2017
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
bq25606 PWR772 Evaluation Module
Table 5. bq25606EVM-772 Bill of Materials (continued)
Designator Qty Value Description Package Reference Part Number Manufacturer Alternate Part
Number Alternate Manufacturer
SH-JP1, SH-JP5, SH-
JP8, SH-JP9, SH-JP11,
SH-JP15, SH-JP16, SH-
JP17, SH-JP18
0 1x2 Shunt, 100mil, Gold plated, Black Shunt 969102-0000-DA 3M SNT-100-BK-G Samtec
SW1, SW2, SW3, SW4 0 Compact Probe Tip Circuit Board Test Points, TH, 25 per TH Scope Probe 131-5031-00 Tektronix
Notes: Unless otherwise noted in the Alternate Part Number or Alternate Manufacturer columns, all parts may be substituted with equivalents.

STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.

FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.

6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated

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TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
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